JP2001102743A - Single-piece board surface - Google Patents

Single-piece board surface

Info

Publication number
JP2001102743A
JP2001102743A JP27760799A JP27760799A JP2001102743A JP 2001102743 A JP2001102743 A JP 2001102743A JP 27760799 A JP27760799 A JP 27760799A JP 27760799 A JP27760799 A JP 27760799A JP 2001102743 A JP2001102743 A JP 2001102743A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
intermediate layer
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27760799A
Other languages
Japanese (ja)
Inventor
Noriaki Kobayashi
憲明 小林
Shoji Watanabe
昭治 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP27760799A priority Critical patent/JP2001102743A/en
Publication of JP2001102743A publication Critical patent/JP2001102743A/en
Pending legal-status Critical Current

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  • Combinations Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a single-piece board surface of two printed boards having connection parts made thin which is suited to making an apparatus itself small in size. SOLUTION: Intermediate layers of printed boards 1, 2 are partly exposed, and the exposed parts of the intermediate layers are electrically connected to integrate the printed boards in one body.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、一枚基板化構造に
関し、特に、２個の多層プリント基板の導電パターンを
電気的に接続して積層一体化するのに有用である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single-substrate structure, and is particularly useful for electrically connecting conductive patterns of two multi-layered printed circuit boards for lamination and integration.

【０００２】[0002]

【従来の技術】従来の一枚基板化構造としては、特開平
７−１２２８５７号公報（以下「公報１」という。）や
特開平９−１４８７３２号公報（以下「公報２」とい
う。）等に記載の技術が知られている。公報１に記載の
一枚基板化構造は、第１のプリント基板の接続エリアに
第２のプリント基板の無電解メッキ後のスルーホール端
部を突き当てて通電溶接により電気的に接続し、層間は
接着シートにより接着し、第１と第２のプリント基板を
積層一体化するようになっている。2. Description of the Related Art Conventional single-substrate structures are disclosed in Japanese Patent Application Laid-Open No. 7-122857 (hereinafter referred to as "publication 1") and Japanese Patent Application Laid-Open No. 9-148732 (hereinafter referred to as "publication 2"). The described technique is known. The single-substrate structure described in Japanese Patent Application Laid-Open Publication No. 2000-133,086 is configured such that an end of a through hole after electroless plating of a second printed circuit board is brought into contact with a connection area of a first printed circuit board, and electrically connected by current welding to form an interlayer. Are bonded by an adhesive sheet, and the first and second printed circuit boards are laminated and integrated.

【０００３】公報２に記載の一枚基板化構造は、複数の
フレキシブルプリント基板の導体を互いに電気接続する
部分を位置合わせして、最上面（又は最下面）のプリン
ト基板を除いて該接続部分に貫通穴を設け、該貫通穴内
に半田を満たして最上面（又は最下面）の導体と各層の
導体を電気的に接続し、コネクタにより各フレキシブル
プリント基板同士を力学的に接続して積層一体化するよ
うになっている。[0003] In the single-substrate structure described in Japanese Patent Laid-Open Publication No. 2000-209, a portion of a plurality of flexible printed circuit boards that electrically connects conductors is aligned with each other, and the connection portion is removed except for the uppermost (or lowermost) printed circuit board. A through hole is provided in the through hole, the solder is filled in the through hole, the uppermost (or lowermost) conductor is electrically connected to the conductor of each layer, and the flexible printed circuit boards are mechanically connected to each other by a connector to be integrally laminated. It is becoming.

【０００４】[0004]

【発明が解決しようとする課題】しかし、上記従来の一
枚基板化構造では、いずれの公報の場合でも、プリント
基板同士を重ねて一体化するようにしているため、プリ
ント基板同士の接続部分では厚くなってしまう問題点が
ある。このため、１枚の基板よりも厚い接続部分がある
ために、装置自体が大きくなり小型化に適さない問題点
がある。However, in the above-described conventional single-substrate structure, the printed circuit boards are overlapped and integrated in any of the publications. There is a problem that it becomes thick. For this reason, there is a problem that the device itself becomes large and unsuitable for miniaturization because there is a connection portion thicker than one substrate.

【０００５】[0005]

【課題を解決するための手段】本発明は、導電性部材か
らなる接続パターンを配線する中間層を有するプリント
基板同士を一体化する一枚基板化構造において、プリン
ト基板に中間層を表出した中間層表出部を形成し、その
中間層表出部同士を電気的に接続することでプリント基
板同士を一体化することを構成上の特徴とする。SUMMARY OF THE INVENTION According to the present invention, an intermediate layer is exposed on a printed circuit board in a single-substrate structure in which printed circuit boards having an intermediate layer for wiring connection patterns made of conductive members are integrated. An intermediate layer exposed portion is formed, and the printed circuit boards are integrated by electrically connecting the intermediate layer exposed portions.

