JP4486896B2 - 微小電子接触構造体 - Google Patents
微小電子接触構造体 Download PDFInfo
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- 238000004377 microelectronic Methods 0.000 title description 5
- 239000010410 layer Substances 0.000 claims description 123
- 239000000463 material Substances 0.000 claims description 89
- 239000000758 substrate Substances 0.000 claims description 47
- 239000000523 sample Substances 0.000 claims description 32
- 238000000576 coating method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 239000010948 rhodium Substances 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 1
- 238000000034 method Methods 0.000 description 46
- 230000008569 process Effects 0.000 description 41
- 238000004519 manufacturing process Methods 0.000 description 39
- 238000003825 pressing Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- -1 rods Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
図12は、上記のような接触構造体の例示的な応用を図解する。図12に示すように、押圧された場合に(先に議論したように)、好ましくは回転する形式である接触構造体1600のアレイが、保持基板1610の貫通孔部1604に組み込まれている。また図12に示すように、接触構造体1600の基部端部は、ハンダ1622又は他の手段(例えば鑞付け、溶接、付着など)により間隔変換器基板1620のパッド1624に固着されている。示すように、間隔変換器基板1620は、対応するパッド1628及び導電性の相互接続1626を有し、相互接続はパッド1624をパッド1628に電気的に接続する。間隔変換器基板1620は、それ自体より大きな装置内に組み込まれている。例えば間隔変換器基板1620は、米国特許第5,974,662号の図5の間隔変換器506を置換可能であり、この特許は参照することにより、その内容を全て本発明に取り入れることとする。保持基板1610は、取付用金具、留め金、付着材料、等を含む任意の好適な手段により、間隔変換器基板1620に固着される。また複数の保持基板1610は、接触構造体1600の多数のアレイを形成するように1つの間隔変換器基板1620に固着される。加えて貫通孔部が導電性材料によって随意的に被覆される。したがって上述したように、接触構造体1600は、随意的に屈曲するように設計され、貫通孔部の導電性の側面と接触して、接触構造体を介する電気抵抗を低減させる可能性がある。
Claims (28)
- 中央の細長い軸に沿って配置されている細長い柱状の微小機械構造体であって、
前記構造体は、
各層が構造材料からなる複数の積層された構造層であって、各層は、遠位端部および近接端部において互いに積層されている、構造層と、
前記構造体の近接端部の実質上剛直な基部部分と、
前記中央の軸に沿って、前記基部部分から延伸する弾力性を有する中間部分であって、前記弾力性を有する部分は、前記複数の層の少なくとも2つに画定されている複数のアームからなる、中間部分と、
前記構造体の遠位端部の、前記弾力性を有する部分から延伸する接触先端と
を含み、
前記基部は、前記複数の層の少なくとも中間層と外側層とからなり、
前記アームは、前記外側層に画定され、前記弾力性を有する中間部分の外側層は、互いに独立して移動する、構造体。 - 前記複数のアームのそれぞれが、前記基部部分に取り付けられている第1端部と前記接触先端に取り付けられている第2端部とを有する、請求項1に記載の構造体。
- 前記複数のアームのそれぞれの前記第2端部が、その対応する第1端部に関して前記中央の軸の周りに配置され、前記構造体がその中央の軸の方向に押圧されたときに、前記接触先端が前記基部部分に対して前記中央の軸の周りを回転する、請求項2に記載の構造体。
- 前記複数のアームのそれぞれの前記第2端部が、前記中央の軸に関してその対応する第1端部と位置合わせされ、前記構造体がその中央の軸の方向に押圧されたときに、前記接触先端が前記基部部分に対して前記中央の軸の周りを回転しない、請求項2に記載の構造体。
