JP3404755B2 - Wire bonding equipment - Google Patents

Wire bonding equipment

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Publication number
JP3404755B2
JP3404755B2 JP31138191A JP31138191A JP3404755B2 JP 3404755 B2 JP3404755 B2 JP 3404755B2 JP 31138191 A JP31138191 A JP 31138191A JP 31138191 A JP31138191 A JP 31138191A JP 3404755 B2 JP3404755 B2 JP 3404755B2
Authority
JP
Japan
Prior art keywords
bonding
wire
camera
image
position coordinates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP31138191A
Other languages
Japanese (ja)
Other versions
JPH05129408A (en
Inventor
雄二 駒木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
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Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP31138191A priority Critical patent/JP3404755B2/en
Publication of JPH05129408A publication Critical patent/JPH05129408A/en
Application granted granted Critical
Publication of JP3404755B2 publication Critical patent/JP3404755B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はワイヤボンディング装置
に関する。FIELD OF THE INVENTION The present invention relates to a wire bonding apparatus .

【０００２】[0002]

【従来の技術】一般に、ワイヤボンディング方法は下記
(1) 〜(4)の如くによりなされる。尚、図４〜６におい
て、１は半導体チップ、１Ａは電極、２はリードフレー
ムのリード、３はワイヤ、４はキャピラリである。2. Description of the Related Art Generally, the wire bonding method is as follows.
This is done as described in (1) to (4). 4 to 6, 1 is a semiconductor chip, 1A is an electrode, 2 is a lead of a lead frame, 3 is a wire, and 4 is a capillary.

【０００３】(1) ボンディング装置を用いてワイヤボン
ディングを行なうに当たり、ボンディング装置に対し、
ボンディング位置座標を設定する（覚え込ませる）必要
がある。この設定作業は「ティーチング作業」と呼ば
れ、作業者によってなされる。(1) When performing wire bonding using a bonding device,
It is necessary to set (remember) the bonding position coordinates. This setting work is called "teaching work" and is performed by the operator.

【０００４】ここでボンディング位置座標とは、半導体
チップ１の電極１Ａ上とリードフレームのリード２上と
において、ワイヤ３が接続される点の座標をいう。Here, the bonding position coordinates mean the coordinates of the point where the wire 3 is connected on the electrode 1A of the semiconductor chip 1 and the lead 2 of the lead frame.

【０００５】(2) ボンディング位置座標が設定される
と、ボンディング装置が有する制御部は、電極１Ａとそ
れに対応するリード２のボンディング位置座標に基づい
て、それぞれのボンディング位置間におけるキャピラリ
４の移動情報、例えばＺストローク（Ａ〜Ｄ）、リバー
スレベル（Ａ〜Ｂ）、リバース量（Ｂ〜Ｃ）、下降軌跡
（Ｄ〜Ｅ）等を、予め設定された演算式等により算出
し、設定する（図４参照）。(2) When the bonding position coordinates are set, the control unit of the bonding apparatus, based on the bonding position coordinates of the electrode 1A and the lead 2 corresponding thereto, the movement information of the capillary 4 between the respective bonding positions. , For example, the Z stroke (A to D), the reverse level (A to B), the reverse amount (B to C), the descending locus (D to E), etc. are calculated and set by a preset arithmetic expression or the like ( (See FIG. 4).

【０００６】(3) 次に、上記のようにして設定されたキ
ャピラリ４の移動情報並びに不図示のカメラにて検出し
た電極１Ａやリード２の位置ずれ量に基づいてキャピラ
リ４が移動し、電極１Ａとリード２の間にワイヤ３を接
続する（図５参照）。(3) Next, the capillaries 4 move based on the movement information of the capillaries 4 set as described above and the amount of displacement of the electrodes 1A and the leads 2 detected by a camera (not shown), and the capillaries 4 move. A wire 3 is connected between 1A and the lead 2 (see FIG. 5).

【０００７】(4) 上記のようにして設定された条件でキ
ャピラリ４を移動させて実際のボンディングを行なう
と、希望するワイヤループが形成されず、カール現象
（形成されたワイヤループを真上から見たときに、ワイ
ヤループが水平方向に湾曲していること）を生じること
がある。(4) When the capillary 4 is moved under the conditions set as described above and the actual bonding is performed, a desired wire loop is not formed, and a curl phenomenon (the formed wire loop from directly above is formed). When viewed, the wire loop may be curved horizontally.

