JP4208856B2 - 液体吐出ヘッドの製造方法 - Google Patents
液体吐出ヘッドの製造方法 Download PDFInfo
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- JP4208856B2 JP4208856B2 JP2005117693A JP2005117693A JP4208856B2 JP 4208856 B2 JP4208856 B2 JP 4208856B2 JP 2005117693 A JP2005117693 A JP 2005117693A JP 2005117693 A JP2005117693 A JP 2005117693A JP 4208856 B2 JP4208856 B2 JP 4208856B2
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- Prior art keywords
- dicing
- adhesive
- supply port
- wafer
- ink supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 title claims description 58
- 238000000034 method Methods 0.000 title claims description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000853 adhesive Substances 0.000 claims description 132
- 230000001070 adhesive effect Effects 0.000 claims description 132
- 238000005520 cutting process Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 33
- 230000002829 reductive effect Effects 0.000 claims description 27
- 230000036961 partial effect Effects 0.000 claims description 18
- 238000002834 transmittance Methods 0.000 claims description 14
- 238000013461 design Methods 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 description 60
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 33
- 230000008569 process Effects 0.000 description 29
- 238000001723 curing Methods 0.000 description 28
- 239000010410 layer Substances 0.000 description 22
- 239000002245 particle Substances 0.000 description 22
- 230000005540 biological transmission Effects 0.000 description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 239000001301 oxygen Substances 0.000 description 14
- 229910052760 oxygen Inorganic materials 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 230000008719 thickening Effects 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000009849 deactivation Effects 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 238000007599 discharging Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000010526 radical polymerization reaction Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000861 blow drying Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
X2=X1+0.1(μm)
Y2=Y1+0.1(μm)
E>C
前述の実施例1〜4の各実施例において図面等を用いて説明した種々の構成は、例えば、ウエハと遮光マスクとの位置合わせ精度が所望の精度でないときには、遮光マスクの透光パターンの寸法をインク供給口の開口の寸法より大きくする構成を採用し、パターン太りの影響を抑えたいときには、遮光マスクの透光パターンの寸法をインク供給口の開口の寸法より小さくする構成を採用する等のように、実際の実施の状況に応じ、適宜組み合わせることによっても前述した所望の効果を得ることができる。
1a 素子部
1b ダイシングストリート
3 インク供給口
10 ダイシングテープ
11 基材
12 粘着剤
12a、12b 粘着性を低減した粘着層
13a、13b 素子基板
15 フレキシブル基板
Claims (2)
- ウエハ面に当該ウエハ面から他方の面側へ向かって先細くなる形状の液体供給口が形成されたウエハを、ダイシングストリートに沿って切断するダイシング方法を用いた液体吐出へッドの製造方法において、
前記液体供給口が形成された前記ウエハ面に、光硬化型の粘着剤を有するダイシングテープの粘着性を有する特定部位が露出して前記液体供給口を覆うように、前記ダイシングストリートに対応する別の部位を含んで当該ダイシングテープを貼着する工程と、
前記液体供給口を覆う前記ダイシングテープの前記特定部位の粘着性と、前記ダイシングストリートに対応する前記ダイシングテープの別の部位の粘着性と、を低下させる部分硬化処理工程と、
前記ダイシングストリートに沿って前記ウエハを切断して素子基板を得る工程と、
を有し、
前記部分硬化処理工程は、前記ダイシングテープが貼着された側から、前記液体供給口を覆う当該ダイシングテープの前記特定部位に対して遮光マスクの透過率の低い減光パターンを介して光を照射するとともに、前記ダイシングストリートに対応する当該ダイシングテープの前記別の部位には前記遮光マスクの透光パターンを介して光を照射することによって、前記特定部位の前記粘着剤の粘着性よりも前記別の部位の前記粘着剤の粘着性を、より低下させることを特徴とする液体吐出ヘッドの製造方法。 - 前記ダイシングストリートに対応する前記ダイシングテープの前記接着剤の粘着性を低下させる前記別の部位の幅を、前記ダイシングストリートの設計ライン幅より広くすることを特徴とする請求項1に記載の液体吐出ヘッドの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005117693A JP4208856B2 (ja) | 2004-04-28 | 2005-04-15 | 液体吐出ヘッドの製造方法 |
US11/113,665 US7569118B2 (en) | 2004-04-28 | 2005-04-25 | Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method |
US12/469,405 US7837820B2 (en) | 2004-04-28 | 2009-05-20 | Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method |
US12/904,023 US20110027970A1 (en) | 2004-04-28 | 2010-10-13 | Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004132415 | 2004-04-28 | ||
JP2004135193 | 2004-04-30 | ||
JP2004353693 | 2004-12-07 | ||
JP2004353694 | 2004-12-07 | ||
JP2005117693A JP4208856B2 (ja) | 2004-04-28 | 2005-04-15 | 液体吐出ヘッドの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006190927A JP2006190927A (ja) | 2006-07-20 |
