JP4324434B2 - Heat dissipation member and manufacturing method thereof - Google Patents
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- 230000017525 heat dissipation Effects 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007747 plating Methods 0.000 claims description 144
- 239000002134 carbon nanofiber Substances 0.000 claims description 96
- 239000002131 composite material Substances 0.000 claims description 96
- 239000002184 metal Substances 0.000 claims description 72
- 229910052751 metal Inorganic materials 0.000 claims description 72
- 238000009713 electroplating Methods 0.000 claims description 50
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 43
- 150000001875 compounds Chemical class 0.000 claims description 8
- 125000006353 oxyethylene group Chemical group 0.000 claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 70
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 33
- 229910052802 copper Inorganic materials 0.000 description 33
- 239000010949 copper Substances 0.000 description 33
- 229910052759 nickel Inorganic materials 0.000 description 26
- 230000005855 radiation Effects 0.000 description 20
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 14
- -1 alkyne diol Chemical class 0.000 description 11
- 239000006229 carbon black Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000000635 electron micrograph Methods 0.000 description 8
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- 239000004065 semiconductor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
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- 239000000463 material Substances 0.000 description 3
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- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- CFNMUZCFSDMZPQ-GHXNOFRVSA-N 7-[(z)-3-methyl-4-(4-methyl-5-oxo-2h-furan-2-yl)but-2-enoxy]chromen-2-one Chemical compound C=1C=C2C=CC(=O)OC2=CC=1OC/C=C(/C)CC1OC(=O)C(C)=C1 CFNMUZCFSDMZPQ-GHXNOFRVSA-N 0.000 description 1
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000255925 Diptera Species 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000000475 acetylene derivatives Chemical class 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000011304 carbon pitch Chemical group 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229940070891 pyridium Drugs 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
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Description
本発明は放熱部材及びその製造方法に関し、更に詳細には金属部品の表面にカーボンナノファイバとめっき金属とから成る複合めっき皮膜が形成された放熱部材及びその製造方法に関する。 The present invention relates to a heat radiating member and a method for manufacturing the heat radiating member, and more particularly to a heat radiating member in which a composite plating film composed of carbon nanofibers and a plated metal is formed on the surface of a metal part and a method for manufacturing the heat radiating member.
半導体装置が搭載された小型電子機器では、半導体素子から発生する熱を速やかに外部に放熱することが、電子機器の性能を保持するうえで大切である。
従来は、電子機器内に装着したファン等の排熱装置によって強制的に熱を外部に排出していた。
しかし、電子機器の小型化、薄型化に伴なって、電子機器内に排熱装置を設置できるスペースの確保が極めて困難になりつつあること、排熱装置の騒音解消の要望が強いこと等のため、電子機器の密閉化等が考えられている。
一方、電子機器を密閉化した場合には、半導体素子から発生する熱を速やかに外部に放熱する放熱部材としてのヒートシンクの性能が重要である。
かかるヒートシンクとしては、下記特許文献１に、金属板の表面にカーボンブラックとチタニア（TiO2）とが配合された塗膜を形成したヒートシンクが提案されている。
Conventionally, heat is forcibly discharged to the outside by a heat exhausting device such as a fan installed in the electronic device.
However, with the downsizing and thinning of electronic devices, it is becoming extremely difficult to secure a space for installing a heat exhaust device in the electronic device, and there is a strong demand for eliminating noise from the heat exhaust device. For this reason, sealing of electronic devices is considered.
On the other hand, when the electronic device is sealed, the performance of the heat sink as a heat radiating member that quickly radiates the heat generated from the semiconductor element to the outside is important.
As such a heat sink, a heat sink in which a coating film in which carbon black and titania (TiO 2 ) are blended is formed on the surface of a metal plate is proposed in Patent Document 1 below.
特許文献１の記載によれば、金属板の表面にカーボンブラックのみが配合された塗膜を形成したヒートシンクでは、図１１（ａ）に示す様に、波長が６μｍ以下では黒体に近似した良好な放射強度を呈するものの、波長が６μｍを越え、特に１２μｍ以上では黒体の放射強度に比較して劣っている。これに対し、金属板の表面にチタニアのみが配合された塗膜を形成したヒートシンクでは、図１１（ｂ）に示す様に、波長が６μｍ以下では黒体の放射強度に比較して劣っているものの、波長が６μｍを越え、１２μｍ以上では黒体に近似した良好な放射強度を呈する。
この様に、短波長側の放射強度が良好のカーボンブラックと、長波長側の放射強度が良好のチタニアとが配合された塗膜を形成したヒートシンクでは、カーボンブラックとチタニアとの各々の放射強度が劣る部分を補うことができる結果、幅広い波長での放射強度を向上でき、放熱性を向上できるというものである。
According to the description of Patent Document 1, in a heatsink in which a coating film containing only carbon black is formed on the surface of a metal plate, as shown in FIG. However, the wavelength is inferior to that of a black body when the wavelength exceeds 6 μm, and particularly 12 μm or more. On the other hand, in the heat sink in which the coating film in which only titania is blended is formed on the surface of the metal plate, as shown in FIG. 11B, the wavelength is 6 μm or less, which is inferior to the radiant intensity of the black body. However, when the wavelength exceeds 6 μm and is 12 μm or more, a good radiation intensity approximating that of a black body is exhibited.
In this way, in the heat sink that forms a coating film containing carbon black with good radiant intensity on the short wavelength side and titania with good radiant intensity on the long wavelength side, each radiant intensity of carbon black and titania. As a result of being able to compensate for the inferior part, the radiation intensity in a wide range of wavelengths can be improved, and the heat dissipation can be improved.
