JP3822123B2 - Multilayer printed wiring board - Google Patents

Multilayer printed wiring board Download PDF

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Publication number
JP3822123B2
JP3822123B2 JP2002081619A JP2002081619A JP3822123B2 JP 3822123 B2 JP3822123 B2 JP 3822123B2 JP 2002081619 A JP2002081619 A JP 2002081619A JP 2002081619 A JP2002081619 A JP 2002081619A JP 3822123 B2 JP3822123 B2 JP 3822123B2
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transmission signal
printed wiring
wiring board
press
fit connector
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JP2002081619A
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JP2003283093A (en
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徹 立石
直紀 中川
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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【０００１】
【発明の属する技術分野】
この発明は、高速伝送信号用プリント配線板と低速伝送信号用プリント配線板を有し、プレスフィットコネクタを実装する多層プリント配線板に関するものである。
【０００２】
【従来の技術】
図７は、従来の多層プリント配線板を示した断面図である。図において２１は多層プリント配線板、２２はプレスフィットコネクタピン、２３はスルーホール、２４はスルーホールに接続されている銅箔、２５はスルーホールのうち信号伝送に用いられない領域（オープンスタブ）、２６はプレスフィットコネクタピン２２のスルーホール２３への挿入面、２７はプレスフィットコネクタピン２２の非挿入面である。
【０００３】
多層プリント配線板２１には複数のスルーホール２３が設けられている。スルーホール２３にプレスフィットコネクタピン２２を圧入することにより、多層プリント配線板２１とプレスフィットコネクタピン２２の電気的な接続が行われ、かつ機械的にピンが保持されている。
【０００４】
次に、プレスフィットコネクタピン２２から多層プリント配線板２１への信号の伝送について、図７、図８、図９を用いて説明する。
信号は、まずプレスフィットコネクタピン２２に接触しているスルーホール２３に伝送され、次にそのスルーホール２３に接続されている銅箔２４に伝送される。このとき、スルーホール２３のうちプレスフィットコネクタピン２２の圧接部から銅箔２４との接続部までの領域は信号伝送に用いられるが、銅箔２４との接続部からプレスフィットコネクタピンの非挿入面２７までは信号伝送に用いられない領域２５となる。
【０００５】
図８、図９において、２４ａ，２４ｂはスルーホール２３を介してプレスフィットコネクタピン２２からその信号が伝送される銅箔、２５ａ，２５ｂは信号伝送に用いられないスルーホールの領域である。図８において銅箔２４ａはプレスフィットコネクタピン２２の圧接範囲内にあるため、スルーホール２３のうち信号伝送に用いられない領域２５ａは長くなる。一方、図９においては、銅箔２４ｂはプレスフィットコネクタピン２２の圧接範囲外にあるため、信号伝送に用いられない領域２５ｂは短くなる。
【０００６】
【発明が解決しようとする課題】
従来の多層プリント配線板は以上のように構成されているので、プレスフィットコネクタピンを挿入するスルーホールに、信号伝送に用いられない領域が存在し、それらの領域がオープンスタブとなる。よって、プレスフィットコネクタピンからの信号伝送において、信号伝送に用いられないスルーホール領域の距離が長くなると、伝送信号の反射が生じ、伝送信号の劣化が起こるという課題があった。特に近年、高多層化の要求によりプリント配線板の板厚が厚くなる傾向にあり、この問題の影響が顕著となっている。
【０００７】
この発明は上記のような課題を解決するためになされたもので、信号伝送に利用されないスルーホールの領域によるスタブ構造を削減することにより、多層プリント配線板の板厚が厚くなっても、伝送信号の反射や伝送信号の波形歪みを是正して、伝送効率の高い多層プリント配線板を得ることを目的とする。
【０００８】
また、この発明は、製造コストが低く、伝送効率の高い多層プリント配線板を得ることを目的とする。
【０００９】
【課題を解決するための手段】
この発明に係る多層プリント配線板は、第１の伝送信号用プリント配線基板層と第２の伝送信号用プリント配線基板層との間に絶縁層を介在させてなる多層プリント配線板であって、第１の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンを挿入するスルーホールと、第１の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンを挿入するスルーホールの位置に対応して第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴とを備えたものである。
この発明に係る多層プリント配線板は、第１の伝送信号用プリント配線基板層と第２の伝送信号用プリント配線基板層との間に絶縁層を介在させてなる多層プリント配線板であって、第１の伝送信号用プリント配線基板層に設けられた第１、または第２の伝送信号用プレスフィットコネクタピンを挿入する複数のスルーホールと、第１の伝送信号用プリント配線基板層に設けられた第２の伝送信号用プレスフィットコネクタピンを挿入するスルーホールの位置に対応して第２の伝送信号用プリント配線基板層に設けられた第２の伝送信号用スルーホールと、第１の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンを挿入するスルーホールの位置に対応して第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴とを備えたものである。
【００１１】
この発明に係る多層プリント配線板は、第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンと電気的に非接続の伝送信号の反射を防止するための連通穴は、プレスフィットコネクタピンと電気的に接触しない程度に大きな径のスルーホールとしたものである。
【００１２】
この発明に係る多層プリント配線板は、第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンと電気的に非接続の伝送信号の反射を防止するための連通穴には、該連通穴と電気的に接触しない程度に径を細くした第１の伝送信号用プレスフィットコネクタピンを圧入するものである。
【００１３】
この発明に係る多層プリント配線板は、第１の伝送信号用プリント配線基板層には、誘電率と誘電正接が低い樹脂を適用したものである。
【００１４】
この発明に係る多層プリント配線板は、第１の伝送信号用プリント配線基板層はビルドアップ工法により形成したものである。
【００１５】
この発明に係る多層プリント配線板は、第１の伝送信号用プリント配線基板層は、第１の伝送信号用プリント配線基板間に絶縁層を設けたものである。
【００１６】
【発明の実施の形態】
以下、この発明の実施の一形態を説明する。
実施の形態１．
