JP3967608B2 - Electronic component delivery mechanism and method in electronic component transport apparatus - Google Patents

Electronic component delivery mechanism and method in electronic component transport apparatus Download PDF

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JP3967608B2
JP3967608B2 JP2002050218A JP2002050218A JP3967608B2 JP 3967608 B2 JP3967608 B2 JP 3967608B2 JP 2002050218 A JP2002050218 A JP 2002050218A JP 2002050218 A JP2002050218 A JP 2002050218A JP 3967608 B2 JP3967608 B2 JP 3967608B2
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electronic component
electronic
delivery
suction
tip
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JP2003246446A (en
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豊彦 早川
忠晴 片岡
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Ueno Seiki Co Ltd
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Ueno Seiki Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品搬送装置における電子部品受渡機構及び方法に関し、特にトランジスタ、ダイオード、ＩＣ等の微小な電子部品（以下、デバイスとも称する）の搬送装置における電子部品受渡機構及び方法に関するものである。
【０００２】
【従来の技術】
上記のような微小な電子部品（デバイス）は、直線移動式の搬送機構（以下、リニアパーツフィーダーとも称する）に個別に投入され、該搬送機構で整列し、自動ハンドリングシステム（オートハンドラー）の各種処理工程へ供給される。各種処理工程では、電気特性テスト、マーキング、外観検査、テーピング等の各種処理が行われる。
【０００３】
上記自動ハンドリングシステムに使用されている直線移動方式の搬送機構（リニアパーツフィーダー）の先端部における従来のデバイス受渡機構を図１に示す。図１（ａ）は従来のデバイス受渡機構を模式的に示す側面図（一部断面図となっている）、図１（ｂ）は同正面図（真空吸引部を取除いた状態）である。
これらの図において、１はリニアパーツフィーダーであり、進行方向に振動してデバイス２を個別に順次連続的に先端部３へ搬送する。一方、先端部３の前方には真空吸引部４が設けられ、真空吸引により、先端部３に達したデバイス２を受渡位置５に移動させる。受渡位置５の上方には上下動可能な真空チャック６が配置され、デバイス２の受渡時には下降し、デバイス２を真空吸引した後、上昇し、デバイス２を次の処理工程ステージへ移送させるようになっている。
また、別の従来のデバイス受渡機構として、図２に示すように、受渡位置５の下方に、上下動可能な突上ピン７が配置され、受渡時に上昇してデバイス２を真空吸引して支持する構成のものもある。
【０００４】
しかしながら、上記従来のデバイス受渡機構には次のような問題があった。
リニアパーツフィーダー１はデバイス搬送のため振動しており、またデバイス２はリニアパーツフィーダー１内では図示の如く大きなあそびをもって供給されてくる。従って、振動するリニアパーツフィーダー１から直接デバイス２を真空チャック６によりチャッキングすると、デバイス２の位置が不安定となりチャッキングミスを起こすことがある。
また、受渡位置５より一個手前のデバイス２の供給スピードはリニアパーツフィーダー１まかせとなり、供給スピードが遅く、デバイス受渡に時間がかかる。さらに、デバイス２に樹脂バリがあった場合、受渡のデバイス２と後続のデバイス２の樹脂バリ同士が引っ掛かって、デバイス２が落下してしまうことがあった。
【０００５】
【発明が解決しようとする課題】
本発明は、かかる従来技術の問題点を解消し、電子部品の受渡位置における位置決め精度を上げて電子部品位置不安定によるチャッキングミスをなくし、電子部品の供給スピードを速くして受渡時間を短縮することができ、かつ樹脂バリ同士の引っ掛かりにより電子部品が落下することに起因するチャッキングミスもなくすことのできる電子部品搬送装置における電子部品受渡機構及び方法を提供することをその課題とする。
【０００６】
【課題を解決するための手段】