しかし、特許文献１のヒートシンクでは、金属板の表面にカーボンブラックとチタニアとが配合された塗膜を形成しているため、バインダーとしての有機樹脂を用いることを要する。かかる有機樹脂は、一般的に金属に比較して熱伝導率等の熱特性が劣るものである。この様に、熱特性が金属よりも劣る有機樹脂を用いることから、カーボンブラックとチタニアとの配合量を塗膜の乾燥質量に対して合計で５質量％以上とすることを必要とする。
また、二種の熱放射材を用いることは、その均一混合等に多大の注意を払うことを要するため、一種の熱放射材を用いることによって熱放射特性が向上されたヒートシンクが望まれている。
そこで、本発明の課題は、金属部品の表面に、一種類の熱放射材を金属マトリックス中に配合された皮膜を形成した放熱部材及びその製造方法を提供とすることにある。
However, in the heat sink of Patent Document 1, since a coating film in which carbon black and titania are blended is formed on the surface of a metal plate, it is necessary to use an organic resin as a binder. Such organic resins are generally inferior in thermal properties such as thermal conductivity compared to metals. As described above, since an organic resin having a thermal property inferior to that of metal is used, it is necessary that the total amount of carbon black and titania is 5% by mass or more based on the dry mass of the coating film.
In addition, since using two kinds of heat radiation materials requires great attention to the uniform mixing and the like, a heat sink having improved heat radiation characteristics by using one kind of heat radiation material is desired. .
Therefore, an object of the present invention is to provide a heat dissipating member in which a film in which one kind of heat radiation material is blended in a metal matrix is formed on the surface of a metal part, and a method for manufacturing the same.
本発明者等は、前記課題を達成すべく検討を重ねた結果、カーボンナノファイバを分散した電解めっき液を用い、金属板の表面に電解めっきによって複合めっき皮膜層を形成した放熱部材によれば、熱放射特性を向上できることを見出し、本発明に到達した。
すなわち、本発明は、カーボンナノファイバが分散されためっき液を用いためっきによって形成された、前記カーボンナノファイバとめっき金属とから成る複合めっき皮膜層が、金属部品の表面に形成されている放熱部材であって、前記複合めっき皮膜層の表面を形成するカーボンナノファイバには、前記めっき金属で覆われている部分と前記カーボンナノファイバの表面が露出している部分とが併存し、且つ前記複合めっき皮膜層の波長３〜３０μｍの領域における熱放射率が、黒体の波長３〜３０μｍの領域における熱放射率に対して０．３以上となるように、前記カーボンナノファイバの表面が露出していることを特徴とする放熱部材にある。
また、本発明は、カーボンナノファイバが分散された電解めっき液を用いた電解めっきによって、前記カーボンナノファイバとめっき金属とから成る複合めっき皮膜層が金属部品の表面に形成された放熱部材を製造する際に、前記電解めっき液には、カーボンナノファイバを分散する分散剤として、アルキンジオール分子中にオキシエチレン側鎖を有するアルキンジオール化合物であって、前記アルキンジオール化合物の分子量の少なくとも２０重量％をオキシエチレン側鎖が占める分散剤を用い、且つ陰極に接続された金属部品のめっき面を電解めっき液の液面に対して水平に載置すると共に、前記金属部品のめっき面の上方に陽極を配設し、前記金属部品及び陽極を上下方向に揺動しつつ、電解めっき液を攪拌して、前記金属部品に電解めっきを施すことを特徴とする放熱部材の製造方法でもある。
As a result of repeated studies to achieve the above-mentioned problems, the present inventors have used an electroplating solution in which carbon nanofibers are dispersed, and according to a heat dissipation member in which a composite plating film layer is formed by electrolytic plating on the surface of a metal plate. The present inventors have found that the heat radiation characteristics can be improved and have reached the present invention.
That is, the present invention provides a heat dissipation method in which a composite plating film layer composed of the carbon nanofibers and the plating metal formed by plating using a plating solution in which carbon nanofibers are dispersed is formed on the surface of a metal component. a member, the carbon nano fibers forming the surface of the composite plating film layer, a portion where the surface of the portion covered by the plating metal the carbon nanofibers is exposed coexist, and the The surface of the carbon nanofiber is exposed so that the thermal emissivity in the region of 3-30 μm wavelength of the composite plating film layer is 0.3 or more with respect to the thermal emissivity in the region of 3-30 μm wavelength of the black body. It exists in the heat radiating member characterized by having carried out .
Further, the present invention produces a heat radiating member in which a composite plating film layer composed of the carbon nanofiber and the plating metal is formed on the surface of the metal component by electrolytic plating using an electrolytic plating solution in which carbon nanofibers are dispersed. In this case, the electrolytic plating solution includes an alkynediol compound having an oxyethylene side chain in an alkynediol molecule as a dispersant for dispersing carbon nanofibers, and at least 20% by weight of the molecular weight of the alkynediol compound. And a plating surface of the metal part connected to the cathode is placed horizontally with respect to the surface of the electrolytic plating solution, and the anode is disposed above the plating surface of the metal part. The electroplating solution is stirred while the metal part and the anode are swung up and down, and the metal part is electrolyzed. Is also a method for producing a heat radiation member, characterized in that the applied Kki.
かかる本発明において、露出するカーボンナノファイバの投影面積を、複合めっき皮膜層の表面に対して３％以上とすることによって、放熱部材の波長３〜３０μｍの領域における熱放射率を向上できる。
この様に、複合めっき皮膜層の表面を形成するカーボンナノファイバに、めっき金属で覆われている部分と露出している部分とを併存させるには、複合めっき被膜に配されたカーボンナノファイバを、前記複合めっき皮膜の表面に対して横向きに配することが有利である。
また、めっき液中のカーボンナノファイバの混合量を、１００ｐｐｍ以上とすることによって、所望の熱放射率の複合めっき皮膜を容易に形成できる。
更に、カーボンナノファイバとして、径が１００〜３００ｎｍで且つ長さが１〜２０μｍのカーボンナノファイバを好適に用いることができる。
尚、金属部品のめっき面に電解めっきを施して複合めっき皮膜を形成した後、前記複合めっき皮膜にエッチングを施すことによっても、前記複合めっき皮膜層の表面を形成するカーボンナノファイバに、前記めっき金属で覆われている部分と露出している部分とを併存させることができる。
In such present invention, the projected area of the carbon nanofibers to be out dew, by 3% or more with respect to the surface of the composite coating layer, it is possible to improve the thermal emissivity in the wavelength region of 3~30μm heat radiation member.
Thus, the carbon nanofibers to form a surface of the composite plating film layer, the coexist and a portion exposed and the portion covered with the plating metal, mosquitoes Bon'nano arranged on the composite plating film Advantageously, the fiber is arranged transversely to the surface of the composite plating film .