図１は、この発明の実施の形態１による多層プリント配線板を示す断面図である。図において１は、高速伝送信号用プリント配線板層（第１の伝送信号用プリント配線基板層）、４は低速伝送信号用プリント配線板層（第２の伝送信号用プリント配線基板層）である。１０は高速伝送信号用プリント配線板層１と低速伝送信号用プリント配線板層４の間に挟まれた絶縁樹脂層（絶縁層）である。２は高速伝送信号用プレスフィットコネクタピン（第１の伝送信号用プレスフィットコネクタピン）であり、５は低速伝送信号用プレスフィットコネクタピン（第２の伝送信号用プレスフィットコネクタピン）である。３は、高速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴（スルーホール）、６は、低速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴（電気的に非接続の連通穴）、７は、高速伝送信号用プリント配線板の低速伝送信号用プレスフィットコネクタピン圧入穴（スルーホール）、８は、低速伝送信号用プリント配線板の低速伝送信号用プレスフィットコネクタピン圧入穴（第２の伝送信号用スルーホール）である。９はスルーホールに接続されている銅箔である。
【００１７】
高速伝送信号用プリント配線板層１および低速伝送信号用プリント配線板層４には、高速伝送信号用プレスフィットコネクタピン２および低速伝送信号用プレスフィットコネクタピン５を圧入するための連通穴が設けられている。高速伝送信号用プリント配線板層１と低速伝送信号用プリント配線板層４の間に絶縁樹脂層１０を重ねた状態で、高速伝送信号用プレスフィットコネクタピン２および低速伝送信号用プレスフィットコネクタピン５を連通穴に圧入することにより、高速伝送信号用プリント配線板層１および低速伝送信号用プリント配線板層４と高速伝送信号用プレスフィットコネクタピン２および低速伝送信号用プレスフィットコネクタピン５の電気的な接続が行われると同時に、構造が機械的に保持される。高速伝送信号用プレスフィットコネクタピン２を圧入する連通穴は、高速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴３と低速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴６から構成される。高速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴３は、銅、はんだ、金等のめっきによる金属膜を形成したスルーホールになっており、高速伝送信号用プレスフィットコネクタピン２と電気的に接続している。低速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴６は、非めっき穴になっており、高速伝送信号用プレスフィットコネクタピン２とは電気的に非接続である。低速伝送信号用プレスフィットコネクタピン５を圧入する連通穴は、高速伝送信号用プリント配線板の低速伝送信号用プレスフィットコネクタピン圧入穴７と低速伝送信号用プリント配線板の低速伝送信号用プレスフィットコネクタピン圧入穴８から構成される。高速伝送信号用プリント配線板の低速伝送信号用プレスフィットコネクタピン圧入穴７および低速伝送信号用プリント配線板の低速伝送信号用プレスフィットコネクタピン圧入穴８は、銅、はんだ、金等のめっきによる金属膜を形成したスルーホールになっており、低速伝送信号用プレスフィットコネクタピン５と電気的に接続している。
【００１８】
次に、実施の形態１による、高速伝送信号用プレスフィットコネクタピン２および低速伝送信号用プレスフィットコネクタピン５からの信号伝送について説明する。
高速伝送信号用プレスフィットコネクタピン２から高速伝送信号用プリント配線板層１に信号を伝送する場合、まず高速伝送信号用プレスフィットコネクタピン２に圧接している連通穴に信号が伝送され、次に連通穴に接続されている銅箔９に信号が伝送される。このとき、高速伝送信号用プレスフィットコネクタピン２と圧接している連通穴のうち、高速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴３はスルーホールであるが、低速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴６は非めっき穴であるため、従来問題となっていた信号伝送に用いられないスルーホール領域を極端に短く若しくは皆無にすることが可能となる。その結果、高速伝送信号用プレスフィットコネクタピン２から伝送された高速伝送信号は、分岐による伝送信号の反射および波形の歪みを生じることなく伝送される。また、低速伝送信号用プレスフィットコネクタピン５からの信号伝送については、従来例と同様である。
【００１９】
以上のように、この実施の形態１によれば、多層プリント配線板を、別々に製造された高速伝送信号用プリント配線板層１及び低速伝送信号用プリント配線板層４から構成し、高速伝送信号用プレスフィットコネクタピン２を圧入する連通穴において、高速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴３はスルーホールとし、低速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴６は非めっき穴としたので、信号伝送に利用されないスルーホールによるスタブ構造が削減され、伝送信号の反射や伝送信号の波形歪みを是正出来るという効果が得られる。
【００２０】
実施の形態２．
図２は、この発明の実施の形態２による多層プリント配線板を示す断面図である。実施の形態１の図１と同一の符号は同一の構成要素を表している。実施の形態２では、低速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴６は、プレスフィットコネクタピン２に電気的に接触しない程度に大きなスルーホールにすることにより、実施の形態１と同等の効果が得られる。
【００２１】
実施の形態３．
図３は、この発明の実施の形態３による多層プリント配線板を示す断面図である。実施の形態１の図１と同一の符号は同じ構成要素を表している。図において２ａは、高速伝送信号用プレスフィットコネクタピンであり、低速伝送信号用プリント配線板層４と接触する領域のピン径を細くしたことにより、低速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴６は従来例と同様のスルーホールであっても電気的に非接触にすることが可能であり、実施の形態１と同等の効果が得られる。
【００２２】
実施の形態４．
図４は、この発明の実施の形態４による多層プリント配線板を示す断面図である。実施の形態１の図１と同一の符号は同じ構成要素を表している。図において１ａは高速伝送信号用プリント配線板層であり、誘電率と誘電正接が低い樹脂を適用して形成されている。誘電率と誘電正接が低い樹脂を適用することにより、プリント配線板の伝送効率を向上させることが可能であるが、高価な材料であるため、多層プリント配線板全体に適用すると、製造コストが高くなってしまう。よって実施の形態４のように高速伝送信号用プリント配線板層１ａのみに誘電率と誘電正接が低い樹脂を適用すれば、比較的安価に製造することができる。
【００２３】
以上のように、この実施の形態４によれば、多層プリント配線板を複数のプリント配線板に分割して作成したことにより、高速伝送信号用プリント配線板層１ａだけに、高価な樹脂を適用出来るようにしたので、低コストで多層プリント配線板の伝送特性を向上させることが出来るという効果が得られる。
【００２４】
実施の形態５．
図５は、この発明の実施の形態５による多層プリント配線板を示す断面図である。実施の形態１の図１と同一の符号は同じ構成要素を表している。図において１ｂは高速伝送信号用プリント配線板層であり、ビルドアップ工法により製造されている。ビルドアップ工法を用いたプリント配線板では、信号の切り返しに用いるバイアをドリルで作成するのではなく、レーザ光線にて作成するため、バイア径が小さくできる特徴があり、そのため、伝送特性に優れた性能を発揮することが出来る。ビルドアップ工法を用いたプリント配線板は高価なため、多層プリント配線板全体に適用すると製造コストが高くなってしまうが、実施の形態５のようにプリント配線板１ｂのみに適用すれば、安価に、伝送特性の優れた多層プリント配線板を製造することが出来る。
【００２５】
以上のように、この実施の形態５によれば、多層プリント配線板を複数のプリント配線板に分割して作成したことにより、高速伝送信号用プリント配線板層１ｂだけに、ビルドアップ工法を適用出来るようにしたので、低コストで多層プリント配線板の伝送特性を向上させることが出来るという効果が得られる。
【００２６】
実施の形態６．