上記目的を達成するために、請求項１の電子部品搬送装置における電子部品受渡機構は、多数の電子部品を個別に電子部品搬送装置上を順次連続的に搬送し、前記電子部品搬送装置の先端部にて電子部品の供給を行い、前記先端部より前方の電子部品受渡位置にて真空吸着手段に電子部品の受渡を行う、電子部品搬送装置における電子部品受渡機構において、前記電子部品搬送装置の先端部位置と前記電子部品受渡位置との間を移動可能であり、前記先端部位置にて電子部品を真空吸着して受け取るための真空吸着部を有し、受け取った電子部品を前記電子部品受渡位置に移動させる電子部品吸着移動手段と、前記電子部品搬送装置の先端部位置近傍にて電子部品の供給を補助するエアーブロー手段と、電子部品の受渡前に後続の電子部品の飛び出しを防止するストッパー手段と、前記電子部品吸着移動手段を昇降させる昇降手段とを備え、前記電子部品吸着移動手段は、電子部品を移動させる方向と垂直方向に軸を備え、この軸を中心として回転方向に揺動自在なレバー部材からなることを特徴とする。
また、請求項２の電子部品搬送装置における電子部品受渡方法は、多数の電子部品を個別に電子部品搬送装置上にて順次連続的に搬送し、前記電子部品搬送装置の先端部近傍にて電子部品の供給を行い、前記先端部より前方の電子部品受渡位置にて真空吸着手段に電子部品の受渡を行う、電子部品搬送装置における電子部品受渡方法において、前記電子部品搬送装置の先端部位置と前記電子部品受渡位置との間を、電子部品を移動させる方向と垂直方向の軸を中心として回転方向に揺動するレバー部材により移動可能であり、前記先端部位置にて電子部品を真空吸着して受け取るための真空吸着部を有する電子部品吸着移動手段と、電子部品の受渡前に後続の電子部品を停止させ飛び出しを防止するストッパー手段と、前記電子部品吸着移動手段を昇降させる昇降手段と、を用いて、前記電子部品吸着移動手段により、供給されてきた電子部品を受け取り、前記電子部品受渡位置にて真空吸着手段に電子部品を受け渡すとともに、前記ストッパー手段により受渡前に後続の電子部品を停止させ飛び出しを防止させ、前記昇降手段により、電子部品を前記真空吸着手段に受け渡す時に前記電子部品吸着移動手段を上昇させることを特徴とする。
【０００７】
【発明の実施の形態】
以下、本発明の実施の形態を好ましい実施例により説明する。
図３は本発明の一実施例に係る電子部品受渡機構（以下、デバイス受渡機構とも称する）の構造を模式的に示す図である。図３（ａ）は該電子部品受渡機構の側面図（一部断面図となっている）、図３（ｂ）は同正面図（アーム状部材を取除いた状態）である。図３（ａ）において一点鎖線で示されているものはデバイス供給時の状態であり、実線で示されているものはデバイス受渡時の状態である。
【０００８】
図中１１はリニアパーツフィーダーであり、デバイス進行方向に振動してデバイス１２を整列し、個別に順次連続的に先端部１３へ搬送する。リニアパーツフィーダー１１はデバイス１２の幅方向の位置決めを行う位置決め部材１４を有するとともに、先端部１３には切り込み部１５が形成されている。位置決め部材１４は、デバイス１２がＩＣ等の半導体素子の場合、デバイス１２との間隔が片側で０．０５〜０．１ｍｍ程度となるように位置決めを行う。なお、Ｂはデバイス１２の樹脂バリである。
【０００９】
リニアパーツフィーダー１１の前方側にはレバー部材１６が軸１７の周りを揺動自在に配置されている。レバー部材１６は、供給されたデバイス１２を載置するための載置部１８を有するとともに、リニアパーツフィーダー１１の先端部１３にて供給されたデバイス１２を真空吸着してバキューム固定するための真空吸着部１９を有する。レバー部材１６は実線で示すデバイス受渡時の位置と一点鎖線で示すデバイス供給時の位置との間を揺動自在であり、その揺動動作は高速動作ソレノイド等からなるアクチュエーター２０により行われる。
【００１０】
デバイス受渡位置２１の上方には真空チャック２２が上下動可能に設置されている。また、リニアパーツフィーダー１１の先端部１３の手前には、デバイス１２の供給を補助するエアーブロー部２３が設置されている。さらに、リニアパーツフィーダー１１の先端部１３付近上方には、デバイス受渡時にデバイス供給位置（先端部１３）にある後続のデバイス１２が不測に飛び出すことを防止するためのストッパー２４が軸２５の周りを回動自在に配置されている。ストッパー２４の回動動作は高速動作ソレノイド等からなるアクチュエーター２６により行われ、実線で示す作動位置と一点鎖線で示す非作動位置との間を揺動できるようになっている。
【００１１】
レバー部材１６を軸支する軸１７は支持台２７に回動可能に取り付けられており、この支持台２７はデバイス受渡時には図４に示すように高速動作ソレノイド等からなるアクチュエーター２８の作動により上昇し、それ以外の時は図３に示すように下降位置にある。
【００１２】
次に本実施例のデバイス受渡機構の動作について述べる。
先ず、リニアパーツフィーダー１１はデバイス進行方向に振動してデバイス１２を整列し、個別に順次連続的に先端部１３に向けて搬送する。エアーブロー部２３は先端部１３に向けてエアーブローして、デバイス１２の先端部１３への供給を補助する。この搬送に当たってデバイス１２は位置決め部材１４によりその幅方向の位置決めがなされる。