【０００６】なお、中間層表出部は、プリント基板の一
側部分に形成してもよい。この場合、一方のプリント基
板の中間層表出部は、一側部分を切り欠いて形成し、こ
の一方の中間層表出部と他方のプリント基板の中間層表
出部とを電気的に接続するのが好ましい。また、中間層
表出部は階段状に形成してもよく、一方のプリント基板
の中間層表出部は、一部をくり抜いて形成し、このくり
抜いた部分に他方のプリント基板を嵌め込んで、一方の
中間層表出部と他方のプリント基板の中間層表出部とを
電気的に接続するようにしてもよく、一方のプリント基
板の中間層表出部の近傍に穴を設け、一方のプリント基
板の中間層表出部と他方のプリント基板の中間層表出部
とを電気的に接続するとともに、一方のプリント基板に
形成した前記穴に他方のプリント基板の一部を嵌め込ん
でもよい。The exposed portion of the intermediate layer may be formed on one side of the printed circuit board. In this case, the exposed portion of the intermediate layer of one printed circuit board is formed by cutting out one side portion, and this one exposed portion of the intermediate layer is electrically connected to the exposed portion of the intermediate layer of the other printed circuit board. Is preferred. The exposed portion of the intermediate layer may be formed in a step-like manner, and the exposed portion of the intermediate layer of one printed circuit board is formed by partially hollowing out the other printed circuit board. Alternatively, the exposed portion of one intermediate layer and the exposed portion of the intermediate layer of the other printed circuit board may be electrically connected, and a hole is provided near the exposed portion of the intermediate layer of one printed circuit board. While electrically connecting the exposed portion of the intermediate layer of the printed circuit board and the exposed portion of the intermediate layer of the other printed circuit board, it is also possible to fit a part of the other printed circuit board into the hole formed in one printed circuit board. Good.

【０００７】さらに、各プリント基板同士の接続は、各
接続パターン同士を接続する導電性接着部材とするのが
好ましく、各プリント基板同士の接続は、各プリント基
板に形成した貫通孔とこの貫通孔に挿通するネジ部材と
で接続固定してもよい。この場合、接続パターンの形成
間隔に合わせた導電性の配線パターンを形成した弾性体
を各プリント基板同士の間に配置するのが好ましい。Further, the connection between the printed boards is preferably made of a conductive adhesive member for connecting the connection patterns, and the connection between the printed boards is made through the through holes formed in the printed boards and the through holes. And may be connected and fixed with a screw member inserted through. In this case, it is preferable to dispose an elastic body on which a conductive wiring pattern is formed in accordance with the formation interval of the connection pattern between the printed circuit boards.

【０００８】このため、プリント基板の中間層同士の接
続パターンを電気的に接続して積層一体化したため、プ
リント基板同士の接続部分の厚みが一枚のプリント基板
の厚みとほぼ等しく形成できる。したがって、装置自体
の小型化に適する。For this reason, since the connection patterns of the intermediate layers of the printed circuit boards are electrically connected and laminated and integrated, the thickness of the connection portion between the printed circuit boards can be substantially equal to the thickness of one printed circuit board. Therefore, it is suitable for miniaturization of the device itself.

【０００９】[0009]

【発明の実施の形態】以下、図面を参照して、本発明の
実施の形態を説明する。なお、これによりこの発明が限
定されるものではない。 第１の実施の形態 図１は、第１の実施の形態の一枚基板化構造の説明図で
あり、（１）に上面、（２）にＡ−Ｂ断面の状態を示
す。プリント基板１は、複数の接続パターン１ａを配線
する４層のパターン層１Ａ，１Ｂ，１Ｃ，１Ｄがそれぞ
れの間に絶縁層Ｘを挟んだ構造とする。また、プリント
基板２も同様に、複数の接続パターン１ａを配置する４
層のパターン層２Ａ，２Ｂ，２Ｃ，２Ｄがそれぞれの間
に絶縁層Ｙを挟んだ構造とする。Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the present invention is not limited by this. First Embodiment FIG. 1 is an explanatory view of a single-substrate structure according to a first embodiment, in which (1) shows an upper surface, and (2) shows a cross-sectional state along AB line. The printed board 1 has a structure in which an insulating layer X is interposed between four pattern layers 1A, 1B, 1C, 1D for wiring a plurality of connection patterns 1a. Similarly, the printed circuit board 2 is provided with a plurality of connection patterns 1a.
Each of the pattern layers 2A, 2B, 2C, and 2D has a structure in which an insulating layer Y is interposed therebetween.

【００１０】プリント基板１は、図中右端部分では、パ
ターン層１Ｃ，１Ｄが絶縁層Ｘを挟んだ構造が突出して
いる。プリント基板２は、図中左端部分では、パターン
層２Ａ，２Ｂが絶縁層Ｙを挟んだ構造が突出している。
そして、（２）ののように、プリント基板１のパター
ン層１Ｃとプリント基板２のパターン層２Ｂを対向させ
て、パターン層１Ｃとパターン層２Ｂのそれぞれに配線
した（１）に示した接続パターン１ａと接続パターン２
ａの間を１本ずつ導電性接着剤等の接着層Ｚで接続し、
プリント基板１，２同士を一体化している。The printed board 1 has a structure in which the pattern layers 1C and 1D sandwich the insulating layer X at the right end in the figure. The printed board 2 has a structure in which the pattern layers 2A and 2B sandwich the insulating layer Y at the left end in the drawing.
Then, as shown in (2), the pattern layer 1C of the printed board 1 and the pattern layer 2B of the printed board 2 are opposed to each other, and wiring is performed on each of the pattern layer 1C and the pattern layer 2B, as shown in (1). 1a and connection pattern 2
a are connected one by one with an adhesive layer Z such as a conductive adhesive,
The printed boards 1 and 2 are integrated.