Moreover, a composite plating film having a desired thermal emissivity can be easily formed by setting the mixing amount of the carbon nanofibers in the plating solution to 100 ppm or more.
Furthermore, as the carbon nanofiber, a carbon nanofiber having a diameter of 100 to 300 nm and a length of 1 to 20 μm can be suitably used.
In addition, after the electrolytic plating is performed on the plating surface of the metal part to form a composite plating film, the plating is also applied to the carbon nanofibers that form the surface of the composite plating film layer by etching the composite plating film. The part covered with metal and the exposed part can coexist .
本発明で用いるカーボンナノファイバは、波長３〜３０μｍの領域における熱放射率が黒体に近似し且つ熱伝導率も優れている。かかるカーボンナノファイバが、本発明に係る放熱部材を形成するめっき金属から成る金属マトリックス中に配合されている。このため、金属板の表面から複合めっき皮膜層の表面に熱が迅速に伝達される。
更に、カーボンナノファイバとめっき金属とから成る複合めっき皮膜層の表面には、放熱特性に優れたカーボンナノファイバの一部が露出し、複合めっき皮膜の表面に到達した熱を迅速に外部に放熱できるため、放熱部材の放熱性を向上できる。
しかも、複合めっき皮膜層の波長３〜３０μｍの領域における熱放射率が、黒体の波長３〜３０μｍの領域における熱放射率に対して０．３以上となるように、カーボンナノファイバの表面が露出しているため、放熱部材の放熱性を更に向上できる。
その結果、放熱性が向上された放熱部材としてのヒートシンクを具備する筐体内に、半導体素子等を密閉化した電子機器では、半導体素子等から発生する熱を速やかに筐体外に放熱でき、電子機器の更なる小型化、薄肉化を図ることができる。
尚、半導体素子等を密閉する筐体自体を、本発明に係る放熱部材で形成することによっても、半導体素子等から発生する熱を速やかに筐体外に放熱できる。
The carbon nanofibers used in the present invention have a thermal emissivity in the wavelength region of 3 to 30 μm, which is close to that of a black body and is excellent in thermal conductivity. Such carbon nanofibers are blended in a metal matrix made of plated metal that forms the heat dissipation member according to the present invention. For this reason, heat is rapidly transferred from the surface of the metal plate to the surface of the composite plating film layer.
Further, the surface of the composite coating layer composed of the carbon nanofibers with the plated metal, rapidly radiated to the outside part of the superior carbon nanofibers in heat dissipation characteristics is exposed and reaches the surface of the composite plating film heat Therefore, the heat dissipation of the heat dissipation member can be improved.
In addition, the surface of the carbon nanofiber is adjusted so that the thermal emissivity in the region of the composite plating film layer with a wavelength of 3 to 30 μm is 0.3 or more with respect to the thermal emissivity of the black body with a wavelength of 3 to 30 μm. Since it is exposed, the heat dissipation of the heat dissipation member can be further improved.
As a result, in an electronic device in which a semiconductor element or the like is sealed in a housing having a heat sink as a heat radiating member with improved heat dissipation, heat generated from the semiconductor element or the like can be quickly radiated to the outside of the housing. Can be further reduced in size and thickness.
Note that the heat generated from the semiconductor element or the like can be quickly radiated out of the case by forming the casing itself for sealing the semiconductor element or the like with the heat radiating member according to the present invention.
本発明に係る放熱部材では、カーボンナノファイバ（以下、ＣＮＦと称することがある）が分散されためっき液を用いて金属部品の表面にめっきを施し、カーボンナノファイバとめっき金属とから成る平滑な表面の複合めっき皮膜層を形成する。
この金属部品としては、熱伝導率が良好な金属、例えば銅、鉄又はこれらの合金から成る金属部品を好適に用いることができる。かかる金属部品の全表面に、金属部品を形成する金属よりも熱伝導率が良好な金属、例えば銅、ニッケル、銀、すず等の金属から成る金属層をめっきによって形成してもよい。
また、ＣＮＦとしては、中実体のカーボンナノファイバ、或いはカーボンナノチューブを用いることができ、両者を混合してもよい。このＣＮＦとしては、径が１００〜３００ｎｍで且つ長さが１〜２０μｍのＣＮＦを好適に用いることができる。
尚、ＣＮＦに代えて汎用されているＰＡＮ系炭素繊維やピッチ系炭素繊維を用いた場合には、複合めっき被膜の表面を平滑面に形成することが困難である。
In the heat dissipating member according to the present invention, the surface of the metal part is plated using a plating solution in which carbon nanofibers (hereinafter may be referred to as CNF) are dispersed, and the smoothness composed of the carbon nanofibers and the plated metal is provided. A composite plating film layer on the surface is formed.
As this metal part, a metal part made of a metal having good thermal conductivity, for example, copper, iron, or an alloy thereof can be suitably used. A metal layer made of a metal having better thermal conductivity than the metal forming the metal part, for example, a metal such as copper, nickel, silver, tin, etc. may be formed on the entire surface of the metal part by plating.
Moreover, as CNF, a solid carbon nanofiber or a carbon nanotube can be used, and both may be mixed. As this CNF, CNF having a diameter of 100 to 300 nm and a length of 1 to 20 μm can be suitably used.
In addition, when the PAN-type carbon fiber and pitch-type carbon fiber which are used widely instead of CNF are used, it is difficult to form the surface of a composite plating film in a smooth surface.
