JPH0380345B2 - - Google Patents

Info

Publication number
JPH0380345B2
JPH0380345B2 JP57213892A JP21389282A JPH0380345B2 JP H0380345 B2 JPH0380345 B2 JP H0380345B2 JP 57213892 A JP57213892 A JP 57213892A JP 21389282 A JP21389282 A JP 21389282A JP H0380345 B2 JPH0380345 B2 JP H0380345B2
Authority
JP
Japan
Prior art keywords
pellet
pellets
bonding
wire
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57213892A
Other languages
Japanese (ja)
Other versions
JPS59105330A (en
Inventor
Susumu Iizaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57213892A priority Critical patent/JPS59105330A/en
Publication of JPS59105330A publication Critical patent/JPS59105330A/en
Publication of JPH0380345B2 publication Critical patent/JPH0380345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 本発明は数mm□ に迄及び集積回路（IC）ペレ
ツトおよび１mm□ 以下と小さなトランジスタ・ペ
レツトを混載固定した配線基板におけるペレツト
の電極パツドと、配線基板の表面に形成されたボ
ンデイングパツドとをワイヤで自動的に接続する
自動ワイヤボンダに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention applies to the electrode pads of the pellets in wiring boards on which integrated circuit (IC) pellets up to a few mm square and small transistor pellets of 1 mm square or less are mixed and fixed, and the electrode pads formed on the surface of the wiring board. This invention relates to an automatic wire bonder that automatically connects bonding pads with wires.

従来、ペレツト上の電極パツドと外部リードを
金線もしくはアルミ線等の細線（ワイヤ）で接続
するワイヤボンダにあつては、ICペレツトのパ
ツド認識、トランジスタ・ペレツトのパターン認
識を行ない位置補正を行なつて自動ボンデイング
をしているものが開発市板されている。 Conventionally, with wire bonders that connect electrode pads on pellets and external leads with thin wires such as gold wires or aluminum wires, position correction is performed by recognizing IC pellet pads and transistor pellet patterns. A product with automatic bonding has been developed and marketed.

しかし、現段階では、ICペレツトだけの自動
ワイヤボンダ、トランジスタ・ペレツトだけの自
動ワイヤボンダしか開発されていない。このため
ICペレツト、トランジスタ・ペレツトの混載さ
れている配線基板におけるワイヤボンデイングの
場合、配線基板はICペレツト用ワイヤボンダお
よびトランジスタ・ペレツト用ワイヤボンダと２
つの能力の異るワイヤボンダをそれぞれ用いなけ
ればならず、組立時間の増大、運搬時の取扱い不
良による歩留低下等好ましくない事態を招いてい
る。これは、小ペレツトおよび大ペレツトの位置
検出がともに行なえる検出系が設けられていない
ことによる。 However, at this stage, only automatic wire bonders for IC pellets and automatic wire bonders for transistor pellets have been developed. For this reason
In the case of wire bonding on a wiring board on which IC pellets and transistor pellets are mixed, the wiring board must be bonded with a wire bonder for IC pellets and a wire bonder for transistor pellets.
Wire bonders with different capacities must be used, leading to undesirable situations such as increased assembly time and decreased yield due to poor handling during transportation. This is because a detection system capable of detecting the positions of both small pellets and large pellets is not provided.

したがつて、本発明の目的は、１mm□ 以下の小
さなペレツトから数mm□ 以上と大きなペレツトを
混載固定した配線基板における各ペレツトのワイ
ヤボンデイングを一台の機械で自動的に行なえる
自動ワイヤボンダを提供することにより、この種
ワイヤボンデイング作業の高能率化、高歩留化を
図ることにある。 Therefore, an object of the present invention is to provide an automatic wire bonder that can automatically perform wire bonding of each pellet on a wiring board on which pellets as small as 1 mm or less to as large as several mm or more are mixed and fixed, using a single machine. By providing this, the purpose is to improve the efficiency and yield of this type of wire bonding work.

以下、実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.

第１図は本発明の一実施例による自動ワイヤボ
ンダを示す正面図、第２図は同じく配線基板の概
要を示す平面図、第３図は小ペレツトにおける位
置認識方法を説明するための原理図、第４図ａ，
ｂは大ペレツトにおける位置認識方法を説明する
ための原理図である。 Fig. 1 is a front view showing an automatic wire bonder according to an embodiment of the present invention, Fig. 2 is a plan view showing an outline of the wiring board, and Fig. 3 is a principle diagram for explaining the position recognition method in small pellets. Figure 4a,
b is a principle diagram for explaining the position recognition method for large pellets.