【００１１】なお、プリント基板１のパターン層１Ｃと
プリント基板２のパターン層２Ｂの中間層を剥き出した
状態は、例えば、各プリント基板１，２の形成途中でマ
スキング等を施して形成すればよい。また、予め所望の
形状に加工した各パターン層を重ね合わせることによ
り、中間層の剥ぎ出し状態を形成し、各プリント基板
１，２を製造するようにしてもよい。The state in which the intermediate layer between the pattern layer 1C of the printed board 1 and the pattern layer 2B of the printed board 2 is exposed may be formed, for example, by performing masking or the like during the formation of the printed boards 1 and 2. . Alternatively, each of the printed circuit boards 1 and 2 may be manufactured by overlapping the respective pattern layers processed in a desired shape in advance to form a stripped state of the intermediate layer.

【００１２】上記第１の実施の形態によると、プリント
基板の厚さの半分で中間層を剥ぎ出してあり、プリント
基板同士の接続は、中間層のパターン同士を接着剤で接
着固定し、プリント基板同士の接続部分の厚みが一枚の
プリント基板の厚みとほぼ等しく形成できる効果が得ら
れる。 第２の実施の形態 図２は、第２の実施の形態の一枚基板化構造の説明図で
あり、（１）に上面、（２）にＡ−Ｂ断面の状態を示
す。プリント基板１は、複数の接続パターン１ａを配線
する４層のパターン層１Ａ，１Ｂ，１Ｃ，１Ｄがそれぞ
れの間に絶縁層Ｘを挟んだ構造とする。また、プリント
基板２も同様に、複数の接続パターン１ａを配置する４
層のパターン層２Ａ，２Ｂ，２Ｃ，２Ｄがそれぞれの間
に絶縁層Ｙを挟んだ構造とする。According to the first embodiment, the intermediate layer is stripped at half the thickness of the printed circuit board. The connection between the printed circuit boards is performed by fixing the patterns of the intermediate layer with an adhesive, The effect that the thickness of the connection portion between the substrates is almost equal to the thickness of one printed circuit board is obtained. Second Embodiment FIGS. 2A and 2B are explanatory views of a single-substrate structure according to a second embodiment, wherein FIG. 2A shows a state of an upper surface, and FIG. 2B shows a state of an AB cross section. The printed board 1 has a structure in which an insulating layer X is interposed between four pattern layers 1A, 1B, 1C, 1D for wiring a plurality of connection patterns 1a. Similarly, the printed circuit board 2 is provided with a plurality of connection patterns 1a.
Each of the pattern layers 2A, 2B, 2C, and 2D has a structure in which an insulating layer Y is interposed therebetween.

【００１３】プリント基板１は、図中右端部分では、パ
ターン層１Ｃ，１Ｄが絶縁層Ｘを挟んだ構造が表出する
ように切り欠いてある。プリント基板２は、図中左端部
分では、パターン層２Ａ，２Ｂが絶縁層Ｙを挟んだ構造
が突出している。そして、（２）ののように、プリン
ト基板１のパターン層１Ｃとプリント基板２のパターン
層２Ｂを対向させて、パターン層１Ｃとパターン層２Ｂ
のそれぞれに配線した（１）に示した接続パターン１ａ
と接続パターン２ａの間を１本ずつ導電性接着剤等の接
着層Ｚで接続し、プリント基板１，２同士を一体化して
いる。The printed circuit board 1 is notched at the right end in the drawing so that the structure in which the pattern layers 1C and 1D sandwich the insulating layer X is exposed. The printed board 2 has a structure in which the pattern layers 2A and 2B sandwich the insulating layer Y at the left end in the drawing. Then, as shown in (2), the pattern layer 1C of the printed circuit board 1 and the pattern layer 2B of the printed circuit board 2 face each other,
Connection pattern 1a shown in (1)
And the connection pattern 2a are connected one by one with an adhesive layer Z such as a conductive adhesive, and the printed boards 1 and 2 are integrated.

【００１４】なお、プリント基板１のパターン層１Ｃと
プリント基板２のパターン層２Ｂの中間層を剥き出した
状態は、例えば、各プリント基板１，２の形成途中でマ
スキング等を施して形成すればよい。また、予め所望の
形状に加工した各パターン層を重ね合わせることによ
り、中間層の剥ぎ出し状態を形成し、各プリント基板
１，２を製造するようにしてもよい。The state in which the intermediate layer between the pattern layer 1C of the printed circuit board 1 and the pattern layer 2B of the printed circuit board 2 is exposed may be formed, for example, by performing masking or the like during the formation of the printed circuit boards 1 and 2. . Alternatively, each of the printed circuit boards 1 and 2 may be manufactured by overlapping the respective pattern layers processed in a desired shape in advance to form a stripped state of the intermediate layer.

