JP3434801B2 - Method for manufacturing beveling wheel for processing peripheral portion of silicon wafer - Google Patents
Method for manufacturing beveling wheel for processing peripheral portion of silicon waferInfo
- Publication number
- JP3434801B2 JP3434801B2 JP2001031366A JP2001031366A JP3434801B2 JP 3434801 B2 JP3434801 B2 JP 3434801B2 JP 2001031366 A JP2001031366 A JP 2001031366A JP 2001031366 A JP2001031366 A JP 2001031366A JP 3434801 B2 JP3434801 B2 JP 3434801B2
- Authority
- JP
- Japan
- Prior art keywords
- grain layer
- abrasive grain
- base metal
- wheel
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、シリコンウエハの
外周部を加工するためのベベリングホイールおよびその
製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a beveling wheel for processing an outer peripheral portion of a silicon wafer and a method for manufacturing the beveling wheel.
【0002】[0002]
【従来の技術】シリコンウエハの加工工程は、シリコン
インゴットを外周刃ブレードやカップ型ホイールなどで
所定寸法の円柱状のインゴットに成形し、この円柱状イ
ンゴットを内周刃ブレードで所定の厚さにスライスして
ウエハとし、このウエハの外周部をベベリングホイール
で面取り研削し、その後にウエハ面をラッピング、エッ
チング、ポリッシングして集積回路のサブスレートを完
成させる、というのが基本的な工程である。2. Description of the Related Art In the process of processing a silicon wafer, a silicon ingot is formed into a cylindrical ingot of a predetermined size with an outer peripheral blade or a cup type wheel, and this cylindrical ingot is formed into a predetermined thickness with an inner peripheral blade. The basic process is to slice the wafer into wafers, chamfer the periphery of the wafer with a beveling wheel, and then lap, etch, and polish the wafer surface to complete the integrated circuit substrate. .
【0003】上記の加工工程のなかで、ウエハの外周部
をベベリングホイールで面取り研削する加工は、図3お
よび図4に示すようなベベリングホイールを使用し、図
5に示すようにして研削加工が行われる。In the above-mentioned processing steps, the beveling wheel for the outer peripheral portion of the wafer is chamfered and ground by using a beveling wheel as shown in FIGS. 3 and 4, and as shown in FIG. Processing is performed.
【0004】図3の(a)はベベリングホイールの外観
の一例を示す斜視図であり、(b)は外周部の部分拡大
図である。ホイール100には、台金101の外周部に
1条または複数条の溝を形成した砥粒層102が固着さ
れている(図3は複数条の溝の例を示す)。台金101
は鉄製の円盤状台金であり、砥粒層102はダイヤモン
ド砥粒とメタルボンドからなる砥粒層である。FIG. 3A is a perspective view showing an example of the appearance of the beveling wheel, and FIG. 3B is a partially enlarged view of the outer peripheral portion. An abrasive grain layer 102 having one or a plurality of grooves formed on the outer periphery of a base metal 101 is fixed to the wheel 100 (FIG. 3 shows an example of a plurality of grooves). Base metal 101
Is an iron disc-shaped base metal, and the abrasive grain layer 102 is an abrasive grain layer composed of diamond abrasive grains and metal bonds.
【0005】図4はベベリングホイールの砥粒層の溝形
状の例を示す図で、(a)は1条の溝103aを形成し
た例、(b)は粗加工用の溝103bと仕上げ加工用の
溝103cをそれぞれ複数条形成した例、(c)は同じ
溝103dを複数条形成した例を示す。FIG. 4 is a diagram showing an example of the groove shape of the abrasive grain layer of the beveling wheel. (A) is an example in which one groove 103a is formed, (b) is a groove 103b for roughing and finishing. An example in which a plurality of grooves 103c are formed respectively, and (c) shows an example in which a plurality of the same grooves 103d are formed.