この実施例の自動ワイヤボンダでは、第２図に
示すように、ペレツトサイズが小さなトランジス
タ・ペレツト１２およびペレツトサイズが大きな
ICペレツト１３を主面に混載固定した配線基板
（セラミツク基板）１４において、配線基板１４
の主面に設けた配線層１５の先端のボンデイング
パツド１６と、各ペレツト１２，１３の電極パツ
ド１７とをワイヤ１８で接続する。第２図ではワ
イヤ１８を接続した状態のものを示す。 In the automatic wire bonder of this embodiment, as shown in FIG.
In the wiring board (ceramic board) 14 on which the IC pellet 13 is mounted and fixed on the main surface, the wiring board 14
The bonding pad 16 at the tip of the wiring layer 15 provided on the main surface of the pellet and the electrode pad 17 of each pellet 12, 13 are connected by a wire 18. FIG. 2 shows the state in which the wire 18 is connected.

第１図で示すように、自動ワイヤボンダでは、
ローダ１に入つている、ICペレツト１３、トラ
ンジスタ・ペレツト１２付完のセラミツク基板１
４をフイーダボンデイング点まで搬送して位置決
めする。Ｘ−Ｙテーブル６に搭載したテレビカメ
ラ等認識用の光学系７を用い、あらかじめプログ
ラムしておいた番地に付いたペレツトをモニタリ
ングして、認識装置８にてペレツトの位置ずれ量
（△ｘ，△ｙ，△θ）を測定する。この測定結果
に基づき、当初プログラムしておいたボンデイン
グツールの移動する位置を補正し、ボンデイング
ユニツト５によつてボンデイングツール４を制御
してボンデイングする。プログラムには配線基板
上のペレツトの品種やICとトランジスタの区別、
ボンデイングパツド１６側ボンデイング位置情報
も入力されている。ハイブリツドICのようにボ
ンデイングパツド側の印刷精度が悪い場合はペレ
ツト側の認識の他にボンデイングパツド１６の認
識も行うことも有る。ボンデイングの完了した製
品はアンローダ２に収納される。 As shown in Figure 1, the automatic wire bonder
Ceramic substrate 1 with IC pellet 13 and transistor pellet 12 included in loader 1
4 to the feeder bonding point and position it. Using an optical system 7 for recognition such as a television camera mounted on the X-Y table 6, the pellet attached to a pre-programmed address is monitored, and the recognition device 8 detects the amount of positional deviation (△x, △y, △θ). Based on this measurement result, the initially programmed moving position of the bonding tool is corrected, and the bonding unit 5 controls the bonding tool 4 to perform bonding. The program includes the types of pellets on the wiring board, the distinction between ICs and transistors,
Bonding position information on the bonding pad 16 side is also input. If the printing accuracy on the bonding pad side is poor, such as in a hybrid IC, the bonding pad 16 may also be recognized in addition to the recognition on the pellet side. The bonded product is stored in the unloader 2.

このワイヤボンダは操作パネル１０を操作して
光学系７による認識ペレツトの順序を指定するこ
とができる。また、位置認識状態はモニタテレビ
９に映し出される。さらに、ボンデイングツール
４はマニピユレータ１１を操作することによつて
手動で作動させることもできるようになつてい
る。 This wire bonder can specify the order of recognition pellets by the optical system 7 by operating the operation panel 10. Further, the position recognition state is displayed on the monitor television 9. Furthermore, the bonding tool 4 can also be operated manually by operating the manipulator 11.

ここで、光学系７によるペレツト位置検出方法
について説明する。 Here, a pellet position detection method using the optical system 7 will be explained.

第３図はペレツトサイズがたとえば0.4〜1.5mm
□ 程度の小さなペレツト、より具体的にはトラン
ジスタ・ペレツト１２の位置認識を行なう例を示
す。この場合、XYテーブル６は光学系７の視野
１９内にトランジスタ・ペレツト１２を位置さ
せ、基準ペレツト位置２０に対する実際に検出さ
れた検出ペレツト付け位置２１のずれ量△ｘ，△
ｙ，△θを常用のペレツト上の特徴的なパターン
位置を探し出すことによつて求める。そして、小
サイズペレツトでは光学系は１回の検出でペレツ
ト位置を検出する。 Figure 3 shows pellet size of, for example, 0.4 to 1.5 mm.
□ An example of recognizing the position of a small pellet, more specifically a transistor pellet 12, will be shown. In this case, the XY table 6 positions the transistor pellet 12 within the field of view 19 of the optical system 7, and determines the amount of deviation △x, △ of the actually detected detection pellet placement position 21 with respect to the reference pellet position 20.
y and Δθ are determined by finding the characteristic pattern position on the conventional pellet. For small-sized pellets, the optical system detects the pellet position with one detection.

