CN109202350B - From chip removal formula welding adsorption equipment - Google Patents
From chip removal formula welding adsorption equipment Download PDFInfo
- Publication number
- CN109202350B CN109202350B CN201811160427.2A CN201811160427A CN109202350B CN 109202350 B CN109202350 B CN 109202350B CN 201811160427 A CN201811160427 A CN 201811160427A CN 109202350 B CN109202350 B CN 109202350B
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- Prior art keywords
- chip
- suction
- mounting
- self
- block
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- 238000003466 welding Methods 0.000 title claims abstract description 51
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 30
- 238000007664 blowing Methods 0.000 claims abstract description 62
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 210000001503 joint Anatomy 0.000 claims description 4
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 239000002893 slag Substances 0.000 abstract description 6
- 230000000712 assembly Effects 0.000 abstract description 5
- 238000000429 assembly Methods 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0625—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum provided with a valve
- B25J15/0633—Air-flow-actuated valves
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Robotics (AREA)
- Arc Welding In General (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a self-chip removing type welding adsorption device, which comprises: the flange mounting plate, the shading mounting plate and the mounting frame are sequentially stacked from top to bottom, and the inside of the mounting frame is hollow and is opened up and down; the shading components and at least three groups of absorbing components are arranged in the mounting frame; and at least three groups of chip blowing assemblies fixedly connected to the bottom of the mounting frame, wherein the suction assemblies are arranged between every two chip blowing assemblies. According to the invention, stable adsorption force is provided for the parts to be welded, the parts to be welded are prevented from frequently falling, the welding precision and efficiency are improved to a certain extent, in addition, the problem that welding slag is difficult to remove in a narrow welding space is solved by setting the chip blowing assembly with a compact structure, and finally, other parts which do not need welding can be protected, so that the damage in the welding process is prevented, the yield is improved, and the invention has wide market application prospect.
Description
Technical Field
The invention relates to the field of nonstandard automation, in particular to a self-chip-removing type welding adsorption device.
Background
In the nonstandard automatic welding operation process, an adsorption device for adsorbing a workpiece to be welded is often needed, and the existing adsorption device has the following problems:
firstly, the absorption is unstable, so that the to-be-welded piece is easy to fall off in the absorption, transfer, assembly and welding processes, and the problems of inaccurate welding position, low welding efficiency and the like are caused;
secondly, welding slag is easy to appear in the welding process, the existing adsorption device does not have a better structure for removing the welding slag, and particularly, the chip removing difficulty is high and the chip removing efficiency is low aiming at a structure with small and narrow welding space;
again, a large amount of high temperature can be generated during the welding process, and other temperature sensitive components of the existing adsorption device can not play a better role in protection.
In view of the foregoing, there is a need for a self-chip removing type welding adsorption device to solve the above problems.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide the self-chip-removing type welding adsorption device which can provide stable adsorption force for the to-be-welded parts, can prevent the to-be-welded parts from frequently falling, improves the welding precision and efficiency to a certain extent, solves the problem that welding slag is difficult to remove in a narrow welding space by setting a chip-blowing assembly with a compact structure, and finally can protect other parts which do not need to be welded, prevent the welding parts from being damaged in the welding process, improve the yield and have wide market application prospect.
To achieve the above objects and other advantages and in accordance with the purpose of the invention, there is provided a self-chip removing welding suction device comprising:
the flange mounting plate, the shading mounting plate and the mounting frame are sequentially stacked from top to bottom, and the inside of the mounting frame is hollow and is opened up and down;
the shading components and at least three groups of absorbing components are arranged in the mounting frame; and
at least three groups of chip blowing components fixedly connected to the bottom of the mounting frame,
wherein, the suction component is located between two liang of bits components that blow, and the suction component includes:
a top plate fixedly connected with the top of the mounting frame;
a guide rail fixedly connected with the inner side wall of the mounting frame; and
and the guide rail extends along the vertical direction, the guide rail and the suction block are positioned right below the top plate, and a return spring is arranged between the top of the suction block and the top plate.
Preferably, the plurality of groups of chip blowing components are arranged around the horizontal plane by taking the symmetry center as a round point, so that an operation space with accommodating capacity is formed around the symmetry center, the suction components are arranged at the edge of the operation space, and the chip blowing components correspond to the suction components in number.
Preferably, a fixing structure for fixedly mounting the top plate and the guide rail is formed on a side wall of the mounting frame, the fixing structure corresponds in number to the suction assembly, and the fixing structure includes:
a fixing groove arranged at the top of the side wall of the mounting frame;
the clamping block protrudes upwards vertically from the bottom of the fixed groove, and the inner wall of the clamping block is flush with the inner side wall of the mounting frame; and
a guide rail mounting groove arranged on the inner wall of the clamping block,
wherein, the guide rail mounting groove extends along vertical direction, and the top of joint piece flushes with the lateral wall top of installing the frame.