【００１５】上記第２の実施の形態によると、プリント
基板の厚さの半分で中間層を剥ぎ出してあり、一方のプ
リント基板を切り欠いて形成した中間層と他方のプリン
ト基板の中間層とを接着剤で接着固定したため、プリン
ト基板同士の接続部分の厚みが一枚のプリント基板の厚
みとほぼ等しく形成できる効果が得られる。 第３の実施の形態 図３は、第３の実施の形態の一枚基板化構造の説明図で
あり、（１）に上面、（２）にＡ−Ｂ断面の状態を示
す。プリント基板１は、複数の接続パターン１ａを配線
する４層のパターン層１Ａ，１Ｂ，１Ｃ，１Ｄがそれぞ
れの間に絶縁層Ｘを挟んだ構造とする。また、プリント
基板２も同様に、複数の接続パターン２ａを配置する４
層のパターン層２Ａ，２Ｂ，２Ｃ，２Ｄがそれぞれの間
に絶縁層Ｙを挟んだ構造とする。なお、３はラバーコネ
クタであり、接続パターン１ａ，２ａの形成間隔に合わ
せた導電性の配線パターン３ａを形成した弾性体からな
る。また、４はネジ部材であり、各プリント基板１，２
に形成した貫通孔１ｂ，２ｂに挿通され、各プリント基
板１，２を接続固定する。According to the second embodiment, the intermediate layer is stripped at half the thickness of the printed circuit board, and the intermediate layer formed by cutting out one printed circuit board and the intermediate layer of the other printed circuit board are separated. Is fixed with an adhesive, an effect that the thickness of the connection portion between the printed circuit boards can be formed substantially equal to the thickness of one printed circuit board is obtained. Third Embodiment FIGS. 3A and 3B are explanatory views of a single-substrate structure according to a third embodiment, wherein FIG. 3A shows a state of an upper surface, and FIG. The printed board 1 has a structure in which an insulating layer X is interposed between four pattern layers 1A, 1B, 1C, 1D for wiring a plurality of connection patterns 1a. Similarly, the printed circuit board 2 is provided with a plurality of connection patterns 2a.
Each of the pattern layers 2A, 2B, 2C, and 2D has a structure in which an insulating layer Y is interposed therebetween. Reference numeral 3 denotes a rubber connector, which is formed of an elastic body having a conductive wiring pattern 3a formed in accordance with the interval between the connection patterns 1a and 2a. Reference numeral 4 denotes a screw member.
The printed circuit boards 1 and 2 are connected and fixed by being inserted through the through holes 1b and 2b formed in the above.

【００１６】プリント基板１は、図中右端部分では、パ
ターン層１Ｄが突出している。プリント基板２は、図中
左端部分では、パターン層２Ａが突出している。そし
て、（２）ののように、プリント基板１のパターン層
１Ｄとプリント基板２のパターン層２Ａを対向させて、
パターン層１Ｄとパターン層２Ａのそれぞれに配線した
（１）に示した接続パターン１ａと接続パターン２ａの
間に１本ずつ配線パターン３ａを合わせてラバーコネク
タ３を配置し、ネジ部材４によって接続し、プリント基
板１，２同士を一体化している。The printed circuit board 1 has a pattern layer 1D protruding at the right end in the figure. The printed circuit board 2 has a pattern layer 2A protruding at the left end in the figure. Then, as shown in (2), the pattern layer 1D of the printed board 1 and the pattern layer 2A of the printed board 2 are opposed to each other.
The rubber connector 3 is arranged by connecting the wiring patterns 3a one by one between the connection pattern 1a and the connection pattern 2a shown in (1), which are wired to the pattern layer 1D and the pattern layer 2A, respectively. , The printed circuit boards 1 and 2 are integrated.

【００１７】なお、プリント基板１のパターン層１Ｄと
プリント基板２のパターン層２Ａの中間層を剥き出した
状態は、例えば、各プリント基板１，２の形成途中でマ
スキング等を施して形成すればよい。また、予め所望の
形状に加工した各パターン層を重ね合わせることによ
り、中間層の剥ぎ出し状態を形成し、各プリント基板
１，２を製造するようにしてもよい。The state in which the intermediate layer between the pattern layer 1D of the printed circuit board 1 and the pattern layer 2A of the printed circuit board 2 is exposed may be formed, for example, by performing masking or the like during the formation of the printed circuit boards 1 and 2. . Alternatively, each of the printed circuit boards 1 and 2 may be manufactured by overlapping the respective pattern layers processed in a desired shape in advance to form a stripped state of the intermediate layer.

【００１８】上記第３の実施の形態によると、プリント
基板の厚さの半分で中間層を剥ぎ出してあり、一方のプ
リント基板を切り欠いて形成した中間層と他方のプリン
ト基板の中間層との間にラバーコネクタを配置し、ネジ
部材で接続固定したため、プリント基板同士の接続部分
の厚みが一枚のプリント基板の厚みとほぼ等しく形成で
きる効果が得られる。According to the third embodiment, the intermediate layer is exposed at half the thickness of the printed circuit board, and the intermediate layer formed by cutting out one printed circuit board and the intermediate layer of the other printed circuit board are separated. Since the rubber connector is disposed between the printed circuit boards and connected and fixed with the screw member, an effect that the thickness of the connection portion between the printed circuit boards can be formed substantially equal to the thickness of one printed circuit board is obtained.

【００１９】第４の実施の形態 図４は、第４の実施の形態の一枚基板化構造の説明図で
あり、一体化前の斜視図を示す。プリント基板１は、上
記各実施の形態と同様に、複数の接続パターン１ａ等を
配線する６層のパターン層１Ａ，１Ｂ，１Ｃ，１Ｄ，１
Ｅ，１Ｆがそれぞれの間に絶縁層を挟んだ構造とする。
プリント基板２も同様に６層とするが説明を省略する。Fourth Embodiment FIG. 4 is an explanatory view of a single-substrate structure according to a fourth embodiment, and shows a perspective view before integration. The printed circuit board 1 has six pattern layers 1A, 1B, 1C, 1D, 1 for wiring a plurality of connection patterns 1a and the like, similarly to the above embodiments.
E and 1F have a structure in which an insulating layer is interposed therebetween.
Similarly, the printed circuit board 2 has six layers, but the description is omitted.