図６は、この発明の実施の形態６による多層プリント配線板を示す断面図である。実施の形態１の図１と同一の符号は同じ構成要素を表している。図において１ｃは高速伝送信号用プリント配線板層であり、１１は、複数枚の高速伝送信号用プリント配線板を重ねる場合に、高速伝送信号用プリント配線板間に設ける絶縁樹脂の層（高速伝送信号用プリント配線板層の絶縁層）であり、誘電率、誘電正接が低い絶縁樹脂から成る。高速伝送信号用プリント配線板層１と高速伝送信号用プリント配線板層１ｃを重ねた場合、重なり合った両配線板で伝送する差動信号の間に空間を設けることにより、さらに伝送特性を向上させることが出来る。
【００２７】
以上のように、この実施の形態６によれば、高速伝送信号用プリント配線板層１と高速伝送信号用プリント配線板層１ｃの間に、誘電率、誘電正接が低い絶縁樹脂による層を設けることにより、さらに伝送特性が向上するという効果が得られる。
【００２８】
【発明の効果】
以上のように、この発明によれば、第１の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンを挿入するスルーホールと、第１の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンを挿入するスルーホールの位置に対応して第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴とを備えたことにより、信号伝送に利用されないスルーホールの領域によるスタブ構造を削減し、多層プリント配線板の板厚が厚くなっても、伝送信号の反射や伝送信号の波形歪みを是正して、伝送効率を向上させる効果がある。
この発明によれば、第１の伝送信号用プリント配線基板層に設けられた第１、または第２の伝送信号用プレスフィットコネクタピンを挿入する複数のスルーホールと、第１の伝送信号用プリント配線基板層に設けられた第２の伝送信号用プレスフィットコネクタピンを挿入するスルーホールの位置に対応して第２の伝送信号用プリント配線基板層に設けられた第２の伝送信号用スルーホールと、第１の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンを挿入するスルーホールの位置に対応して第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴とを備えたことにより、信号伝送に利用されないスルーホールの領域によるスタブ構造を削減し、多層プリント配線板の板厚が厚くなっても、伝送信号の反射や伝送信号の波形歪みを是正して、伝送効率を向上させる効果がある。
【００３０】
この発明によれば、第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴は、プレスフィットコネクタピンと電気的に接触しない程度に大きな径のスルーホールとしたことにより、信号伝送に利用されないスルーホールの領域によるスタブ構造を削減し、伝送信号の反射や伝送信号の波形歪みを是正して、伝送効率を向上させる効果がある。
【００３１】
この発明によれば、第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴には、該連通穴と電気的に接触しない程度に径を細くした第１の伝送信号用プレスフィットコネクタピンを圧入することにより、信号伝送に利用されないスルーホールの領域によるスタブ構造を削減し、伝送信号の反射や伝送信号の波形歪みを是正して、伝送効率を向上させる効果がある。
【００３２】
この発明によれば、第１の伝送信号用プリント配線基板層には、誘電率と誘電正接が低い樹脂を適用したことにより、低コストで、多層プリント配線板の伝送特性を向上させる効果がある。
【００３３】
この発明によれば、第１の伝送信号用プリント配線基板層は、ビルドアップ工法で形成したことにより、低コストで、多層プリント配線板の伝送特性を向上させる効果がある。
【００３４】
この発明によれば、第１の伝送信号用プリント配線基板間に絶縁層を設けたことにより、多層プリント配線板の伝送特性をさらに向上させる効果がある。
【図面の簡単な説明】
【図１】 この発明の実施の形態１による多層プリント配線板を示す断面図である。
【図２】 この発明の実施の形態２による多層プリント配線板を示す断面図である。
【図３】 この発明の実施の形態３による多層プリント配線板を示す断面図である。
【図４】 この発明の実施の形態４による多層プリント配線板を示す断面図である。
【図５】 この発明の実施の形態５による多層プリント配線板を示す断面図である。
【図６】 この発明の実施の形態６による多層プリント配線板を示す断面図である。
【図７】 従来の多層プリント配線板を示す断面図である。
【図８】 従来の多層プリント配線板における信号伝送を説明するための断面図である。
【図９】 従来の多層プリント配線板における信号伝送を説明するための断面図である。
【符号の説明】
１，１ａ，１ｂ，１ｃ 高速伝送信号用プリント配線板層（第１の伝送信号用プリント配線基板層）、２，２ａ 高速伝送信号用プレスフィットコネクタピン（第１の伝送信号用プレスフィットコネクタピン）、３ 高速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴（スルーホール）、４ 低速伝送信号用プリント配線板層（第２の伝送信号用プリント配線基板層）、５ 低速伝送信号用プレスフィットコネクタピン（第２の伝送信号用プレスフィットコネクタピン）、６ 低速伝送信号用プリント配線板の高速伝送信号用プレスフィットコネクタピン圧入穴（電気的に非接続の連通穴）、７ 高速伝送信号用プリント配線板の低速伝送信号用プレスフィットコネクタピン圧入穴（スルーホール）、８ 低速伝送信号用プリント配線板の低速伝送信号用プレスフィットコネクタピン圧入穴（第２の伝送信号用スルーホール）、９ スルーホールに接続されている銅箔、１０ 絶縁樹脂層（絶縁層）、１１ 高速伝送信号用プリント配線板間の絶縁樹脂層（高速伝送信号用プリント配線板層の絶縁層）。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer printed wiring board having a printed wiring board for high-speed transmission signals and a printed wiring board for low-speed transmission signals, on which a press-fit connector is mounted.
[0002]
[Prior art]
FIG. 7 is a cross-sectional view showing a conventional multilayer printed wiring board. In the figure, 21 is a multilayer printed wiring board, 22 is a press-fit connector pin, 23 is a through hole, 24 is a copper foil connected to the through hole, and 25 is a region of the through hole that is not used for signal transmission (open stub). , 26 is an insertion surface of the press-fit connector pin 22 into the through hole 23, and 27 is a non-insertion surface of the press-fit connector pin 22.
[0003]
The multilayer printed wiring board 21 is provided with a plurality of through holes 23. By press-fitting the press-fit connector pins 22 into the through holes 23, the multilayer printed wiring board 21 and the press-fit connector pins 22 are electrically connected, and the pins are mechanically held.
[0004]