第４図ａ，ｂはペレツトサイズがたとえば1.5
mm□ 以上のペレツト、より具体的にはICペレツ
ト１３の位置認識を行なう例を示す。XYテーブ
ル６はICペレツト１３の位置検出時には２箇所
を検出するようになつている。すなわち、光学系
の倍率は一定しているため、小サイズペレツトで
は前記のように一視野内に位置検出をするに充分
なペレツト部分が映し出される。しかし、たとえ
ば、1.5mm□ 以上のペレツトになると、同一視野
内にペレツトの位置認識ができる程度のペレツト
部分が映らなくなる。このため、ペレツトサイズ
が大きい場合には、対角線上に設けた２つの認識
用パツド（電極パツドでもよい。）２２，２３を
検出する。大ペレツトの位置検出は、最初に第４
図ａに示すように、視野１９内にICペレツト１
３の一隅を映し出し、基準認識用パツド２４，２
５のうち対応する基準認識用パツド２４に対する
一方の認識用パツド２２のずれを測定する。その
後、XYテーブル６はあらかじめ設定された長さ
だけ移動し、同図ｂで示すように、ICペレツト
１３の他の隅の認識用パツド２３を映し出し、他
の基準認識用パツド２５に対するずれ量を検出
し、基準ICペレツト２６に対するICペレツト１
３のずれ量△ｘ，△ｙ，△θを演算して求める。 In Figure 4 a and b, the pellet size is, for example, 1.5.
An example of recognizing the position of a pellet larger than mm□, more specifically an IC pellet 13, will be shown. The XY table 6 is designed to detect two locations when detecting the position of the IC pellet 13. That is, since the magnification of the optical system is constant, in the case of a small-sized pellet, a sufficient portion of the pellet to detect the position is projected within one field of view as described above. However, for example, if the pellet is 1.5 mm square or larger, the pellet cannot be seen within the same field of view to the extent that the pellet's position can be recognized. Therefore, when the pellet size is large, two recognition pads (or electrode pads may be used) 22 and 23 provided diagonally are detected. The position of the large pellet is first detected by the fourth
As shown in Figure a, there is an IC pellet 1 within the field of view 19.
Reflect one corner of 3 and mark the reference recognition pad 24, 2.
5, the deviation of one of the recognition pads 22 from the corresponding reference recognition pad 24 is measured. Thereafter, the XY table 6 is moved by a preset length, and as shown in FIG. IC pellet 1 relative to reference IC pellet 26
The deviation amounts △x, △y, and △θ of 3 are calculated and obtained.

そして、配線基板１４上の各ペレツトのずれ量
が検出された後は、演算系で各ワイヤボンデイン
グ位置を求め、ボンデイングユニツト５によつて
ボンデイングツール４を制御し、このワイヤボン
デイング機構により大・小ペレツトのワイヤボン
デイングを順次自動的に行なう。 After the amount of deviation of each pellet on the wiring board 14 is detected, the calculation system determines each wire bonding position, the bonding unit 5 controls the bonding tool 4, and this wire bonding mechanism Wire bonding of pellets is automatically performed sequentially.

このような実施例によれば、同一配線基板上に
固定された小さなペレツトから大きなペレツトに
亘つて、その固定位置ずれ量を自動的に検出し
て、ワイヤボンデイング機構の動きを自動的に修
正制御し、その後、自動的にワイヤボンデイング
を正確に行なう。このため、従来のようなペレツ
トサイズが異なる毎に所定のワイヤボンダを選択
使用する必要もなくなり、配線基板の運搬作業も
不要となることから、運搬ミスによつて配線基板
を損傷させることもなく歩留の向上とが図れる。
また、運搬作業が不要となることから、工完の短
縮も図ることができる。 According to this embodiment, the amount of deviation in the fixed position of small pellets to large pellets fixed on the same wiring board is automatically detected, and the movement of the wire bonding mechanism is automatically corrected and controlled. Then, wire bonding is automatically and accurately performed. This eliminates the need to select and use a predetermined wire bonder for each different pellet size, as was the case in the past, and eliminates the need to transport wiring boards, thereby increasing yields without damaging wiring boards due to transport errors. It is possible to improve the
Additionally, since no transportation work is required, the time required to complete the work can be shortened.