【００２０】プリント基板１は、図中右端部分では、パ
ターン層１Ｅとパターン層１Ｃが階段状に形成した構造
が突出している。プリント基板２も対称に階段状のパタ
ーン層が形成してあるが説明を省略する。そして、プリ
ント基板１のパターン層１Ｅ，１Ｃとプリント基板２の
階段状に形成したパターン層を対向させて、接続パター
ン１ａ等を１本ずつ導電性接着剤等の接着層で接続し、
プリント基板１，２同士を一体化する。The printed circuit board 1 has a structure in which a pattern layer 1E and a pattern layer 1C are formed in a step shape at the right end in the drawing. The printed circuit board 2 is also formed with a symmetrical step-shaped pattern layer, but the description is omitted. Then, the pattern layers 1E and 1C of the printed board 1 and the pattern layers formed in a stepwise shape of the printed board 2 are opposed to each other, and the connection patterns 1a and the like are connected one by one with an adhesive layer such as a conductive adhesive.
The printed boards 1 and 2 are integrated.

【００２１】なお、プリント基板１の中間層を剥き出し
た状態は、例えば、各プリント基板１，２の形成途中で
マスキング等を施して形成すればよい。また、予め所望
の形状に加工した各パターン層を重ね合わせることによ
り、中間層の剥ぎ出し状態を形成し、各プリント基板
１，２を製造するようにしてもよい。上記第４の実施の
形態によると、プリント基板の厚さの半分で各プリント
基板が重なるように中間層を階段状に剥ぎ出してあり、
プリント基板同士の接続は、中間層のパターン同士を接
着剤で接着固定し、プリント基板同士の接続部分の厚み
が一枚のプリント基板の厚みとほぼ等しく形成できる効
果が得られる。なお、階段状に中間層を表出したため、
一体化時のがたつきを防止することができる。The state in which the intermediate layer of the printed board 1 is exposed may be formed, for example, by performing masking or the like during the formation of each of the printed boards 1 and 2. Alternatively, each of the printed circuit boards 1 and 2 may be manufactured by overlapping the respective pattern layers processed in a desired shape in advance to form a stripped state of the intermediate layer. According to the fourth embodiment, the intermediate layer is peeled off in a stepwise manner so that each printed circuit board overlaps with half the thickness of the printed circuit board.
In the connection between the printed boards, an effect is obtained in which the patterns of the intermediate layers are bonded and fixed with an adhesive so that the thickness of the connection portion between the printed boards is substantially equal to the thickness of one printed board. In addition, because the middle layer was exposed stepwise,
It is possible to prevent rattling during integration.

【００２２】第５の実施の形態 図５は、第５の実施の形態の一枚基板化構造の説明図で
あり、（１）に上面、（２）にＡ−Ｂ断面の状態を示
す。プリント基板１は、複数の接続パターン１ａを配線
する４層のパターン層１Ａ，１Ｂ，１Ｃ，１Ｄがそれぞ
れの間に絶縁層Ｘを挟んだ構造とする。また、プリント
基板２も同様に、複数の接続パターン１ａを配置する４
層のパターン層２Ａ，２Ｂ，２Ｃ，２Ｄがそれぞれの間
に絶縁層Ｙを挟んだ構造とする。Fifth Embodiment FIGS. 5A and 5B are explanatory views of a single-substrate structure according to a fifth embodiment, wherein FIG. 5A shows the state of the upper surface, and FIG. The printed board 1 has a structure in which an insulating layer X is interposed between four pattern layers 1A, 1B, 1C, 1D for wiring a plurality of connection patterns 1a. Similarly, the printed circuit board 2 is provided with a plurality of connection patterns 1a.
Each of the pattern layers 2A, 2B, 2C, and 2D has a structure in which an insulating layer Y is interposed therebetween.

【００２３】プリント基板１は、図中中央部分では、パ
ターン層１Ｃ，１Ｄが絶縁層Ｘを挟んだ構造がドーナツ
状に形成され、中心は貫通している。プリント基板２
は、図中周縁部分では、パターン層２Ｂが表出した構造
をしている。そして、（２）ののように、プリント基
板１のパターン層１Ｃとプリント基板２のパターン層２
Ｂを対向させて、パターン層１Ｃとパターン層２Ｂのそ
れぞれに配線した（１）に示した接続パターン１ａと接
続パターン２ａの間を１本ずつ導電性接着剤等の接着層
Ｚで接続し、プリント基板１，２同士を一体化してい
る。In the printed circuit board 1, a structure in which the pattern layers 1C and 1D sandwich the insulating layer X is formed in a donut shape at the center portion in the figure, and the center is penetrated. Printed circuit board 2
Has a structure in which the pattern layer 2B is exposed at the peripheral portion in the figure. Then, as shown in (2), the pattern layer 1C of the printed board 1 and the pattern layer 2C of the printed board 2
B, the connection pattern 1a and the connection pattern 2a shown in (1), which are wired to the pattern layer 1C and the pattern layer 2B, respectively, are connected one by one with an adhesive layer Z such as a conductive adhesive. The printed boards 1 and 2 are integrated.