Next, transmission of signals from the press-fit connector pins 22 to the multilayer printed wiring board 21 will be described with reference to FIGS. 7, 8, and 9.
The signal is first transmitted to the through hole 23 in contact with the press-fit connector pin 22, and then transmitted to the copper foil 24 connected to the through hole 23. At this time, the region from the press-contact portion of the press-fit connector pin 22 to the connection portion with the copper foil 24 in the through hole 23 is used for signal transmission, but the press-fit connector pin is not inserted from the connection portion with the copper foil 24. The surface 27 is an area 25 that is not used for signal transmission.
[0005]
8 and 9, reference numerals 24a and 24b denote copper foils through which the signal is transmitted from the press-fit connector pin 22 through the through-hole 23, and reference numerals 25a and 25b denote through-hole regions not used for signal transmission. In FIG. 8, since the copper foil 24a is within the press-contact range of the press-fit connector pin 22, the region 25a that is not used for signal transmission in the through hole 23 becomes long. On the other hand, in FIG. 9, since the copper foil 24b is outside the press contact range of the press-fit connector pin 22, the region 25b not used for signal transmission is shortened.
[0006]
[Problems to be solved by the invention]
Since the conventional multilayer printed wiring board is configured as described above, there are regions that are not used for signal transmission in the through holes into which the press-fit connector pins are inserted, and these regions become open stubs. Therefore, in the signal transmission from the press-fit connector pin, when the distance of the through-hole region that is not used for signal transmission becomes long, there is a problem that the transmission signal is reflected and the transmission signal is deteriorated. Particularly, in recent years, the printed wiring board has a tendency to increase in thickness due to a demand for a higher number of layers, and the influence of this problem is remarkable.
[0007]
The present invention has been made to solve the above-described problems. Even if the thickness of the multilayer printed wiring board is increased by reducing the stub structure by the through-hole region that is not used for signal transmission, the transmission can be performed. An object of the present invention is to obtain a multilayer printed wiring board having high transmission efficiency by correcting signal reflection and waveform distortion of a transmission signal.
[0008]
Another object of the present invention is to obtain a multilayer printed wiring board with low manufacturing cost and high transmission efficiency.
[0009]
[Means for Solving the Problems]
The multilayer printed wiring board according to the present invention is a multilayer printed wiring board having an insulating layer interposed between the first transmission signal printed wiring board layer and the second transmission signal printed wiring board layer, A through hole for inserting a first transmission signal press-fit connector pin provided in the first transmission signal printed wiring board layer, and a first transmission signal provided in the first transmission signal printed wiring board layer The first transmission signal press-fit connector pin provided on the second transmission signal printed wiring board layer corresponding to the position of the through-hole into which the press-fit connector pin is inserted is a transmission signal that is not electrically connected to the first transmission signal press-fit connector pin . It is provided with a communication hole for preventing reflection .