かかるＣＮＦが分散されためっき液としては、電解めっきによってめっき金属から成るめっき皮膜層を金属部材の表面に形成し得る電解めっき液が好ましい。このめっき金属としては、熱伝導率が良好で且つ錆び難い金属、例えばニッケル、銅、金、銀から成るめっき金属が好ましい。
かかる電解めっき液には、カーボンナノファイバを分散する分散剤としてのアルカンジオール化合物、アルケンジオール化合物又はアルキンジオール化合物が配合されている。特に、アルキンジオール分子中にオキシエチレン側鎖を有するアルキンジオールであって、このアルキンジオール化合物の分子量の少なくとも２０重量％をオキシエチレン側鎖が占める分散剤を好適に用いることができる。このオキシエチレン側鎖が占める割合を８５重量％以下とすることが好ましい。
更に、電解めっき液には、界面活性剤としてのケトン基、アルデヒド基又はカルボン酸基を有する有機化合物、カーボンモノオキサイド化合物、クマリン誘導体、アリルアルデヒドのスルホン化物、アリル基を有するスルホン化合物、アルキレンカルボキシエステル、アルキレンアルデヒド、アセチレン誘導体、ピリジウム化合物、アルカンスルホン化合物又はアゾ化合物が配合されていてもよい。
かかる電解めっき液にＣＮＦを分散するには、予め分散剤溶液に浸漬して分散性を向上したＣＮＦを電解めっき液に混合することが好ましい。
The plating solution in which CNF is dispersed is preferably an electrolytic plating solution that can form a plating film layer made of a plating metal on the surface of the metal member by electrolytic plating. As the plating metal, a metal having good thermal conductivity and hardly rusting, for example, a plating metal made of nickel, copper, gold or silver is preferable.
Such an electrolytic plating solution contains an alkanediol compound, alkenediol compound or alkynediol compound as a dispersant for dispersing the carbon nanofibers. In particular, a alkyne diol having an oxyethylene side chain in the alkyne diol molecule, and a dispersant in which the oxyethylene side chain accounts for at least 20% by weight of the molecular weight of the alkyne diol compound can be suitably used. The proportion of the oxyethylene side chain is preferably 85% by weight or less.
Further, the electrolytic plating solution includes an organic compound having a ketone group, an aldehyde group or a carboxylic acid group as a surfactant, a carbon monooxide compound, a coumarin derivative, a sulfonated product of allyl aldehyde, a sulfone compound having an allyl group, alkylene carboxy. An ester, an alkylene aldehyde, an acetylene derivative, a pyridium compound, an alkanesulfone compound, or an azo compound may be blended.
In order to disperse CNF in such an electrolytic plating solution, it is preferable to mix CNF, which has been previously immersed in a dispersant solution and has improved dispersibility, into the electrolytic plating solution.
電解めっき液に混合するＣＮＦの混合量は、１００ｐｐｍ以上が好ましく、更に好ましくは５００ｐｐｍ以上、特に好ましくは１０００ｐｐｍ以上である。ＣＮＦの混合量の上限は１重量％程度である。ＣＮＦの混合量が１重量％を越えると、ＣＮＦの分散が困難となる傾向にある。
この様にＣＮＦが分散された電解めっき液を用いて電解めっきを施す際には、ＣＮＦの分散状態を維持するため、電解めっき液を攪拌しつつ、電流密度を３Ａ／ｄｍ2以下で施すことが好ましい。電流密度を３Ａ／ｄｍ2を越える条件で電解めっきを施すと、形成される複合めっき皮膜層の表面が凹凸面になり易い傾向にある。
更に、直流電源の陰極に接続されて電解めっき液の液面に対して水平に載置した金属部品のめっき面の上方に直流電源の陽極に接続された陽極板を載置し、金属部品と陽極板とを上下方向に揺動させつつ電解めっきを施すことによって、ＣＮＦを金属部品のめっき面に均一に配設できる。
かかる電解めっきによって、金属部品の表面には、ＣＮＦとめっき金属とから成る複合めっき皮膜層を形成できる。この複合めっき被膜層は、その表面が平滑であって、ＣＮＦの多数本が複合めっき皮膜の表面に対して横向きに配されている。
The amount of CNF mixed in the electrolytic plating solution is preferably 100 ppm or more, more preferably 500 ppm or more, and particularly preferably 1000 ppm or more. The upper limit of the mixing amount of CNF is about 1% by weight. When the mixing amount of CNF exceeds 1% by weight, dispersion of CNF tends to be difficult.
When electrolytic plating is performed using an electrolytic plating solution in which CNF is dispersed in this way, in order to maintain the dispersed state of CNF, the electrolytic plating solution is stirred and applied at a current density of 3 A / dm 2 or less. Is preferred. When electrolytic plating is performed under a condition where the current density exceeds 3 A / dm 2 , the surface of the formed composite plating film layer tends to be uneven.
Furthermore, an anode plate connected to the anode of the DC power source is placed above the plating surface of the metal component that is connected to the cathode of the DC power source and placed horizontally with respect to the liquid level of the electrolytic plating solution. By performing electrolytic plating while swinging the anode plate in the vertical direction, CNF can be uniformly disposed on the plating surface of the metal part.
By such electrolytic plating, a composite plating film layer made of CNF and plating metal can be formed on the surface of the metal part. The composite plating film layer has a smooth surface, and a large number of CNFs are arranged laterally with respect to the surface of the composite plating film .
この様に、金属板の表面に形成された複合めっき皮膜層では、ＣＮＦが複合めっき皮膜の表面に対して横向きに配されているため、その表面を形成するＣＮＦには、めっき金属で覆われている部分と露出している部分とが併存する。
この露出するＣＮＦの露出面積を、電子顕微鏡の顕微鏡写真から投影面積として算出すると、露出するＣＮＦの投影面積は、複合めっき皮膜層の表面に対して３％以上となる。
かかる複合めっき皮膜層が金属板の表面に形成された放熱部材では、波長３〜３０μｍの領域における熱放射率を、黒体の波長３〜３０μｍの領域における熱放射率に対して０．３以上とすることができる。
つまり、複合部材を構成する金属部品の表面に形成された複合めっき皮膜では、熱伝導率等の熱特性に優れたＣＮＦが、熱伝導率等の熱特性に優れためっき金属から成る金属マトリックス中に横向きに配されているため、金属部材の表面から複合めっき皮膜層の表面に熱が迅速に伝達される。
更に、複合めっき皮膜層の表面に、めっき金属で覆われている部分と露出している部分とが併存するＣＮＦが存在しており、かかるＣＮＦの露出面からは、めっき金属から伝熱された熱が直ちに放熱されるため、複合めっき皮膜層の放熱性を向上できるものと考えられる。
尚、金属部品のめっき面に電解めっきを施して複合めっき皮膜を形成した後、この複合めっき皮膜にエッチングを施すことによっても、複合めっき皮膜層の表面に、めっき金属で覆われている部分と露出している部分とが併存するＣＮＦを存在させることができる。
In this way, in the composite plating film layer formed on the surface of the metal plate, CNF is disposed laterally with respect to the surface of the composite plating film, so that the CNF forming the surface is covered with the plating metal. The exposed part and the exposed part coexist .