JP4208856B2 true JP4208856B2 (ja) | 2009-01-14 |
Family
ID=35185874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005117693A Expired - Fee Related JP4208856B2 (ja) | 2004-04-28 | 2005-04-15 | 液体吐出ヘッドの製造方法 |
Country Status (2)
Country | Link |
---|---|
US (3) | US7569118B2 (ja) |
JP (1) | JP4208856B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4208856B2 (ja) * | 2004-04-28 | 2009-01-14 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
TWI250629B (en) * | 2005-01-12 | 2006-03-01 | Ind Tech Res Inst | Electronic package and fabricating method thereof |
US7835001B2 (en) * | 2006-05-24 | 2010-11-16 | Samsung Mobile Display Co., Ltd. | Method of aligning a substrate, mask to be aligned with the same, and flat panel display apparatus using the same |
JP5054954B2 (ja) * | 2006-09-22 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
KR101759347B1 (ko) * | 2010-12-14 | 2017-08-01 | 삼성디스플레이 주식회사 | 박막 증착용 마스크 프레임 조립체 및 그 제조방법 |
JP5582314B2 (ja) * | 2011-10-11 | 2014-09-03 | Tdk株式会社 | チップ部品支持装置及びその製造方法 |
JP6091955B2 (ja) * | 2013-03-26 | 2017-03-08 | リンテック株式会社 | 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法 |
WO2014192631A1 (ja) * | 2013-05-31 | 2014-12-04 | 三井化学東セロ株式会社 | 電子部材の剥離方法および積層体 |
US9701119B2 (en) | 2014-06-12 | 2017-07-11 | Funai Electric Co., Ltd. | Fluid ejection chip including hydrophilic and hydrophopic surfaces and methods of forming the same |
JP7276652B2 (ja) | 2019-04-11 | 2023-05-18 | エア・ウォーター・パフォーマンスケミカル株式会社 | 光ラジカル硬化酸素阻害低減剤、光ラジカル硬化酸素阻害低減剤を含有する光ラジカル重合性組成物及び光ラジカル硬化酸素阻害低減剤を含有する塗膜並びにその硬化方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6279649A (ja) | 1985-10-03 | 1987-04-13 | Mitsui Toatsu Chem Inc | 半導体ダイシング方法 |
DE3620025A1 (de) * | 1986-06-13 | 1987-12-17 | Henkel Kgaa | Verwendung von acylierten 3-amino-1,2,4-triazolen als korrosionsinhibitoren fuer buntmetalle |
GB8730220D0 (en) * | 1987-12-29 | 1988-02-03 | Exxon Chemical Patents Inc | Detergents |
US5362681A (en) * | 1992-07-22 | 1994-11-08 | Anaglog Devices, Inc. | Method for separating circuit dies from a wafer |
JP3097619B2 (ja) | 1997-10-02 | 2000-10-10 | 日本電気株式会社 | 電界放射冷陰極の製造方法 |
JP3408130B2 (ja) | 1997-12-19 | 2003-05-19 | キヤノン株式会社 | インクジェット記録ヘッドおよびその製造方法 |
US6271102B1 (en) * | 1998-02-27 | 2001-08-07 | International Business Machines Corporation | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
JP2000223446A (ja) * | 1998-11-27 | 2000-08-11 | Denso Corp | 半導体装置およびその製造方法 |
US6482778B2 (en) * | 1999-08-11 | 2002-11-19 | Ethyl Corporation | Zinc and phosphorus containing transmission fluids having enhanced performance capabilities |
JP2002043253A (ja) | 2000-07-26 | 2002-02-08 | Nec Corp | 半導体素子のダイシング方法 |
WO2002074686A2 (en) * | 2000-12-05 | 2002-09-26 | Analog Devices, Inc. | A method and device for protecting micro electromechanical systems structures during dicing of a wafer |
US6893574B2 (en) * | 2001-10-23 | 2005-05-17 | Analog Devices Inc | MEMS capping method and apparatus |
US7329947B2 (en) * | 2003-11-07 | 2008-02-12 | Sumitomo Mitsubishi Silicon Corporation | Heat treatment jig for semiconductor substrate |
JP4208856B2 (ja) * | 2004-04-28 | 2009-01-14 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
-
2005
- 2005-04-15 JP JP2005117693A patent/JP4208856B2/ja not_active Expired - Fee Related
- 2005-04-25 US US11/113,665 patent/US7569118B2/en not_active Expired - Fee Related
-
2009
- 2009-05-20 US US12/469,405 patent/US7837820B2/en not_active Expired - Fee Related
-
2010
- 2010-10-13 US US12/904,023 patent/US20110027970A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20090242111A1 (en) | 2009-10-01 |
US7837820B2 (en) | 2010-11-23 |
US7569118B2 (en) | 2009-08-04 |
JP2006190927A (ja) | 2006-07-20 |
US20050241754A1 (en) | 2005-11-03 |
US20110027970A1 (en) | 2011-02-03 |
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