【００１３】
デバイス供給時には、アクチュエーター２０が作動し、レバー部材１６を一点鎖線の位置まで揺動させる。この時ストッパー２４は一点鎖線の位置にあり、支持台２７は下降位置にある。レバー部材１６は、真空吸着部１９により、リニアパーツフィーダー１１内で幅方向に位置決めされ、先端部１３に達したデバイス１２を、バキューム固定する。その後、アクチュエーター２０の作動によりレバー部材１６は実線位置まで揺動し、これにより、受渡となるデバイス１２（斜線を付してある）はレバー部材１６の載置部１８上に載置された状態で強制的に引っ張り出され、振動するリニアパーツフィーダー１１から分離される。この動作と同期して、次の受渡となるデバイス１２はリニアパーツフィーダー１１の振動により先端部１３に達する。次いで、アクチュエーター２８の作動により支持台２７が上昇し、これにより図３のようなデバイス１２同士の樹脂バリＢの重なりがあっても、図４のように樹脂バリＢの重なりは分離する。そして、真空チャック２２が下降し、受渡となるデバイス１２をチャッキングした後、上昇と同時にアクチュエーター２６の作動によりストッパー２４が実線位置の状態となり、デバイス受取時に後続のデバイス１２の飛び出しを防止する。
デバイス１２の受渡が終わると、レバー部材１６が先端部１３にあるデバイス１２を取りに動いた後、アクチュエーター２６の作動によりストッパー２４は一点鎖線の状態まで回動する。
【００１４】
以上の動作を繰り返して、デバイス受渡が高速に行われる。例えば、アクチュエーター２０、２６として高速動作ソレノイドを使用すると、デバイス供給動作が１サイクル２０ｍｓ以下も可能となる。また、位置決め部１４による幅方向の位置決めと、デバイス受渡時においてリニアパーツフィーダー１１から分離した状態で受渡を行うことにより、位置決め精度が向上し、デバイス位置不安定によるチャッキングミスがなくなる。さらに、デバイス１２に樹脂バリＢ同士の重なりがあっても、デバイス受渡時にレバー部材１６が支持台２７とともに上昇して樹脂バリＢの重なりが分離され、その状態で受渡が行われるので、樹脂バリ重なりによるチャッキングミスがなくなる。
【００１５】
以上本発明を一実施例に基づいて説明してきたが、本発明は上記実施例に限定されず、種々の変形、変更が可能である。
例えば、上記実施例では、電子部品吸着移動手段として、揺動自在なレバー部材を用いたが、直線方向に前進、後退する部材を用いてもよい。
また、上記実施例では、アクチュエーターとして高速動作ソレノイドを用いたが、パルスモーターを使った偏心カム等を用いてもよい。
【００１６】
【発明の効果】
本発明によれば、電子部品搬送装置の先端部において、供給されてきた電子部品をバキューム固定できる電子部品吸着移動手段で強制的に引っ張りだすことで、振動する電子部品搬送装置と分離した状態で電子部品の受渡が行えるため、位置決め精度が上がり、電子部品位置不安定によるチャッキングミスをなくすことができる。
また、電子部品吸着移動手段と、電子部品飛び出し防止のためのストッパー手段とを備えることにより、電子部品の供給スピードを速くすることができる。
さらに、電子部品受渡時に昇降手段により電子部品吸着移動手段が上昇するため、受渡の電子部品の樹脂バリと後続の電子部品の樹脂バリとの重なりがあってもそれが分離され、樹脂バリ重なりによるチャッキングミスをなくすことができる。
【図面の簡単な説明】
【図１】従来のデバイス受渡機構の構造を模式的に示す図で、（ａ）は側面図、（ｂ）は正面図である。
【図２】従来の別のデバイス受渡機構の構造を模式的に示す図で、（ａ）は側面図、（ｂ）は正面図である。
【図３】本発明の一実施例に係るデバイス受渡機構の構造を模式的に示す図で、（ａ）は側面図、（ｂ）は正面図である。
【図４】デバイス受渡時におけるデバイス受渡機構の状態を示す図である。
【符号の説明】
１１ リニアパーツフィーダー
１２ デバイス（微小な電子部品）
１３ 先端部
１４ 位置決め部材
１５ 切り込み部
１６ レバー部材
１７ 軸
１８ 載置部
１９ 真空吸着部
２０ アクチュエーター
２１ デバイス受渡位置
２２ 真空チャック
２３ エアーブロー部
２４ ストッパー
２５ 軸
２６ アクチュエーター
２７ 支持台
２８ アクチュエーター
Ｂ 樹脂バリ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component delivery mechanism and method in an electronic component transport apparatus, and more particularly to an electronic component delivery mechanism and method in a transport apparatus for minute electronic components (hereinafter also referred to as devices) such as transistors, diodes, and ICs. .