【0006】図5の(a)はシリコンウエハ外周部の研
削加工方法の一例を示す図で、(b)は加工後のシリコ
ンウエハの外周部形状を示す図である。シリコンウエハ
の加工工程において、ウエハが切断されたままの状態で
は外周部端面のエッジ部が尖っており、各加工工程での
取り扱い作業時に欠けが発生しやすく、この欠けたチッ
プによりウエハ面が汚れたり傷やクラックなどが発生し
たりして、半導体装置の歩留まり低下を招くことにな
る。このため、ウエハの外周部端面のエッジ部を削り取
るベベリング加工が施される。このベベリング加工は、
図5の(a)に示すように、ウエハ200を真空チャッ
ク300により保持し、ウエハ200とホイール100
を回転させて、同図(b)に示すような形状に外周部を
研削加工する。FIG. 5A is a diagram showing an example of a method for grinding the outer peripheral portion of a silicon wafer, and FIG. 5B is a diagram showing the outer peripheral shape of the silicon wafer after processing. In the process of processing silicon wafers, the edge of the outer peripheral end face is sharp when the wafer is still cut, and chipping is likely to occur during handling work in each processing step. Or, scratches, cracks, or the like may occur, leading to a reduction in yield of semiconductor devices. For this reason, a beveling process is performed to scrape off the edge portion of the outer peripheral end surface of the wafer. This beveling process is
As shown in FIG. 5A, the wafer 200 is held by the vacuum chuck 300, and the wafer 200 and the wheel 100 are held.
Is rotated to grind the outer peripheral portion into a shape as shown in FIG.
【0007】[0007]
【発明が解決しようとする課題】上記のようなシリコン
ウエハ外周部加工用のベベリングホイールにおいて、砥
粒層を形成するためのボンドとして従来はメタルボンド
が用いられてきた。このメタルボンドとしては、銅、
錫、コバルトの単体金属あるいは合金の粉末が用いら
れ、この金属粉末と砥粒の混合物を金型などに充填した
後、700〜900℃で焼結することにより、台金に砥
粒層を固着させる。この焼結方法は、鉄(たとえばS2
5C〜S45C)製の台金に金属粉末と砥粒の成形混合
物を加圧、加熱した状態で焼結することにより、砥粒層
を台金に直接固着させる方法である。In the beveling wheel for processing the outer peripheral portion of the silicon wafer as described above, a metal bond has been conventionally used as a bond for forming an abrasive grain layer. For this metal bond, copper,
Powder of a simple metal or alloy of tin and cobalt is used, and a mixture of this metal powder and abrasive grains is filled in a mold and then sintered at 700 to 900 ° C to fix the abrasive grain layer to the base metal. Let This sintering method is based on iron (eg S2
5C to S45C) a base metal, and a molding mixture of metal powder and abrasive grains is pressed and sintered in a heated state to directly fix the abrasive layer to the base metal.
【0008】しかしながら、鉄製台金を用いた従来のベ
ベリングホイールは、ホイール重量が大で、研磨機械へ
の取付け、取外しの作業性が良くない。また、研削加工
時に使用する研削液である水により鉄製の台金に錆が発
生し、シリコンウエハを汚染するという問題がある。台
金の錆の発生に対しては、鉄製の台金にNiメッキを施
したりステンレス鋼製の台金を使用したりすることも考
えられるが、Niメッキでは錆防止に対して完全ではな
く、またステンレス鋼は材料コストが高く重量も大で、
砥粒層の接着性も低いという問題点がある。However, a conventional beveling wheel using an iron base metal has a large wheel weight, and the workability of mounting and removing it on a polishing machine is not good. In addition, there is a problem that water, which is a grinding liquid used during grinding, causes rust on the iron base metal and contaminates the silicon wafer. To prevent rusting of the base metal, it is possible to apply Ni plating to an iron base metal or use a stainless steel base metal, but Ni plating is not perfect for rust prevention. Also, stainless steel has high material cost and weight,
There is a problem that the adhesiveness of the abrasive grain layer is also low.