【０００８】この原因はいろいろ考えられるが、その 1
つとして、例えば図６に示すように、ワイヤ３をリード
２上にボンディングする際、キャピラリ４先端から導出
しているワイヤ３が長すぎる（ワイヤ繰出し量不良）た
めに垂れ下がり、この部分がリード２先端のアール部に
接触し、外方（アール部の接線に対する直交方向）に弾
かれてしまうことがあげられる（ボンディング不良）。There are various possible causes for this, part 1
For example, as shown in FIG. 6, when the wire 3 is bonded onto the lead 2, the wire 3 led out from the tip of the capillary 4 is too long (a wire feeding amount is defective) and hangs down, and this portion is dropped. It can be said that it comes into contact with the rounded portion at the tip and is flipped outward (direction orthogonal to the tangent line of the rounded portion) (bonding failure).

【０００９】そこでワイヤボンディング後に、ワイヤル
ープの形成状態を検査し、ループ形状が不良の場合は、
キャピラリ４のＺストローク、下降軌跡等の調整を施
し、ボンディング不良をなくすようにしている。Therefore, after wire bonding, the formation state of the wire loop is inspected, and if the loop shape is defective,
The Z stroke of the capillary 4 and the descending locus are adjusted to eliminate defective bonding.

【００１０】[0010]

【発明が解決しようとする課題】然るに、従来技術にお
いて、ワイヤループの形成状態を検査するには、ボンデ
ィングの終了したリードフレームを「プロジェクタ」と
呼ばれる検査装置まで搬送し、ここで各ワイヤループの
カール量を測定、検査していた。However, in the prior art, in order to inspect the formation state of wire loops, the lead frame after bonding is conveyed to an inspection device called a "projector", and here, each wire loop is inspected. The curl amount was measured and inspected.

【００１１】ところが、検査装置まで搬送する間の振動
により、ワイヤループが変形してしまうことがある。そ
のためボンディング時にはワイヤループが正常に形成さ
れたにもかかわらず、検査装置まで搬送後の検査では異
常と判定されてしまい、ボンディング情報の調整に混乱
を来すこととなる（つまり真の判定が行なわれない）。However, the wire loop may be deformed by the vibration during the transportation to the inspection device. Therefore, even though the wire loop was normally formed during bonding, it is determined to be abnormal in the inspection after being transported to the inspection device, which causes confusion in the adjustment of the bonding information (that is, the true determination is made). Not).

【００１２】本発明は、ワイヤループの真の検査をする
ことができるようにすることを目的とする。The present invention aims at being able to make a true inspection of wire loops.

【００１３】[0013]

【課題を解決するための手段】請求項１の発明は、ボン
ディング作業位置に位置付けられたボンディング対象部
品の画像をカメラで取込み、取り込んだ画像からボンデ
ィング位置座標を求め、求めたボンディング位置座標に
ワイヤを接続するワイヤボンディング装置において、カ
メラによって撮像されたワイヤループの画像におけるカ
ール量最大部分を検出する画像認識手段と、画像認識手
段の検出結果に基づいてワイヤループの最大カール量を
演算し、該最大カール量を表示手段に表示させる演算制
御手段とを有してなるようにしたものである。According to a first aspect of the present invention, an image of a component to be bonded positioned at a bonding work position is captured by a camera, bonding position coordinates are obtained from the captured image, and a wire is placed at the obtained bonding position coordinate. In the wire bonding apparatus for connecting the image recognition means for detecting the maximum amount of curl in the image of the wire loop captured by the camera, the maximum curl amount of the wire loop is calculated based on the detection result of the image recognition means, An arithmetic control unit for displaying the maximum curl amount on the display unit is provided.

【００１４】請求項２の発明は、請求項１の発明におい
て更に、前記演算制御手段が、前記カメラの撮像結果か
ら得た、２つのボンディング位置座標Ｐ1、Ｐ2を通る直
線の式を演算で求める手段と、前記カメラの撮像結果か
ら求めた、ボンディングされたワイヤのループの最大カ
ール点Ｐ3から上記 2点Ｐ1、Ｐ2を通る直線に対して下
ろした垂線の長さを演算で求める手段とを有して構成さ
れるようにしたものである。 The invention of claim 2 is the same as the invention of claim 1.
Furthermore, the calculation control means calculates the equation of a straight line passing through the two bonding position coordinates P1 and P2 obtained from the image pickup result of the camera, and the bonding obtained from the image pickup result of the camera. And a means for calculating the length of a perpendicular line drawn from the maximum curl point P3 of the wire loop to the straight line passing through the two points P1 and P2.