The exposed area of CNF to output dew this, when calculated as the projected area of the microscope photograph of an electron microscope, the projected area of the CNF to leave exposed, is 3% or more with respect to the surface of the composite plating film layer.
In the heat radiating member in which the composite plating film layer is formed on the surface of the metal plate, the thermal emissivity in the wavelength region of 3 to 30 μm is 0.3 or more than the thermal emissivity in the black body wavelength region of 3 to 30 μm. It can be.
In other words, in the composite plating film formed on the surface of the metal part constituting the composite member, CNF excellent in thermal characteristics such as thermal conductivity is contained in a metal matrix composed of a plating metal excellent in thermal characteristics such as thermal conductivity. Therefore, heat is quickly transferred from the surface of the metal member to the surface of the composite plating film layer.
Furthermore, CNF in which the part covered with the plating metal and the exposed part coexist exists on the surface of the composite plating film layer, and heat was transferred from the plating metal from the exposed surface of the CNF. Since heat is immediately radiated, it is considered that the heat dissipation of the composite plating film layer can be improved.
In addition, after forming the composite plating film by performing electrolytic plating on the plating surface of the metal part, the surface of the composite plating film layer is also covered with the plated metal by etching the composite plating film. There can be CNF coexisting with the exposed part .
電解めっき液として、硫酸ニッケル・６水和物（１００ｇ／Ｌ）、塩化ニッケル・６水和物（４５ｇ／Ｌ）、ホウ酸（３０ｇ／Ｌ）、界面活性剤としての２−ブチン−１，４−ジオール（０．０１wt％）及びアルキンジオール分子中にオキシエチレン側鎖を有するアルキンジオール化合物であって、このアルキンジオール化合物の分子量の８５重量％をオキシエチレン側鎖が占める分散剤（1.0 wt％）を添加した電解めっき液を用いた。
この電解めっき液には、径が１００〜３００ｎｍで且つ長さが１０〜２０μｍのＣＮＦを、１００ｐｐｍとなるように混合した。
かかるＣＮＦが混合された電解めっき液は、図１に示す様に、めっき槽１０に貯留される。この電解めっき液１２には、めっき面にマスキングテープによって有効面積が１８ｃｍ2となるように面積規制された金属部品としての銅板１４を、このめっき面と電解めっき液１２の液面とが平行となるように浸漬すると共に、銅板１４のめっき面の上方にニッケル板１８を浸漬する。その後、直流電源１６の陰極に銅板１４を接続すると共に、直流電源１６の陽極にニッケル板１８を接続し、電流密度を１Ａ／ｄｍ2に調整しつつ、電解ニッケルめっきを施した。この電解ニッケルめっきの際には、めっき液温度を５０℃に維持しつつ、電解めっき液に攪拌機１９によって攪拌を施すと共に、銅板１４とニッケル板１８とを上下方向（矢印Ａ方向）に揺動した。
かかる電解ニッケルめっきは、銅板１４のめっき面に厚さ２０μｍの複合めっき皮膜層が形成されるまで継続した。
銅板１４のめっき面に所定厚さの複合めっき皮膜層が形成されて放熱部材としてのヒートシンクが得られたとき、電解めっきを終了した。めっき液から取り出して洗浄したヒートシンクの複合めっき被覆層の表面が平滑であった。
かかる複合めっき皮膜層の表面を電子顕微鏡で約５０００倍に拡大して観察した。この電子顕微鏡による拡大写真を図２に示す。図２からも判る様に、複合めっき皮膜層の表面には、複合めっき皮膜層の表面に対して多数本の横向きに配設されたＣＮＦが存在している。この様に、複合めっき皮膜層の表面に配設されたＣＮＦには、めっき金属としてのニッケルが析出して覆われている部分と露出している部分とが併存するＣＮＦが存在している。
図２に示す露出するＣＮＦの投影面積を、図２に示す電子顕微鏡写真から測定すると、複合めっき皮膜層の表面に対して３％であった。
As an electroplating solution, nickel sulfate hexahydrate (100 g / L), nickel chloride hexahydrate (45 g / L), boric acid (30 g / L), 2-butyne-1 as a surfactant, 4-Diol (0.01 wt%) and an alkyne diol compound having an oxyethylene side chain in the alkyne diol molecule, wherein the oxyethylene side chain accounts for 85 wt% of the molecular weight of the alkyne diol compound (1.0 wt%) %) Was used.
In this electrolytic plating solution, CNF having a diameter of 100 to 300 nm and a length of 10 to 20 μm was mixed so as to be 100 ppm.
The electrolytic plating solution mixed with such CNF is stored in a plating tank 10 as shown in FIG. The electrolytic plating solution 12 includes a copper plate 14 as a metal part whose area is regulated to 18 cm 2 by a masking tape on the plating surface, and the plating surface and the electrolytic plating solution 12 are parallel to each other. Then, the nickel plate 18 is immersed above the plated surface of the copper plate 14. Thereafter, the copper plate 14 was connected to the cathode of the DC power supply 16 and the nickel plate 18 was connected to the anode of the DC power supply 16, and electrolytic nickel plating was performed while adjusting the current density to 1 A / dm 2 . During the electrolytic nickel plating, the electrolytic plating solution is agitated by the agitator 19 while maintaining the plating solution temperature at 50 ° C., and the copper plate 14 and the nickel plate 18 are swung in the vertical direction (arrow A direction). did.
Such electrolytic nickel plating was continued until a 20 μm thick composite plating film layer was formed on the plated surface of the copper plate 14.
When a composite plating film layer having a predetermined thickness was formed on the plated surface of the copper plate 14 and a heat sink as a heat radiating member was obtained, the electrolytic plating was finished. The surface of the composite plating coating layer of the heat sink that was removed from the plating solution and washed was smooth.
