JPH04334879A - High density connection - Google Patents
High density connectionInfo
- Publication number
- JPH04334879A JPH04334879A JP3105424A JP10542491A JPH04334879A JP H04334879 A JPH04334879 A JP H04334879A JP 3105424 A JP3105424 A JP 3105424A JP 10542491 A JP10542491 A JP 10542491A JP H04334879 A JPH04334879 A JP H04334879A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- press
- pin
- fit
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電気回路基板と電気回
路基板との高密度接続方法に関し、特にコネクタに用い
る接続ピンとボードのスルーホールに関するものである
。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of high-density connection between electrical circuit boards, and more particularly to connection pins and through-holes of boards used in connectors.
【０００２】0002
【従来の技術】電気回路基板間の接続方法の一つに、高
密度コネクタを用いてマザーボードを介して複数のドー
タボードを接続する方法がある。この場合マザーボード
側のコネクタにプレスフィットピンを用いてボードのス
ルーホールとピンを接続する方法がある。図２に一般的
なプレスフィットピンの形状と断面を示す。このピン１
０としては通常リン青銅を下地に表面に適当な厚みに金
をメッキしたものを用いる。図４は一般的なスルーホー
ルの形状を示した図で図４（ａ）は透視図、図４（ｂ）
は断面図である。スルーホールは通常適当な厚みの銅メ
ッキ１６の上にハンダメッキ１５を行なう。このスルー
ホールに図２に示した接続ピンを圧入（プレスフィット
）し機械的・電気的接続を得る。2. Description of the Related Art One method for connecting electrical circuit boards is to connect a plurality of daughter boards via a motherboard using high-density connectors. In this case, there is a method of using press-fit pins on the connector on the motherboard side to connect the pins to the through holes on the board. Figure 2 shows the shape and cross section of a typical press-fit pin. This pin 1
0 is usually made of phosphor bronze with the surface plated with gold to an appropriate thickness. Figure 4 is a diagram showing the shape of a general through hole, with Figure 4(a) being a perspective view and Figure 4(b) being a perspective view.
is a sectional view. Through holes are usually formed by solder plating 15 on copper plating 16 of a suitable thickness. The connection pin shown in FIG. 2 is press-fitted into this through hole to obtain mechanical and electrical connection.
【０００３】0003
【発明が解決しようとする課題】しかしながら、ドータ
ボードとマザーボードの接続信号数が増えると使用する
ピン数が増加するため、必然的にボードの接続辺の辺長
が大きくなってしまう。また、マザーボード側のスルー
ホールも増加するため、配線層での配線密度の低下を引
き起こしてしまう。[Problems to be Solved by the Invention] However, as the number of connection signals between the daughter board and the motherboard increases, the number of pins used also increases, which inevitably increases the length of the connection side of the board. Furthermore, since the number of through holes on the motherboard side increases, the wiring density in the wiring layer decreases.
【０００４】本発明は、かかる問題点に鑑み、電気回路
基板での実装面積および実装効率を低下させることなく
、高密度な高速信号伝送路を実現するものである。In view of the above problems, the present invention realizes a high-density, high-speed signal transmission path without reducing the mounting area and mounting efficiency on an electric circuit board.
【０００５】[0005]
【課題を解決するための手段】本発明の高密度接続方法
は、第１の絶縁体により互いに絶縁され、前記第１の絶
縁体の表面に形成された複数の接触接続面を持つプレス
フィット接続ピンと、第２の絶縁体により互いに絶縁さ
れ前記プレスフィット接続ピンの前記各接続面に接続さ
れる複数の接触接続面を持つスルーホールにより接続を
行なうことを特徴とする。[Means for Solving the Problems] A high-density connection method of the present invention provides a press-fit connection that is insulated from each other by a first insulator and has a plurality of contact connection surfaces formed on the surface of the first insulator. The connection is made by a pin and a through hole having a plurality of contact connection surfaces that are insulated from each other by a second insulator and connected to each of the connection surfaces of the press-fit connection pin.
【０００６】本発明の高密度接続方法は、上記プレスフ
ィット接続ピンと前記プレスフィット接続ピンの前記各
接続面と嵌合する互いに絶縁された複数の接続コンタク
トを持つ雌型嵌合部により接続を行なうことを特徴とす
る。[0006] The high-density connection method of the present invention performs connection by using the press-fit connection pin and a female fitting portion having a plurality of mutually insulated connection contacts that fit with each of the connection surfaces of the press-fit connection pin. It is characterized by
【０００７】[0007]
【作用】本発明のプレスフィット接続ピンは、表面に複
数の接続面を持つため、一本のピンで同時に複数の信号
を伝えることができるため、本発明のスルーホールと接
続させることにより、一つのスルーホールで同時に複数
の基板パターンをピンに伝えることができる。さらに本
発明の複数の接続コンタクトを持つ雌型嵌合部と組み合
わせることにより、回路基板と回路基板を高密度に接続
することが可能になる。[Function] The press-fit connection pin of the present invention has multiple connection surfaces on its surface, so one pin can transmit multiple signals at the same time. Multiple board patterns can be transmitted to the pins at the same time using one through hole. Further, by combining the present invention with a female fitting portion having a plurality of connection contacts, it becomes possible to connect circuit boards with high density.