【００１５】[0015]

【作用】ボンディング装置自体によってワイヤのループ
状態を検査できる。即ち、ボンディング装置がボンディ
ング位置座標の設定のために本来的に有しているカメラ
を用い、ボンディングされたワイヤのループ状態を当該
カメラで直ちに取込んで検出できる。従って、ボンディ
ング後の運搬による振動等の悪影響を付与されない真の
ワイヤループを、ボンディング終了後即座に検査でき
る。The bonding device itself can inspect the loop state of the wire. That is, a camera that the bonding apparatus originally has for setting the bonding position coordinates is used, and the loop state of the bonded wire can be immediately captured and detected by the camera. Therefore, a true wire loop that is not adversely affected by vibration after transportation after bonding can be inspected immediately after bonding is completed.

【００１６】[0016]

【実施例】図１は本発明の実施に用いられる演算回路の
一例を示すブロック図、図２はカメラのモニタ画面を示
す模式図、図３はワイヤループを示す模式図、図４はキ
ャピラリの移動情報を示す模式図、図５はワイヤボンデ
ィング状態を示す模式図である。1 is a block diagram showing an example of an arithmetic circuit used for implementing the present invention, FIG. 2 is a schematic diagram showing a monitor screen of a camera, FIG. 3 is a schematic diagram showing a wire loop, and FIG. 4 is a capillary diagram. FIG. 5 is a schematic diagram showing movement information, and FIG. 5 is a schematic diagram showing a wire bonding state.

【００１７】先ず、本発明が実施されるワイヤボンディ
ング方法の一般的手順について説明する。First, the general procedure of the wire bonding method for carrying out the present invention will be described.

【００１８】(1) ボンディング位置座標のティーチング
（図１、図２参照） ティーチングは、電極１Ａとリード２とを画像認識手段
により撮像することにて行なう。即ち撮像手段（カメラ
１０）により、半導体チップ１またはリード２を撮像
し、撮像した画像をモニタ１１に表示する。このときモ
ニタ１１の画面中央には、カメラの中心位置を示し、且
つモニタ画面１１Ａにおけるポイントを指示するときの
目合わせとなる指示マーク（「レチクル１２」と呼ばれ
る）が表示されている（図２参照）。そしてモニタ１１
に表示された電極１Ａまたはリード２上にレチクル１２
を合わせることにて、 2つのボンディング位置座標Ｐ1
、Ｐ2 の設定を行なう。(1) Teaching of bonding position coordinates (see FIGS. 1 and 2) Teaching is performed by imaging the electrode 1A and the lead 2 by an image recognition means. That is, the image pickup means (camera 10) picks up the semiconductor chip 1 or the lead 2 and displays the picked-up image on the monitor 11. At this time, in the center of the screen of the monitor 11, an instruction mark (referred to as "reticle 12") is displayed which indicates the center position of the camera and serves as an alignment when pointing a point on the monitor screen 11A (FIG. 2). reference). And monitor 11
On the electrode 1A or the lead 2 displayed on the reticle 12
By aligning the two bonding position coordinates P1
, P2 are set.

【００１９】ところで、ボンディング装置が備えるカメ
ラ１０は、Ｘ−Ｙテーブル２０上に載置されており、そ
して操作盤に設けられたＸ−Ｙテーブル手動移動手段
（「チェスマン２１」と呼ばれる）を操作することに
て、ＸＹドライバ２２を介してＸ−Ｙ方向に移動させる
ことができるようになっている。By the way, the camera 10 provided in the bonding apparatus is mounted on the XY table 20, and the XY table manual moving means (called "chessman 21") provided on the operation panel is operated. By doing so, it can be moved in the XY directions via the XY driver 22.