なお、本発明は前記実施例に限定されない。 Note that the present invention is not limited to the above embodiments.

以上のように、本発明によれば、１mm□ 以下の
小さなペレツトから数mm□ 以上と大きなペレツト
が混載固定されている配線基板におけるワイヤボ
ンデイングを一台のワイヤボンダで自動的に行な
えることから、ワイヤボンデイングの工完短縮、
歩留向上を図ることができる。 As described above, according to the present invention, a single wire bonder can automatically perform wire bonding on a wiring board on which pellets as small as 1 mm or less to as large as several mm or more are mixed and fixed. Wire bonding work completed faster,
Yield can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例による自動ワイヤボ
ンダを示す正面図、第２図は同じく配線基板の概
要を示す平面図、第３図は小ペレツトにおける位
置認識方法を説明するための原理図、第４図ａ，
ｂは大ペレツトにおける位置認識方法を説明する
ための原理図である。 １……ローダ、２……アンローダ、３……フイ
ーダ、４……ボンデイングツール、５……ボンデ
イングユニツト、６……XYテーブル、７……光
学系、９……モニタテレビ、１２……トランジス
タ・ペレツト、１３……ICペレツト、１４……
配線基板、１５……配線、１６……ボンデイング
パツド、１７……電極パツド、１８……ワイヤ、
１９……視野、２０……基準ペレツト位置、２１
……検出ペレツト付け位置、２２，２３……認識
用パツド、２４，２５……基準認識用パツド、２
６……基準ICペレツト。 Fig. 1 is a front view showing an automatic wire bonder according to an embodiment of the present invention, Fig. 2 is a plan view showing an outline of the wiring board, and Fig. 3 is a principle diagram for explaining the position recognition method in small pellets. Figure 4a,
b is a principle diagram for explaining the position recognition method for large pellets. 1... Loader, 2... Unloader, 3... Feeder, 4... Bonding tool, 5... Bonding unit, 6... XY table, 7... Optical system, 9... Monitor TV, 12... Transistor. Pellet, 13...IC pellet, 14...
Wiring board, 15... Wiring, 16... Bonding pad, 17... Electrode pad, 18... Wire,
19...Field of view, 20...Reference pellet position, 21
...Detection pellet attachment position, 22, 23...Recognition pad, 24, 25...Reference recognition pad, 2
6...Reference IC pellet.

Claims (1)

【特許請求の範囲】[Claims] １ 配線基板における各ペレツトの電極パツドと
配線基板表面に設けられたボンデイングパツドと
をワイヤで接続するワイヤボンダであつて、大き
さの異なるペレツトに対しその位置を検出する検
出機構と、その検出機構の情報に基づいてあらか
じめ記憶しているペレツト位置情報との位置ずれ
を補正する手段を有し、上記検出対象のペレツト
の大きさに応じ別異の位置検出基準を適用し得る
如くなしたことを特徴とする自動ワイヤボンダ。1. A wire bonder that connects the electrode pad of each pellet on a wiring board and a bonding pad provided on the surface of the wiring board with a wire, and a detection mechanism that detects the position of pellets of different sizes, and the detection mechanism. The present invention has a means for correcting the positional deviation from the pellet position information stored in advance based on the information of the pellet, and is capable of applying different position detection criteria depending on the size of the pellet to be detected. Automatic wire bonder with special features.
JP57213892A 1982-12-08 1982-12-08 Automatic wire bonder Granted JPS59105330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57213892A JPS59105330A (en) 1982-12-08 1982-12-08 Automatic wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57213892A JPS59105330A (en) 1982-12-08 1982-12-08 Automatic wire bonder

Publications (2)

Publication Number Publication Date
JPS59105330A JPS59105330A (en) 1984-06-18
JPH0380345B2 true JPH0380345B2 (en) 1991-12-24

Family

ID=16646738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57213892A Granted JPS59105330A (en) 1982-12-08 1982-12-08 Automatic wire bonder

Country Status (1)

Country Link
JP (1) JPS59105330A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5450267A (en) * 1977-09-27 1979-04-20 Matsushita Electric Ind Co Ltd Automatic wire bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5450267A (en) * 1977-09-27 1979-04-20 Matsushita Electric Ind Co Ltd Automatic wire bonding method

Also Published As

Publication number Publication date
JPS59105330A (en) 1984-06-18

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