【０００８】[0008]
【実施例】本発明による一実施例を図を用いて詳細に説
明する。図１は本発明のプレスフィット接続ピンを示す
。図１（ａ）は側面、図１（ｂ）は断面を示す。ピン全
体は、セラミック絶縁体２により構成され、その周辺に
（本実施例では４か所）接続端子１を設けている。この
端子１としては、通常下地としてりん青銅やベリリウム
銅がもちいられ、表面処理としてニッケルやスズ・鉛・
金等がメッキされる。ピン中央部はプレスフィットによ
り回路基板のスルーホールと接合される部分である。ま
た、ピン上部は雌型嵌合部と接合する部分であり、４か
所の接続端子はそれぞれ連続的に形成されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a press-fit connecting pin of the invention. FIG. 1(a) shows a side view, and FIG. 1(b) shows a cross section. The entire pin is made of a ceramic insulator 2, and connection terminals 1 are provided around it (at four locations in this embodiment). For this terminal 1, phosphor bronze or beryllium copper is usually used as the base, and nickel, tin, lead, etc. are used as the surface treatment.
It is plated with gold etc. The center part of the pin is the part that is connected to the through hole of the circuit board by press fit. Further, the upper part of the pin is a part to be joined to the female fitting part, and connection terminals at four locations are each formed continuously.
【０００９】図３は本発明のスルーホールを示した図で
あり、図３（ａ）は透視図、図３（ｂ）は断面図である
。
本実施例では４つの接続面３を示している。各接続面は
、通常銅メッキを下地としてハンダメッキされる。本発
明では、これらの各接続面３をセラミック絶縁体４によ
り絶縁させることにより、各接続面３を独立に使用する
ことができる。したがって、本発明の図１に示すプレス
フィット接続ピンと、図５に示すように接合させること
により、一つのスルーホール、接続ピンにより同時に４
つの信号を伝えることができる。FIG. 3 is a diagram showing a through hole of the present invention, with FIG. 3(a) being a perspective view and FIG. 3(b) being a sectional view. In this embodiment, four connection surfaces 3 are shown. Each connection surface is usually solder plated with copper plating as the base. In the present invention, by insulating each of these connection surfaces 3 with a ceramic insulator 4, each connection surface 3 can be used independently. Therefore, by joining the press-fit connection pin shown in FIG. 1 of the present invention as shown in FIG.
can transmit two signals.
【００１０】図６は本発明によるコネクタの雌型嵌合部
を示す。コネクタの雌型嵌合部７は４つの接続端子５を
持ちセラミック６により機械的に保持され、また電気的
に絶縁されている。この雌型嵌合部７は、本発明の接続
ピンの上部と接合することにより、一組の結合コネクタ
を成すものである。これにより一組のコネクションで同
時に４つの信号を伝えることができる。FIG. 6 shows a female mating portion of a connector according to the invention. The female fitting part 7 of the connector has four connection terminals 5, is mechanically held by a ceramic 6, and is electrically insulated. This female fitting part 7 constitutes a pair of coupling connectors by joining with the upper part of the connecting pin of the present invention. This allows four signals to be transmitted simultaneously through one set of connections.
【００１１】以上述べたように、本発明のプレスフィッ
ト接続ピン、スルーホール、雌型嵌合部を用いたコネク
ションを実現することにより、一組の機械的接続で同時
に複数の電気的接続を行なうことができる。したがって
、ドータボードとマザーボードを用いたバックプレーン
システムを構成する場合、本発明の接続方法により、非
常に高密度なコネクションを実現することが可能となる
。As described above, by realizing a connection using the press-fit connection pin, through hole, and female fitting part of the present invention, a plurality of electrical connections can be made simultaneously with one set of mechanical connections. be able to. Therefore, when configuring a backplane system using a daughter board and a motherboard, the connection method of the present invention makes it possible to realize extremely high-density connections.
【００１２】なお、本実施例では、スルーホールとして
両面配線基板の例を示したが、さらに複数の配線層から
なる多層板の場合にも非常に有効である。In this embodiment, a double-sided wiring board is used as the through hole, but it is also very effective in the case of a multilayer board consisting of a plurality of wiring layers.
