JP3938783B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP3938783B2 JP3938783B2 JP2006019274A JP2006019274A JP3938783B2 JP 3938783 B2 JP3938783 B2 JP 3938783B2 JP 2006019274 A JP2006019274 A JP 2006019274A JP 2006019274 A JP2006019274 A JP 2006019274A JP 3938783 B2 JP3938783 B2 JP 3938783B2
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Description
本発明の実施例1であるBGA構造を採用する半導体装置の概略構成を図1(主面側の平面図)、図2(図1に示すA−A線の位置で切った断面図)、図3(図2の要部拡大断面図)及び図4(裏面側の樹脂封止体を除去した状態を示す裏面側の要部拡大平面図)に示す。
本発明の実施例2であるBGA構造を採用する半導体装置の概略構成を図12(断面図)及び図13(裏面側の樹脂封止体を除去した状態を示す裏面側の要部拡大平面図)に示す。
本発明の実施例3であるBGA構造を採用する半導体装置の概略構成を図14(裏面側の樹脂封止体を除去した状態を示す裏面側の要部平面図)に示す。
本発明の実施例4であるBGA構造を採用する半導体装置の概略構成を図15(裏面側の樹脂封止体を除去した状態を示す裏面側の要部平面図)に示す。
1A:電極パッド
1B:電極パッド
2:半導体ペレット
2A:外部端子
3:絶縁層
4:バンプ電極
5:スリット
6:ボンディングワイヤ
7:樹脂封止体
7A:樹脂
8A,8B:電極プレート
10:成形金型
10A:上型
10B:下型
11:キャビティ
11A,11B,12:凹部
13:流入ゲート
14:ヒートステージ
14A:凹部
15:実装基板
15A:電極パッド
Claims (10)
- 第1主面及び前記第1主面とは反対側の第2主面と、前記第1主面から前記第2主面に貫通するスリットとを有し、前記第2主面上に複数の電極パッドを有するリジット基板と、
主面に回路システムと複数の外部端子を有する半導体ペレットであって、前記半導体ペレットの前記主面が前記リジット基板の前記第1主面に向かい合い、かつ、前記複数の外部端子が前記スリットの内側に平面的に位置し、かつ、前記スリットの一部の領域が前記半導体ペレットの外側に平面的に位置するように前記リジット基板上に搭載された半導体ペレットと、
前記半導体ペレットの前記複数の外部端子と前記リジット基板の前記複数の電極パッドとを前記スリットを通して各々電気的に接続する複数のボンディングワイヤと、
前記リジット基板の前記第1主面及び前記第2主面の両側に形成され、前記スリットを介して互いに連続した樹脂封止体であって、前記複数のボンディングワイヤを封止する樹脂封止体と、
前記リジット基板の前記第2主面上に形成され、前記複数の電極パッドと各々電気的に接続された複数のバンプ電極であって、平面的に前記スリットの両側に格子状に配列された複数のバンプ電極と、
を有することを特徴とする半導体装置。 - 請求項1において、前記リジッド基板は、ガラス繊維と樹脂を含んだ基板であることを特徴とする半導体装置。
- 請求項2において、前記ガラス繊維と樹脂を含んだ基板の樹脂は、エポキシ樹脂、ポリイミド樹脂、マレイミド樹脂のいずれかであることを特徴とする半導体装置。
- 請求項1において、前記樹脂封止体は、添加物としてフィラーを含む樹脂から形成されることを特徴とする半導体装置。
- 請求項1において、前記リジット基板は、ポリエステルフィルム又はポリイミドフィルムからなるフレキシブル基板のヤング率より高いヤング率を有することを特徴とする半導体装置。
- 請求項5において、前記リジット基板のヤング率は、16〜22GPaであることを特徴とする半導体装置。
- 請求項1において、前記リジット基板は、前記第2主面にのみ配線が設けられた単層構造の基板であることを特徴とする半導体装置。
- 請求項1において、前記複数のボンディングワイヤは、金ワイヤであることを特徴とする半導体装置。
- 請求項1において、前記複数のバンプ電極は、Pb−Sn系の合金材で形成されることを特徴とする半導体装置。
- 請求項1において、前記複数の外部端子は、前記半導体ペレットの前記主面の中央部において、前記半導体ペレットの長辺に沿って縦に配列され、前記スリットは、前記複数の外部端子の配列方向に沿って形成されていることを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006019274A JP3938783B2 (ja) | 1994-12-20 | 2006-01-27 | 半導体装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31644494 | 1994-12-20 | ||
JP2006019274A JP3938783B2 (ja) | 1994-12-20 | 2006-01-27 | 半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003322604A Division JP3883531B2 (ja) | 1994-12-20 | 2003-09-16 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2006121116A JP2006121116A (ja) | 2006-05-11 |
JP3938783B2 true JP3938783B2 (ja) | 2007-06-27 |
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Application Number | Title | Priority Date | Filing Date |
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JP2006019274A Expired - Lifetime JP3938783B2 (ja) | 1994-12-20 | 2006-01-27 | 半導体装置 |
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JP (1) | JP3938783B2 (ja) |
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