【0009】この問題点に対して、鉄製の台金に代えて
アルミニウム製またはアルミニウム合金製の台金とする
ことが考えられる。しかし、台金をアルミニウム製また
はアルミニウム合金製にした場合、台金に砥粒層を固着
する焼結工程において、アルミニウムまたはアルミニウ
ム合金は焼結温度に耐えられないので、焼結による直接
固着を採用することができない。そこで焼結による直接
固着に代えて、接着剤により固着することも考えられる
が、一般の超砥粒ホイールなどで用いられている従来の
エポキシ樹脂系を主体とする接着剤はその組成から導電
性を有していないので、ベベリングホイールの砥粒層固
着用に採用することはできない。ベベリングホイールの
砥粒層は、前述の溝形成に放電加工が行われるが、この
放電加工の加工物は電気抵抗(比抵抗)が低い方が良
い。比抵抗が1×103Ω・cm以上になると発熱して
加工にトラブルが発生するので、この比抵抗は1×10
2Ω・cm以下であることが望ましく、導電性を有して
いない接着剤は放電加工時に発熱し、ベベリングホイー
ルの砥粒層固着用としては適していない。To solve this problem, it is conceivable to replace the iron base metal with an aluminum or aluminum alloy base metal. However, when the base metal is made of aluminum or aluminum alloy, aluminum or aluminum alloy cannot withstand the sintering temperature in the sintering process of fixing the abrasive grain layer to the base metal, so direct fixing by sintering is adopted. Can not do it. Therefore, instead of directly fixing by sintering, it is possible to fix it with an adhesive, but the adhesive mainly composed of conventional epoxy resin used in general superabrasive wheels etc. is electrically conductive due to its composition. Therefore, it cannot be used for fixing the abrasive layer to the beveling wheel. In the abrasive grain layer of the beveling wheel, electric discharge machining is performed for forming the above-mentioned groove, but it is preferable that the electric discharge machined product has a low electric resistance (specific resistance). If the specific resistance becomes 1 × 10 3 Ω · cm or more, heat will be generated and processing problems will occur, so this specific resistance is 1 × 10 3.
It is preferably 2 Ω · cm or less, and an adhesive having no conductivity generates heat during electric discharge machining and is not suitable for fixing an abrasive grain layer to a beveling wheel.
【0010】本発明が解決すべき課題は、ベベリングホ
イールの砥粒層固着用の接着剤に導電性を持たせ、台金
として軽金属製または軽金属合金製の台金を採用するこ
とを可能とし、ベベリングホイールの重量軽減をはかる
ことにある。The problem to be solved by the present invention is to make the adhesive for fixing the abrasive grain layer of the beveling wheel conductive and to make it possible to employ a base metal made of light metal or a light metal alloy. , To reduce the weight of the beveling wheel.
【0011】[0011]
【課題を解決するための手段】本発明は、台金の外周部
に1条または複数条の溝を形成した砥粒層が固着された
シリコンウエハ外周部加工用ベベリングホイールであっ
て、前記台金をアルミニウム製またはアルミニウム合金
製の台金とし、前記砥粒層を結合剤としてメタルボンド
または導電性レジンボンドを用いた砥粒層とし、金属粉
末を含有する接着剤を介して前記台金に前記砥粒層を固
着させたことを特徴とする。The present invention relates to a beveling wheel for processing an outer peripheral portion of a silicon wafer, in which an abrasive grain layer having one or a plurality of grooves formed on the outer peripheral portion of a base metal is fixed. The base metal is a base metal made of aluminum or an aluminum alloy, the abrasive grain layer is an abrasive grain layer using a metal bond or a conductive resin bond as a binder, and the base metal is provided via an adhesive containing a metal powder. The abrasive grain layer is fixed to the above.
【0012】台金に砥粒層を固着させるための接着剤と
して、金属粉末を適量含有する接着剤を使用することに
より、接着剤に導電性を持たせることができ、台金に砥
粒層を固着した後に砥粒層の溝形成のための放電加工を
行うのに適した比抵抗1×102Ω・cm以下の導電性
を確保することができる。また、接着剤により台金に砥
粒層を固着することにより、従来のような台金と一体化
した複雑な成形金型を使用する必要がなく、砥粒層のみ
の金型ですむので、製造コストを低減することができ
る。また、台金としてアルミニウム製またはアルミニウ
ム合金製の台金を採用することができ、ベベリングホイ
ールの軽量化を達成することができる。By using an adhesive containing an appropriate amount of metal powder as the adhesive for fixing the abrasive grain layer to the base metal, the adhesive can be made conductive, and the base metal has an abrasive grain layer. It is possible to secure the electrical conductivity of 1 × 10 2 Ω · cm or less suitable for performing the electric discharge machining for forming the groove of the abrasive grain layer after the fixing. In addition, by fixing the abrasive grain layer to the base metal with an adhesive, it is not necessary to use a complicated molding die integrated with the base metal as in the past, and a die with only the abrasive grain layer is necessary. The manufacturing cost can be reduced. Further, a base metal made of aluminum or aluminum alloy can be adopted as the base metal, and the weight reduction of the beveling wheel can be achieved.
