JP4003116B2 - 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 - Google Patents

磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 Download PDF

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Publication number
JP4003116B2
JP4003116B2 JP2001362137A JP2001362137A JP4003116B2 JP 4003116 B2 JP4003116 B2 JP 4003116B2 JP 2001362137 A JP2001362137 A JP 2001362137A JP 2001362137 A JP2001362137 A JP 2001362137A JP 4003116 B2 JP4003116 B2 JP 4003116B2
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JP
Japan
Prior art keywords
acid
polishing
polyoxyethylene sorbitan
polishing composition
magnetic disk
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Expired - Lifetime
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JP2001362137A
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English (en)
Japanese (ja)
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JP2003160781A (ja
Inventor
智明 石橋
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Fujimi Inc
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Fujimi Inc
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Application filed by Fujimi Inc filed Critical Fujimi Inc
Priority to JP2001362137A priority Critical patent/JP4003116B2/ja
Priority to TW091124806A priority patent/TW593632B/zh
Priority to GB0225878A priority patent/GB2383797B/en
Priority to MYPI20024366A priority patent/MY122895A/en
Priority to US10/303,875 priority patent/US6811583B2/en
Priority to CNB021543151A priority patent/CN1230481C/zh
Publication of JP2003160781A publication Critical patent/JP2003160781A/ja
Application granted granted Critical
Publication of JP4003116B2 publication Critical patent/JP4003116B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2001362137A 2001-11-28 2001-11-28 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 Expired - Lifetime JP4003116B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001362137A JP4003116B2 (ja) 2001-11-28 2001-11-28 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法
TW091124806A TW593632B (en) 2001-11-28 2002-10-24 Polishing composition for a substrate for a magnetic disk and polishing method employing it
GB0225878A GB2383797B (en) 2001-11-28 2002-11-06 Polishing composition for a substrate for a magnetic disk and polishing method employing it
MYPI20024366A MY122895A (en) 2001-11-28 2002-11-22 Polishing composition for a substrate for a magnetic disk and polishing method employing it
US10/303,875 US6811583B2 (en) 2001-11-28 2002-11-26 Polishing composition for a substrate for a magnetic disk and polishing method employing it
CNB021543151A CN1230481C (zh) 2001-11-28 2002-11-28 磁盘基材的抛光组合物和使用该组合物的抛光方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001362137A JP4003116B2 (ja) 2001-11-28 2001-11-28 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法

Publications (2)

Publication Number Publication Date
JP2003160781A JP2003160781A (ja) 2003-06-06
JP4003116B2 true JP4003116B2 (ja) 2007-11-07

Family

ID=19172688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001362137A Expired - Lifetime JP4003116B2 (ja) 2001-11-28 2001-11-28 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法

Country Status (6)

Country Link
US (1) US6811583B2 (zh)
JP (1) JP4003116B2 (zh)
CN (1) CN1230481C (zh)
GB (1) GB2383797B (zh)
MY (1) MY122895A (zh)
TW (1) TW593632B (zh)