The multilayer printed wiring board according to the present invention is a multilayer printed wiring board having an insulating layer interposed between the first transmission signal printed wiring board layer and the second transmission signal printed wiring board layer, A plurality of through-holes for inserting the first or second transmission signal press-fit connector pins provided in the first transmission signal printed wiring board layer, and the first transmission signal printed wiring board layer. A second transmission signal through-hole provided in the second transmission signal printed circuit board layer corresponding to the position of the through-hole into which the second transmission signal press-fit connector pin is inserted, and the first transmission Provided in the second printed wiring board layer for transmission signals corresponding to the positions of the through holes into which the first press fit connector pins for transmission signals provided in the printed circuit board layer for signals are inserted. The the first transmission signal press-fit connector pin is obtained and a communication hole for preventing reflection of the transmission signal electrically disconnected.
[0011]
The multilayer printed wiring board according to the present invention communicates with the first transmission signal press-fit connector pin provided on the second transmission signal printed wiring board layer to prevent reflection of the transmission signal that is not electrically connected. The hole is a through hole having a diameter large enough not to make electrical contact with the press-fit connector pin.
[0012]
The multilayer printed wiring board according to the present invention communicates with the first transmission signal press-fit connector pin provided on the second transmission signal printed wiring board layer to prevent reflection of the transmission signal that is not electrically connected. In the hole, the first transmission signal press-fit connector pin whose diameter is thinned to such an extent that it does not come into electrical contact with the communication hole is press-fitted.
[0013]
In the multilayer printed wiring board according to the present invention, a resin having a low dielectric constant and dielectric loss tangent is applied to the first printed wiring board layer for transmission signals .
[0014]
In the multilayer printed wiring board according to the present invention, the first transmission signal printed wiring board layer is formed by a build-up method.
[0015]
In the multilayer printed wiring board according to the present invention, the first transmission signal printed wiring board layer is provided with an insulating layer between the first transmission signal printed wiring boards .
[0016]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below.
Embodiment 1 FIG.
1 is a cross-sectional view showing a multilayer printed wiring board according to Embodiment 1 of the present invention. In the figure, 1 is a high-speed transmission signal printed wiring board layer (first transmission signal printed wiring board layer) , and 4 is a low-speed transmission signal printed wiring board layer (second transmission signal printed wiring board layer) . . Reference numeral 10 denotes an insulating resin layer (insulating layer) sandwiched between the high-speed transmission signal printed wiring board layer 1 and the low-speed transmission signal printed wiring board layer 4. 2 is a high-speed transmission signal press-fit connector pin (first transmission signal press-fit connector pin) , and 5 is a low-speed transmission signal press-fit connector pin (second transmission signal press-fit connector pin) . 3 is a press-fit connector pin press-fitting hole for a high-speed transmission signal of a printed wiring board for a high-speed transmission signal (through hole) , and 6 is a press-fit connector pin press-fitting hole for a high-speed transmission signal of a printed wiring board for a low-speed transmission signal (electrical the communicating hole of the non-connection), 7, press-fit connector pin press-fitting hole (through-hole low-speed transmission signals of the high-speed transmission signal for a printed wiring board), 8, press low-speed transmission signals for low-speed transmission signal printed circuit board This is a fit connector pin press-fitting hole (second transmission signal through hole) . 9 is a copper foil connected to the through hole.
[0017]
The high-speed transmission signal printed wiring board layer 1 and the low-speed transmission signal printed wiring board layer 4 are provided with communication holes for press-fitting the high-speed transmission signal press-fit connector pin 2 and the low-speed transmission signal press-fit connector pin 5. It has been. A high-speed transmission signal press-fit connector pin 2 and a low-speed transmission signal press-fit connector pin in a state where an insulating resin layer 10 is stacked between the high-speed transmission signal printed wiring board layer 1 and the low-speed transmission signal printed wiring board layer 4. By press-fitting 5 into the communication hole, the high-speed transmission signal printed wiring board layer 1, the low-speed transmission signal printed wiring board layer 4, the high-speed transmission signal press-fit connector pin 2, and the low-speed transmission signal press-fit connector pin 5 At the same time that the electrical connection is made, the structure is mechanically held. The press-fit connector pin 2 for press-fitting the high-speed transmission signal press-fit connector pin 2 is a press-fit connector pin press-fitting hole 3 for the high-speed transmission signal printed wiring board and the high-speed transmission signal press-fit for the low-speed transmission signal printed wiring board. It consists of a connector pin press-fitting hole 6. The press-fit connector pin press-fitting hole 3 for the high-speed transmission signal printed wiring board is a through hole in which a metal film is formed by plating copper, solder, gold or the like, and the press-fit connector pin for the high-speed transmission signal 2 is electrically connected. The press-fit connector pin press-fitting hole 6 for high-speed transmission signals on the printed wiring board for low-speed transmission signals is a non-plated hole and is not electrically connected to the press-fit connector pin 2 for high-speed transmission signals. The press-fit connector pin 5 for press-fitting the low-speed transmission signal press-fit connector pin 5 is a press-fit connector pin press-fitting hole 7 for the low-speed transmission signal printed wiring board for the high-speed transmission signal and the low-speed transmission signal press-fit for the low-speed transmission signal printed wiring board. It consists of a connector pin press-fitting hole 8. The press-fit connector pin press-fitting hole 7 for the low-speed transmission signal of the printed wiring board for the high-speed transmission signal and the press-fit connector pin press-fitting hole 8 for the low-speed transmission signal of the printed wiring board for the low-speed transmission signal are formed by plating with copper, solder, gold, etc. The through hole is formed with a metal film, and is electrically connected to the press-fit connector pin 5 for low-speed transmission signals.