The surface of the composite plating film layer was observed with an electron microscope at a magnification of about 5000 times. An enlarged photograph of this electron microscope is shown in FIG. As can be seen from FIG. 2 , a large number of CNFs are provided on the surface of the composite plating film layer so as to be laterally arranged with respect to the surface of the composite plating film layer . As described above, CNF disposed on the surface of the composite plating film layer includes CNF in which nickel as a plating metal is deposited and covered and exposed .
The projected area of CNF to leave exposed are shown in FIG. 2, as measured from the electron micrograph shown in FIG. 2, it was 3% relative to the surface of the composite plating film layer.
実施例１において、ＣＮＦの混合量を５００ｐｐｍとした他は、実施例１と同様に、電解ニッケルめっきを施し、銅板の表面に厚さ２０μｍの複合めっき皮膜層が形成されたヒートシンクを得た。この複合めっき皮膜層は平滑であって、その表面を電子顕微鏡で約５０００倍に拡大して観察した。
電子顕微鏡による拡大写真を図３に示す。図３からも判る様に、複合めっき皮膜層の表面には、複合めっき皮膜層の表面に対して多数本の横向きに配設されたＣＮＦが存在している。この様に、複合めっき皮膜層の表面に配設されたＣＮＦの露出部分が、図２に示す複合めっき皮膜層の表面に比較して拡大されている。
図３に示す露出するＣＮＦの投影面積を、図３に示す電子顕微鏡写真から測定すると、複合めっき皮膜層の表面に対して７％であった。
In Example 1, except that the mixing amount of CNF was 500 ppm, electrolytic nickel plating was performed in the same manner as in Example 1 to obtain a heat sink in which a composite plating film layer having a thickness of 20 μm was formed on the surface of the copper plate. This composite plating film layer was smooth, and its surface was magnified about 5000 times with an electron microscope and observed.
An enlarged photograph by an electron microscope is shown in FIG. As can be seen from FIG. 3, the surface of the composite plating film layer has a large number of CNFs arranged in the lateral direction with respect to the surface of the composite plating film layer . Thus, the exposed portion of CNF disposed on the surface of the composite plating film layer is enlarged as compared with the surface of the composite plating film layer shown in FIG.
The projected area of CNF to leave exposed are shown in FIG. 3, as measured from the electron micrograph shown in FIG. 3, it was 7% with respect to the surface of the double coupling plating film layer.
実施例１において、ＣＮＦの混合量を１０００ｐｐｍとした他は、実施例１と同様に、電解ニッケルめっきを施し、銅板の表面に厚さ２０μｍの複合めっき皮膜層が形成されたヒートシンクを得た。この複合めっき皮膜層は平滑であって、その表面を電子顕微鏡で約５０００倍に拡大して観察した。
電子顕微鏡による拡大写真を図４に示す。図４からも判る様に、複合めっき皮膜層の表面には、複合めっき皮膜層の表面に対して多数本の横向きに配設されたＣＮＦが存在している。この様に、複合めっき皮膜層の表面に配設されたＣＮＦの露出部分が、図２及び図３に示す複合めっき皮膜層の表面に比較して拡大されている。
図４に示す露出するＣＮＦの投影面積を、図４に示す電子顕微鏡写真から測定すると、複合めっき皮膜層の表面に対して１０％であった。
In Example 1, except that the mixing amount of CNF was 1000 ppm, electrolytic nickel plating was performed in the same manner as in Example 1 to obtain a heat sink in which a composite plating film layer having a thickness of 20 μm was formed on the surface of the copper plate. This composite plating film layer was smooth, and its surface was magnified about 5000 times with an electron microscope and observed.
An enlarged photograph by an electron microscope is shown in FIG. As can be seen from FIG. 4, there are a large number of CNFs arranged laterally with respect to the surface of the composite plating film layer on the surface of the composite plating film layer . Thus, the exposed part of CNF arranged on the surface of the composite plating film layer is enlarged as compared with the surface of the composite plating film layer shown in FIGS.
The projected area of CNF to leave exposed are shown in FIG. 4, as measured from the electron micrograph shown in FIG. 4, it was 10% with respect to the surface of the composite plating film layer.
実施例３で得られたヒートシンクをエッチング液に浸漬し、複合めっき被膜にエッチングを施した。エッチングを施したヒートシンクの複合めっき被膜の表面を電子顕微鏡で約５０００倍に拡大して観察した。
電子顕微鏡による拡大写真を図５に示す。図５からも判る様に、エッチングが施された複合めっき皮膜層の表面にも、図４に示す複合めっき被膜層の表面と同様に、ＣＮＦは複合めっき皮膜層の表面に対して横向きに配設されているものである。
The heat sink obtained in Example 3 was immersed in an etching solution, and the composite plating film was etched. The surface of the composite plating film of the etched heat sink was observed with an electron microscope at a magnification of about 5000 times.
An enlarged photograph taken with an electron microscope is shown in FIG. As seen from FIG. 5, also the surface of the etching is performed composite coating layer, similar to the surface of the composite plating film layer shown in FIG. 4, C NF is transverse to the surface of the composite coating layer It is arranged.
実施例１において、ＣＮＦの混合量を１０００ｐｐｍとした他は、実施例１と同様に、電解ニッケルめっきを施し、銅板の表面に厚さ５μｍの複合めっき皮膜層が形成されたヒートシンクを得た。この複合めっき皮膜層は平滑であって、その表面を電子顕微鏡で約５０００倍に拡大して観察した。電子顕微鏡による拡大写真を図６に示す。
図６に示す厚さ５μｍの複合めっき皮膜層の表面状態は、実施例３で得た厚さ２０μｍの複合めっき皮膜層の表面状態（図４）と同様に、複合めっき皮膜層の表面に対して多数本のＣＮＦは横向きに配設されているものである。
In Example 1, except that the mixing amount of CNF was 1000 ppm, electrolytic nickel plating was performed in the same manner as in Example 1 to obtain a heat sink in which a composite plating film layer having a thickness of 5 μm was formed on the surface of the copper plate. This composite plating film layer was smooth, and its surface was magnified about 5000 times with an electron microscope and observed. An enlarged photograph by an electron microscope is shown in FIG.
