JP4003116B2 - 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 - Google Patents
磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 Download PDFInfo
- Publication number
- JP4003116B2 JP4003116B2 JP2001362137A JP2001362137A JP4003116B2 JP 4003116 B2 JP4003116 B2 JP 4003116B2 JP 2001362137 A JP2001362137 A JP 2001362137A JP 2001362137 A JP2001362137 A JP 2001362137A JP 4003116 B2 JP4003116 B2 JP 4003116B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- polishing
- polyoxyethylene sorbitan
- polishing composition
- magnetic disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001362137A JP4003116B2 (ja) | 2001-11-28 | 2001-11-28 | 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 |
TW091124806A TW593632B (en) | 2001-11-28 | 2002-10-24 | Polishing composition for a substrate for a magnetic disk and polishing method employing it |
GB0225878A GB2383797B (en) | 2001-11-28 | 2002-11-06 | Polishing composition for a substrate for a magnetic disk and polishing method employing it |
MYPI20024366A MY122895A (en) | 2001-11-28 | 2002-11-22 | Polishing composition for a substrate for a magnetic disk and polishing method employing it |
US10/303,875 US6811583B2 (en) | 2001-11-28 | 2002-11-26 | Polishing composition for a substrate for a magnetic disk and polishing method employing it |
CNB021543151A CN1230481C (zh) | 2001-11-28 | 2002-11-28 | 磁盘基材的抛光组合物和使用该组合物的抛光方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001362137A JP4003116B2 (ja) | 2001-11-28 | 2001-11-28 | 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003160781A JP2003160781A (ja) | 2003-06-06 |
JP4003116B2 true JP4003116B2 (ja) | 2007-11-07 |
Family
ID=19172688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001362137A Expired - Lifetime JP4003116B2 (ja) | 2001-11-28 | 2001-11-28 | 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6811583B2 (zh) |
JP (1) | JP4003116B2 (zh) |
CN (1) | CN1230481C (zh) |
GB (1) | GB2383797B (zh) |
MY (1) | MY122895A (zh) |
TW (1) | TW593632B (zh) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4068499B2 (ja) * | 2003-05-09 | 2008-03-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2005138197A (ja) * | 2003-11-04 | 2005-06-02 | Fujimi Inc | 研磨用組成物及び研磨方法 |
US20050194562A1 (en) * | 2004-02-23 | 2005-09-08 | Lavoie Raymond L.Jr. | Polishing compositions for controlling metal interconnect removal rate in semiconductor wafers |
JP2006077127A (ja) * | 2004-09-09 | 2006-03-23 | Fujimi Inc | 研磨用組成物及びそれを用いた研磨方法 |
US7497913B2 (en) * | 2005-04-28 | 2009-03-03 | Sematech Inc. | Method and apparatus for colloidal particle cleaning |
US20060280860A1 (en) * | 2005-06-09 | 2006-12-14 | Enthone Inc. | Cobalt electroless plating in microelectronic devices |
JP4481898B2 (ja) * | 2005-07-25 | 2010-06-16 | ユシロ化学工業株式会社 | 水性砥粒分散媒組成物 |
TWI385226B (zh) * | 2005-09-08 | 2013-02-11 | 羅門哈斯電子材料Cmp控股公司 | 用於移除聚合物阻障之研磨漿液 |
US7435162B2 (en) * | 2005-10-24 | 2008-10-14 | 3M Innovative Properties Company | Polishing fluids and methods for CMP |
JP2007214205A (ja) | 2006-02-07 | 2007-08-23 | Fujimi Inc | 研磨用組成物 |
JP2007257810A (ja) * | 2006-03-24 | 2007-10-04 | Hoya Corp | 磁気ディスク用ガラス基板の製造方法および磁気ディスクの製造方法 |
EP2535400A2 (en) * | 2006-07-11 | 2012-12-19 | Rhodia, Inc. | Aqueous dispersions of hybrid coacervates delivering specific properties onto solid surfaces and comprising inorganic solid particles and a copolymer |
JP5204960B2 (ja) | 2006-08-24 | 2013-06-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
TWI402335B (zh) * | 2006-09-08 | 2013-07-21 | Kao Corp | 研磨液組合物 |
CN101153206A (zh) * | 2006-09-29 | 2008-04-02 | 安集微电子(上海)有限公司 | 用于抛光多晶硅的化学机械抛光液 |
CA2700413A1 (en) * | 2007-10-05 | 2009-04-09 | Saint-Gobain Ceramics & Plastics, Inc. | Polishing of sapphire with composite slurries |