【0013】前記接着剤としては、金属粉末を50〜8
0重量%含有したエポキシ樹脂系接着剤が好適である。
金属粉末としては、鉄、アルミニウム、銅、錫などの平
均粒径2〜50μmの粉末を用いることができる。鉄、
アルミニウム、銅、錫などの金属粉末をエポキシ樹脂に
含有させることにより、接着剤に導電性を持たせること
ができる。ここで、金属粉末の含有量が50重量%未満
であれば接着剤の比抵抗が1×103Ω・cm以上とな
って放電加工が可能な導電性が得られず、含有量が80
重量%を超えると接着能力が低下するので、含有量は前
記範囲が望ましい。また、金属粉末の平均粒径が2μm
より小さいと金属粉末の製造コストが高くなり、50μ
mより大きくなると、金属粒子間の間隔が広くなって導
電性を阻害し、比抵抗が1×103Ω・cm以上となっ
て放電加工時に発熱する。As the adhesive, 50 to 8 of metal powder is used.
An epoxy resin-based adhesive containing 0% by weight is suitable.
As the metal powder, powder of iron, aluminum, copper, tin or the like having an average particle diameter of 2 to 50 μm can be used. iron,
The adhesive can be made conductive by incorporating a metal powder such as aluminum, copper, or tin into the epoxy resin. Here, if the content of the metal powder is less than 50% by weight, the specific resistance of the adhesive is 1 × 10 3 Ω · cm or more, and electrical conductivity capable of electrical discharge machining cannot be obtained.
If the content is more than wt%, the adhesive ability will decrease, so the content is preferably within the above range. The average particle size of the metal powder is 2 μm
If it is smaller, the manufacturing cost of the metal powder increases,
When it is larger than m, the interval between the metal particles is widened to hinder the conductivity, and the specific resistance becomes 1 × 10 3 Ω · cm or more and heat is generated during electric discharge machining.
【0014】上記のベベリングホイールは、金型を用い
てメタルボンドまたは導電性レジンボンドを結合剤とし
た環状の砥粒層を製造する工程、アルミニウム製または
アルミニウム合金製の台金の外周部に導電性を有する接
着剤を介して前記環状の砥粒層を固着する工程、前記台
金に固着させた砥粒層に放電加工により1条または複数
条の溝を形成する工程を含む製造方法によって製造する
ことができる。The above-mentioned beveling wheel has a step of producing an annular abrasive grain layer using a metal bond or a conductive resin bond as a binder by using a die, and an outer peripheral portion of a base metal made of aluminum or aluminum alloy. By a manufacturing method including a step of fixing the annular abrasive grain layer via an electrically conductive adhesive, and a step of forming one or more grooves by electric discharge machining in the abrasive grain layer fixed to the base metal It can be manufactured.
【0015】[0015]
【発明の実施の形態】図1は本発明の実施形態における
ベベリングホイールを示す部分断面図である。ベベリン
グホイール(以下、ホイールという)10は、円盤状の
台金1と、この台金1の外周部に溝付き砥粒層2を固着
したものである。台金1はアルミニウム合金製で、外径
約200mm、外周部の厚さ約15mmである。砥粒層
2は、ダイヤモンド砥粒とメタルボンドからなり、後述
する方法により台金1に接着した後、放電加工により1
条の溝3を形成したものである。1 is a partial sectional view showing a beveling wheel according to an embodiment of the present invention. A bevelling wheel (hereinafter, referred to as a wheel) 10 has a disc-shaped base metal 1 and a grooved abrasive grain layer 2 fixed to an outer peripheral portion of the base metal 1. The base metal 1 is made of an aluminum alloy and has an outer diameter of about 200 mm and an outer peripheral thickness of about 15 mm. The abrasive grain layer 2 is composed of diamond abrasive grains and a metal bond, and is adhered to the base metal 1 by a method described later, and then 1 by electrical discharge machining.
