JP5618974B2 - ワイヤボンディング装置 - Google Patents
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- JP5618974B2 JP5618974B2 JP2011278335A JP2011278335A JP5618974B2 JP 5618974 B2 JP5618974 B2 JP 5618974B2 JP 2011278335 A JP2011278335 A JP 2011278335A JP 2011278335 A JP2011278335 A JP 2011278335A JP 5618974 B2 JP5618974 B2 JP 5618974B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/16—Arc welding or cutting making use of shielding gas
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Description
Claims (9)
- 半導体チップの電極と基板の電極との間をワイヤによって接続するワイヤボンディング装置であって、
前記ワイヤを前記各電極に接合するボンディングツールと、
前記ボンディングツールの先端が抜き差しされる貫通穴が設けられた水平板と、
前記水平板の上面に沿って前記貫通穴の中心に向って酸化防止ガスを吹き出す第1の酸化防止ガス流路と、
前記水平板の上面に沿って前記貫通穴の中心に向って前記第1の酸化防止ガス流路と交差する方向から酸化防止ガスを吹き出す第2の酸化防止ガス流路と、を備え、
前記水平板の前記各酸化防止ガス流路が配置されていない領域は、前記水平板上面の気体が前記水平板の縁の外側に流出できるように開放されていること、
を特徴とするワイヤボンディング装置。 - 請求項1に記載のワイボンディング装置であって、
前記第1の酸化防止ガス流路の吹き出し口の周縁と、前記第2の酸化防止ガス流路の吹き出し口の周縁と、前記各吹き出し口の各周縁の間とには、その近傍に酸化防止ガスが滞留するように前記水平板の上面に設けられた壁面が延びていること、
を特徴とするワイヤボンディング装置。 - 請求項2に記載のワイボンディング装置であって、
前記壁面は、前記水平板に設けられた前記貫通穴の周縁から離間して設けられていること、
を特徴とするワイヤボンディング装置。 - 請求項2または3に記載のワイヤボンディング装置であって、
前記各酸化防止ガス流路の前記各吹き出し口に接続する部分は、それぞれ前記水平板の上面に沿って延びる直線管路であり、
前記各直線管路の内部には、酸化防止ガスの偏流を抑制するガイドベーンがそれぞれ設けられていること、
を特徴とするワイヤボンディング装置。 - 請求項4に記載のワイヤボンディング装置であって、
前記各ガイドベーンは、平板を十字形に組み合わせて前記直線管路の断面を4つのセクションに区分し、
前記平板は、前記水平板の上面に対して傾斜して配置されていること、
を特徴とするワイヤボンディング装置。 - 請求項1から3のいずれか1項に記載のワイヤボンディング装置であって、
前記水平板の下面から斜め下方向に向かって前記貫通穴の中心に酸化防止ガスを吹き出す第3の酸化防止ガス流路と、を備えること、
を特徴とするワイヤボンディング装置。 - 請求項6に記載のワイヤボンディング装置であって、
前記第1の酸化防止ガス流路と、前記第2の酸化防止ガス流路と、前記第3の酸化防止ガス流路と、前記水平板とは、共通の基体部に設けられ、
前記基体部は、前記第1の酸化防止ガス流路の吹き出し口の周縁と、前記第2の酸化防止ガス流路の吹き出し口の周縁と、前記各吹き出し口の各周縁の間で、前記水平板の上面に配置され、その近傍に酸化防止ガスが滞留する壁面を有していること、
を特徴とするワイヤボンディング装置。 - 請求項6または7に記載のワイヤボンディング装置であって、
前記第3の酸化防止ガス流路は、前記ボンディングツールの先端に向かって酸化防止ガスを吹き出すこと、
を特徴とするワイヤボンディング装置。 - 請求項1から8のいずれか1項に記載のワイヤボンディング装置であって、
前記第1、第2の各酸化防止ガス流路のいずれか一方の酸化防止ガス流路の吹き出し口から前記水平板の前記貫通穴に向かって延び、前記ボンディングツール先端に延出したワイヤとの間にスパークを発生させてフリーエアーボールを形成するトーチ電極が設けられていること、
を特徴とするワイヤボンディング装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011278335A JP5618974B2 (ja) | 2011-08-16 | 2011-12-20 | ワイヤボンディング装置 |
CN201280039641.7A CN103975426B (zh) | 2011-08-16 | 2012-05-30 | 打线装置 |
SG2014005524A SG2014005524A (en) | 2011-08-16 | 2012-05-30 | Wire bonding apparatus |
PCT/JP2012/063844 WO2013024612A1 (ja) | 2011-08-16 | 2012-05-30 | ワイヤボンディング装置 |
KR1020147002374A KR101587569B1 (ko) | 2011-08-16 | 2012-05-30 | 와이어 본딩 장치 |
TW101125757A TWI467676B (zh) | 2011-08-16 | 2012-07-18 | Threading device |
US14/170,745 US20140151341A1 (en) | 2011-08-16 | 2014-02-03 | Wire bonding apparatus |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011178019 | 2011-08-16 | ||
JP2011178019 | 2011-08-16 | ||
JP2011278335A JP5618974B2 (ja) | 2011-08-16 | 2011-12-20 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
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JP2013058716A JP2013058716A (ja) | 2013-03-28 |
JP5618974B2 true JP5618974B2 (ja) | 2014-11-05 |
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ID=47714941
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Application Number | Title | Priority Date | Filing Date |