【００２０】そこで作業者は、モニタ１１に映し出され
た画像を見ながらチェスマン２１を操作することにてカ
メラ１０を移動させ、レチクル１２を電極１Ａ又はリー
ド２上における理想的なボンディング位置に合わせる。
そしてこの位置合わせ後、操作盤のポイント指定ボタン
２３を押すことで、ボンディング位置座標が演算制御装
置３０のメモリ３１に記憶される。Then, the operator moves the camera 10 by operating the chessman 21 while looking at the image displayed on the monitor 11, and aligns the reticle 12 with the ideal bonding position on the electrode 1A or the lead 2.
Then, after this alignment, by pressing the point designation button 23 on the operation panel, the bonding position coordinates are stored in the memory 31 of the arithmetic and control unit 30.

【００２１】 (2) キャピラリの移動情報の設定（図４参照） ボンディング位置座標が設定されると、ボンディング装
置が有する制御装置３０は、電極１Ａとそれに対応する
リード２のボンディング位置座標に基づいて、それぞれ
のボンディング位置間におけるキャピラリ４の移動情
報、例えばＺストローク（Ａ〜Ｄ）、リバースレベル
（Ａ〜Ｂ）、リバース量（Ｂ〜Ｃ）、下降軌跡（Ｄ〜
Ｅ）等を、予め設定された演算式等により算出し、設定
する。(2) Setting of Capillary Movement Information (See FIG. 4) When the bonding position coordinates are set, the control device 30 included in the bonding device determines the bonding position coordinates of the electrode 1A and the lead 2 corresponding thereto. , Movement information of the capillary 4 between the respective bonding positions, for example, Z stroke (A to D), reverse level (A to B), reverse amount (B to C), descending trajectory (D to).
E) and the like are calculated and set by a preset arithmetic expression or the like.

【００２２】(3) キャピラリの移動によるワイヤボンデ
ィング（図５参照） 制御装置３０は、上記のようにして設定されたキャピラ
リ４の移動情報に基づいて、ＸＹドライバ２２、及びＺ
ドライバ２４を制御することにより、キャピラリ４を移
動し、電極１Ａとリード２の間にワイヤ３を接続する。(3) Wire Bonding by Moving Capillaries (See FIG. 5) The control device 30 controls the XY drivers 22 and Z based on the movement information of the capillaries 4 set as described above.
By controlling the driver 24, the capillary 4 is moved to connect the wire 3 between the electrode 1A and the lead 2.

【００２３】(4) ワイヤループの検査（図３参照） 制御装置３０は、ワイヤボンディング後に、ワイヤルー
プの形成状態を検査し、ループ形状が不良の場合は、キ
ャピラリ４のＺストローク、下降軌跡等の調整を施し、
ボンディング不良をなくすようにする。このとき、制御
装置３０は、指定された 2つの座標点Ｐ1、Ｐ2（１つ
の電極上におけるボンディング位置座標Ｐ1 と、対応す
るリード上のボンディング位置座標Ｐ2）を通る直線の
式を演算で求める手段、指定された第３の座標点Ｐ3
（２点Ｐ1、Ｐ2を通る直線に対してワイヤループが水平
方向へ最も湾曲、即ちカールしている点）から、２点Ｐ
1、Ｐ2を通る直線に対して下ろした垂線の長さ（最大カ
ール量）を演算で求める手段とを具備する。(4) Inspection of wire loop (see FIG. 3) The control device 30 inspects the formation state of the wire loop after wire bonding, and if the loop shape is defective, Z stroke of the capillary 4, descending locus, etc. Adjustment,
Try to eliminate defective bonding. At this time, the control device 30 obtains a formula of a straight line passing through the two designated coordinate points P1 and P2 (bonding position coordinate P1 on one electrode and bonding position coordinate P2 on the corresponding lead) by calculation. , The designated third coordinate point P3
From the point (where the wire loop is most curved in the horizontal direction, that is, the point where the wire loop is curled with respect to the straight line passing through the two points P1 and P2), the two points P
1, a means for calculating the length ( maximum curl amount) of a perpendicular drawn from a straight line passing through P2.

【００２４】以下、上記制御装置３０によるワイヤルー
プの検査手順について、詳述する。先ずワイヤループの
検査を行なうに当たり、対象とするワイヤループのファ
ーストボンディング点である電極１Ａの座標Ｐ1 を指定
する（尚この座標Ｐ1 、及びリード２上の座標Ｐ2 は、
予めティーチングされているので、改めて記憶させる必
要はない。）。The inspection procedure of the wire loop by the controller 30 will be described in detail below. First, in conducting the inspection of the wire loop, the coordinate P1 of the electrode 1A which is the first bonding point of the target wire loop is designated (the coordinate P1 and the coordinate P2 on the lead 2 are
Since it is taught in advance, it is not necessary to store it again. ).