[0002]
[Prior art]
The minute electronic components (devices) as described above are individually put into a linear movement type transport mechanism (hereinafter also referred to as a linear parts feeder), aligned by the transport mechanism, and various types of automatic handling systems (auto handlers). Supplied to the processing step. In various processing steps, various processes such as an electrical property test, marking, appearance inspection, taping, and the like are performed.
[0003]
FIG. 1 shows a conventional device delivery mechanism at the front end of a linear movement type conveyance mechanism (linear parts feeder) used in the automatic handling system. FIG. 1A is a side view schematically showing a conventional device delivery mechanism (partially a cross-sectional view), and FIG. 1B is a front view thereof (with a vacuum suction part removed). .
In these drawings, reference numeral 1 denotes a linear parts feeder which vibrates in the traveling direction and sequentially and continuously conveys the devices 2 to the tip 3. On the other hand, a vacuum suction part 4 is provided in front of the tip part 3, and the device 2 that has reached the tip part 3 is moved to the delivery position 5 by vacuum suction. A vacuum chuck 6 that can move up and down is arranged above the delivery position 5, and is lowered when the device 2 is delivered. After the device 2 is vacuum-sucked, it is raised and the device 2 is transferred to the next processing step stage. It has become.
As another conventional device delivery mechanism, as shown in FIG. 2, a push-up pin 7 that can be moved up and down is disposed below the delivery position 5 and is lifted during delivery to support the device 2 by vacuum suction. There are also configurations that do.
[0004]
However, the conventional device delivery mechanism has the following problems.
The linear parts feeder 1 vibrates for device conveyance, and the device 2 is supplied in the linear parts feeder 1 with a large play as shown in the figure. Therefore, if the device 2 is chucked directly from the vibrating linear parts feeder 1 by the vacuum chuck 6, the position of the device 2 becomes unstable and a chucking mistake may occur.
Further, the supply speed of the device 2 immediately before the delivery position 5 is left to the linear parts feeder 1, the supply speed is slow, and it takes time to deliver the device. Furthermore, when the device 2 has a resin burr, the resin burr of the delivery device 2 and the subsequent device 2 may be caught and the device 2 may fall.
[0005]
[Problems to be solved by the invention]
The present invention eliminates the problems of the prior art, increases the positioning accuracy of the electronic component at the delivery position, eliminates the chucking mistake due to the unstable position of the electronic component, increases the supply speed of the electronic component, and shortens the delivery time. It is an object of the present invention to provide an electronic component delivery mechanism and method in an electronic component conveying apparatus that can eliminate the chucking mistake caused by the electronic components falling due to the catching of resin burrs.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the electronic component delivery mechanism in the electronic component conveying apparatus according to claim 1 conveys a large number of electronic components individually and sequentially on the electronic component conveying device, and the tip of the electronic component conveying device. In the electronic component delivery mechanism in the electronic component transport apparatus, the electronic component is delivered to the vacuum suction means at the electronic component delivery position in front of the tip portion. It is movable between a tip position and the electronic component delivery position, and has a vacuum suction portion for receiving the electronic component by vacuum suction at the tip position, and the received electronic component is delivered to the electronic component An electronic component suction moving means for moving the electronic component to the position, an air blow means for assisting the supply of the electronic component in the vicinity of the position of the tip of the electronic component transport device, and a subsequent electronic component before the electronic component is delivered. Stopper means for preventing protrusion and elevating means for elevating and lowering the electronic component adsorption moving means, the electronic component adsorption movement means having an axis perpendicular to the direction in which the electronic component is moved, and centering on this axis It is characterized by comprising a lever member swingable in the rotation direction.