【００２４】なお、プリント基板１のパターン層１Ｃと
プリント基板２のパターン層２Ｂの中間層を剥き出した
状態は、例えば、各プリント基板１，２の形成途中でマ
スキング等を施して形成すればよい。また、予め所望の
形状に加工した各パターン層を重ね合わせることによ
り、中間層の剥ぎ出し状態を形成し、各プリント基板
１，２を製造するようにしてもよい。The state in which the intermediate layer between the pattern layer 1C of the printed circuit board 1 and the pattern layer 2B of the printed circuit board 2 is exposed may be formed, for example, by performing masking or the like during the formation of each of the printed circuits 1 and 2. . Alternatively, each of the printed circuit boards 1 and 2 may be manufactured by overlapping the respective pattern layers processed in a desired shape in advance to form a stripped state of the intermediate layer.

【００２５】上記第５の実施の形態によると、プリント
基板の厚さの半分で中間層を剥ぎ出してあり、プリント
基板同士の接続は、中間層のパターン同士を接着剤で接
着固定し、プリント基板同士の接続部分の厚みが一枚の
プリント基板の厚みとほぼ等しく形成できる効果が得ら
れる。また、一方のプリント基板の中央部に他方のプリ
ント基板を嵌め込むため、接続信頼性が高い効果が得ら
れる。According to the fifth embodiment, the intermediate layer is stripped at half the thickness of the printed circuit board. The connection between the printed circuit boards is performed by bonding and fixing the patterns of the intermediate layer with an adhesive. The effect that the thickness of the connection portion between the substrates is almost equal to the thickness of one printed circuit board is obtained. Further, since the other printed circuit board is fitted into the center of one printed circuit board, an effect of high connection reliability can be obtained.

【００２６】第６の実施の形態 図６は、第６の実施の形態の一枚基板化構造の説明図で
あり、（１）に上面、（２）にＡ−Ｂ断面の状態を示
す。プリント基板１は、複数の接続パターン１ａを配線
する４層のパターン層１Ａ，１Ｂ，１Ｃ，１Ｄがそれぞ
れの間に絶縁層Ｘを挟んだ構造とする。また、プリント
基板２も同様に、複数の接続パターン１ａを配置する４
層のパターン層２Ａ，２Ｂ，２Ｃ，２Ｄがそれぞれの間
に絶縁層Ｙを挟んだ構造とする。Sixth Embodiment FIGS. 6A and 6B are explanatory views of a single-substrate structure according to a sixth embodiment, wherein FIG. 6A shows an upper surface, and FIG. The printed board 1 has a structure in which an insulating layer X is interposed between four pattern layers 1A, 1B, 1C, 1D for wiring a plurality of connection patterns 1a. Similarly, the printed circuit board 2 is provided with a plurality of connection patterns 1a.
Each of the pattern layers 2A, 2B, 2C, and 2D has a structure in which an insulating layer Y is interposed therebetween.

【００２７】プリント基板１は、図中右端部分では、パ
ターン層１Ｃ，１Ｄが絶縁層Ｘを挟んだ構造が形成さ
れ、このパターン層２Ｃが表出した部分とプリント基板
１全体とで囲む部分に穴１ｃを設けてある。プリント基
板２は、図中左端部分では、パターン層２Ａ，２Ｂが絶
縁層Ｙを挟んだ構造が突出し、その先端に絶縁層Ｙ２が
形成してある。そして、（２）ののように、プリント
基板１のパターン層１Ｃとプリント基板２のパターン層
２Ｂを対向させて、パターン層１Ｃとパターン層２Ｂの
それぞれに配線した（１）に示した接続パターン１ａと
接続パターン２ａの間を１本ずつ導電性接着剤等の接着
層Ｚで接続するとともに、穴１ｃに絶縁層Ｙ２を挿通し
て、プリント基板１，２同士を一体化している。The printed board 1 has a structure in which the pattern layers 1C and 1D sandwich the insulating layer X at the right end in the figure. A hole 1c is provided. The printed board 2 has a structure in which the pattern layers 2A and 2B sandwich the insulating layer Y protrude at the left end portion in the figure, and the insulating layer Y2 is formed at the tip. Then, as shown in (2), the pattern layer 1C of the printed board 1 and the pattern layer 2B of the printed board 2 are opposed to each other, and wiring is performed on each of the pattern layer 1C and the pattern layer 2B, as shown in (1). 1a and the connection pattern 2a are connected one by one with an adhesive layer Z such as a conductive adhesive, and the insulating layer Y2 is inserted into the hole 1c to integrate the printed boards 1 and 2 with each other.

【００２８】なお、プリント基板１のパターン層１Ｃと
プリント基板２のパターン層２Ｂの中間層を剥き出した
状態は、例えば、各プリント基板１，２の形成途中でマ
スキング等を施して形成すればよい。また、予め所望の
形状に加工した各パターン層を重ね合わせることによ
り、中間層の剥ぎ出し状態を形成し、各プリント基板
１，２を製造するようにしてもよい。The state in which the intermediate layer between the pattern layer 1C of the printed board 1 and the pattern layer 2B of the printed board 2 is exposed may be formed, for example, by performing masking or the like during the formation of the printed boards 1 and 2. . Alternatively, each of the printed circuit boards 1 and 2 may be manufactured by overlapping the respective pattern layers processed in a desired shape in advance to form a stripped state of the intermediate layer.