The groove 3 of the strip is formed.
【0016】図2は図1のホイールの製造工程を示す図
であり、(a)は台金に接着する前の砥粒層を示し、
(b)は台金への砥粒層の接着工程を示し、(c)は台
金への砥粒層接着後で溝形成前の状態を示す。FIG. 2 is a view showing a manufacturing process of the wheel of FIG. 1, (a) shows an abrasive grain layer before being adhered to a base metal,
(B) shows the step of adhering the abrasive grain layer to the base metal, and (c) shows the state after the adhering of the abrasive grain layer to the base metal and before the groove formation.
【0017】図2(a)に示すリング状砥粒層2aは、
一般のリムタイプのホイールの砥粒層と同様な製造方法
により作製されるもので、所定の金型に金属粉からなる
メタルボンドとダイヤモンド砥粒の混合物を充填し、加
圧、加熱状態のもとで焼成して作製される。リング状砥
粒層2aのリングの幅は約3mmであり、リングの厚さ
は約8mmである。The ring-shaped abrasive grain layer 2a shown in FIG.
It is produced by the same manufacturing method as the abrasive grain layer of a general rim type wheel, and it is filled with a mixture of a metal bond consisting of metal powder and diamond abrasive grains in a predetermined mold, and it is heated under pressure. It is made by firing at. The ring-shaped abrasive grain layer 2a has a ring width of about 3 mm and a ring thickness of about 8 mm.
【0018】図2(b)に示すように、台金1の外周部
はリング状砥粒層2aを嵌め込むために分割構造となっ
ており、台金1の本体につながる本体部1aと分割部1
bとに分割されている。リング状砥粒層2aを嵌め込む
ときには、分割部1bを台金1本体から外しておき、本
体部1aと分割部1bの接触面、および、本体部1aと
分割部1bとがリング状砥粒層2aと接触する面に接着
剤4(図中、斜線で示す)を塗布し、本体部1aの段部
にリング状砥粒層2aを載置した状態で分割部1bを本
体部1aに密着させることで、同図(c)に示すよう
に、台金1の外周部にリング状砥粒層2aが固着された
状態となる。As shown in FIG. 2 (b), the outer periphery of the base metal 1 has a divided structure for fitting the ring-shaped abrasive grain layer 2a, and is divided from the main body 1a connected to the main body of the base metal 1. Part 1
It is divided into b and. When the ring-shaped abrasive grain layer 2a is fitted, the divided portion 1b is removed from the main body 1 of the base metal 1, and the contact surface between the main body portion 1a and the divided portion 1b and the ring-shaped abrasive grain are formed between the main body portion 1a and the divided portion 1b. Adhesive 4 (shown by diagonal lines in the figure) is applied to the surface in contact with the layer 2a, and the divided portion 1b is brought into close contact with the main body 1a with the ring-shaped abrasive grain layer 2a placed on the stepped portion of the main body 1a As a result, the ring-shaped abrasive grain layer 2a is fixed to the outer peripheral portion of the base metal 1 as shown in FIG.
【0019】図2(b)の工程において、台金1の外周
部の本体部1aと分割部1bおよびリング状砥粒層2a
を接着させる接着剤4として本実施形態では、エポキシ
系樹脂に平均粒径10μmの銅粉を60重量%含有させ
た接着剤を用いている。エポキシ系樹脂に銅粉を含有さ
せることにより接着剤に導電性が付与され、粒径10μ
mの銅粉を50重量%含有させたとき比抵抗はほぼ5×
102Ω・cmとなり、60重量%含有させたときほぼ
1×102Ω・cm、80重量%含有させたときほぼ2
0Ω・cmとなる。銅粉の含有量が40重量%のとき
は、比抵抗はほぼ1×104Ω・cmとなり、銅粉の含
有量が50重量%未満では1×103Ω・cmより低い
比抵抗が得られない。In the step of FIG. 2 (b), the main body 1a on the outer peripheral portion of the base metal 1 and the divided portion 1b and the ring-shaped abrasive grain layer 2a.