Preferably, the guide rail is installed in the guide rail installation groove, the top plate is provided with a yielding hole penetrating through the upper surface and the lower surface of the guide rail installation groove, and when the top plate is installed in the fixing groove, the clamping block and the guide rail penetrate through the yielding hole without interference.
Preferably, the light shielding assembly includes:
the support frame comprises two vertical sections which are arranged in parallel and a horizontal section which is connected with the bottoms of the two vertical sections, and the two vertical sections and the horizontal section are integrally combined to enable the support frame to be in a U-shaped structure;
the mounting column is fixedly connected to the horizontal section; and
a front fixing section and a rear fixing section which are respectively fixedly connected with the tops of the two vertical sections,
wherein, the bottom rigid coupling of erection column has the light screen.
Preferably, the flange mounting plate and the shading mounting plate are respectively provided with a light hole penetrating through the upper surface and the lower surface of the flange mounting plate and a shading mounting hole, the shading mounting plate is provided with a front shading mounting groove and a rear shading mounting groove which are communicated with the edges of the shading mounting holes, the two vertical sections vertically extend downwards from the top of the shading mounting hole, and the front fixing section and the rear fixing section are respectively arranged in the front shading mounting groove and the rear shading mounting groove.
Preferably, the mounting posts and the light shield are each made of beryllium copper.
Preferably, the upper surface of the flange mounting plate is provided with a motor mounting groove which is concentrically arranged with the light hole.
Preferably, the suction block is integrally combined with a suction pipe extending vertically downwards on the opposite side of the operation space, and a suction gas path with one end communicated with the outside atmosphere and the other end communicated with the suction pipe is arranged inside the suction block.
Preferably, the suction interface is in butt joint with the position of the suction gas circuit, which is communicated with the outside atmosphere, and the tail end of the suction pipe is lower than the lower surface of the suction block.
Preferably, the chip blowing assembly comprises:
a chip blowing block which is fixedly arranged; and
a chip blowing air pipe arranged in the chip blowing block,
the chip blowing air pipe extends to the bottom surface of the chip blowing block obliquely downwards in the chip blowing block, and a chip blowing air passage with one end communicated with the outside atmosphere and the other end communicated with the chip blowing air pipe is arranged in the chip blowing block.
Preferably, the chip blowing air channel is in butt joint with an air blowing interface at a position where the chip blowing air channel is communicated with the outside atmosphere, and an included angle alpha is formed between the extending direction of the chip blowing air channel and the longitudinal axis, so that chip removing air flows blown out of all the chip blowing air channels are converged under the center of the operation space.
Preferably, the included angle α is 30 ° to 75 °.
Compared with the prior art, the invention has the beneficial effects that: the welding device has the advantages that stable adsorption force is provided for the parts to be welded, the parts to be welded can be prevented from frequently falling, the welding precision and efficiency are improved to a certain extent, in addition, the problem that welding slag is difficult to remove in a narrow welding space is solved by setting the chip blowing assembly with a compact structure, and finally, other parts which do not need to be welded can be protected, so that the parts to be welded are prevented from being damaged in the welding process, the yield is improved, and the welding device has a wide market application prospect.
Drawings
FIG. 1 is a three-dimensional view of a self-chip removing weld adsorption device according to the present invention;
FIG. 2 is a view of a three-dimensional structure of the self-chip removing welding adsorption device according to the invention after hiding the flange mounting plate and the shading mounting plate;
FIG. 3 is an exploded view of a self chip removing weld adsorption device according to the present invention;
FIG. 4 is a front view of a self-chip removing weld adsorption device according to the present invention;
FIG. 5 is a top view of a self chip removing weld adsorption device according to the present invention;
FIG. 6 is a cross-sectional view taken along the direction A-A in FIG. 5;
FIG. 7 is a three-dimensional view of the suction assembly and chip blowing assembly of the self-chip removing welding suction device according to the present invention;
FIG. 8 is a three-dimensional mechanical view of a self-chip removing weld adsorption device according to the present invention with multiple sets of chip blowing assemblies circumferentially arranged;
FIG. 9 is a front view of a suction assembly in a self-chip removing weld suction apparatus according to the present invention;
FIG. 10 is a three-dimensional view of the suction assembly of the self-chip removing welding suction device according to the present invention;
fig. 11 is a three-dimensional structure view of a suction component in the self-chip removing type welding suction device according to the present invention at another view angle.