According to another aspect of the present invention, there is provided an electronic component delivery method in which the electronic component delivery method sequentially and continuously conveys a large number of electronic components individually on the electronic component delivery device. In the electronic component delivery method in the electronic component transport apparatus, the parts are supplied, and the electronic component is delivered to the vacuum suction means at the electronic component delivery position in front of the tip part. The electronic component can be moved between the electronic component delivery position by a lever member that swings in a rotational direction about an axis perpendicular to the direction in which the electronic component is moved, and the electronic component is vacuum-sucked at the tip position. Electronic component suction moving means having a vacuum suction portion for receiving the electronic component, stopper means for stopping the subsequent electronic component before delivery of the electronic component to prevent popping out, and the electronic component suction movement The electronic component sucking and moving means for receiving the supplied electronic component and delivering the electronic component to the vacuum suction means at the electronic component delivery position, and the stopper means. Then, before the delivery, the subsequent electronic component is stopped and prevented from popping out, and when the electronic component is delivered to the vacuum suction means, the electronic component suction moving means is raised by the elevating means.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
The preferred embodiments of the present invention will be described below.
FIG. 3 is a diagram schematically showing the structure of an electronic component delivery mechanism (hereinafter also referred to as a device delivery mechanism) according to an embodiment of the present invention. 3A is a side view of the electronic component delivery mechanism (partially a sectional view), and FIG. 3B is a front view of the electronic component delivery mechanism (with the arm-like member removed). In FIG. 3A, what is indicated by a one-dot chain line is a state at the time of device supply, and what is indicated by a solid line is a state at the time of device delivery.
[0008]
In the figure, 11 is a linear parts feeder, which vibrates in the device traveling direction to align the devices 12 and sequentially and sequentially conveys them to the tip portion 13. The linear parts feeder 11 has a positioning member 14 for positioning the device 12 in the width direction, and a notch portion 15 is formed at the distal end portion 13. When the device 12 is a semiconductor element such as an IC, the positioning member 14 performs positioning so that the distance from the device 12 is about 0.05 to 0.1 mm on one side. B is a resin burr of the device 12.
[0009]
A lever member 16 is disposed on the front side of the linear parts feeder 11 so as to be swingable around a shaft 17. The lever member 16 has a placement portion 18 for placing the supplied device 12, and a vacuum for vacuum-fixing the device 12 supplied at the distal end portion 13 of the linear parts feeder 11 by vacuum suction. It has a suction part 19. The lever member 16 is swingable between a device delivery position indicated by a solid line and a device supply position indicated by an alternate long and short dash line, and the swinging operation is performed by an actuator 20 including a high-speed operation solenoid.
[0010]
A vacuum chuck 22 is installed above the device delivery position 21 so as to be movable up and down. In addition, an air blow unit 23 that assists the supply of the device 12 is installed in front of the front end portion 13 of the linear parts feeder 11. Further, above the vicinity of the tip 13 of the linear parts feeder 11, a stopper 24 for preventing the subsequent device 12 at the device supply position (tip 13) from unexpectedly jumping out around the shaft 25 when the device is delivered. It is rotatably arranged. The rotation operation of the stopper 24 is performed by an actuator 26 composed of a high-speed operation solenoid or the like, and can swing between an operation position indicated by a solid line and a non-operation position indicated by a one-dot chain line.
[0011]
A shaft 17 that pivotally supports the lever member 16 is rotatably attached to a support base 27. The support base 27 is raised by the operation of an actuator 28 such as a high-speed operation solenoid as shown in FIG. Otherwise, it is in the lowered position as shown in FIG.
[0012]
Next, the operation of the device delivery mechanism of this embodiment will be described.
First, the linear parts feeder 11 vibrates in the device traveling direction, aligns the devices 12, and sequentially and sequentially conveys them toward the tip portion 13. The air blow unit 23 blows air toward the distal end portion 13 to assist the supply of the device 12 to the distal end portion 13. In this conveyance, the device 12 is positioned in the width direction by the positioning member 14.