- 前記複数のアームのそれぞれが、前記複数の層の外側層に画定され、その1つの層に前記第1端部と前記第2端部とを有する、請求項2に記載の構造体。
- 前記複数のアームのそれぞれが、前記外側層の1つの層に画定され、その1つの層に前記第1端部と前記第2端部とを有する、請求項2に記載の構造体。
- 前記複数のアームのそれぞれが、前記複数の層の対向する外側層に画定され、各アームが、前記外側層の一方の層に前記第1端部を、前記外側層の対向する層に前記第2端部を有する、請求項2に記載の構造体。
- 前記複数のアームのそれぞれが、前記外側層の一方の層を前記外側層の対向する層に接続する中央層の部分をさらに含む、請求項7に記載の構造体。
- 前記複数のアームのそれぞれが、前記外側層の一方の層を前記外側層の対向する層に接続する接合部分をさらに含む、請求項7に記載の構造体。
- 前記複数のアームが二重螺旋形状を画定する、請求項1に記載の構造体。
- 前記複数の層のそれぞれが、パターン形成された犠牲層上に構造材料を付着することと、前記犠牲層を除去することとにより形成されている、請求項1に記載の構造体。
- 前記弾力性を有する部分の前記複数のアームが曲がりくねった形状を有する、請求項1に記載の構造体。
- 前記複数の層の外側層が、前記基部部分と前記接触先端の間の中間の前記弾力性を有する部分において、一点で互いに接続されている、請求項1に記載の構造体。
- 前記接触先端が前記複数の層の本質的に剛直な積層を含む、請求項1に記載の構造体。
- 前記複数の層のそれぞれが、ニッケル、コバルト、およびこれらの合金から選択された材料を含む、請求項1に記載の構造体。
- 前記構造体を概して被覆する導電性材料の被覆をさらに含む、請求項1に記載の構造体。
- 探針装置であって、
前記探針装置は、
軸に沿って配置されているタイプの複数の接触プローブであって、
前記複数の接触プローブのそれぞれは、
接触部分において互いに積層された複数の層と、
基部部分と、
前記接触部分と前記基部部分の間に配置されている弾力性を有する部分と
を含み、前記弾力性を有する部分が複数のアームを含み、前記接触部分および前記基部部分のそれぞれは、2つの外側層が前記弾力性を有する部分において互いに独立して移動するように、前記2つの外側層の間に間隔を提供するスペーサ層を含み、前記接触プローブは、押圧されたときに前記基部部分に対して前記接触部分をツイストするように構成されている、複数の接触プローブと、
前記複数の接触プローブが挿入されている貫通孔部を有する基板であって、前記接触部分の少なくとも一部分が前記貫通孔部から外に延伸するように、前記接触プローブのそれぞれの弾力性を有する部分が前記接触部分を付勢する、基板と
を含む、探針装置。 - 前記貫通孔部がねじ山を付けられ、前記接触プローブのそれぞれの前記接触部分が、前記貫通孔部のねじ山と可動の係合をするねじ係合構造をさらに含む、請求項17に記載の探針装置。
- 前記接触プローブのそれぞれが、前記基板の表面に対して配置されているアンカー部をさらに含む、請求項17に記載の探針装置。
- 前記貫通孔部のそれぞれがねじ山のついた管状部を含む、請求項17に記載の探針装置。
- 前記ねじ山のついた管状部のそれぞれがロジウムを含む、請求項20に記載の探針装置。
- 各接触構造の軸は、前記接触部分、前記基部部分、および前記接触構造の前記弾力性を有する部分を通り、各接触プローブは、前記接触構造の前記軸に関してツイストするように構成されている、請求項17に記載の探針装置。
- 探針装置であって、
前記探針装置は、
軸に沿って配置されているタイプの複数の接触プローブであって、前記複数の接触プローブのそれぞれは、
複数の積層された構造層と、
前記構造層に画定された接触部分と、
前記構造層に画定された基部部分と、
前記接触部分と前記基部部分との間に配置された弾力性を有する部分と
を含み、前記弾力性を有する部分は、前記複数の層のうちの少なくとも2つに画定された複数のアームを含み、前記層は、前記弾力性を有する部分において独立して移動可能である、複数の接触プローブと、
前記複数の接触プローブが挿入されている貫通孔部を有する基板であって、前記接触部分の少なくとも一部分が前記貫通孔部から外に延伸するように、前記接触プローブのそれぞれの前記弾力性を有する部分が前記接触部分を付勢する、基板と
を含む、探針装置。 - 前記複数のアームのそれぞれは、前記基部部分に取り付けられている第1端部と、前記接触部分に取り付けられている第2端部とを含み、前記複数のアームのそれぞれの前記第2端部は、その対応する第1端部に関して前記軸の周りに配置され、前記接触プローブが押圧されたときに、前記接触部分が前記基部部分に対して前記軸の周りを回転する、請求項17に記載の探針装置。
- 前記接触プローブのそれぞれは、複数の積層された構造層を含み、
前記接触部分は、前記積層された構造層に画定され、
前記基部部分は、前記積層された構造層に画定され、
前記複数のアームは、前記複数の層のうちの少なくとも2つに画定される、請求項17に記載の装置。 - 前記接触部分は、前記構造層の全てに画定され、