KR101323577B1 (ko) * | 2007-10-05 | 2013-10-30 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 개선된 탄화규소 입자, 그 제조방법 및 그의 이용 방법 |
CN101451044B (zh) * | 2007-11-30 | 2013-10-02 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
KR101564676B1 (ko) * | 2008-02-01 | 2015-11-02 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 및 이를 이용한 연마 방법 |
JP5643188B2 (ja) * | 2008-05-09 | 2014-12-17 | ロディア オペレーションズRhodia Operations | ハイブリッドナノスケール粒子 |
CN101665661A (zh) * | 2008-09-05 | 2010-03-10 | 安集微电子科技(上海)有限公司 | 胺类化合物的应用以及一种化学机械抛光液 |
US20130260027A1 (en) * | 2010-12-29 | 2013-10-03 | Hoya Corporation | Method for manufacturing glass substrate for magnetic disk, and method for manufacturing magnetic disk |
KR101257336B1 (ko) * | 2012-04-13 | 2013-04-23 | 유비머트리얼즈주식회사 | 연마용 슬러리 및 이를 이용한 기판 연마 방법 |
CN105131391A (zh) * | 2012-12-13 | 2015-12-09 | 苏州亨利通信材料有限公司 | 用于光电缆的聚乙烯材料 |
CN103035331B (zh) * | 2012-12-13 | 2015-08-26 | 苏州亨利通信材料有限公司 | 抗水汽填充绳及其制造工艺 |
SG11201509225VA (en) * | 2013-05-15 | 2015-12-30 | Basf Se | Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of n-vinyl-homopolymers and n-vinyl copolymers |
WO2015146942A1 (ja) | 2014-03-28 | 2015-10-01 | 山口精研工業株式会社 | 研磨剤組成物、および磁気ディスク基板の研磨方法 |
CN103937414B (zh) * | 2014-04-29 | 2018-03-02 | 杰明纳微电子股份有限公司 | 一种计算机硬盘盘基片的精抛光液 |
US10144850B2 (en) * | 2015-09-25 | 2018-12-04 | Versum Materials Us, Llc | Stop-on silicon containing layer additive |
MY184933A (en) | 2015-09-25 | 2021-04-30 | Yamaguchi Seiken Kogyo Co Ltd | Polishing composition and method for polishing magnetic disk substrate |
CN105647391B (zh) * | 2016-01-13 | 2017-12-15 | 上海欧柏森环境工程管理有限公司 | 一种石材抛光粉 |
JP7034667B2 (ja) | 2017-10-24 | 2022-03-14 | 山口精研工業株式会社 | 磁気ディスク基板用研磨剤組成物 |
US10479911B1 (en) | 2018-06-05 | 2019-11-19 | Cabot Microelectronics Corporation | Composition and method for polishing memory hard disks exhibiting reduced edge roll off |
JP2022553346A (ja) * | 2019-10-22 | 2022-12-22 | シーエムシー マテリアルズ,インコーポレイティド | 酸化ケイ素及び炭素ドープ酸化ケイ素cmpのための組成物並びに方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5352277A (en) * | 1988-12-12 | 1994-10-04 | E. I. Du Pont De Nemours & Company | Final polishing composition |
JP2002517593A (ja) * | 1998-06-10 | 2002-06-18 | ロデール ホールディングス インコーポレイテッド | 金属cmpにおける研磨用組成物および研磨方法 |
JP3998813B2 (ja) | 1998-06-15 | 2007-10-31 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
SG78405A1 (en) | 1998-11-17 | 2001-02-20 | Fujimi Inc | Polishing composition and rinsing composition |
JP4273475B2 (ja) | 1999-09-21 | 2009-06-03 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
US6258140B1 (en) * | 1999-09-27 | 2001-07-10 | Fujimi America Inc. | Polishing composition |
JP3490038B2 (ja) * | 1999-12-28 | 2004-01-26 | Necエレクトロニクス株式会社 | 金属配線形成方法 |
US6299795B1 (en) * | 2000-01-18 | 2001-10-09 | Praxair S.T. Technology, Inc. | Polishing slurry |
TWI268286B (en) | 2000-04-28 | 2006-12-11 | Kao Corp | Roll-off reducing agent |
JP3768401B2 (ja) * | 2000-11-24 | 2006-04-19 | Necエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
-
2001
- 2001-11-28 JP JP2001362137A patent/JP4003116B2/ja not_active Expired - Lifetime
-
2002
- 2002-10-24 TW TW091124806A patent/TW593632B/zh not_active IP Right Cessation
- 2002-11-06 GB GB0225878A patent/GB2383797B/en not_active Expired - Fee Related
- 2002-11-22 MY MYPI20024366A patent/MY122895A/en unknown
- 2002-11-26 US US10/303,875 patent/US6811583B2/en not_active Expired - Fee Related
- 2002-11-28 CN CNB021543151A patent/CN1230481C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1422922A (zh) | 2003-06-11 |
TW593632B (en) | 2004-06-21 |
CN1230481C (zh) | 2005-12-07 |
MY122895A (en) | 2006-05-31 |
GB2383797B (en) | 2005-02-09 |
GB2383797A (en) | 2003-07-09 |
US20030121214A1 (en) | 2003-07-03 |
US6811583B2 (en) | 2004-11-02 |
GB0225878D0 (en) | 2002-12-11 |
JP2003160781A (ja) | 2003-06-06 |
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