【００１３】[0013]
【発明の効果】本発明による高密度接続方法は、プレス
フィット接続ピン、基板スルーホール、雌型嵌合部それ
ぞれにセラミック等による絶縁により、複数の接続端子
を形成している。このため、これらを組み合わせた一組
のコネクションにより複数の信号を同時に伝えることが
できる。したがって回路基板間の接続に、本発明による
コネクタを用いることにより高密度な基板間接続を行な
うことができる。以上のように、本発明による基板間接
続方法は、非常に高密度な基板間接続を行なうことがで
きるため、コンピュータシステム、特に非常に高密度な
ネットワーク配線を持つ、並列コンピュータシステムに
おいて、非常に効率の良い基板間接続を行なうことがで
きる。[Effects of the Invention] In the high-density connection method according to the present invention, a plurality of connection terminals are formed in each of the press-fit connection pins, substrate through-holes, and female fitting portions by insulating them with ceramic or the like. Therefore, a plurality of signals can be transmitted simultaneously through a set of connections that are a combination of these. Therefore, by using the connector according to the present invention for connection between circuit boards, it is possible to perform high-density connection between boards. As described above, the board-to-board connection method according to the present invention can perform very high-density board-to-board connections, so it is very useful in computer systems, especially in parallel computer systems with very high-density network wiring. It is possible to perform efficient board-to-board connections.
【図１】（ａ）は本発明のプレスフィット接続ピンを示
す正面図である。
（ｂ）は本発明のプレスフィット接続ピンを示す断面図
である。FIG. 1(a) is a front view showing a press-fit connection pin of the present invention. (b) is a sectional view showing a press-fit connection pin of the present invention.
【図２】（ａ）は従来のプレスフィット接続ピンを示す
正面図である。
（ｂ）は従来のプレスフィット接続ピンを示す断面図で
ある。FIG. 2(a) is a front view showing a conventional press-fit connection pin. (b) is a sectional view showing a conventional press-fit connection pin.
【図３】（ａ）は本発明のスルーホールの構造図である
。
（ｂ）は本発明のスルーホールの断面図である。FIG. 3(a) is a structural diagram of a through hole of the present invention. (b) is a sectional view of the through hole of the present invention.
【図４】（ａ）は従来のスルーホールの構造図である。 （ｂ）は従来のスルーホールの断面図である。FIG. 4(a) is a structural diagram of a conventional through hole. (b) is a sectional view of a conventional through hole.
【図５】本発明のプレスフィット接続ピンとスルーホー
ルの結合図である。FIG. 5 is a diagram of a press-fit connection pin and a through hole of the present invention;
【図６】本発明のコネクタの雌型嵌合部を示す構造図で
ある。FIG. 6 is a structural diagram showing a female fitting portion of the connector of the present invention.
１ プレスフィットピンの接続端子 ２，４，６ セラミック絶縁体 ３ スルーホールの接続端子 ５ 接続端子 ７ コネクタアウタースリーブ 1 Press fit pin connection terminal 2, 4, 6 Ceramic insulator 3 Through-hole connection terminal 5 Connection terminal 7 Connector outer sleeve
Claims (2)
前記第１の絶縁体の表面に形成された複数の接触接続面
を持つプレスフィット接続ピンと、第２の絶縁体により
互いに絶縁され前記プレスフィット接続ピンの前記各接
続面に接続される複数の接触接続面を持つスルーホール
により接続を行なうことを特徴とする高密度接続方法。1. Insulated from each other by a first insulator,
a press-fit connection pin having a plurality of contact connection surfaces formed on the surface of the first insulator; and a plurality of contacts insulated from each other by a second insulator and connected to each of the connection surfaces of the press-fit connection pin. A high-density connection method characterized by connecting through holes with connection surfaces.
ピンとプレスフィット接続ピンの前記各接続面と嵌合す
る互いに絶縁された複数の接続コンタクトを持つ雌型嵌
合部により接続を行なうことを特徴とする高密度接続方
法。2. The press-fit connection pin according to claim 1 is connected to the press-fit connection pin by a female fitting portion having a plurality of mutually insulated connection contacts that fit with each of the connection surfaces of the press-fit connection pin. High-density connection method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3105424A JPH04334879A (en) | 1991-05-10 | 1991-05-10 | High density connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3105424A JPH04334879A (en) | 1991-05-10 | 1991-05-10 | High density connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04334879A true JPH04334879A (en) | 1992-11-20 |
Family
ID=14407221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3105424A Pending JPH04334879A (en) | 1991-05-10 | 1991-05-10 | High density connection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04334879A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100647226B1 (en) * | 2005-05-31 | 2006-11-23 | 정락환 | Connector pin for printed circuit board |
| JP2011114158A (en) * | 2009-11-26 | 2011-06-09 | Sumitomo Wiring Syst Ltd | Printed-wiring board laminate and method of manufacturing the same |
-
1991
- 1991-05-10 JP JP3105424A patent/JPH04334879A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100647226B1 (en) * | 2005-05-31 | 2006-11-23 | 정락환 | Connector pin for printed circuit board |
| JP2011114158A (en) * | 2009-11-26 | 2011-06-09 | Sumitomo Wiring Syst Ltd | Printed-wiring board laminate and method of manufacturing the same |
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