【００２９】上記第６の実施の形態によると、プリント
基板の厚さの半分で中間層を剥ぎ出してあり、プリント
基板同士の接続は、中間層のパターン同士を接着剤で接
着固定し、プリント基板同士の接続部分の厚みが一枚の
プリント基板の厚みとほぼ等しく形成できる効果が得ら
れる。また、一方のプリント基板に形成した穴に他方の
プリント基板の一部を鍵状に引っかけるようにしたた
め、接続パターンでの加重負担を軽減することができ
る。According to the sixth embodiment, the intermediate layer is stripped at half the thickness of the printed circuit board, and the connection between the printed circuit boards is performed by fixing the patterns of the intermediate layer with an adhesive and printing. The effect that the thickness of the connection portion between the substrates is almost equal to the thickness of one printed circuit board is obtained. Also, since a part of the other printed circuit board is hooked in a hole in one of the printed circuit boards in a key shape, the load on the connection pattern can be reduced.

【００３０】[0030]

【発明の効果】以上説明したように本発明の一枚基板化
構造によると、プリント基板の中間層同士の接続パター
ンを電気的に接続して積層一体化したため、従来のよう
に単に重ねて一体化した場合に比べて、プリント基板同
士の接続部分は薄くなり、特に、プリント基板の厚さの
半分で剥ぎ出した場合には、プリント基板同士の接続部
分の厚みが一枚のプリント基板の厚みとほぼ等しく形成
できる効果が得られる。したがって、装置自体の小型化
にも期待できるため、コスト的・高密度的実装を行うこ
とが期待できる。As described above, according to the single-substrate structure of the present invention, the connection patterns of the intermediate layers of the printed circuit board are electrically connected and laminated and integrated. The connection between the printed circuit boards is thinner than the case where the printed circuit board is thinned, especially when the printed circuit board is stripped at half the thickness of the printed circuit board. An effect that can be formed substantially equal to the above is obtained. Therefore, the device itself can be expected to be reduced in size, so that cost and high-density mounting can be expected.

【図面の簡単な説明】[Brief description of the drawings]

【図１】第１の実施の形態の一枚基板化構造の説明図FIG. 1 is an explanatory diagram of a single-substrate structure according to a first embodiment;

【図２】第２の実施の形態の一枚基板化構造の説明図FIG. 2 is an explanatory diagram of a single-substrate structure according to a second embodiment;

【図３】第３の実施の形態の一枚基板化構造の説明図FIG. 3 is an explanatory diagram of a single-substrate structure according to a third embodiment;

【図４】第４の実施の形態の一枚基板化構造の説明図FIG. 4 is an explanatory diagram of a single-substrate structure according to a fourth embodiment;

【図５】第５の実施の形態の一枚基板化構造の説明図FIG. 5 is an explanatory diagram of a single-substrate structure according to a fifth embodiment;

【図６】第６の実施の形態の一枚基板化構造の説明図FIG. 6 is an explanatory diagram of a single-substrate structure according to a sixth embodiment;

【符号の説明】[Explanation of symbols]

１，２ プリント基板 1,2 printed circuit board

Claims (9)

【特許請求の範囲】[Claims] 【請求項１】 導電性部材からなる接続パターンを配線
する中間層を有するプリント基板同士を一体化する一枚
基板化構造において、 プリント基板に中間層を表出した中間層表出部を形成
し、その中間層表出部同士を電気的に接続することでプ
リント基板同士を一体化することを特徴とする一枚基板
化構造。In a single-substrate structure in which printed boards having an intermediate layer for wiring a connection pattern made of a conductive member are integrated, an exposed part of the intermediate layer is formed on the printed board. And a printed circuit board integrated by electrically connecting the exposed portions of the intermediate layer. 【請求項２】 請求項１において、中間層表出部は、プ
リント基板の一側部分に形成したことを特徴とする一枚
基板化構造。2. The single-substrate structure according to claim 1, wherein the exposed portion of the intermediate layer is formed on one side of the printed circuit board. 【請求項３】 請求項２において、一方のプリント基板
の中間層表出部は、一側部分を切り欠いて形成し、この
一方の中間層表出部と他方のプリント基板の中間層表出
部とを電気的に接続するようにしたことを特徴とする一
枚基板化構造。3. The printed circuit board according to claim 2, wherein the exposed portion of the intermediate layer of one of the printed circuit boards is formed by cutting out one side portion, and the exposed portion of the intermediate layer of the one printed circuit board and the exposed portion of the intermediate layer of the other printed circuit board are formed. A single-substrate structure, wherein the parts are electrically connected to each other. 【請求項４】 請求項１、請求項２又は請求項３におい
て、中間層表出部は階段状に形成したことを特徴とする
一枚基板化構造。4. The single-substrate structure according to claim 1, wherein the exposed portion of the intermediate layer is formed in a step shape. 【請求項５】 請求項１において、一方のプリント基板
の中間層表出部は、一部をくり抜いて形成し、このくり
抜いた部分に他方のプリント基板を嵌め込んで、一方の
中間層表出部と他方のプリント基板の中間層表出部とを
電気的に接続するようにしたことを特徴とする一枚基板
化構造。5. The intermediate layer exposed portion of one printed circuit board according to claim 1, wherein the exposed portion of the intermediate layer of one printed circuit board is formed by partially hollowing out, and the other printed circuit board is fitted into the hollowed portion. A single-substrate structure, wherein the portion and the exposed portion of the intermediate layer of the other printed circuit board are electrically connected. 【請求項６】 請求項１、請求項２又は請求項３におい
て、一方のプリント基板の中間層表出部の近傍に穴を設
け、一方のプリント基板の中間層表出部と他方のプリン
ト基板の中間層表出部とを電気的に接続するとともに、
一方のプリント基板に形成した前記穴に他方のプリント
基板の一部を嵌め込むことを特徴とする一枚基板化構
造。6. The printed circuit board according to claim 1, wherein a hole is provided in the vicinity of the exposed portion of the intermediate layer of one of the printed circuit boards, and the exposed portion of the intermediate layer of the one printed circuit board and the other printed circuit board are provided. While electrically connecting the exposed part of the intermediate layer,
A single board structure, wherein a part of the other printed board is fitted into the hole formed in one printed board. 【請求項７】 請求項１から請求項６のいずれかにおい
て、各プリント基板同士の接続は、各接続パターン同士
を接続する導電性接着部材とすることを特徴とする一枚
基板化構造。7. The single-substrate structure according to claim 1, wherein the connection between the printed boards is made of a conductive adhesive member that connects the connection patterns. 【請求項８】 請求項１から請求項６のいずれかにおい
て、各プリント基板同士の接続は、各プリント基板に形
成した貫通孔とこの貫通孔に挿通するネジ部材とで接続
固定することを特徴とする一枚基板化構造。8. The printed circuit board according to claim 1, wherein the connection between the printed boards is fixed by a through hole formed in each printed board and a screw member inserted into the through hole. Single substrate structure. 【請求項９】 請求項８において、接続パターンの形成
間隔に合わせた導電性の配線パターンを形成した弾性体
を各プリント基板同士の間に配置したことを特徴とする
一枚基板化構造。9. The single-substrate structure according to claim 8, wherein an elastic body having a conductive wiring pattern formed in accordance with a formation interval of the connection pattern is arranged between the printed boards.
JP27760799A 1999-09-29 1999-09-29 Single-piece board surface Pending JP2001102743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27760799A JP2001102743A (en) 1999-09-29 1999-09-29 Single-piece board surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27760799A JP2001102743A (en) 1999-09-29 1999-09-29 Single-piece board surface