Detailed Description
The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses a device for practicing the invention. In the drawings, the shape and size may be exaggerated for clarity, and the same reference numerals will be used throughout the drawings to designate the same or similar components. In the following description, terms such as center, thickness, height, length, front, back, rear, left, right, top, bottom, upper, lower, etc. are based on the orientation or positional relationship shown in the drawings. In particular, "height" corresponds to the top-to-bottom dimension, "width" corresponds to the left-to-right dimension, and "depth" corresponds to the front-to-back dimension. These relative terms are for convenience of description and are not generally intended to require a particular orientation. Terms (e.g., "connected" and "attached") referring to an attachment, coupling, etc., refer to a relationship wherein these structures are directly or indirectly secured or attached to one another through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise.
Referring to fig. 1 to 11, the self-chip removing welding suction device 1 includes:
a flange mounting plate 12, a shading mounting plate 13 and a mounting frame 11 which are sequentially stacked from top to bottom, wherein the inside of the mounting frame 11 is hollow and is opened up and down;
a shade assembly 14 and at least three groups of suction assemblies 15 arranged in the mounting frame 11; and
at least three groups of chip blowing components 16 fixedly connected to the bottom of the mounting frame 11,
wherein, suction component 15 locates between two liang of bits subassembly 16 that blows, suction component 15 includes:
a top plate 153 fixedly connected to the top of the mounting frame 11;
rails 151 and guide rail fixedly connected to inner side walls of the mounting frame 11
The sucking block 154 is slidably connected with the guide rail 151, the guide rail 151 extends along the vertical direction, the guide rail 151 and the sucking block 154 are all located under the top plate 153, and a return spring 1531 is arranged between the top of the sucking block 154 and the top plate 153. In a preferred embodiment, the guide rail 151 is slidably coupled with a slider 152, and the suction block 154 is fixedly connected with the slider 152.
Referring to fig. 8, a plurality of groups of chip-blowing components 16 are arranged circumferentially on a horizontal plane with their centers of symmetry as dots, so as to form circumferentially at their centers of symmetry an operating space having a receiving capacity, at the edges of which the chip-blowing components 16 are arranged, the chip-blowing components 16 corresponding in number to the chip-sucking components 15.
Referring to fig. 2 and 3, a fixing structure 112 for fixing the mounting top plate 153 and the guide rail 151 is formed on a side wall of the mounting frame 11, the fixing structure 112 corresponds in number to the suction members 15, and the fixing structure 112 includes:
a fixing groove 1121 formed at the top of the side wall of the mounting frame 11;
a catching block 1122 protruding vertically upward from the bottom of the fixing groove 1121, the inner wall of the catching block 1122 being flush with the inner wall of the mounting frame 11; and
a guide rail mounting groove 1123 provided on the inner wall of the engaging block 1122,
the rail mounting groove 1123 extends in the vertical direction, and the top of the clip 1122 is flush with the top of the side wall of the mounting frame 11. In the preferred embodiment, the fixing structure 112, the chip blowing assembly 16 and the suction assembly 15 are all provided with four groups.
Further, the guide rail 151 is mounted in the guide rail mounting groove 1123, the top plate 153 is provided with a relief hole penetrating the upper and lower surfaces thereof, and the engaging block 1122 penetrates the relief hole without interfering with the guide rail 151 when the top plate 153 is mounted in the fixing groove 1121.
Referring to fig. 3, the shade assembly 14 includes:
the support frame 141, the support frame 141 includes two parallel vertical sections and a horizontal section connecting the bottoms of the two vertical sections, the two vertical sections are integrally combined with the horizontal section to make the support frame 141 have a U-shaped structure;
the mounting post 142 is fixedly connected to the horizontal section; and
a front fixing section 1411 and a rear fixing section 1412 respectively fixedly connected to the tops of the two vertical sections,
a light shielding plate 1421 is fixedly connected to the bottom of the mounting post 142. In a preferred embodiment, the mounting post 142 and the light shield 1421 are provided in the center of the operating space.
Referring to fig. 3, the flange mounting plate 12 and the light shielding mounting plate 13 are respectively provided with a light transmitting hole 121 and a light shielding mounting hole 131 penetrating through the upper and lower surfaces of the flange mounting plate and the light shielding mounting plate 13, the light shielding mounting plate 13 is provided with a front light shielding mounting groove 133 and a rear light shielding mounting groove 132 communicated with the edge of the light shielding mounting hole 131, the two vertical sections vertically extend downwards from the top of the light shielding mounting hole 131, and the front fixing section 1411 and the rear fixing section 1412 are respectively mounted in the front light shielding mounting groove 133 and the rear light shielding mounting groove 132.