【００２５】この指令によりカメラ１０が移動し、モニ
タ１１上にはその電極１Ａが写し出される。このときモ
ニタ画面１１Ａには、カメラ１０によって撮像されたワ
イヤループも写し出されている（実際には画面の面積の
制限からワイヤループの一部が写し出される）。また画
面中央には、レチクル１２が表示されている。そこで作
業者は、このモニタ１１を見ながらチェスマン２１を操
作し、カメラ１０を徐々に移動させることにて、ワイヤ
ループを追いかけ、その（水平方向に）最も湾曲してい
る部分、即ちカール量最大部分を探しだす。そして探し
だしたカール量最大部分にカメラ中心、即ちレチクル１
２に合わせ、ポイント指定ボタン２３を押す。これに
て、その座標点（Ｐ3 ）がボンディング装置に記憶され
る。The camera 10 is moved by this command, and the electrode 1A is projected on the monitor 11. At this time, the wire loop imaged by the camera 10 is also displayed on the monitor screen 11A (actually, a part of the wire loop is displayed due to the limitation of the screen area). The reticle 12 is displayed in the center of the screen. Therefore, the operator operates the chessman 21 while looking at the monitor 11 and gradually moves the camera 10 to follow the wire loop, and the most curved portion (horizontal direction), that is, the maximum curl amount. Find the part. And the camera center, that is, the reticle 1 is located in the maximum curl amount that is found
In accordance with 2, press the point designation button 23. As a result, the coordinate point (P3) is stored in the bonding apparatus.

【００２６】この後作業者は、不図示の操作盤の演算指
令ボタンを押すことにより、演算制御装置３０はカール
量の演算を開始する。演算は、後述する演算式に従って
行なわれる。そして算出されたカール量は、モニタ１１
の所定の領域に表示される。After this, the operator presses a calculation command button on the operation panel (not shown), and the calculation control device 30 starts calculation of the curl amount. The calculation is performed according to a calculation formula described later. Then, the calculated curl amount is displayed on the monitor 11
Is displayed in a predetermined area.

【００２７】作業者は、表示されたカール量を目安にボ
ンディング情報の調整を行なう。ここで、上述のカール
量は、座標点Ｐ3 からボンディング位置座標Ｐ1 、Ｐ2
を通る直線に対して下ろした垂線の長さＬであり、下記
(1) 式〜(6) 式により演算される。The operator adjusts the bonding information based on the displayed curl amount. Here, the above-mentioned curl amount is calculated from the coordinate point P3 to the bonding position coordinates P1 and P2.
It is the length L of the perpendicular drawn from the straight line passing through
It is calculated by equations (1) to (6).

【００２８】2つの座標点Ｐ1 （ａ、ｂ）、Ｐ2 （ｃ、
ｄ）を通る直線Ｈの式をTwo coordinate points P1 (a, b), P2 (c,
Formula of straight line H passing through d)

【００２９】[0029]

【数１】 とする。このとき、傾きαはＰ1 、Ｐ2 の座標から[Equation 1] And At this time, the inclination α is calculated from the coordinates of P1 and P2.

【００３０】[0030]

【数２】 で表わせる。また、ｘ＝ａのとき、ｙ＝ｂであることか
ら、[Equation 2] Can be expressed as Also, when x = a, y = b, so

【００３１】[0031]

【数３】 従って、(2) 式、(3) 式を(1) 式に代入すると、[Equation 3] Therefore, when substituting equations (2) and (3) into equation (1),

【００３２】[0032]

【数４】 となり、これは、[Equation 4] And this is

【００３３】[0033]

【数５】 と変形できる。そこで座標点Ｐ3 （ｅ、ｆ）から直線Ｈ
に下ろした垂線の長さＬは、次の通りとなる。[Equation 5] Can be transformed. Then, from the coordinate point P3 (e, f) to the straight line H
The vertical length L of the vertical line is as follows.