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JP2005138197A (ja) * 2003-11-04 2005-06-02 Fujimi Inc 研磨用組成物及び研磨方法
US20050194562A1 (en) * 2004-02-23 2005-09-08 Lavoie Raymond L.Jr. Polishing compositions for controlling metal interconnect removal rate in semiconductor wafers
JP2006077127A (ja) * 2004-09-09 2006-03-23 Fujimi Inc 研磨用組成物及びそれを用いた研磨方法
US7497913B2 (en) * 2005-04-28 2009-03-03 Sematech Inc. Method and apparatus for colloidal particle cleaning
US20060280860A1 (en) * 2005-06-09 2006-12-14 Enthone Inc. Cobalt electroless plating in microelectronic devices
JP4481898B2 (ja) * 2005-07-25 2010-06-16 ユシロ化学工業株式会社 水性砥粒分散媒組成物
TWI385226B (zh) * 2005-09-08 2013-02-11 羅門哈斯電子材料Cmp控股公司 用於移除聚合物阻障之研磨漿液
US7435162B2 (en) * 2005-10-24 2008-10-14 3M Innovative Properties Company Polishing fluids and methods for CMP
JP2007214205A (ja) 2006-02-07 2007-08-23 Fujimi Inc 研磨用組成物
JP2007257810A (ja) * 2006-03-24 2007-10-04 Hoya Corp 磁気ディスク用ガラス基板の製造方法および磁気ディスクの製造方法
EP2535400A2 (en) * 2006-07-11 2012-12-19 Rhodia, Inc. Aqueous dispersions of hybrid coacervates delivering specific properties onto solid surfaces and comprising inorganic solid particles and a copolymer
JP5204960B2 (ja) 2006-08-24 2013-06-05 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
TWI402335B (zh) * 2006-09-08 2013-07-21 Kao Corp 研磨液組合物
CN101153206A (zh) * 2006-09-29 2008-04-02 安集微电子(上海)有限公司 用于抛光多晶硅的化学机械抛光液
CA2700413A1 (en) * 2007-10-05 2009-04-09 Saint-Gobain Ceramics & Plastics, Inc. Polishing of sapphire with composite slurries
KR101323577B1 (ko) * 2007-10-05 2013-10-30 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 개선된 탄화규소 입자, 그 제조방법 및 그의 이용 방법
CN101451044B (zh) * 2007-11-30 2013-10-02 安集微电子(上海)有限公司 一种化学机械抛光液
KR101564676B1 (ko) * 2008-02-01 2015-11-02 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 이를 이용한 연마 방법
JP5643188B2 (ja) * 2008-05-09 2014-12-17 ロディア オペレーションズRhodia Operations ハイブリッドナノスケール粒子
CN101665661A (zh) * 2008-09-05 2010-03-10 安集微电子科技(上海)有限公司 胺类化合物的应用以及一种化学机械抛光液
US20130260027A1 (en) * 2010-12-29 2013-10-03 Hoya Corporation Method for manufacturing glass substrate for magnetic disk, and method for manufacturing magnetic disk
KR101257336B1 (ko) * 2012-04-13 2013-04-23 유비머트리얼즈주식회사 연마용 슬러리 및 이를 이용한 기판 연마 방법
CN105131391A (zh) * 2012-12-13 2015-12-09 苏州亨利通信材料有限公司 用于光电缆的聚乙烯材料
CN103035331B (zh) * 2012-12-13 2015-08-26 苏州亨利通信材料有限公司 抗水汽填充绳及其制造工艺
SG11201509225VA (en) * 2013-05-15 2015-12-30 Basf Se Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of n-vinyl-homopolymers and n-vinyl copolymers
WO2015146942A1 (ja) 2014-03-28 2015-10-01 山口精研工業株式会社 研磨剤組成物、および磁気ディスク基板の研磨方法
CN103937414B (zh) * 2014-04-29 2018-03-02 杰明纳微电子股份有限公司 一种计算机硬盘盘基片的精抛光液
US10144850B2 (en) * 2015-09-25 2018-12-04 Versum Materials Us, Llc Stop-on silicon containing layer additive
MY184933A (en) 2015-09-25 2021-04-30 Yamaguchi Seiken Kogyo Co Ltd Polishing composition and method for polishing magnetic disk substrate
CN105647391B (zh) * 2016-01-13 2017-12-15 上海欧柏森环境工程管理有限公司 一种石材抛光粉
JP7034667B2 (ja) 2017-10-24 2022-03-14 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物
US10479911B1 (en) 2018-06-05 2019-11-19 Cabot Microelectronics Corporation Composition and method for polishing memory hard disks exhibiting reduced edge roll off
JP2022553346A (ja) * 2019-10-22 2022-12-22 シーエムシー マテリアルズ,インコーポレイティド 酸化ケイ素及び炭素ドープ酸化ケイ素cmpのための組成物並びに方法

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US5352277A (en) * 1988-12-12 1994-10-04 E. I. Du Pont De Nemours & Company Final polishing composition
JP2002517593A (ja) * 1998-06-10 2002-06-18 ロデール ホールディングス インコーポレイテッド 金属cmpにおける研磨用組成物および研磨方法
JP3998813B2 (ja) 1998-06-15 2007-10-31 株式会社フジミインコーポレーテッド 研磨用組成物
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JP4273475B2 (ja) 1999-09-21 2009-06-03 株式会社フジミインコーポレーテッド 研磨用組成物
US6258140B1 (en) * 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
JP3490038B2 (ja) * 1999-12-28 2004-01-26 Necエレクトロニクス株式会社 金属配線形成方法
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TWI268286B (en) 2000-04-28 2006-12-11 Kao Corp Roll-off reducing agent
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Necエレクトロニクス株式会社 化学的機械的研磨用スラリー

Also Published As

Publication number Publication date
CN1422922A (zh) 2003-06-11
TW593632B (en) 2004-06-21
CN1230481C (zh) 2005-12-07
MY122895A (en) 2006-05-31
GB2383797B (en) 2005-02-09
GB2383797A (en) 2003-07-09
US20030121214A1 (en) 2003-07-03
US6811583B2 (en) 2004-11-02
GB0225878D0 (en) 2002-12-11
JP2003160781A (ja) 2003-06-06

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