In a preferred embodiment, the mounting post 142 and the light shield 1421 are both made of beryllium copper.
Further, a motor mounting groove 122 is formed on the upper surface of the flange 12 and concentric with the light hole 121.
Referring to fig. 9 to 11, a suction pipe 1541 extending vertically downward is integrally combined with the suction block 154 on the opposite side of the operation space, and a suction gas path having one end opened to the outside atmosphere and the other end communicating with the suction pipe 1541 is provided inside the suction block 154.
Further, a suction interface 1542 is connected to the connection part of the suction gas path and the outside atmosphere, and the tail end of the suction pipe 1541 is lower than the lower surface of the suction block 154.
Further, the chip blowing assembly 16 includes:
a fixedly arranged chip blowing block 161; and
a chip blowing air pipe 163 provided inside the chip blowing block 161,
the chip blowing air pipe 163 extends obliquely downward to the bottom surface of the chip blowing block 161 in the chip blowing block 161, and a chip blowing air passage 1621 with one end opening to the outside atmosphere and the other end communicating with the chip blowing air pipe 163 is provided in the chip blowing block 161.
Further, the chip blowing air channel 1621 is in butt joint with the air blowing interface 162 at the position communicated with the external atmosphere, and the extending direction 1631 of the chip blowing air channel 163 forms an included angle alpha with the longitudinal axis, so that the chip removing air flows blown out of all the chip blowing air channels 163 are converged under the center of the operation space.
Further, the included angle alpha is 30-75 degrees. In one embodiment, the included angle α is 30 °; in one embodiment, the included angle α is 75 °; in one embodiment, the included angle α is 45 °; in a preferred embodiment, the included angle α is 58 °.
During operation, the manipulator is connected with the adsorption equipment 1 through the flange mounting plate 12, under the drive of manipulator, adsorption equipment 1 will wait to weld the piece and inhale and shift to the welding plane directly over, this adsorption equipment 1 of manipulator drive descends a certain distance, wait to weld the piece and offset with the welding plane, the manipulator continues to descend a certain distance, make the return spring receive vertical ascending compressive force, and then produce vertical decurrent restoring force, under the effect of spring restoring force, wait to weld the piece to be compressed tightly and be fixed in on the welding plane, in compressing tightly the in-process, the light screen 1421 will wait to protect the region and cover, in order to play the guard action, the welding slag that produces in the welding process then is blown away in time by blowing bits trachea 163 and is got rid of.
The number of equipment and the scale of processing described herein are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be readily apparent to those skilled in the art.
Although embodiments of the present invention have been disclosed above, it is not limited to the details and embodiments shown and described, it is well suited to various fields of use for which the invention would be readily apparent to those skilled in the art, and accordingly, the invention is not limited to the specific details and illustrations shown and described herein, without departing from the general concepts defined in the claims and their equivalents.
Claims (12)
1. A self chip removing weld adsorption device (1), characterized by comprising:
a flange mounting plate (12), a shading mounting plate (13) and a mounting frame (11) which are sequentially stacked from top to bottom, wherein the inside of the mounting frame (11) is hollow and is opened up and down;
a shading component (14) and at least three groups of absorbing components (15) which are arranged in the mounting frame (11); and
at least three groups of chip blowing components (16) fixedly connected to the bottom of the mounting frame (11),
wherein, suction component (15) are located between two liang of bits subassembly (16), suction component (15) include:
a top plate (153) fixedly connected with the top of the mounting frame (11);
a guide rail (151) fixedly connected with the inner side wall of the mounting frame (11); and
the suction block (154) is in sliding fit with the guide rail (151), the guide rail (151) extends along the vertical direction, the guide rail (151) and the suction block (154) are both positioned under the top plate (153), and a return spring (1531) is arranged between the top of the suction block (154) and the top plate (153);
the shade assembly (14) includes:
the support frame (141) comprises two parallel vertical sections and a horizontal section connected with the bottoms of the two vertical sections, and the two vertical sections and the horizontal section are integrally combined to enable the support frame (141) to be in a U-shaped structure;
the mounting column (142) is fixedly connected to the horizontal section; and
a front fixing section (1411) and a rear fixing section (1412) which are respectively fixedly connected with the tops of the two vertical sections,
wherein, the bottom of the mounting column (142) is fixedly connected with a light shielding plate (1421).
2. Self-chip removing welding suction device (1) according to claim 1, characterized in that groups of chip blowing components (16) are arranged circumferentially on the horizontal plane with their centre of symmetry as dots, so that an operating space with a receiving capacity is formed circumferentially at their centre of symmetry, suction components (15) are arranged at the edges of said operating space, the chip blowing components (16) corresponding in number to the suction components (15).