[0018]
Next, signal transmission from the high-speed transmission signal press-fit connector pin 2 and the low-speed transmission signal press-fit connector pin 5 according to the first embodiment will be described.
When transmitting a signal from the press-fit connector pin 2 for high-speed transmission signal to the printed wiring board layer 1 for high-speed transmission signal, the signal is first transmitted to the communication hole press-contacted with the press-fit connector pin 2 for high-speed transmission signal. A signal is transmitted to the copper foil 9 connected to the communication hole. At this time, among the communication holes that are in pressure contact with the press-fit connector pin 2 for high-speed transmission signal, the press-fit connector pin press-fitting hole 3 for high-speed transmission signal of the printed wiring board for high-speed transmission signal is a through hole, but low-speed transmission. Since the press-fit connector pin press-fitting hole 6 for high-speed transmission signals on signal printed wiring boards is a non-plated hole, the through-hole region that has not been used for signal transmission, which has been a problem in the past, can be made extremely short or completely absent. It becomes possible. As a result, the high-speed transmission signal transmitted from the press-fit connector pin 2 for high-speed transmission signals is transmitted without causing reflection of the transmission signal due to branching and waveform distortion. Signal transmission from the press-fit connector pin 5 for low-speed transmission signals is the same as in the conventional example.
[0019]
As described above, according to the first embodiment, the multilayer printed wiring board is composed of the high-speed transmission signal printed wiring board layer 1 and the low-speed transmission signal printed wiring board layer 4 which are separately manufactured, and the high-speed transmission. The press-fit connector pin press-fitting hole 3 for the high-speed transmission signal printed wiring board is a through hole in the communication hole for press-fitting the signal press-fit connector pin 2, and the high-speed transmission signal for the low-speed transmission signal printed wiring board. Since the press-fit connector pin press-fitting hole 6 is a non-plated hole, a stub structure by a through hole that is not used for signal transmission is reduced, and the effect that the reflection of the transmission signal and the waveform distortion of the transmission signal can be corrected can be obtained.
[0020]
Embodiment 2. FIG.
FIG. 2 is a cross-sectional view showing a multilayer printed wiring board according to Embodiment 2 of the present invention. The same reference numerals as those in FIG. 1 of the first embodiment represent the same components. In the second embodiment, the press-fit connector pin press-fitting hole 6 for the high-speed transmission signal of the printed wiring board for the low-speed transmission signal is formed as a through hole that is large enough not to be in electrical contact with the press-fit connector pin 2. An effect equivalent to that of Embodiment 1 is obtained.
[0021]
Embodiment 3 FIG.
FIG. 3 is a sectional view showing a multilayer printed wiring board according to Embodiment 3 of the present invention. The same reference numerals as those in FIG. 1 of the first embodiment represent the same components. In the figure, reference numeral 2a denotes a press-fit connector pin for a high-speed transmission signal. By reducing the pin diameter in the region in contact with the low-speed transmission signal printed wiring board layer 4, the high-speed transmission signal printed wiring board for the high-speed transmission signal. Even if the press-fit connector pin press-fitting hole 6 is a through-hole similar to the conventional example, it can be made electrically non-contact, and the same effect as in the first embodiment can be obtained.
[0022]
Embodiment 4 FIG.
4 is a sectional view showing a multilayer printed wiring board according to Embodiment 4 of the present invention. The same reference numerals as those in FIG. 1 of the first embodiment represent the same components. In the figure, reference numeral 1a denotes a printed wiring board layer for high-speed transmission signals, which is formed by applying a resin having a low dielectric constant and dielectric loss tangent. Although it is possible to improve the transmission efficiency of a printed wiring board by applying a resin having a low dielectric constant and dielectric loss tangent, it is an expensive material, so that it is expensive to apply to the entire multilayer printed wiring board. turn into. Therefore, if a resin having a low dielectric constant and dielectric loss tangent is applied only to the high-speed transmission signal printed wiring board layer 1a as in the fourth embodiment, it can be manufactured at a relatively low cost.
[0023]
As described above, according to the fourth embodiment, an expensive resin is applied only to the high-speed transmission signal printed wiring board layer 1a by dividing the multilayer printed wiring board into a plurality of printed wiring boards. Since it was made possible, the effect that the transmission characteristic of a multilayer printed wiring board can be improved at low cost is acquired.
[0024]
Embodiment 5 FIG.
5 is a cross-sectional view showing a multilayer printed wiring board according to Embodiment 5 of the present invention. The same reference numerals as those in FIG. 1 of the first embodiment represent the same components. In the figure, 1b is a printed wiring board layer for high-speed transmission signals, which is manufactured by a build-up method. In the printed wiring board using the build-up method, the via used for turning back the signal is not created with a drill, but is created with a laser beam, so the via diameter can be reduced, and therefore, the transmission characteristics are excellent. Performance can be demonstrated. Since the printed wiring board using the build-up method is expensive, the manufacturing cost becomes high when applied to the entire multilayer printed wiring board. However, if the printed wiring board is applied only to the printed wiring board 1b as in the fifth embodiment, it is inexpensive. A multilayer printed wiring board having excellent transmission characteristics can be manufactured.
[0025]
As described above, according to the fifth embodiment, the build-up method is applied only to the high-speed transmission signal printed wiring board layer 1b by dividing the multilayer printed wiring board into a plurality of printed wiring boards. Since it was made possible, the effect that the transmission characteristic of a multilayer printed wiring board can be improved at low cost is acquired.
[0026]
Embodiment 6 FIG.
