JP4451429B2 - 洗浄装置 - Google Patents
洗浄装置 Download PDFInfo
- Publication number
- JP4451429B2 JP4451429B2 JP2006282365A JP2006282365A JP4451429B2 JP 4451429 B2 JP4451429 B2 JP 4451429B2 JP 2006282365 A JP2006282365 A JP 2006282365A JP 2006282365 A JP2006282365 A JP 2006282365A JP 4451429 B2 JP4451429 B2 JP 4451429B2
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- Japan
- Prior art keywords
- cleaning
- wafer
- processed
- holding
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004140 cleaning Methods 0.000 title claims description 156
- 238000012545 processing Methods 0.000 claims description 160
- 239000000758 substrate Substances 0.000 claims description 97
- 230000002093 peripheral effect Effects 0.000 claims description 70
- 239000010409 thin film Substances 0.000 claims description 17
- 238000005406 washing Methods 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 description 184
- 238000012546 transfer Methods 0.000 description 79
- 238000000034 method Methods 0.000 description 26
- 230000008569 process Effects 0.000 description 23
- 239000007788 liquid Substances 0.000 description 22
- 239000002002 slurry Substances 0.000 description 17
- 239000000126 substance Substances 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 238000005498 polishing Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
Images
Landscapes
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
33 保持装置
34 両面洗浄装置
90 周縁部洗浄手段
91 軸部
92 洗浄具
922 ブラシ毛
93 回転駆動部
100 基板処理装置
200 CMP装置
W ウエハ
Claims (7)
- 薄板状の被処理体を処理する洗浄装置において、
前記被処理体の端部を洗浄する略円錐状の傾斜側面を有する洗浄部を有する周縁部洗浄手段と、
前記周縁部洗浄手段を被処理体の端部に当接させる移動手段と、
前記被処理体を保持した状態で前記被処理体を回転させる第1回転駆動部と、
を有し、
前記周縁部洗浄手段の前記洗浄部は、一体形成されたPVAのスポンジ体により形成され、
前記移動手段は被処理体の端部を周縁部洗浄手段の前記スポンジ体により形成された前記傾斜側面に当接させ、
前記スポンジ体に押圧されて、前記第1駆動部により回転される被処理体の一方の面及び端面が同時に洗浄され、
更に、前記周縁部洗浄手段は、被処理体の周縁に1個配置されていることを特徴とする洗浄装置。 - 請求項1に記載の洗浄装置において、
前記周縁部洗浄手段を回転させる第2回転駆動部を有することを特徴とする洗浄装置。 - 請求項2に記載の洗浄装置において、
前記第1回転駆動部は、前記被処理体の周縁部を保持しつつ前記被処理体を回転させ、
前記第1回転駆動部と前記第2回転駆動部とを反対方向に回転させる第1制御手段を更に有することを特徴とする洗浄装置。 - 請求項2に記載の洗浄装置において、
前記第1回転駆動部は、前記被処理体の周縁部を保持しつつ前記被処理体を回転させ、
前記第1回転駆動部と前記第2回転駆動部とを同方向に回転させる第1制御手段を更に有することを特徴とする洗浄装置。 - 請求項4に記載の洗浄装置において、
前記第1回転駆動部と前記第2回転駆動部とは、前記被処理体と前記周縁部洗浄手段とを同方向に異なる回転速度で回転させることを特徴とする洗浄装置。 - 請求項2から請求項5までのいずれかに記載の洗浄装置において、
前記第2回転駆動部は、前記被処理体の主面に垂直な軸を中心として前記周縁部洗浄手段を回転させることを特徴とする洗浄装置。 - 請求項1から請求項6までのいずれかに記載の洗浄装置において、
前記被処理体は、薄膜が形成された表面を研磨する加工処理がされた基板であることを特徴とする洗浄装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006282365A JP4451429B2 (ja) | 2006-10-17 | 2006-10-17 | 洗浄装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006282365A JP4451429B2 (ja) | 2006-10-17 | 2006-10-17 | 洗浄装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000027848A Division JP3892635B2 (ja) | 2000-02-04 | 2000-02-04 | 洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007044693A JP2007044693A (ja) | 2007-02-22 |
JP4451429B2 true JP4451429B2 (ja) | 2010-04-14 |
Family
ID=37847988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006282365A Expired - Lifetime JP4451429B2 (ja) | 2006-10-17 | 2006-10-17 | 洗浄装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4451429B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4928343B2 (ja) | 2007-04-27 | 2012-05-09 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US20110296634A1 (en) * | 2010-06-02 | 2011-12-08 | Jingdong Jia | Wafer side edge cleaning apparatus |
US10229842B2 (en) * | 2013-07-26 | 2019-03-12 | Applied Materials, Inc. | Double sided buff module for post CMP cleaning |
CN111671944A (zh) * | 2020-06-18 | 2020-09-18 | 鹤壁市人民医院 | 一种用于内分泌检查医疗器的消毒装置 |
KR102590328B1 (ko) * | 2020-12-24 | 2023-10-16 | 세메스 주식회사 | 기판 파지 장치 및 이를 포함하는 액 처리 장치, 및 기판 처리 설비 |
CN113458050B (zh) * | 2021-07-13 | 2022-04-26 | 深圳市本广德科技有限公司 | 一种升降式具有清洁功能的广告调节夹 |
-
2006
- 2006-10-17 JP JP2006282365A patent/JP4451429B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
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JP2007044693A (ja) | 2007-02-22 |
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