JP4324538B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number: JP4324538B2
Authority: JP; Japan
Prior art keywords: substrate; slit nozzle; preliminary; lip; substrate processing
Prior art date: 2004-10-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2004291306A

Other languages

English (en)

Japanese (ja)

Other versions

JP2006108287A (ja

Inventor

善則高木

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Screen Holdings Co Ltd

Dainippon Screen Manufacturing Co Ltd

Original Assignee

Screen Holdings Co Ltd

Dainippon Screen Manufacturing Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-10-04

Filing date

2004-10-04

Publication date

2009-09-02

2004-10-04 Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd

2004-10-04 Priority to JP2004291306A priority Critical patent/JP4324538B2/ja

2005-08-26 Priority to TW094129400A priority patent/TWI263542B/zh

2005-09-28 Priority to KR1020050090231A priority patent/KR100722642B1/ko

2005-09-29 Priority to CNB2005101076795A priority patent/CN100418641C/zh

2005-09-29 Priority to CN2008100913851A priority patent/CN101276148B/zh

2006-04-20 Publication of JP2006108287A publication Critical patent/JP2006108287A/ja

2009-09-02 Application granted granted Critical

2009-09-02 Publication of JP4324538B2 publication Critical patent/JP4324538B2/ja

Status Active legal-status Critical Current

2024-10-04 Anticipated expiration legal-status Critical

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Coating Apparatus (AREA)
Application Of Or Painting With Fluid Materials (AREA)
Materials For Photolithography (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

JP2004291306A 2004-10-04 2004-10-04 基板処理装置および基板処理方法 Active JP4324538B2 (ja)

Priority Applications (5)

Application Number	Priority Date	Filing Date	Title
JP2004291306A JP4324538B2 (ja)	2004-10-04	2004-10-04	基板処理装置および基板処理方法
TW094129400A TWI263542B (en)	2004-10-04	2005-08-26	Apparatus for and method of processing substrate
KR1020050090231A KR100722642B1 (ko)	2004-10-04	2005-09-28	기판 처리 장치 및 기판 처리 방법
CNB2005101076795A CN100418641C (zh)	2004-10-04	2005-09-29	基板处理装置以及基板处理方法
CN2008100913851A CN101276148B (zh)	2004-10-04	2005-09-29	基板处理装置

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2004291306A JP4324538B2 (ja)	2004-10-04	2004-10-04	基板処理装置および基板処理方法

Publications (2)

Publication Number	Publication Date
JP2006108287A JP2006108287A (ja)	2006-04-20
JP4324538B2 true JP4324538B2 (ja)	2009-09-02

Family

ID=36377670

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2004291306A Active JP4324538B2 (ja)	2004-10-04	2004-10-04	基板処理装置および基板処理方法

Country Status (2)

Country	Link
JP (1)	JP4324538B2 (zh)
CN (2)	CN100418641C (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4727203B2 (ja) *	2004-10-18	2011-07-20	大日本スクリーン製造株式会社	基板処理装置
JP5019170B2 (ja) *	2006-05-23	2012-09-05	株式会社ニコン	メンテナンス方法、露光方法及び装置、並びにデバイス製造方法
KR100828665B1 (ko) *	2006-12-28	2008-05-09	주식회사 디엠에스	유체 분사노즐
KR200456618Y1 (ko) *	2007-05-07	2011-11-09	주식회사 케이씨텍	슬릿 코터용 예비토출장치
JP5028195B2 (ja) *	2007-09-10	2012-09-19	大日本スクリーン製造株式会社	基板処理装置および基板処理方法
JP2010240550A (ja) *	2009-04-03	2010-10-28	Dainippon Screen Mfg Co Ltd	基板処理装置
JP2011082230A (ja) *	2009-10-05	2011-04-21	Dainippon Screen Mfg Co Ltd	基板塗布装置
JP2011230112A (ja) *	2010-04-06	2011-11-17	Dainippon Screen Mfg Co Ltd	塗布装置
JP6049560B2 (ja) *	2013-07-09	2016-12-21	東京エレクトロン株式会社	塗布装置およびスリットノズル
KR101578368B1 (ko) *	2014-12-04	2015-12-18	주식회사 디엠에스	노즐립 클리너 및 이를 이용한 슬릿 코터
CN105880115A (zh) *	2016-04-27	2016-08-24	安庆市鸿裕工业产品设计有限公司	干复机刮刀作业网纹辊平滑控制组件
KR102190114B1 (ko)	2017-08-17	2020-12-11	주식회사 엘지화학	슬롯들의 움직임으로 전극 활물질 슬러리의 코팅 형태가 변환되는 슬롯 다이 코터
CN110620065A (zh) *	2019-08-26	2019-12-27	石狮市纳傲贸易有限公司	一种晶圆加工设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
BR9507569A (pt) *	1994-04-29	1997-08-05	Minnesota Mining & Mfg	Aparelho e processo de revestimento com matriz
JPH11244760A (ja) *	1998-02-26	1999-09-14	Dainippon Screen Mfg Co Ltd	基板処理装置
JP2001338864A (ja) *	2000-05-30	2001-12-07	Dainippon Screen Mfg Co Ltd	基板処理装置および基板処理方法
JP4736177B2 (ja) *	2000-11-16	2011-07-27	大日本印刷株式会社	枚葉基板の製造方法
JP2002282760A (ja) *	2001-03-26	2002-10-02	Dainippon Screen Mfg Co Ltd	液体供給ノズル及びその製造方法、処理装置ならびに処理方法
JP4091372B2 (ja) *	2002-07-16	2008-05-28	大日本スクリーン製造株式会社	基板処理装置
JP3940054B2 (ja) *	2002-10-07	2007-07-04	大日本スクリーン製造株式会社	ノズル清掃装置およびこのノズル清掃装置を備えた基板処理装置
JP3877719B2 (ja) *	2002-11-07	2007-02-07	東京応化工業株式会社	スリットコータの予備吐出装置
JP4524580B2 (ja) *	2004-05-26	2010-08-18	三菱化学株式会社	枚葉塗布装置、およびダイ位置決め方法
JP4436212B2 (ja) *	2004-08-20	2010-03-24	信越化学工業株式会社	ダイコータの塗工方法およびこの方法によって作製されたフォトリソグラフィ用ペリクル

2004
- 2004-10-04 JP JP2004291306A patent/JP4324538B2/ja active Active
2005
- 2005-09-29 CN CNB2005101076795A patent/CN100418641C/zh active Active
- 2005-09-29 CN CN2008100913851A patent/CN101276148B/zh active Active

Also Published As

Publication number	Publication date
CN101276148B (zh)	2011-06-01
CN1757441A (zh)	2006-04-12
CN101276148A (zh)	2008-10-01
CN100418641C (zh)	2008-09-17
JP2006108287A (ja)	2006-04-20

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Publication	Publication Date	Title
JP4490797B2 (ja)	2010-06-30	基板処理装置
KR100642666B1 (ko)	2006-11-10	노즐 세정 장치 및 기판 처리 장치
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