FIG. 6 is a sectional view showing a multilayer printed wiring board according to Embodiment 6 of the present invention. The same reference numerals as those in FIG. 1 of the first embodiment represent the same components. In the figure, 1c is a printed wiring board layer for high-speed transmission signals, and 11 is an insulating resin layer (high-speed transmission layer) provided between the printed wiring boards for high-speed transmission signals when a plurality of printed wiring boards for high-speed transmission signals are stacked. An insulating layer of a printed wiring board layer for signals), and made of an insulating resin having a low dielectric constant and dielectric loss tangent. When the printed wiring board layer 1 for high-speed transmission signals and the printed wiring board layer 1c for high-speed transmission signals are overlapped, the transmission characteristics are further improved by providing a space between the differential signals transmitted by the two overlapping wiring boards. I can do it.
[0027]
As described above, according to the sixth embodiment, a layer made of an insulating resin having a low dielectric constant and dielectric loss tangent is provided between the high-speed transmission signal printed wiring board layer 1 and the high-speed transmission signal printed wiring board layer 1c. As a result, the effect of further improving the transmission characteristics can be obtained.
[0028]
【The invention's effect】
As described above, according to the present invention, the through hole for inserting the first transmission signal press-fit connector pin provided in the first transmission signal printed wiring board layer, and the first transmission signal printed wiring The first transmission signal press-fit connector provided in the second transmission signal printed wiring board layer corresponding to the position of the through hole for inserting the first transmission signal press-fit connector pin provided in the board layer By providing communication holes for preventing reflection of transmission signals that are not electrically connected to the pins, the stub structure due to the areas of through holes that are not used for signal transmission is reduced, and the thickness of the multilayer printed wiring board is reduced. Even when the thickness is increased, there is an effect of correcting transmission signal reflection and transmission signal waveform distortion and improving transmission efficiency.
According to the present invention, the plurality of through-holes for inserting the first or second transmission signal press-fit connector pins provided in the first transmission signal printed wiring board layer, and the first transmission signal print Second transmission signal through hole provided in the second transmission signal printed wiring board layer corresponding to the position of the through hole for inserting the second transmission signal press-fit connector pin provided in the wiring board layer And the second transmission signal printed wiring board layer corresponding to the position of the through hole for inserting the first transmission signal press-fit connector pin provided in the first transmission signal printed wiring board layer. by the first transmission signal press-fit connector pin and a communication hole for preventing reflection of the transmission signal electrically disconnected was, Do is utilized for signal transmission Reduce stub structure by area of the through hole, even if the plate thickness of the multilayer printed wiring board becomes thicker, and correct the waveform distortion of the reflected and transmitted signals of the transmission signals, the effect of improving the transmission efficiency.
[0030]
According to this invention, the communication hole for preventing reflection of the transmission signal that is electrically disconnected from the first transmission signal press-fit connector pin provided in the second transmission signal printed wiring board layer is By making the through-holes large enough not to make electrical contact with the press-fit connector pins, the stub structure due to the area of the through-holes not used for signal transmission is reduced, and transmission signal reflection and transmission signal waveform distortion are corrected. Thus, there is an effect of improving transmission efficiency.
[0031]
According to the present invention, the communication hole for preventing reflection of the transmission signal electrically disconnected from the first transmission signal press-fit connector pin provided in the second transmission signal printed wiring board layer is provided in the communication hole. The first transmission signal press-fit connector pin having a diameter reduced to such an extent that it does not come into electrical contact with the communication hole is press-fitted to reduce the stub structure due to the through-hole region not used for signal transmission. This improves the transmission efficiency by correcting the reflection and the waveform distortion of the transmission signal.
[0032]
According to the present invention, the first transmission signal printed wiring board layer has the effect of improving the transmission characteristics of the multilayer printed wiring board at low cost by applying the resin having a low dielectric constant and dielectric loss tangent. .
[0033]
According to the present invention, the first printed wiring board layer for transmission signals is formed by the build-up method, so that the transmission characteristics of the multilayer printed wiring board are improved at low cost.
[0034]
According to the present invention, by providing the insulating layer between the first printed circuit boards for transmission signals, there is an effect of further improving the transmission characteristics of the multilayer printed wiring board.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a multilayer printed wiring board according to Embodiment 1 of the present invention.
FIG. 2 is a cross-sectional view showing a multilayer printed wiring board according to Embodiment 2 of the present invention.
FIG. 3 is a cross-sectional view showing a multilayer printed wiring board according to Embodiment 3 of the present invention.
FIG. 4 is a sectional view showing a multilayer printed wiring board according to Embodiment 4 of the present invention.
FIG. 5 is a cross-sectional view showing a multilayer printed wiring board according to Embodiment 5 of the present invention.
FIG. 6 is a cross-sectional view showing a multilayer printed wiring board according to Embodiment 6 of the present invention.
FIG. 7 is a cross-sectional view showing a conventional multilayer printed wiring board.
FIG. 8 is a cross-sectional view for explaining signal transmission in a conventional multilayer printed wiring board.
FIG. 9 is a cross-sectional view for explaining signal transmission in a conventional multilayer printed wiring board.
