JP4265461B2 - 電子部品装着装置 - Google Patents
電子部品装着装置 Download PDFInfo
- Publication number
- JP4265461B2 JP4265461B2 JP2004103756A JP2004103756A JP4265461B2 JP 4265461 B2 JP4265461 B2 JP 4265461B2 JP 2004103756 A JP2004103756 A JP 2004103756A JP 2004103756 A JP2004103756 A JP 2004103756A JP 4265461 B2 JP4265461 B2 JP 4265461B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- load
- moving block
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Description
2 基板
2a ACF
10 電子部品装着装置
11 スライダ
12 ガイドレール
13 シャフト
15 保持部
15a 保持ヘッド
20 移動ブロック
21 ナット部
30 荷重センサ
30b,30c 取り付け面
31〜33 圧電素子
40 テーブル
50 モータ
51 送りねじ
60 制御部
62 記憶部
63 装着異常検出部
70 リニアスケール
80 異物
601 荷重プロファイル
603 許容範囲
S11〜S18,S21〜S26,S30 ステップ
Claims (3)
- 電子部品を基板に装着する電子部品装着装置であって、
電子部品の装着方向に駆動される移動ブロックと、
電子部品を保持する剛性の高い一体的なブロックである保持ヘッドと、
前記移動ブロックと前記保持ヘッドとの間に設けられ、前記保持ヘッドを支持する荷重センサと、
前記移動ブロックを前記装着方向に移動可能にガイドするガイド機構と、
前記移動ブロックの前記装着方向への駆動を行う駆動機構と、
電子部品の装着時に電子部品に加えられるべき前記装着方向に平行な方向の荷重値の時間に対する変化を示す荷重プロファイルを予め記憶する記憶部と、
前記荷重プロファイルに従って前記移動ブロックの駆動を制御する制御部と、
前記荷重センサにより検出される前記装着方向に平行な方向の垂直荷重の値と前記荷重プロファイルとを比較して、電子部品の装着異常を検出する装着異常検出部と、
前記保持ヘッドの前記装着方向に平行な方向の変位量を検出する変位センサを備え、
前記装着異常検出部が、前記変位センサにより検出された装着開始から終了までの前記保持ヘッドの変位量と、予め前記記憶部に記憶されている基準変位量とを比較して、電子部品の装着異常を検出することを特徴とする電子部品装着装置。 - 請求項1に記載の電子部品装着装置であって、
前記荷重センサは、前記装着方向に平行な方向の垂直荷重および前記装着方向に垂直でかつ互いに直交する2方向の水平荷重を受けて電圧を発生する3つの圧電素子を有することを特徴とする電子部品装着装置。 - 請求項2に記載の電子部品装着装置であって、
前記装着異常検出部が、前記荷重センサにより検出される前記2方向の水平荷重の値を座標値とする2次元空間上の位置と、前記記憶部に予め記憶されている前記2次元空間上の許容範囲とを比較して、電子部品の装着異常を検出することを特徴とする電子部品装着装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004103756A JP4265461B2 (ja) | 2003-06-03 | 2004-03-31 | 電子部品装着装置 |
US10/857,940 US7246430B2 (en) | 2003-06-03 | 2004-06-02 | Electronic component mounting apparatus and electronic component mounting method |
CNB2004100484275A CN100347838C (zh) | 2003-06-03 | 2004-06-03 | 电子元件安装设备及电子元件安装方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003157937 | 2003-06-03 | ||
JP2004103756A JP4265461B2 (ja) | 2003-06-03 | 2004-03-31 | 電子部品装着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005019957A JP2005019957A (ja) | 2005-01-20 |
JP4265461B2 true JP4265461B2 (ja) | 2009-05-20 |
Family
ID=34196681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004103756A Expired - Fee Related JP4265461B2 (ja) | 2003-06-03 | 2004-03-31 | 電子部品装着装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4265461B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007136644A (ja) * | 2005-11-22 | 2007-06-07 | Murata Mfg Co Ltd | 被処理物保持方法、静電吸着機構、静電吸着プローブ、被処理物搬送方法、および被処理物搬送装置 |
KR100843198B1 (ko) * | 2006-06-28 | 2008-07-02 | 삼성전자주식회사 | 반도체 패키지 본딩장치 |
JP4823801B2 (ja) * | 2006-08-01 | 2011-11-24 | Juki株式会社 | 電子部品実装方法及び装置 |
JP5083733B2 (ja) * | 2007-12-04 | 2012-11-28 | 上野精機株式会社 | 保持手段駆動装置、その制御方法、及び制御プログラム |
JP2010219334A (ja) * | 2009-03-17 | 2010-09-30 | Nec Corp | 電子部品製造装置、方法及びプログラム |
JP2013197146A (ja) * | 2012-03-16 | 2013-09-30 | Renesas Electronics Corp | 半導体装置の製造方法及び半導体製造装置 |
CN105247978B (zh) * | 2013-03-26 | 2018-03-27 | 富士机械制造株式会社 | 电子电路元件安装*** |
US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
JP2015153794A (ja) * | 2014-02-12 | 2015-08-24 | ヤマハ発動機株式会社 | 部品実装装置、及び検知装置 |
EP3648562B1 (en) * | 2017-06-26 | 2022-02-16 | Fuji Corporation | Electronic component mounting apparatus |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3504448B2 (ja) * | 1996-10-17 | 2004-03-08 | 株式会社ルネサステクノロジ | 半導体装置 |
JP3447982B2 (ja) * | 1999-06-16 | 2003-09-16 | 株式会社アルテクス | 超音波振動接合装置 |
JP4703054B2 (ja) * | 2001-07-30 | 2011-06-15 | 株式会社東芝 | ボンディング装置及びその方法 |
-
2004
- 2004-03-31 JP JP2004103756A patent/JP4265461B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2005019957A (ja) | 2005-01-20 |
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