【００３４】[0034]

【数６】 [Equation 6]

【００３５】然るに、本実施例によれば、下記〜の
効果がある。 ボンディング装置自体によってワイヤループのカール
量を検査できるようにしたため、従来のように搬送中の
振動が、形成されたワイヤループに悪影響を与えるとい
ったことがなくなり、信頼できる真のワイヤループの検
査結果を得ることができる。Therefore, according to this embodiment, the following effects (1) to (4) are obtained. Since the curling amount of the wire loop can be inspected by the bonding device itself, the vibration during transportation does not adversely affect the formed wire loop as in the past, and a reliable true wire loop inspection result can be obtained. Obtainable.

【００３６】またリードフレームを搬送する必要がな
いので、検査を行なうために従来有した搬送時間を不要
とでき、結果として検査時間を短縮することもできる。Further, since it is not necessary to carry the lead frame, it is possible to eliminate the conventional carrying time for carrying out the inspection, and as a result, the inspection time can be shortened.

【００３７】またボンディング終了後即座に検査を行
なえるため、不良半導体装置の製造を最小限に止めるこ
とができる（１枚のリードフレームには、通常、複数個
単位で半導体チップが載置されているため、ワイヤボン
ディングの際は、１リードフレームあるいは１マガジン
を１単位としてボンディングが行なわれる。このため従
来のように、プロジェクタへ搬送するものにおいては、
１リードフレームあるいは１マガジン分のボンディング
が終了後、１単位ごとにプロジェクタへ搬送されるよう
になっていたため、検査装置にてボンディング状態の不
良が発見されるまでには既に多くの不良半導体装置が製
造されてしまうという欠点があった）。Further, since the inspection can be carried out immediately after the bonding is completed, the production of defective semiconductor devices can be minimized (in general, a plurality of semiconductor chips are mounted on one lead frame. Therefore, at the time of wire bonding, one lead frame or one magazine is used as one unit for bonding.
After the bonding of one lead frame or one magazine was completed, the units were conveyed to the projector one by one. Therefore, many defective semiconductor devices have already been detected by the inspection device until a defective bonding state is found. It had the drawback of being manufactured).

【００３８】尚、上記実施例においては、第 3の座標点
Ｐ3 を作業者の手動操作にて指定したが、画像認識手段
を用いて自動検出するようにしてもよい。この場合カメ
ラによりワイヤループ上の座標点Ｐ3 を順に追っていく
とともに、この時同時に座標点Ｐ3 から、Ｐ1 、Ｐ2 を
通る直線に下ろした垂線の長さを算出し、この長さの最
大値をカール量としてモニタに表示するようにすること
もできる。In the above embodiment, the third coordinate point P3 was designated by the operator's manual operation, but it may be automatically detected by using the image recognition means. In this case, the camera follows the coordinate point P3 on the wire loop in order, and at the same time, the length of the perpendicular line drawn from the coordinate point P3 to the straight line passing through P1 and P2 is calculated, and the maximum value of this length is curled. It can be displayed on the monitor as a quantity.

【００３９】更に上記実施例において、ティーチング作
業時にボンディング位置座標Ｐ1 、Ｐ2 とともに基準パ
ターンを設定し、ボンディング時にボンディング対象部
品の画像をカメラにて取り込み、取り込んだ画像を基準
パターンと比較することによりボンディング位置座標の
補正を行ない、補正後のボンディング位置座標をＰ1、
Ｐ2 と置き換えても良い。Further, in the above embodiment, the reference pattern is set together with the bonding position coordinates P1 and P2 during the teaching operation, the image of the component to be bonded is captured by the camera at the time of bonding, and the captured image is compared with the reference pattern. Correct the position coordinates, and set the corrected bonding position coordinates to P1,
It may be replaced with P2.

【００４０】[0040]

【発明の効果】以上のように本発明によれば、ワイヤル
ープの真の検査をすることができる。As described above, according to the present invention, the true inspection of the wire loop can be performed.

【図面の簡単な説明】[Brief description of drawings]

【図１】図１は本発明の実施に用いられる演算回路の一
例を示すブロック図である。FIG. 1 is a block diagram showing an example of an arithmetic circuit used for implementing the present invention.

【図２】図２はカメラのモニタ画面を示す模式図であ
る。FIG. 2 is a schematic diagram showing a monitor screen of a camera.

【図３】図３はワイヤループを示す模式図である。FIG. 3 is a schematic view showing a wire loop.