Publications (1)

Publication Number Publication Date
JP2001102743A true JP2001102743A (en) 2001-04-13

Family

ID=17585790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27760799A Pending JP2001102743A (en) 1999-09-29 1999-09-29 Single-piece board surface

Country Status (1)

Country Link
JP (1) JP2001102743A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358421A (en) * 2000-06-12 2001-12-26 Matsushita Electric Ind Co Ltd Bonding structure of printed wiring board
JPWO2004066691A1 (en) * 2003-01-22 2006-05-18 日本電気株式会社 Circuit board device and wiring board connection method
JP2009027034A (en) * 2007-07-20 2009-02-05 Nitto Denko Corp Wiring circuit board and connection structure thereof
CN102781176A (en) * 2011-05-10 2012-11-14 深圳光启高等理工研究院 Splicing method of circuit board and splicing circuit board
DE102014111619A1 (en) * 2014-08-14 2016-02-18 FELA GmbH Conductor rail for electrical components, in particular for lighting devices, system of busbars for electrical components, in particular for lighting devices, and method for producing a busbar for electrical components, in particular for lighting devices
WO2016072338A1 (en) * 2014-11-04 2016-05-12 株式会社村田製作所 Transmission line cable
CN105682362A (en) * 2016-03-31 2016-06-15 上海中航光电子有限公司 Flexible circuit board and displayer thereof
US20190229390A1 (en) * 2016-12-01 2019-07-25 Murata Manufacturing Co., Ltd. Multilayer substrate connecting body and transmission line device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358421A (en) * 2000-06-12 2001-12-26 Matsushita Electric Ind Co Ltd Bonding structure of printed wiring board
JPWO2004066691A1 (en) * 2003-01-22 2006-05-18 日本電気株式会社 Circuit board device and wiring board connection method
JP4584144B2 (en) * 2003-01-22 2010-11-17 日本電気株式会社 Circuit board device and wiring board connection method
JP2009027034A (en) * 2007-07-20 2009-02-05 Nitto Denko Corp Wiring circuit board and connection structure thereof
CN102781176A (en) * 2011-05-10 2012-11-14 深圳光启高等理工研究院 Splicing method of circuit board and splicing circuit board
DE102014111619B4 (en) * 2014-08-14 2016-07-28 FELA GmbH Conductor rail for electrical components, in particular for lighting devices, system of busbars for electrical components, in particular for lighting devices, and method for producing a busbar for electrical components, in particular for lighting devices
DE102014111619A1 (en) * 2014-08-14 2016-02-18 FELA GmbH Conductor rail for electrical components, in particular for lighting devices, system of busbars for electrical components, in particular for lighting devices, and method for producing a busbar for electrical components, in particular for lighting devices
WO2016072338A1 (en) * 2014-11-04 2016-05-12 株式会社村田製作所 Transmission line cable
JPWO2016072338A1 (en) * 2014-11-04 2017-06-01 株式会社村田製作所 Transmission line cable
US10153534B2 (en) 2014-11-04 2018-12-11 Murata Manufacturing Co., Ltd. Transmission line cable
CN105682362A (en) * 2016-03-31 2016-06-15 上海中航光电子有限公司 Flexible circuit board and displayer thereof
US20190229390A1 (en) * 2016-12-01 2019-07-25 Murata Manufacturing Co., Ltd. Multilayer substrate connecting body and transmission line device
US11056756B2 (en) * 2016-12-01 2021-07-06 Murata Manufacturing Co., Ltd. Multilayer substrate connecting body and transmission line device

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