In the present embodiment, as the adhesive 4 for adhering, the adhesive used is an epoxy resin containing 60% by weight of copper powder having an average particle diameter of 10 μm. Conductivity is imparted to the adhesive by incorporating copper powder in the epoxy resin, and the particle size is 10 μm.
When containing 50% by weight of copper powder of m, the specific resistance is about 5 ×
It becomes 10 2 Ω · cm, which is approximately 1 × 10 2 Ω · cm when it is contained at 60% by weight, and approximately 2 when it is contained at 80% by weight.
It becomes 0 Ω · cm. When the content of copper powder is 40% by weight, the specific resistance is about 1 × 10 4 Ω · cm, and when the content of copper powder is less than 50% by weight, the specific resistance lower than 1 × 10 3 Ω · cm is obtained. I can't.
【0020】この後、放電加工によりリング状砥粒層2
aに図1に示す断面形状の溝3を形成する。放電加工に
よる溝3の形成方法は従来と同様な方法により行うこと
ができる。本実施形態では図1に示す形状の溝3を形成
しているが、砥粒層および溝の形状は前述の図4に示し
た形状を含め各種の形状とすることができるのはいうま
でもない。After that, the ring-shaped abrasive grain layer 2 is formed by electric discharge machining.
A groove 3 having a sectional shape shown in FIG. 1 is formed in a. The method of forming the groove 3 by electric discharge machining can be performed by a method similar to the conventional method. In this embodiment, the groove 3 having the shape shown in FIG. 1 is formed, but it goes without saying that the shapes of the abrasive grain layer and the groove can be various shapes including the shape shown in FIG. Absent.
【0021】表1に本実施形態で用いた銅粉入りエポキ
シ系樹脂接着剤の物性を、銅粉なしの従来の接着剤とと
もに示す。Table 1 shows the physical properties of the epoxy resin adhesive containing copper powder used in this embodiment together with the conventional adhesive without copper powder.
【表1】 [Table 1]
【0022】表1からわかるように、曲げ強度について
は、銅粉末の添加量の増加により段階的に低下している
が、実用的には表2に示す接着強度のほうが重要であ
り、ここはで参考物性値とする。曲げ弾性係数について
は、銅粉末の添加量を増加すると曲げ弾性係数が高くな
って砥粒層を受ける剛性が向上し、シリコンウエハ加工
時の切れ味が向上して不良原因のチッピングなどの減少
に有効となる。As can be seen from Table 1, the bending strength gradually decreases with an increase in the addition amount of the copper powder, but in practice, the adhesive strength shown in Table 2 is more important. Refer to physical properties. Regarding the bending elastic modulus, increasing the amount of copper powder added increases the bending elastic modulus and improves the rigidity of receiving the abrasive grain layer, improving the sharpness when processing silicon wafers and reducing chipping, which is the cause of defects. Becomes
【0023】表2に本実施形態で用いた銅粉入りエポキ
シ系樹脂接着剤による台金と代表的な砥粒層(銅、錫系
のメタルボンド)との接着強度の測定結果を示す。Table 2 shows the measurement results of the adhesive strength between the base metal and the typical abrasive grain layer (copper, tin-based metal bond) using the epoxy resin adhesive containing copper powder used in this embodiment.
【表2】 [Table 2]
【0024】表2に示すように、アルミ鋳物2種の台金
に銅粉入りのエポキシ系樹脂接着剤を用いてメタルボン
ド砥粒層を接着したときの接着強度は25〜45Mpa
であり、炭素鋼(S45C)台金の場合に比べ若干低下
するが、ホイール形状にして回転試験を行った結果で
は、通常の使用周速の3倍の周速で回転させた場合でも
なんの問題もなく、実用的には充分な接着強度であるこ
とが確認された。As shown in Table 2, the adhesive strength when the metal bond abrasive grain layer is adhered to the base metal of two kinds of aluminum castings using the epoxy resin adhesive containing copper powder is 25 to 45 Mpa.
It is slightly lower than that of the carbon steel (S45C) base metal, but the result of the rotation test with the wheel shape shows that even when it is rotated at a peripheral speed three times the normal peripheral speed. It was confirmed that there was no problem and the adhesive strength was practically sufficient.
