TW200727338A - Substrate processing apparatus and substrate processing method and substrate processing program - Google Patents
Substrate processing apparatus and substrate processing method and substrate processing programInfo
- Publication number
- TW200727338A TW200727338A TW095108195A TW95108195A TW200727338A TW 200727338 A TW200727338 A TW 200727338A TW 095108195 A TW095108195 A TW 095108195A TW 95108195 A TW95108195 A TW 95108195A TW 200727338 A TW200727338 A TW 200727338A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate processing
- area
- substrate
- coating
- stage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The stage 76 is divided into five areas that are the carrying-in area M1, the changes area M2, the coating area M3, the changes area M4, and the taking-out area M5 in the direction of a long neighborhood (X directions). The coating area M3 is making the blowing port 88 of positive pressure, and the suction port 90 of negative pressure intermingled, and can hold the surfacing altitude Hb of the substrate G to a setting value in high accuracy. In case the substrate G passes through this coating area M3, the resist liquid R is supplied on it from the upper resist nozzle 78. The resist nozzle 78 has the nozzle body of a long shape prolonged in the direction of Y by the length which can cover the substrate G on a stage 76 from an end to other ends, and moves in the opposite direction from the 1st position to the 2nd position with the conveyance direction of the substrate G at the time of coating process.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005067082A JP4571525B2 (en) | 2005-03-10 | 2005-03-10 | Substrate processing apparatus and substrate processing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200727338A true TW200727338A (en) | 2007-07-16 |
TWI305659B TWI305659B (en) | 2009-01-21 |
Family
ID=37093541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095108195A TWI305659B (en) | 2005-03-10 | 2006-03-10 | Substrate processing apparatus and substrate processing method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4571525B2 (en) |
KR (2) | KR101154756B1 (en) |
TW (1) | TWI305659B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI661505B (en) * | 2010-02-17 | 2019-06-01 | 日商尼康股份有限公司 | Transfer device, transfer method, exposure device, and component manufacturing method |
TWI685911B (en) * | 2011-05-13 | 2020-02-21 | 日商尼康股份有限公司 | Object exchange system, object exchange method, and exposure apparatus |
TWI807413B (en) * | 2020-09-25 | 2023-07-01 | 日商斯庫林集團股份有限公司 | Substrate processing method |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4884871B2 (en) * | 2006-07-27 | 2012-02-29 | 東京エレクトロン株式会社 | Coating method and coating apparatus |
JP4318714B2 (en) * | 2006-11-28 | 2009-08-26 | 東京エレクトロン株式会社 | Coating device |
JP2009018917A (en) * | 2007-07-12 | 2009-01-29 | Tokyo Ohka Kogyo Co Ltd | Application device, substrate delivery method and application method |
KR100874611B1 (en) | 2007-08-13 | 2008-12-17 | 주식회사 케이씨텍 | The meathod of multi layer coatings |
KR100891723B1 (en) * | 2007-09-19 | 2009-04-03 | 주식회사 엠엠티 | Non-Contact Panel Cleaning Apparatus |
JP4495752B2 (en) | 2007-11-06 | 2010-07-07 | 東京エレクトロン株式会社 | Substrate processing apparatus and coating apparatus |
JP2010034309A (en) * | 2008-07-29 | 2010-02-12 | Dainippon Screen Mfg Co Ltd | Coating apparatus and substrate processing system |
KR101341013B1 (en) * | 2008-09-04 | 2013-12-13 | 엘지디스플레이 주식회사 | Washing device |