3. The self-chip removing welding suction device (1) according to claim 2, wherein a fixing structure (112) for fixing the mounting top plate (153) and the guide rail (151) is formed on a side wall of the mounting frame (11), the fixing structure (112) corresponds in number to the suction assembly (15), and the fixing structure (112) includes:
a fixed slot (1121) which is arranged on the top of the side wall of the mounting frame (11);
a clamping block (1122) protruding vertically upwards from the bottom of the fixing groove (1121), the inner wall of the clamping block (1122) being flush with the inner wall of the mounting frame (11); and
a guide rail mounting groove (1123) arranged on the inner wall of the clamping block (1122),
the guide rail mounting groove (1123) extends in the vertical direction, and the top of the clamping block (1122) is flush with the top of the side wall of the mounting frame (11).
4. A self-chip removing welding suction device (1) according to claim 3, wherein the guide rail (151) is mounted in the guide rail mounting groove (1123), the top plate (153) is provided with a relief hole penetrating the upper and lower surfaces thereof, and when the top plate (153) is mounted in the fixing groove (1121), the clamping block (1122) and the guide rail (151) pass through the relief hole without interference.
5. The self-chip removing type welding adsorption device (1) according to claim 1, wherein a light transmission hole (121) and a light shielding mounting hole (131) penetrating through the upper surface and the lower surface of the flange mounting plate (12) and the light shielding mounting plate (13) are respectively formed, a front light shielding mounting groove (133) and a rear light shielding mounting groove (132) which are communicated with the edge of the light shielding mounting hole (131) are formed in the light shielding mounting plate (13), the two vertical sections vertically extend downwards from the top of the light shielding mounting hole (131), and the front fixing section (1411) and the rear fixing section (1412) are respectively arranged in the front light shielding mounting groove (133) and the rear light shielding mounting groove (132).
6. The self-chip removing weld adsorption device (1) according to claim 1, wherein the mounting post (142) and the light shield (1421) are each made of beryllium copper material.
7. The self-chip removing welding adsorption device (1) according to claim 5, wherein the upper surface of the flange mounting plate (12) is provided with a motor mounting groove (122) concentric with the light transmission hole (121).
8. The self-chip removing welding adsorption device (1) according to claim 2, wherein a suction block (154) is integrally combined with a vertically downward extending suction pipe (1541) on the opposite side of the operation space, and a suction gas path with one end opening to the outside atmosphere and the other end communicating with the suction pipe (1541) is provided inside the suction block (154).
9. The self-chip removing welding adsorption device (1) according to claim 8, wherein a suction interface (1542) is in butt joint with the suction gas path and the outside atmosphere, and the tail end of the suction pipe (1541) is lower than the lower surface of the suction block (154).
10. The self-chip removing welding suction device (1) according to claim 2, characterized in that the chip blowing assembly (16) comprises:
a chip blowing block (161) fixedly arranged; and
a chip blowing air pipe (163) arranged in the chip blowing block (161),
the chip blowing air pipe (163) extends to the bottom surface of the chip blowing block (161) obliquely downwards in the chip blowing block (161), and a chip blowing air passage (1621) with one end communicated with the outside atmosphere and the other end communicated with the chip blowing air pipe (163) is arranged in the chip blowing block (161).
11. The self-chip removing welding adsorption device (1) according to claim 10, wherein a chip blowing interface (162) is butted at a position where the chip blowing air channel (1621) is communicated with the external atmosphere, and the extending direction (1631) of the chip blowing air channel (163) forms an included angle alpha with the longitudinal axis, so that chip removing air flows blown out of all the chip blowing air channels (163) are converged under the center of the operation space.
12. The self-chip removing weld adsorption device (1) according to claim 11, wherein the included angle α is 30 ° to 75 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811160427.2A CN109202350B (en) | 2018-09-30 | 2018-09-30 | From chip removal formula welding adsorption equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811160427.2A CN109202350B (en) | 2018-09-30 | 2018-09-30 | From chip removal formula welding adsorption equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109202350A CN109202350A (en) | 2019-01-15 |
| CN109202350B true CN109202350B (en) | 2023-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811160427.2A Active CN109202350B (en) | 2018-09-30 | 2018-09-30 | From chip removal formula welding adsorption equipment |
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| CN (1) | CN109202350B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109900721B (en) * | 2019-03-06 | 2021-11-23 | 台州市康新电容器有限公司 | Printed circuit board detects roof equipment that floats |
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