JPS5841799B2 - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5841799B2 JPS5841799B2 JP7304880A JP7304880A JPS5841799B2 JP S5841799 B2 JPS5841799 B2 JP S5841799B2 JP 7304880 A JP7304880 A JP 7304880A JP 7304880 A JP7304880 A JP 7304880A JP S5841799 B2 JPS5841799 B2 JP S5841799B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- conductive pattern
- undercoat
- carbon paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は配線板片側で平面交差するクロスオーバー回路
を有する印刷配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board having a crossover circuit that intersects in plane on one side of the wiring board.
従来のクロスオーバーする回路を有する印刷配線板とし
ては、両面銅張積層板に穿孔し、スルホールメッキなど
の手段で表裏を導通させ、クロスオーバーする回路パタ
ーンを表面、裏面に形成する両面スルホール印刷配線板
が用いられていた。Conventional printed wiring boards with crossover circuits include double-sided through-hole printed wiring, in which holes are drilled in a double-sided copper-clad laminate, the front and back sides are made conductive by means such as through-hole plating, and crossover circuit patterns are formed on the front and back sides. board was used.
しかしながら、両面スルホール印刷配線板は製作するの
に工程数が多く、多量の薬品処理を施す必要がありコス
トの点でも不利となり、しかも多くの製造日数を要する
といった欠点があった。However, double-sided through-hole printed wiring boards require a large number of steps to manufacture, require a large amount of chemical treatment, are disadvantageous in terms of cost, and have the disadvantage of requiring a large number of manufacturing days.
このようなものに対して、銅張積層板の表面に銅箔パタ
ーンをエツチングにより形成し、これらの銅箔パターン
間で導通の必要とされるパターン間にある非接続パター
ン上に絶縁樹脂を塗布し、絶縁樹脂膜上をクロスオーバ
ーするように回路パターンを印刷により形成する印刷配
線板がある。For such items, copper foil patterns are formed on the surface of copper-clad laminates by etching, and insulating resin is applied on non-connecting patterns between patterns that require continuity between these copper foil patterns. However, there is a printed wiring board in which a circuit pattern is formed by printing so as to cross over an insulating resin film.
その−例を第１図に示すが、１は絶縁基板、２は導電パ
ターン、３は熱硬化性樹脂よりなるアンダーコート、４
は銀ペイント、５は熱硬化性樹脂よりなるオーバーコー
トであり、この構成のものにおいても製造工程上の問題
として銀移行が発生すること、また銀の移行防止のため
アンダーコート３、オーバーコート５の塗布膜厚を十分
に確保しなげればならないという欠点を有するものであ
った。An example thereof is shown in FIG. 1, where 1 is an insulating substrate, 2 is a conductive pattern, 3 is an undercoat made of thermosetting resin, and 4 is an insulating substrate.
is a silver paint, and 5 is an overcoat made of a thermosetting resin. Even with this configuration, silver migration occurs as a problem in the manufacturing process, and in order to prevent silver migration, undercoat 3 and overcoat 5 are used. This method has the disadvantage that a sufficient coating film thickness must be ensured.
また、カーボンペイントを用いて回路を構成するものと
して抵抗印刷配線板がある。Furthermore, there is a resistor printed wiring board that uses carbon paint to construct a circuit.
この抵抗印刷配線板はカーボンペイント塗布膜を抵抗と
しての機能を果すように設計され、その−例を第２図に
示す。This resistive printed wiring board is designed so that the carbon paint coating functions as a resistor, and an example thereof is shown in FIG.
第２図において６は絶縁基板であり、この絶縁基板６の
上面にはエツチング法などによって導電パターンＴが形
成され、その必要とする部分に熱硬化性樹脂のアンダー
コート８を印刷し、このアンダーコート８上にカーボン
ペイント９を印刷により形成し、このカーボンペイント
層９と上述の導電パターン７とを銀ペイント１０により
電気的に接続し、さらにこのカーボンペイント層９、銀
ペイント層１０上に熱硬化性樹脂よりなるオーバーコー
ト１１を施して構成されていた。In FIG. 2, reference numeral 6 denotes an insulating substrate, and a conductive pattern T is formed on the upper surface of this insulating substrate 6 by an etching method, etc., and an undercoat 8 of thermosetting resin is printed on the required portions, and this undercoat is A carbon paint 9 is formed on the coat 8 by printing, this carbon paint layer 9 and the above-mentioned conductive pattern 7 are electrically connected by a silver paint 10, and furthermore, this carbon paint layer 9 and the silver paint layer 10 are coated with heat. It was constructed by applying an overcoat 11 made of a curable resin.