JP4787872B2 (en) * | 2008-10-16 | 2011-10-05 | 東京エレクトロン株式会社 | Substrate transfer processing equipment |
KR101071583B1 (en) | 2009-08-21 | 2011-10-10 | 주식회사 케이씨텍 | Inline type substrate coater apparatus |
KR101051767B1 (en) * | 2009-09-01 | 2011-07-25 | 주식회사 케이씨텍 | Floating Board Coater Device |
JP5010019B2 (en) * | 2010-09-09 | 2012-08-29 | 東京エレクトロン株式会社 | stage |
JP5663297B2 (en) * | 2010-12-27 | 2015-02-04 | 東京応化工業株式会社 | Coating device |
KR102096956B1 (en) * | 2011-12-22 | 2020-04-06 | 세메스 주식회사 | Apparatus and Method for treating substrate |
KR102190687B1 (en) * | 2014-12-08 | 2020-12-15 | 엘지디스플레이 주식회사 | slit coaster system |
JP2018043200A (en) * | 2016-09-15 | 2018-03-22 | 株式会社Screenホールディングス | Coating applicator and application method |
JP6905830B2 (en) * | 2017-01-11 | 2021-07-21 | 株式会社Screenホールディングス | Substrate processing equipment and substrate processing method |
JP6860357B2 (en) * | 2017-01-20 | 2021-04-14 | 株式会社Screenホールディングス | Coating device and coating method |
JP6860356B2 (en) * | 2017-01-20 | 2021-04-14 | 株式会社Screenホールディングス | Coating device and coating method |
CN112566730A (en) * | 2018-08-22 | 2021-03-26 | 东京毅力科创株式会社 | Drawing device and drawing method |
KR102262080B1 (en) * | 2019-08-22 | 2021-06-07 | 세메스 주식회사 | Apparatus for treating substrate |
WO2022209197A1 (en) * | 2021-03-31 | 2022-10-06 | 東京エレクトロン株式会社 | Coating processing device, coating processing method, and coating processing program |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0455347A (en) * | 1990-06-20 | 1992-02-24 | Konica Corp | Method and device for applying oily resin solution |
JP2002346463A (en) * | 2001-05-24 | 2002-12-03 | Toppan Printing Co Ltd | Sheet glass coating device |
JP2003290697A (en) * | 2002-04-02 | 2003-10-14 | Toppan Printing Co Ltd | Device for continuously coating single sheet |
TWI226303B (en) * | 2002-04-18 | 2005-01-11 | Olympus Corp | Substrate carrying device |
JP2004273714A (en) | 2003-03-07 | 2004-09-30 | Tokyo Electron Ltd | Equipment and method for substrate treatment |
-
2005
- 2005-03-10 JP JP2005067082A patent/JP4571525B2/en active Active
-
2006
- 2006-03-09 KR KR1020060022159A patent/KR101154756B1/en active IP Right Grant
- 2006-03-10 TW TW095108195A patent/TWI305659B/en active
-
2011
- 2011-10-24 KR KR1020110108796A patent/KR101188077B1/en active IP Right Grant
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI661505B (en) * | 2010-02-17 | 2019-06-01 | 日商尼康股份有限公司 | Transfer device, transfer method, exposure device, and component manufacturing method |
TWI777060B (en) * | 2010-02-17 | 2022-09-11 | 日商尼康股份有限公司 | Conveyor device, exposure device, and device manufacturing method |
TWI685911B (en) * | 2011-05-13 | 2020-02-21 | 日商尼康股份有限公司 | Object exchange system, object exchange method, and exposure apparatus |
TWI739271B (en) * | 2011-05-13 | 2021-09-11 | 日商尼康股份有限公司 | Object holding apparatus, object exchange system, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
TWI807413B (en) * | 2020-09-25 | 2023-07-01 | 日商斯庫林集團股份有限公司 | Substrate processing method |
US11742211B2 (en) | 2020-09-25 | 2023-08-29 | SCREEN Holdings Co., Ltd. | Substrate processing method |
Also Published As
Publication number | Publication date |
---|---|
KR20060097659A (en) | 2006-09-14 |
KR20110131149A (en) | 2011-12-06 |
JP4571525B2 (en) | 2010-10-27 |
TWI305659B (en) | 2009-01-21 |
JP2006253373A (en) | 2006-09-21 |
KR101154756B1 (en) | 2012-06-08 |
KR101188077B1 (en) | 2012-10-08 |
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