Surface conditions of the composite plating film layer having a thickness of 5μm shown in FIG. 6, like the surface state of the composite coating layer having a thickness of 20μm was obtained in Example 3 (FIG. 4), to the surface of the composite coating layer A large number of CNFs are arranged horizontally.
実施例１〜３において得られた、銅板の表面にＣＮＦとニッケルとから成る複合めっき皮膜層が形成されたヒートシンクの各々について、その示差放射スペクトルを測定した結果を図７に示す。かかる示差放射スペクトルの測定には、光学的零位方式によるダブルビームの赤外分光光度計を用いた放射特性試験器を使用した。
更に、実施例４において得られた、銅板の表面に形成したＣＮＦとニッケルとから成る複合めっき皮膜層にエッチングを施して得たヒートシンクについても、その示差放射スペクトルを図８に示した。この図８には、実施例４において得られたヒートシンクの示差放射スペクトルも併せて示した。
また、比較例１として、実施例１において、ＣＮＦを混合しなかった他は、実施例１と同様に電解ニッケルめっきを施し、銅板１４のめっき面に厚さ２０μｍのニッケルめっき皮膜層が形成されたヒートシンクについても、その示差放射スペクトルを図７に併せて示した。
図７及び図８から明らかな様に、ＣＮＦを１００ｐｐｍ以上混合しためっき液を用いて電解めっきを施した実施例１〜４のニッケルとＣＮＦとから成る複合めっき皮膜層が銅板１４のめっき面に形成されたヒートシンクでは、波長３〜３０μｍの領域における熱放射率は、黒体の波長３〜３０μｍの領域における熱放射率に対して０．３以上となり、比較例１の銅板１４のめっき面にニッケルめっき皮膜層が形成されたヒートシンクに比較して、放熱性に優れていることが判る。
尚、図８に示す実施例４で得たヒートシンクの熱放射率は、実施例３で得たヒートシンクの熱放射率よりも低い値を示したが、エッチングによっては、ＣＮＦの一部が脱落したことによるものと考えられる。
FIG. 7 shows the result of measuring the differential emission spectrum of each of the heat sinks obtained in Examples 1 to 3 in which the composite plating film layer made of CNF and nickel was formed on the surface of the copper plate. For the measurement of the differential radiation spectrum, a radiation characteristic tester using a double beam infrared spectrophotometer by an optical nulling method was used.
Further, the differential radiation spectrum of the heat sink obtained by etching the composite plating film layer made of CNF and nickel formed on the surface of the copper plate obtained in Example 4 is shown in FIG. In FIG. 8, the differential radiation spectrum of the heat sink obtained in Example 4 is also shown.
Further, as Comparative Example 1, electrolytic nickel plating was performed in the same manner as in Example 1 except that CNF was not mixed in Example 1, and a nickel plating film layer having a thickness of 20 μm was formed on the plated surface of the copper plate 14. The differential radiation spectrum of the heat sink was also shown in FIG.
As apparent from FIGS. 7 and 8, the composite plating film layer composed of nickel and CNF of Examples 1 to 4 subjected to electrolytic plating using a plating solution in which 100 ppm or more of CNF is mixed is formed on the plated surface of the copper plate 14. In the formed heat sink, the thermal emissivity in the wavelength region of 3 to 30 μm is 0.3 or more with respect to the thermal emissivity of the black body in the wavelength region of 3 to 30 μm, and on the plated surface of the copper plate 14 of Comparative Example 1 It can be seen that the heat dissipation is superior to the heat sink on which the nickel plating film layer is formed.
In addition, although the heat emissivity of the heat sink obtained in Example 4 shown in FIG. 8 showed a value lower than the heat emissivity of the heat sink obtained in Example 3, a part of CNF dropped out by etching. This is probably due to this.
実施例１において、ＣＮＦに代えてカーボンブラックを１０００ｐｐｍ混合した他は、実施例１と同様に、電解ニッケルめっきを施し、銅板１４の表面に厚さ２０μｍの複合めっき皮膜層を形成したヒートシンクを得た。このヒートシンクの示差放射スペクトルを、実施例４と同様にして測定し、その結果を図９に示す。図９には、実施例３のヒートシンクについての示差放射スペクトルも併せて示す。
図９から明らかな様に、比較例２のヒートシンクは、実施例３のヒートシンクに比較して、長波長側での放熱性が劣ることが判る。
In Example 1, except that 1000 ppm of carbon black was mixed instead of CNF, electrolytic nickel plating was performed in the same manner as in Example 1 to obtain a heat sink in which a composite plating film layer having a thickness of 20 μm was formed on the surface of the copper plate 14. It was. The differential radiation spectrum of this heat sink was measured in the same manner as in Example 4, and the results are shown in FIG. In FIG. 9, the differential radiation spectrum about the heat sink of Example 3 is also shown collectively.
As can be seen from FIG. 9, the heat sink of Comparative Example 2 is inferior in heat dissipation on the long wavelength side as compared with the heat sink of Example 3.
図１０（ａ）に示す放熱性評価装置を用い、銅板の表面に形成した複合めっき皮膜層の相異に因る筐体内の温度変化を測定した。図１０（ａ）の放熱性評価装置には、横断面形状がコ字状のフッ素樹脂から成る断熱性筐体２０の底面に温度が５０℃に維持されるヒータ２２を設置し、断熱性筐体２０の開口部には、銅板１４の表面に複合めっき皮膜層を形成したヒートシンク２４を設置した。このヒートシンク２４には、ヒータ２２から断熱性筐体２０の壁部を熱伝導する熱は実質的に零である。
また、ヒートシンク２４の下方１０ｍｍの箇所に、温度測定装置２６の熱センサを挿入して断熱性筐体２０内の温度を測定した。
ここで、銅板の表面にＣＮＦとニッケルとから成る複合めっき皮膜層を形成したヒートシンク２４（実施例３）を用いた場合の断熱性筐体２０内の温度変化を図１０（ｂ）に示す。
更に、銅板の表面に厚さ２０μｍのニッケルめっき皮膜層を形成したヒートシンク（比較例１）を用いた場合の断熱性筐体２０内の温度変化も図１０（ｂ）に併せて示す。
図１０（ｂ）から明らかな様に、銅板の表面にＣＮＦとニッケルとから成る複合めっき皮膜層が形成されたヒートシンク２４（実施例３）を用いることによって、銅板の表面に厚さ２０μｍのニッケルめっき皮膜層を形成したヒートシンク２４（比較例１）に比較して、放熱性が向上されていることが判る。
Using the heat dissipation evaluation apparatus shown in FIG. 10 (a), the temperature change in the housing due to the difference in the composite plating film layer formed on the surface of the copper plate was measured. In the heat dissipation evaluation apparatus shown in FIG. 10A, a heater 22 whose temperature is maintained at 50 ° C. is installed on the bottom surface of a heat insulating casing 20 made of a fluororesin having a U-shaped cross section. A heat sink 24 in which a composite plating film layer was formed on the surface of the copper plate 14 was installed in the opening of the body 20. In the heat sink 24, the heat conducted from the heater 22 to the wall portion of the heat insulating casing 20 is substantially zero.