【0025】〔試験例〕前記実施形態のホイール(発明
品)とS45C台金にメタルボンド砥粒層を直接固着さ
せたホイール(従来品)を用いてシリコンウエハの加工
試験を行った。
加工条件
ホイール仕様:SD600N125M60
ホイール寸法:202φ×20T×30H
ホイール周速:1800m/min
取代:約0.4mm
被加工材:150φシリコンウエハ[Test Example] A silicon wafer processing test was carried out using the wheel (invention product) of the above embodiment and a wheel (conventional product) in which a metal bond abrasive grain layer was directly adhered to an S45C base metal. Processing conditions Wheel specifications: SD600N125M60 Wheel dimensions: 202 φ × 20 T × 30 H Wheel peripheral speed: 1800 m / min Working allowance: Approx. 0.4 mm Work material: 150 φ Silicon wafer
【0026】試験結果を表3に示す。The test results are shown in Table 3.
【表3】 [Table 3]
【0027】発明品のホイールは、銅粉末を含有した曲
げ弾性係数の高い接着剤を介して砥粒層が台金に固着さ
れているので、砥粒層を受ける剛性が高く、シリコンウ
エハ加工時の切れ味が向上して不良原因のチッピングな
どが減少し、不良率は従来品に比して50%減となっ
た。In the wheel of the invention, since the abrasive grain layer is fixed to the base metal via the adhesive containing copper powder and having a high flexural modulus, the wheel has a high rigidity to receive the abrasive grain layer and is excellent in processing the silicon wafer. The sharpness was improved and chipping caused by defects was reduced, and the defect rate was reduced by 50% compared to the conventional product.
【0028】[0028]
【発明の効果】金属粉末を適量含有する接着剤を介して
アルミニウム製またはアルミニウム合金製の台金にメタ
ルボンドまたは導電性レジンボンドを結合剤として用い
た砥粒層を固着することにより、台金に砥粒層を固着し
た後に砥粒層の溝形成のための放電加工を行うのに適し
た導電性を確保し、同時に軽量化を達成することができ
る。また、従来のような台金と一体化した複雑な成形金
型を使用する必要がなく、砥粒層のみの金型ですむの
で、製造コストを低減することができる。EFFECTS OF THE INVENTION By attaching an abrasive grain layer using a metal bond or a conductive resin bond as a binder to an aluminum or aluminum alloy base metal through an adhesive containing an appropriate amount of metal powder, the base metal It is possible to secure conductivity suitable for performing electric discharge machining for forming a groove in the abrasive grain layer after fixing the abrasive grain layer to, and at the same time achieve weight reduction. Further, since it is not necessary to use a complicated molding die integrated with a base metal as in the conventional case, and a die having only an abrasive grain layer is required, the manufacturing cost can be reduced.
【図1】 本発明の実施形態におけるベベリングホイー
ルを示す部分断面図である。FIG. 1 is a partial cross-sectional view showing a beveling wheel according to an embodiment of the present invention.
【図2】 図1のベベリングホイールの製造工程を示す
図である。FIG. 2 is a diagram showing a manufacturing process of the bevelling wheel of FIG.
【図3】 ベベリングホイールの全体形状の例を示す図
である。FIG. 3 is a diagram showing an example of the overall shape of a bevelling wheel.
【図4】 ベベリングホイールの砥粒層の溝の形態の例
を示す図である。FIG. 4 is a diagram showing an example of the form of grooves in an abrasive grain layer of a beveling wheel.
【図5】 ベベリングホイールによる研削加工の例を示
す図である。FIG. 5 is a diagram showing an example of grinding processing using a beveling wheel.