[Explanation of symbols]
1, 1a, 1b, 1c High-speed transmission signal printed wiring board layer (first transmission signal printed wiring board layer) 2, 2a High-speed transmission signal press-fit connector pin (first transmission signal press-fit connector pin 3 ) Press-fit connector pin press-fitting hole (through hole) for high-speed transmission signal on printed wiring board for high-speed transmission signal 4 Printed wiring board layer for low-speed transmission signal (second printed wiring board layer for transmission signal) 5 Low-speed transmission signal Press-fit connector pin for transmission signal (second press-fit connector pin for transmission signal) , 6 Press-fit connector pin press-fit hole for high-speed transmission signal on the printed wiring board for low-speed transmission signal (electrically unconnected communication hole) , 7 speed transmission low-speed transmission signal press-fit connector pin press-fitting hole (through hole) of the signal for a printed wiring board, 8 low-speed transmission Low-speed transmission signal press-fit connector pin press-fitting holes of the issue for a printed wiring board (second transmission signal through-hole), 9 copper foil is connected to a through hole, 10 an insulating resin layer (an insulating layer), 11 high-speed transmission Insulating resin layer between printed wiring boards for signals (insulating layer of printed wiring board layers for high-speed transmission signals).

Claims (7)

第１の伝送信号用プリント配線基板層と第２の伝送信号用プリント配線基板層との間に絶縁層を介在させてなる多層プリント配線板であって、
上記第１の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンを挿入するスルーホールと、
上記第１の伝送信号用プリント配線基板層に設けられた上記第１の伝送信号用プレスフィットコネクタピンを挿入するスルーホールの位置に対応して上記第２の伝送信号用プリント配線基板層に設けられた上記第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴とを備えたことを特徴とする多層プリント配線板。A multilayer printed wiring board comprising an insulating layer interposed between a first transmission signal printed wiring board layer and a second transmission signal printed wiring board layer,
A through hole for inserting a first transmission signal press-fit connector pin provided in the first transmission signal printed circuit board layer;
Provided in the second transmission signal printed wiring board layer corresponding to the position of the through hole for inserting the first transmission signal press-fit connector pin provided in the first transmission signal printed wiring board layer. A multilayer printed wiring board comprising a communication hole for preventing reflection of a transmission signal that is electrically disconnected from the first transmission signal press-fit connector pin. 第１の伝送信号用プリント配線基板層と第２の伝送信号用プリント配線基板層との間に絶縁層を介在させてなる多層プリント配線板であって、
上記第１の伝送信号用プリント配線基板層に設けられた第１、または第２の伝送信号用プレスフィットコネクタピンを挿入する複数のスルーホールと、
上記第１の伝送信号用プリント配線基板層に設けられた上記第２の伝送信号用プレスフィットコネクタピンを挿入するスルーホールの位置に対応して上記第２の伝送信号用プリント配線基板層に設けられた第２の伝送信号用スルーホールと、
上記第１の伝送信号用プリント配線基板層に設けられた上記第１の伝送信号用プレスフィットコネクタピンを挿入するスルーホールの位置に対応して上記第２の伝送信号用プリント配線基板層に設けられた上記第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴とを備えたことを特徴とする多層プリント配線板。A multilayer printed wiring board comprising an insulating layer interposed between a first transmission signal printed wiring board layer and a second transmission signal printed wiring board layer,
A plurality of through-holes for inserting the first or second transmission signal press-fit connector pins provided in the first transmission signal printed wiring board layer;
Provided in the second transmission signal printed wiring board layer corresponding to the position of the through hole for inserting the second transmission signal press-fit connector pin provided in the first transmission signal printed wiring board layer. A second transmission signal through-hole formed,
Provided in the second transmission signal printed wiring board layer corresponding to the position of the through hole for inserting the first transmission signal press-fit connector pin provided in the first transmission signal printed wiring board layer. A multilayer printed wiring board comprising a communication hole for preventing reflection of a transmission signal that is electrically disconnected from the first transmission signal press-fit connector pin. 第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴は、プレスフィットコネクタピンと電気的に接触しない程度に大きな径のスルーホールとしたことを特徴とする請求項１または請求項２記載の多層プリント配線板。The communication hole for preventing reflection of the transmission signal that is electrically disconnected from the first transmission signal press-fit connector pin provided in the second transmission signal printed wiring board layer is electrically connected to the press-fit connector pin. 3. The multilayer printed wiring board according to claim 1, wherein the through-hole has a diameter large enough not to come into contact with the multilayer printed wiring board. 第２の伝送信号用プリント配線基板層に設けられた第１の伝送信号用プレスフィットコネクタピンとは電気的に非接続の伝送信号の反射を防止するための連通穴には、該連通穴と電気的に接触しない程度に径を細くした第１の伝送信号用プレスフィットコネクタピンを圧入することを特徴とする請求項１または請求項２記載の多層プリント配線板。A communication hole for preventing reflection of a transmission signal electrically disconnected from the first transmission signal press-fit connector pin provided on the second transmission signal printed wiring board layer is provided in the communication hole and the electrical connection hole. 3. The multilayer printed wiring board according to claim 1, wherein the first transmission signal press-fit connector pin having a diameter reduced to such an extent that it does not come into contact is press-fitted. 第１の伝送信号用プリント配線基板層には、誘電率と誘電正接が低い樹脂を適用したことを特徴とする請求項１または請求項２記載の多層プリント配線板。  3. The multilayer printed wiring board according to claim 1, wherein a resin having a low dielectric constant and dielectric loss tangent is applied to the first transmission signal printed wiring board layer. 第１の伝送信号用プリント配線基板層は、ビルドアップ工法により形成したことを特徴とする請求項１または請求項２記載の多層プリント配線板。  3. The multilayer printed wiring board according to claim 1, wherein the first transmission signal printed wiring board layer is formed by a build-up method. 第１の伝送信号用プリント配線基板層は、第１の伝送信号用プリント配線基板間に絶縁層を設けたことを特徴とする請求項１または請求項２記載の多層プリント配線板。  3. The multilayer printed wiring board according to claim 1, wherein the first transmission signal printed wiring board layer is provided with an insulating layer between the first transmission signal printed wiring boards. 4.
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