[0013]
At the time of supplying the device, the actuator 20 operates to swing the lever member 16 to the position of the alternate long and short dash line. At this time, the stopper 24 is in the position of the one-dot chain line, and the support base 27 is in the lowered position. The lever member 16 is positioned in the width direction in the linear parts feeder 11 by the vacuum suction portion 19 and vacuum-fixes the device 12 that has reached the distal end portion 13. Thereafter, the lever member 16 swings to the solid line position by the operation of the actuator 20, whereby the delivery device 12 (hatched) is placed on the placement portion 18 of the lever member 16. Is forcibly pulled out and separated from the vibrating linear parts feeder 11. In synchronization with this operation, the next delivery device 12 reaches the tip 13 by the vibration of the linear parts feeder 11. Next, the support base 27 is raised by the operation of the actuator 28, so that even if there is an overlap of the resin burrs B between the devices 12 as shown in FIG. 3, the overlap of the resin burrs B is separated as shown in FIG. Then, after the vacuum chuck 22 is lowered and chucks the device 12 to be delivered, simultaneously with the ascent, the stopper 24 is in a solid line position by the operation of the actuator 26, and the subsequent device 12 is prevented from popping out when the device is received.
When the delivery of the device 12 is completed, after the lever member 16 has moved to pick up the device 12 at the distal end portion 13, the stopper 24 is rotated to the state of the one-dot chain line by the operation of the actuator 26.
[0014]
By repeating the above operation, device delivery is performed at high speed. For example, when a high-speed operation solenoid is used as the actuators 20 and 26, the device supply operation can be 20 ms or less per cycle. Further, positioning in the width direction by the positioning portion 14 and delivery in a state separated from the linear parts feeder 11 at the time of device delivery improves positioning accuracy and eliminates a chucking error due to unstable device position. Furthermore, even if the resin burrs B overlap each other in the device 12, the lever member 16 rises together with the support base 27 at the time of delivery of the device, and the overlap of the resin burrs B is separated. Eliminates chucking mistakes due to overlap.
[0015]
Although the present invention has been described based on one embodiment, the present invention is not limited to the above embodiment, and various modifications and changes can be made.
For example, in the above embodiment, a swingable lever member is used as the electronic component suction moving means, but a member that moves forward and backward in a linear direction may be used.
In the above embodiment, a high-speed solenoid is used as the actuator, but an eccentric cam using a pulse motor may be used.
[0016]
【The invention's effect】
According to the present invention, the electronic component transport device is separated from the vibrating electronic component transport device by forcibly pulling the supplied electronic component by the electronic component suction moving means that can be vacuum fixed at the tip of the electronic component transport device. Since electronic parts can be delivered, positioning accuracy is improved and chucking mistakes due to unstable electronic part positions can be eliminated.
Further, by providing the electronic component suction moving means and the stopper means for preventing the electronic component from popping out, the supply speed of the electronic components can be increased.
Further, when the electronic component is delivered, the lifting / lowering means raises the electronic component suction moving means. Therefore, even if there is an overlap between the resin burr of the delivered electronic component and the resin burr of the subsequent electronic component, it is separated. Chucking mistakes can be eliminated.
[Brief description of the drawings]
1A and 1B are diagrams schematically showing a structure of a conventional device delivery mechanism, where FIG. 1A is a side view and FIG. 1B is a front view.
2A and 2B are views schematically showing the structure of another conventional device delivery mechanism, where FIG. 2A is a side view and FIG. 2B is a front view.
3A and 3B are diagrams schematically showing a structure of a device delivery mechanism according to an embodiment of the present invention, where FIG. 3A is a side view and FIG. 3B is a front view.
FIG. 4 is a diagram illustrating a state of a device delivery mechanism at the time of device delivery.