1 台金 1a 本体部 1b 分割部 2 砥粒層 2a リング状砥粒層 3 溝 4 接着剤 10 ホイール 1 unit 1a main body 1b Dividing part 2 Abrasive layer 2a Ring-shaped abrasive grain layer 3 grooves 4 adhesive 10 wheels
フロントページの続き (51)Int.Cl.7 識別記号 FI B24D 5/00 B24D 5/00 P (56)参考文献 特開 平6−226637(JP,A) 特開2000−94334(JP,A) (58)調査した分野(Int.Cl.7,DB名) B24D 3/00 310 B24D 3/00 340 B24D 3/00 350 B24D 3/34 B24D 5/00 Continuation of front page (51) Int.Cl. 7 identification code FI B24D 5/00 B24D 5/00 P (56) References JP-A-6-226637 (JP, A) JP-A-2000-94334 (JP, A) (58) Fields surveyed (Int.Cl. 7 , DB name) B24D 3/00 310 B24D 3/00 340 B24D 3/00 350 B24D 3/34 B24D 5/00
Claims (2)
レジンボンドを結合剤とした環状の砥粒層を製造する工
程と、アルミニウム製またはアルミニウム合金製の台金
の外周部に導電性を有する接着剤を介して前記環状の砥
粒層を固着する工程と、前記台金に固着させた砥粒層に
放電加工により1条または複数条の溝を形成する工程と
を含むシリコンウエハ外周部加工用ベベリングホイール
の製造方法。 1. A metal bond or conductivity using a mold.
A process for manufacturing an annular abrasive grain layer using resin bond as a binder
And base metal made of aluminum or aluminum alloy
The ring-shaped abrasive is attached to the outer periphery of the
The process of fixing the grain layer and the abrasive grain layer fixed to the base metal
A step of forming a single or multiple grooves by electric discharge machining
Beveling wheel for silicon wafer outer peripheral processing including
Manufacturing method.
粉末を50〜80重量%含有する樹脂を用いる請求項1
記載のシリコンウエハ外周部加工用ベベリングホイール
の製造方法。 2. A metal as the conductive adhesive.
A resin containing 50 to 80% by weight of powder is used.
Beveling wheel for processing the outer peripheral portion of a silicon wafer
Manufacturing method.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001031366A JP3434801B2 (en) | 2001-02-07 | 2001-02-07 | Method for manufacturing beveling wheel for processing peripheral portion of silicon wafer |
TW090133373A TW584585B (en) | 2001-02-07 | 2001-12-31 | Beveling wheel for processing silicon wafer outer periphery and the manufacture method thereof |
KR1020020004463A KR100628018B1 (en) | 2001-02-07 | 2002-01-25 | Beveling wheel for processing outer circumference part of silicone wafer and manufacturing method of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001031366A JP3434801B2 (en) | 2001-02-07 | 2001-02-07 | Method for manufacturing beveling wheel for processing peripheral portion of silicon wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002239912A JP2002239912A (en) | 2002-08-28 |
JP3434801B2 true JP3434801B2 (en) | 2003-08-11 |
Family
ID=18895461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001031366A Expired - Fee Related JP3434801B2 (en) | 2001-02-07 | 2001-02-07 | Method for manufacturing beveling wheel for processing peripheral portion of silicon wafer |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3434801B2 (en) |
KR (1) | KR100628018B1 (en) |
TW (1) | TW584585B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MXPA03006434A (en) * | 2003-07-18 | 2005-01-21 | Univ Mexico Nacional Autonoma | Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces. |
JP4815801B2 (en) * | 2004-12-28 | 2011-11-16 | 信越半導体株式会社 | Silicon wafer polishing method and manufacturing method, disk-shaped workpiece polishing apparatus, and silicon wafer |
KR102396166B1 (en) * | 2015-10-05 | 2022-05-11 | 이화다이아몬드공업 주식회사 | Edge wheel for edge grinding of substrate having passage of cooling water and method of manufacturing the wheel |
KR101920901B1 (en) * | 2017-07-24 | 2018-11-22 | 이화다이아몬드공업 주식회사 | Edging wheel using grinding block and method of manufacturing the wheel |
JP7093875B2 (en) * | 2021-06-24 | 2022-06-30 | 一郎 片山 | Workpiece processing equipment, grindstone, and work processing method |
-
2001
- 2001-02-07 JP JP2001031366A patent/JP3434801B2/en not_active Expired - Fee Related
- 2001-12-31 TW TW090133373A patent/TW584585B/en not_active IP Right Cessation
-
2002
- 2002-01-25 KR KR1020020004463A patent/KR100628018B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20020065838A (en) | 2002-08-14 |
KR100628018B1 (en) | 2006-09-26 |
TW584585B (en) | 2004-04-21 |
JP2002239912A (en) | 2002-08-28 |
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