In addition, a temperature sensor 26 was inserted into a portion 10 mm below the heat sink 24 to measure the temperature in the heat insulating casing 20.
Here, FIG. 10B shows a temperature change in the heat insulating casing 20 when the heat sink 24 (Example 3) in which the composite plating film layer made of CNF and nickel is formed on the surface of the copper plate is used.
Furthermore, the temperature change in the heat insulation housing | casing 20 at the time of using the heat sink (comparative example 1) which formed the 20-micrometer-thick nickel plating film layer on the surface of a copper plate is also shown in FIG.10 (b).
As is clear from FIG. 10B, by using the heat sink 24 (Example 3) in which the composite plating film layer made of CNF and nickel is formed on the surface of the copper plate, nickel having a thickness of 20 μm is formed on the surface of the copper plate. It can be seen that the heat dissipation is improved as compared with the heat sink 24 (Comparative Example 1) on which the plating film layer is formed.
１０ 槽
１２ 電解めっき液
１４ 銅板（金属部品）
１６ 直流電源
１８ ニッケル板
１９ 攪拌機
２０ 断熱性筐体
２２ ヒータ
２４ ヒートシンク
２６ 温度測定装置
10 Tank 12 Electrolytic plating solution 14 Copper plate (metal parts)
16 DC power supply 18 Nickel plate 19 Stirrer 20 Heat insulating housing 22 Heater 24 Heat sink 26 Temperature measuring device
Claims (9)
前記複合めっき皮膜層の表面を形成するカーボンナノファイバには、前記めっき金属で覆われている部分と前記カーボンナノファイバの表面が露出している部分とが併存し、
且つ前記複合めっき皮膜層の波長３〜３０μｍの領域における熱放射率が、黒体の波長３〜３０μｍの領域における熱放射率に対して０．３以上となるように、前記カーボンナノファイバの表面が露出していることを特徴とする放熱部材。 A composite plating film layer composed of the carbon nanofibers and a plating metal formed by plating using a plating solution in which carbon nanofibers are dispersed is a heat dissipation member formed on the surface of a metal component,
The carbon nanofiber forming the surface of the composite plating film layer has a portion covered with the plating metal and a portion where the surface of the carbon nanofiber is exposed,
And the surface of the carbon nanofiber so that the thermal emissivity in the wavelength region of 3 to 30 μm of the composite plating film layer is 0.3 or more with respect to the thermal emissivity in the wavelength range of 3 to 30 μm of the black body. A heat dissipating member characterized by being exposed.
前記電解めっき液には、カーボンナノファイバを分散する分散剤として、アルキンジオール分子中にオキシエチレン側鎖を有するアルキンジオール化合物であって、前記アルキンジオール化合物の分子量の少なくとも２０重量％をオキシエチレン側鎖が占める分散剤を用い、
且つ陰極に接続された金属部品のめっき面を電解めっき液の液面に対して水平に載置すると共に、前記金属部品のめっき面の上方に陽極を配設し、
前記金属部品及び陽極を上下方向に揺動しつつ、電解めっき液を攪拌して、前記金属部品に電解めっきを施すことを特徴とする放熱部材の製造方法。 When producing a heat radiating member in which a composite plating film layer composed of the carbon nanofiber and the plating metal is formed on the surface of the metal part by electrolytic plating using an electrolytic plating solution in which carbon nanofibers are dispersed,
The electrolytic plating solution includes an alkynediol compound having an oxyethylene side chain in an alkynediol molecule as a dispersant for dispersing carbon nanofibers, and at least 20% by weight of the molecular weight of the alkynediol compound is on the oxyethylene side. Using a dispersant occupied by the chain,
And while placing the plating surface of the metal part connected to the cathode horizontally with respect to the surface of the electrolytic plating solution, the anode is disposed above the plating surface of the metal part,
A method of manufacturing a heat radiating member, wherein the metal component and the anode are subjected to electrolytic plating while the electrolytic plating solution is stirred while swinging the metal component and the anode in the vertical direction .
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| JP2008169402A (en) * | 2005-04-28 | 2008-07-24 | Tokyo Univ Of Agriculture & Technology | Electrochemical reaction process |
| JP4878452B2 (en) * | 2005-08-02 | 2012-02-15 | 東京特殊電線株式会社 | Composite coated copper wire and composite coated enameled copper wire |
| JP4719646B2 (en) * | 2006-08-25 | 2011-07-06 | 日精樹脂工業株式会社 | Manufacturing method of composite plating products |
| US8846201B2 (en) | 2009-03-05 | 2014-09-30 | Nissei Industrial Plastic Co., Ltd. | Composite plated product |
| JP5736270B2 (en) | 2010-09-14 | 2015-06-17 | 新光電気工業株式会社 | Heat dissipation component and manufacturing method thereof |
| JP5631775B2 (en) | 2011-02-24 | 2014-11-26 | 新光電気工業株式会社 | Composite plating solution |
| JP2014033104A (en) * | 2012-08-03 | 2014-02-20 | Shinko Electric Ind Co Ltd | Heat radiation component and manufacturing method of the same |
| JP6118540B2 (en) | 2012-11-08 | 2017-04-19 | 新光電気工業株式会社 | Heat dissipation component and manufacturing method thereof |
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