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JP2011278335A Active JP5618974B2 (ja) | 2011-08-16 | 2011-12-20 | ワイヤボンディング装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140151341A1 (ja) |
JP (1) | JP5618974B2 (ja) |
KR (1) | KR101587569B1 (ja) |
CN (1) | CN103975426B (ja) |
SG (1) | SG2014005524A (ja) |
TW (1) | TWI467676B (ja) |
WO (1) | WO2013024612A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5916814B2 (ja) * | 2014-08-06 | 2016-05-11 | 株式会社カイジョー | ボンディング方法及びボンディング装置 |
US10541223B2 (en) * | 2017-05-05 | 2020-01-21 | Kulicke And Soffa Industries, Inc. | Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines |
TWI677068B (zh) * | 2017-05-24 | 2019-11-11 | 日商新川股份有限公司 | 打線接合裝置 |
JP2020155425A (ja) * | 2017-07-07 | 2020-09-24 | ヤマハモーターロボティクスホールディングス株式会社 | ワイヤボンディング装置 |
CN116000511B (zh) * | 2022-12-26 | 2024-04-09 | 深圳市海志亿半导体工具有限公司 | 一种增强细间距送丝成形效果的劈刀刀头 |
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US2544711A (en) * | 1949-03-26 | 1951-03-13 | Air Reduction | Method and apparatus for welding with gas shields having laminar flow |
US4976393A (en) * | 1986-12-26 | 1990-12-11 | Hitachi, Ltd. | Semiconductor device and production process thereof, as well as wire bonding device used therefor |
US5031821A (en) * | 1988-08-19 | 1991-07-16 | Hitachi, Ltd. | Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method |
JPH03253045A (ja) * | 1990-03-02 | 1991-11-12 | Hitachi Ltd | ワイヤボンディング装置 |
JP3478510B2 (ja) * | 1995-03-17 | 2003-12-15 | 芝浦メカトロニクス株式会社 | ワイヤボンディング装置 |
JP2003037131A (ja) * | 2001-07-25 | 2003-02-07 | Sanyo Electric Co Ltd | ボンディング装置 |
US20070251980A1 (en) * | 2006-04-26 | 2007-11-01 | Gillotti Gary S | Reduced oxidation system for wire bonding |
JP4392015B2 (ja) | 2006-11-21 | 2009-12-24 | 株式会社カイジョー | ワイヤボンディング装置 |
JP4369507B2 (ja) * | 2007-12-07 | 2009-11-25 | 株式会社新川 | ボンディング装置及びボンディング方法 |
JP5753644B2 (ja) * | 2008-06-10 | 2015-07-22 | クリック アンド ソッファ インダストリーズ、インク. | ワイヤーボンディング作業における酸化軽減のためのガス配送システム |
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2011
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2012
- 2012-05-30 SG SG2014005524A patent/SG2014005524A/en unknown
- 2012-05-30 KR KR1020147002374A patent/KR101587569B1/ko active IP Right Grant
- 2012-05-30 WO PCT/JP2012/063844 patent/WO2013024612A1/ja active Application Filing
- 2012-05-30 CN CN201280039641.7A patent/CN103975426B/zh active Active
- 2012-07-18 TW TW101125757A patent/TWI467676B/zh active
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2014
- 2014-02-03 US US14/170,745 patent/US20140151341A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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CN103975426A (zh) | 2014-08-06 |
CN103975426B (zh) | 2017-09-26 |
KR101587569B1 (ko) | 2016-01-21 |
US20140151341A1 (en) | 2014-06-05 |
TWI467676B (zh) | 2015-01-01 |
SG2014005524A (en) | 2014-05-29 |
JP2013058716A (ja) | 2013-03-28 |
WO2013024612A1 (ja) | 2013-02-21 |
KR20140040842A (ko) | 2014-04-03 |
TW201310557A (zh) | 2013-03-01 |
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