【図４】図４はキャピラリの移動情報を示す模式図であ
る。FIG. 4 is a schematic diagram showing capillary movement information.

【図５】図５はワイヤボンディング状態を示す模式図で
ある。FIG. 5 is a schematic diagram showing a wire bonding state.

【図６】図６はカールの発生原因の一例を示す模式図で
ある。FIG. 6 is a schematic diagram showing an example of a cause of curl.

【符号の説明】[Explanation of symbols]

１Ａ 電極（ボンディング対象部品） ２ リード（ボンディング対象部品） ３ ワイヤ １０ カメラ１１ モニタ（表示手段） ３０ 演算制御装置1A electrode (bonding target part) 2 lead (bonding target part) 3 wire 10 camera 11 monitor (display means) 30 arithmetic and control unit

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/66 H21L 21/60 301 H01L 21/60 321 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/66 H21L 21/60 301 H01L 21/60 321

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 ボンディング作業位置に位置付けられた
ボンディング対象部品の画像をカメラで取込み、取り込
んだ画像からボンディング位置座標を求め、求めたボン
ディング位置座標にワイヤを接続するワイヤボンディン
グ装置において、 カメラによって撮像されたワイヤループの画像における
カール量最大部分を検出する画像認識手段と、画像認識
手段の検出結果に基づいてワイヤループの最大カール量
を演算し、該最大カール量を表示手段に表示させる演算
制御手段とを有してなることを特徴とするワイヤボンデ
ィング装置。1. An image of a bonding target positioned at a bonding work position is captured by a camera in a wire bonding apparatus that captures an image of a bonding target component with a camera, obtains bonding position coordinates from the captured image, and connects a wire to the obtained bonding position coordinates. Image recognition means for detecting the maximum curl amount portion in the image of the formed wire loop, and arithmetic control for calculating the maximum curl amount of the wire loop based on the detection result of the image recognition means and displaying the maximum curl amount on the display means. And a wire bonding apparatus. 【請求項２】 前記演算制御手段が、前記カメラの撮像
結果から求めた、２つのボンディング位置座標Ｐ1、Ｐ2
を通る直線の式を演算で求める手段と、前記カメラの撮
像結果から得た、ボンディングされたワイヤのループの
最大カール点Ｐ3から上記２点Ｐ1、Ｐ2を通る直線に対
して下ろした垂線の長さを演算で求める手段とを有して
構成される請求項１に記載のワイヤボンディング装置。2. The two bonding position coordinates P1 and P2 obtained by the arithmetic and control unit from the image pickup result of the camera.
Means for calculating the equation of a straight line passing through the length of the perpendicular line drawn from the maximum curl point P3 of the loop of the bonded wire obtained from the image pickup result of the camera to the straight line passing through the two points P1 and P2. The wire bonding apparatus according to claim 1, wherein the wire bonding apparatus is configured to have a means for calculating the height.
JP31138191A 1991-10-31 1991-10-31 Wire bonding equipment Expired - Fee Related JP3404755B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31138191A JP3404755B2 (en) 1991-10-31 1991-10-31 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31138191A JP3404755B2 (en) 1991-10-31 1991-10-31 Wire bonding equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2002077305A Division JP3476810B2 (en) 2002-02-12 2002-02-12 Wire bonding equipment

Publications (2)

Publication Number Publication Date
JPH05129408A JPH05129408A (en) 1993-05-25
JP3404755B2 true JP3404755B2 (en) 2003-05-12

Family

ID=18016497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31138191A Expired - Fee Related JP3404755B2 (en) 1991-10-31 1991-10-31 Wire bonding equipment

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Country Link
JP (1) JP3404755B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3476810B2 (en) 2002-02-12 2003-12-10 芝浦メカトロニクス株式会社 Wire bonding equipment

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0967582A (en) * 1995-08-31 1997-03-11 Hitachi Ltd Process and apparatus for preparing hydrogen/carbon monoxide mixed gas
KR100625939B1 (en) * 2005-07-28 2006-09-18 앰코 테크놀로지 코리아 주식회사 Method for detecting wire usage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3476810B2 (en) 2002-02-12 2003-12-10 芝浦メカトロニクス株式会社 Wire bonding equipment

Also Published As

Publication number Publication date
JPH05129408A (en) 1993-05-25

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