JP4392015B2 - ワイヤボンディング装置 - Google Patents
ワイヤボンディング装置 Download PDFInfo
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- JP4392015B2 JP4392015B2 JP2006314431A JP2006314431A JP4392015B2 JP 4392015 B2 JP4392015 B2 JP 4392015B2 JP 2006314431 A JP2006314431 A JP 2006314431A JP 2006314431 A JP2006314431 A JP 2006314431A JP 4392015 B2 JP4392015 B2 JP 4392015B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H01L2224/7825—Means for applying energy, e.g. heating means
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85053—Bonding environment
- H01L2224/85054—Composition of the atmosphere
- H01L2224/85075—Composition of the atmosphere being inert
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
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- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- Engineering & Computer Science (AREA)
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Description
前記内部空間に繋げられ、前記酸化防止ガスを通す多孔質部材と、
ワイヤを繰り出すキャピラリと、
前記内部空間に先端が配置され、前記キャピラリから繰り出されたワイヤにスパークさせるスパークロッドと、
を具備し、
前記多孔質部材を通した前記酸化防止ガスによって前記内部空間を満たしながら、前記キャピラリから繰り出されたワイヤの先端を前記内部空間に位置させ、前記スパークロッドの先端から前記ワイヤの先端にスパークさせることによりフリーエアボールを形成することを特徴とする。
(実施の形態1)
図1は、本発明の実施の形態1によるワイヤボンディング装置を模式的に示す図である。図2(A)は、本発明の実施の形態1によるワイヤボンディング装置の超音波ホーン、キャピラリ、スパークロッド及びガスカバーを示す斜視図であり、図2(B)は、図2(A)に示すスパークロッド及びガスカバーを分解した斜視図である。図3(A)は、図2(A)に示すガスカバーの断面を示す図であり、図3(B)は、図3(A)に示す多孔質部材を上方から視た平面図である。
図4(A)は、本発明の実施の形態2によるワイヤボンディング装置のガスカバーの断面を示す図であり、図4(B)は、図4(A)に示す多孔質部材とキャビティーを示す平面図である。図4において図3と同一部分には同一符号を付し、実施の形態1と異なる部分についてのみ説明する。
図5は、本発明の実施の形態3によるワイヤボンディング装置のガスカバーを示す斜視図である。図6は、図5に示すガスカバーの断面を示す図である。図5及び図6において図4と同一部分には同一符号を付し、実施の形態2と異なる部分についてのみ説明する。
また、上記実施の形態3では、パイプ状のガスカバー19を用いているため、ガスカバー19を作製する際の加工が実施の形態2に比べて容易であるという利点がある。
図7は、本発明の実施の形態4によるワイヤボンディング装置のガスカバーを示す斜視図である。図8は、図7に示すガスカバーの断面を示す図である。図7及び図8において図3と同一部分には同一符号を付し、実施の形態1と異なる部分についてのみ説明する。
また、上記実施の形態4では、パイプ状のガスカバー29を用いているため、ガスカバー19を作製する際の加工が実施の形態1に比べて容易であるという利点がある。
2…スパークロッド
2a…スパークロッドの先端
3…右ガスノズル
4…銅ワイヤ
4a…銅ワイヤの先端
5…ガス閉じ込めチューブ
6…上部インラインオリフィス
7…下部インラインオリフィス
8…超音波ホーン
9,19,29…ガスカバー
10a…上部穴
10b…下部穴
11…ガス通路
11a…ガス流入口
12,22,32,42…多孔質部材
12a,42a…第1の貫通孔
12b,42b…第2の貫通孔
13…XYステージ
14…スパークジェネレータ
15…超音波制御回路
16…モータ制御回路1
17…ボンディングアーム
18…キャビティー
19…ガスノズル
20…モータ制御回路2
21…ボンディングヘッド
Claims (4)
- 酸化防止ガスで満たすための内部空間を有するガスカバーと、
前記内部空間に繋げられ、前記酸化防止ガスを通す多孔質部材と、
ワイヤを繰り出すキャピラリと、
前記内部空間に先端が配置され、前記キャピラリから繰り出されたワイヤにスパークさせるスパークロッドと、
を具備し、
前記多孔質部材を通した前記酸化防止ガスによって前記内部空間を満たしながら、前記キャピラリから繰り出されたワイヤの先端を前記内部空間に位置させ、前記スパークロッドの先端から前記ワイヤの先端にスパークさせることにより偏芯の発生を抑制したフリーエアボールを形成することを特徴とするワイヤボンディング装置。 - 前記ガスカバーに設けられ、前記内部空間の上部に位置する上部穴と、前記ガスカバーに設けられ、前記内部空間の下部に位置し且つ前記上部穴に対向するように配置された下部穴と、前記上部穴、前記内部空間及び前記下部穴を前記キャピラリが通過するように前記キャピラリを移動させる機構と、をさらに具備することを特徴とする請求項1に記載のワイヤボンディング装置。
- 前記酸化防止ガスは、前記多孔質部材を通って前記内部空間に導入され、前記内部空間を満たした前記酸化防止ガスは、前記上部穴及び前記下部穴から前記ガスカバーの外部に排出されることを特徴とする請求項2に記載のワイヤボンディング装置。
- 前記多孔質部材は、前記内部空間の周囲を覆うように形成されていることを特徴とする請求項1乃至3のいずれか一項に記載のワイヤボンディング装置。
Priority Applications (1)
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JP2006314431A JP4392015B2 (ja) | 2006-11-21 | 2006-11-21 | ワイヤボンディング装置 |
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JP2006314431A JP4392015B2 (ja) | 2006-11-21 | 2006-11-21 | ワイヤボンディング装置 |
Publications (2)
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JP2008130825A JP2008130825A (ja) | 2008-06-05 |
JP4392015B2 true JP4392015B2 (ja) | 2009-12-24 |
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JP2006314431A Active JP4392015B2 (ja) | 2006-11-21 | 2006-11-21 | ワイヤボンディング装置 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5753644B2 (ja) | 2008-06-10 | 2015-07-22 | クリック アンド ソッファ インダストリーズ、インク. | ワイヤーボンディング作業における酸化軽減のためのガス配送システム |
JP4817341B2 (ja) * | 2009-08-13 | 2011-11-16 | 株式会社カイジョー | ワイヤボンディング装置 |
JP2012244093A (ja) | 2011-05-24 | 2012-12-10 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP5618974B2 (ja) | 2011-08-16 | 2014-11-05 | 株式会社新川 | ワイヤボンディング装置 |
JP5592029B2 (ja) * | 2012-01-26 | 2014-09-17 | 株式会社新川 | 酸化防止ガス吹き出しユニット |
JP2014075519A (ja) | 2012-10-05 | 2014-04-24 | Shinkawa Ltd | 酸化防止ガス吹き出しユニット |
JP5916814B2 (ja) * | 2014-08-06 | 2016-05-11 | 株式会社カイジョー | ボンディング方法及びボンディング装置 |
JP6467281B2 (ja) | 2015-04-30 | 2019-02-13 | 日鉄マイクロメタル株式会社 | ボンディングワイヤのボール形成方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS60244034A (ja) * | 1984-05-18 | 1985-12-03 | Mitsubishi Electric Corp | ワイヤボンデイング用雰囲気形成装置 |
JPH10193125A (ja) * | 1997-01-14 | 1998-07-28 | Nippon Light Metal Co Ltd | 溶極式溶接機の溶接トーチ |
JP2004034811A (ja) * | 2002-07-02 | 2004-02-05 | Hino Motors Ltd | キャブティルト装置 |
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