前記基部部分は、前記構造層の全てに画定され、
前記弾力性を有する部分の前記アームのそれぞれは、前記構造層のうちの全てよりも少ない構造層に画定される、請求項25に記載の装置。 - 前記接触プローブは、押圧されたときに前記接触部分をツイストするように構成されている、請求項23に記載の装置。
- 前記接触部分は、前記構造層の全てに画定され、
前記基部部分は、前記構造層の全てに画定され、
前記弾力性を有する部分の前記アームのそれぞれは、前記構造層のうちの全てよりも少ない構造層に画定される、請求項23に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/328,083 US6945827B2 (en) | 2002-12-23 | 2002-12-23 | Microelectronic contact structure |
PCT/US2003/040829 WO2004059330A2 (en) | 2002-12-23 | 2003-12-18 | Microelectronic contact structure |
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JP2006511804A JP2006511804A (ja) | 2006-04-06 |
JP2006511804A5 JP2006511804A5 (ja) | 2009-02-19 |
JP4486896B2 true JP4486896B2 (ja) | 2010-06-23 |
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JP2004563896A Expired - Lifetime JP4486896B2 (ja) | 2002-12-23 | 2003-12-18 | 微小電子接触構造体 |
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---|---|
US (2) | US6945827B2 (ja) |
EP (1) | EP1579225A2 (ja) |
JP (1) | JP4486896B2 (ja) |
KR (1) | KR101037305B1 (ja) |
CN (1) | CN100414301C (ja) |
AU (1) | AU2003299786A1 (ja) |
WO (1) | WO2004059330A2 (ja) |
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- 2003-12-18 WO PCT/US2003/040829 patent/WO2004059330A2/en active Application Filing
- 2003-12-18 CN CNB2003801093003A patent/CN100414301C/zh not_active Expired - Fee Related
- 2003-12-18 EP EP03800059A patent/EP1579225A2/en not_active Withdrawn
- 2003-12-18 AU AU2003299786A patent/AU2003299786A1/en not_active Abandoned
- 2003-12-18 KR KR1020057011866A patent/KR101037305B1/ko not_active IP Right Cessation
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2005
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Also Published As
Publication number | Publication date |
---|---|
AU2003299786A1 (en) | 2004-07-22 |
WO2004059330A3 (en) | 2004-11-18 |
US20070270041A1 (en) | 2007-11-22 |
WO2004059330A2 (en) | 2004-07-15 |
US20040121627A1 (en) | 2004-06-24 |
CN100414301C (zh) | 2008-08-27 |
JP2006511804A (ja) | 2006-04-06 |
EP1579225A2 (en) | 2005-09-28 |
KR20050094412A (ko) | 2005-09-27 |
US6945827B2 (en) | 2005-09-20 |
CN1745306A (zh) | 2006-03-08 |
US7731546B2 (en) | 2010-06-08 |
KR101037305B1 (ko) | 2011-05-27 |
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