JP4571525B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
JP4571525B2
JP4571525B2 JP2005067082A JP2005067082A JP4571525B2 JP 4571525 B2 JP4571525 B2 JP 4571525B2 JP 2005067082 A JP2005067082 A JP 2005067082A JP 2005067082 A JP2005067082 A JP 2005067082A JP 4571525 B2 JP4571525 B2 JP 4571525B2
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Japan
Prior art keywords
substrate
stage
unit
nozzle
region
Prior art date
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Active
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JP2005067082A
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English (en)
Japanese (ja)
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JP2006253373A (ja
Inventor
義治 太田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005067082A priority Critical patent/JP4571525B2/ja
Priority to KR1020060022159A priority patent/KR101154756B1/ko
Priority to TW095108195A priority patent/TWI305659B/zh
Publication of JP2006253373A publication Critical patent/JP2006253373A/ja
Application granted granted Critical
Publication of JP4571525B2 publication Critical patent/JP4571525B2/ja
Priority to KR1020110108796A priority patent/KR101188077B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2005067082A 2005-03-10 2005-03-10 基板処理装置及び基板処理方法 Active JP4571525B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005067082A JP4571525B2 (ja) 2005-03-10 2005-03-10 基板処理装置及び基板処理方法
KR1020060022159A KR101154756B1 (ko) 2005-03-10 2006-03-09 기판 처리 장치 및 기판 처리 방법
TW095108195A TWI305659B (en) 2005-03-10 2006-03-10 Substrate processing apparatus and substrate processing method
KR1020110108796A KR101188077B1 (ko) 2005-03-10 2011-10-24 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005067082A JP4571525B2 (ja) 2005-03-10 2005-03-10 基板処理装置及び基板処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009294325A Division JP5221508B2 (ja) 2009-12-25 2009-12-25 基板処理装置

Publications (2)

Publication Number Publication Date
JP2006253373A JP2006253373A (ja) 2006-09-21
JP4571525B2 true JP4571525B2 (ja) 2010-10-27

Family

ID=37093541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005067082A Active JP4571525B2 (ja) 2005-03-10 2005-03-10 基板処理装置及び基板処理方法

Country Status (3)

Country Link
JP (1) JP4571525B2 (ko)
KR (2) KR101154756B1 (ko)
TW (1) TWI305659B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008029938A (ja) * 2006-07-27 2008-02-14 Tokyo Electron Ltd 塗布方法及び塗布装置

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4318714B2 (ja) * 2006-11-28 2009-08-26 東京エレクトロン株式会社 塗布装置
JP2009018917A (ja) * 2007-07-12 2009-01-29 Tokyo Ohka Kogyo Co Ltd 塗布装置、基板の受け渡し方法及び塗布方法
KR100874611B1 (ko) 2007-08-13 2008-12-17 주식회사 케이씨텍 다층 코팅 방법
KR100891723B1 (ko) * 2007-09-19 2009-04-03 주식회사 엠엠티 비접촉식 패널 세정장치
JP4495752B2 (ja) 2007-11-06 2010-07-07 東京エレクトロン株式会社 基板処理装置及び塗布装置
JP2010034309A (ja) * 2008-07-29 2010-02-12 Dainippon Screen Mfg Co Ltd 塗布装置および基板処理システム
KR101341013B1 (ko) * 2008-09-04 2013-12-13 엘지디스플레이 주식회사 세정 장치
JP4787872B2 (ja) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 基板搬送処理装置
KR101071583B1 (ko) 2009-08-21 2011-10-10 주식회사 케이씨텍 부상식 기판 코터 장치
KR101051767B1 (ko) * 2009-09-01 2011-07-25 주식회사 케이씨텍 부상식 기판 코터 장치
CN107017191B (zh) * 2010-02-17 2020-08-14 株式会社尼康 搬送装置、曝光装置、以及元件制造方法
JP5010019B2 (ja) * 2010-09-09 2012-08-29 東京エレクトロン株式会社 ステージ
JP5663297B2 (ja) * 2010-12-27 2015-02-04 東京応化工業株式会社 塗布装置
TWI685911B (zh) * 2011-05-13 2020-02-21 日商尼康股份有限公司 物體更換系統、物體更換方法、及曝光裝置
KR102096956B1 (ko) * 2011-12-22 2020-04-06 세메스 주식회사 기판 처리 장치 및 방법
KR102190687B1 (ko) * 2014-12-08 2020-12-15 엘지디스플레이 주식회사 슬릿코터 시스템
JP2018043200A (ja) * 2016-09-15 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
JP6905830B2 (ja) * 2017-01-11 2021-07-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6860357B2 (ja) * 2017-01-20 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
JP6860356B2 (ja) * 2017-01-20 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
CN112566730A (zh) * 2018-08-22 2021-03-26 东京毅力科创株式会社 绘制装置和绘制方法
KR102262080B1 (ko) * 2019-08-22 2021-06-07 세메스 주식회사 기판 처리 장치
JP7520665B2 (ja) * 2020-09-25 2024-07-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
WO2022209197A1 (ja) * 2021-03-31 2022-10-06 東京エレクトロン株式会社 塗布処理装置、塗布処理方法および塗布処理プログラム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455347A (ja) * 1990-06-20 1992-02-24 Konica Corp 油性樹脂溶液の塗布方法及び装置
JP2002346463A (ja) * 2001-05-24 2002-12-03 Toppan Printing Co Ltd 単板塗布装置
JP2003290697A (ja) * 2002-04-02 2003-10-14 Toppan Printing Co Ltd 単板連続塗布装置
WO2003086917A1 (fr) * 2002-04-18 2003-10-23 Olympus Corporation Dispositif de transport de substrat

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273714A (ja) 2003-03-07 2004-09-30 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455347A (ja) * 1990-06-20 1992-02-24 Konica Corp 油性樹脂溶液の塗布方法及び装置
JP2002346463A (ja) * 2001-05-24 2002-12-03 Toppan Printing Co Ltd 単板塗布装置
JP2003290697A (ja) * 2002-04-02 2003-10-14 Toppan Printing Co Ltd 単板連続塗布装置
WO2003086917A1 (fr) * 2002-04-18 2003-10-23 Olympus Corporation Dispositif de transport de substrat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008029938A (ja) * 2006-07-27 2008-02-14 Tokyo Electron Ltd 塗布方法及び塗布装置

Also Published As

Publication number Publication date
KR20060097659A (ko) 2006-09-14
TW200727338A (en) 2007-07-16
KR20110131149A (ko) 2011-12-06
TWI305659B (en) 2009-01-21
JP2006253373A (ja) 2006-09-21
KR101154756B1 (ko) 2012-06-08
KR101188077B1 (ko) 2012-10-08

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