[Explanation of symbols]
11 Linear parts feeder 12 Device (micro electronic parts)
13 Tip part 14 Positioning member 15 Notch part 16 Lever member 17 Shaft 18 Placement part 19 Vacuum suction part 20 Actuator 21 Device delivery position 22 Vacuum chuck 23 Air blow part 24 Stopper 25 Shaft 26 Actuator 27 Support base 28 Actuator B Resin burr

Claims (2)

多数の電子部品を個別に電子部品搬送装置上を順次連続的に搬送し、前記電子部品搬送装置の先端部にて電子部品の供給を行い、前記先端部より前方の電子部品受渡位置にて真空吸着手段に電子部品の受渡を行う、電子部品搬送装置における電子部品受渡機構において、
前記電子部品搬送装置の先端部位置と前記電子部品受渡位置との間を移動可能であり、前記先端部位置にて電子部品を真空吸着して受け取るための真空吸着部を有し、受け取った電子部品を前記電子部品受渡位置に移動させる電子部品吸着移動手段と、
前記電子部品搬送装置の先端部位置近傍にて電子部品の供給を補助するエアーブロー手段と、
電子部品の受渡前に後続の電子部品の飛び出しを防止するストッパー手段と、
前記電子部品吸着移動手段を昇降させる昇降手段とを備え、
前記電子部品吸着移動手段は、電子部品を移動させる方向と垂直方向に軸を備え、この軸を中心として回転方向に揺動自在なレバー部材からなることを特徴とする電子部品搬送装置における電子部品受渡機構。 A number of electronic components individually in sequence continuously transporting the electronic component transporting apparatus above performs the supply of the electronic component at the tip of the electronic component conveying device, vacuum at the front of the electronic component transfer position than the tip In the electronic component delivery mechanism in the electronic component transport device that delivers the electronic component to the suction means,
Electronic wherein a the tip position of the electronic component conveying device movable between said electronic component delivery position, having a vacuum suction unit for receiving and vacuum suck the electronic component at the tip position, the received an electronic component suction moving means for moving the component to the electronic component delivery position,
And air blowing means for assisting the supply of the electronic component at the tip position near the electronic component conveying device,
Stopper means for preventing subsequent electronic parts from popping out before delivery of the electronic parts;
And a lifting means for lifting the electronic component suction moving means,
The electronic component suction moving means comprises a lever member that has a shaft in a direction perpendicular to the direction in which the electronic component is moved, and that is swingable in the rotational direction about the shaft. Delivery mechanism. 多数の電子部品を個別に電子部品搬送装置上にて順次連続的に搬送し、前記電子部品搬送装置の先端部近傍にて電子部品の供給を行い、前記先端部より前方の電子部品受渡位置にて真空吸着手段に電子部品の受渡を行う、電子部品搬送装置における電子部品受渡方法において、
前記電子部品搬送装置の先端部位置と前記電子部品受渡位置との間を、電子部品を移動させる方向と垂直方向の軸を中心として回転方向に揺動するレバー部材により移動可能であり、前記先端部位置にて電子部品を真空吸着して受け取るための真空吸着部を有する電子部品吸着移動手段と、
電子部品の受渡前に後続の電子部品を停止させ飛び出しを防止するストッパー手段と、
前記電子部品吸着移動手段を昇降させる昇降手段と、
を用いて、
前記電子部品吸着移動手段により、供給されてきた電子部品を受け取り、前記電子部品受渡位置にて真空吸着手段に電子部品を受け渡すとともに、前記ストッパー手段により受渡前に後続の電子部品を停止させ飛び出しを防止させ、前記昇降手段により、電子部品を前記真空吸着手段に受け渡す時に前記電子部品吸着移動手段を上昇させることを特徴とする電子部品搬送装置における電子部品受渡方法。A large number of electronic components sequentially transported continuously at discrete electronic component conveying device on, perform the supply of the electronic components in the vicinity of the distal end portion of the electronic component conveying device, the electronic component transfer position in front than the tip In the electronic component delivery method in the electronic component transport device, which delivers the electronic component to the vacuum suction means,
It is movable between the tip position of the electronic component transport device and the electronic component delivery position by a lever member that swings in a rotational direction about an axis perpendicular to the direction in which the electronic component is moved. Electronic component suction moving means having a vacuum suction part for vacuum-sucking and receiving the electronic component at the part position;
Stopper means to stop the subsequent electronic parts and prevent popping out before delivery of the electronic parts,
Elevating means for elevating the electronic component suction moving means;
Using,
By the electronic component suction moving means to receive said electronic components, which is supplied, together with the transferring electronic components to the vacuum suction means in the electronic component delivery position, pop-out to stop the subsequent electronic components before delivery by the stopper means An electronic component delivery method in an electronic component transport apparatus , wherein the electronic component suction moving means is raised when the electronic component is delivered to the vacuum suction means by the elevating means .
JP2002050218A 2002-02-26 2002-02-26 Electronic component delivery mechanism and method in electronic component transport apparatus Expired - Fee Related JP3967608B2 (en)

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