この構成のものにおいても水分、大気、電荷の影響によ
り銀移行が発生し、下地の銅の導電パターン７に錆が発
生して回路抵抗値に大きなばらつきが生じたりし、それ
らを阻止するためにアンダーコ−）８やオーバーコート
１１の熱硬化性樹脂層を十分に確保しなげればならない
といった欠点をもつものであった。Even with this configuration, silver migration occurs due to the influence of moisture, the atmosphere, and electrical charges, and rust occurs on the underlying copper conductive pattern 7, causing large variations in circuit resistance. This method has the disadvantage that it is necessary to ensure sufficient thermosetting resin layers for the undercoat 8 and overcoat 11.
本発明は以上のような従来の欠点を除去し、クロスオー
バーする回路パターンを有する印刷配線板を安価に製造
できる構造をもつ印刷配線板を提供しようとするもので
ある。The present invention aims to eliminate the above-mentioned conventional drawbacks and provide a printed wiring board having a structure that allows printed wiring boards having crossover circuit patterns to be manufactured at low cost.
以下、本発明の実施例を図面第３図により説明する。Hereinafter, an embodiment of the present invention will be described with reference to FIG. 3 of the drawing.
１２は絶縁基板であり、この絶縁基板１２０片面には銅
箔をエツチングなどにより形成した導電パターン１３が
形成され、この導電パターン１３上の必要とする部分に
のみ紫外線硬化性樹脂のアンダーコート１４をパターン
状に形成し、このアンダーコート１４の施されない導電
パターン１３上に金あるいはニッケルなどの耐錆性の金
属めつき１５を施し、この金属めつき１５およびアンダ
ーコート１４上にカーボンペイント層１６を導体パター
ン１３に対してクロスオーバーするように設けて構成さ
れている。Reference numeral 12 denotes an insulating substrate. On one side of this insulating substrate 120, a conductive pattern 13 is formed by etching copper foil, and an undercoat 14 of ultraviolet curable resin is applied only to the necessary portions of the conductive pattern 13. A rust-resistant metal plating 15 such as gold or nickel is applied to the conductive pattern 13 on which the undercoat 14 is not applied, and a carbon paint layer 16 is applied on the metal plating 15 and the undercoat 14. It is provided and configured to cross over the conductor pattern 13.
そして、最終的には外形、孔加工、仕上げ加工を施して
印刷配線板とされる。Then, the printed wiring board is finally made into a printed wiring board by performing external shaping, hole processing, and finishing processing.
なお、上記のカーボンペイント層１６として用いるカー
ボンペイントの組成の一例としては以下のものがある。An example of the composition of the carbon paint used as the carbon paint layer 16 is as follows.
レゾール型フェノール樹脂 ７５重量部エポキシ
樹脂 ２５重量部
黒 鉛 ８５重量部カーボンブ
ラック ３５重量部シクロヘキサノール
１００重量部粘度調整用ジンジルアルコール
適量上記組成のものを３本ロールミルで均一分散
させたものを用いる。Resol type phenolic resin 75 parts by weight epoxy
Resin 25 parts by weight Graphite 85 parts by weight Carbon black 35 parts by weight Cyclohexanol
100 parts by weight Zingyl alcohol for viscosity adjustment
An appropriate amount of the above-mentioned composition is uniformly dispersed using a three-roll mill.
このように本発明の印刷配線板はクロスオーバー用の導
体として銀ペイントを使用しないため、銀移行などが無
くなり、電気的特性劣化の懸念が全くなく、銀移行防止
のためアンダーコートを１００μ以上にする必要もなく
なる。In this way, the printed wiring board of the present invention does not use silver paint as a crossover conductor, so there is no silver migration, and there is no concern about deterioration of electrical characteristics. There's no need to do that.
すなわち、本発明におけるアンダーコートとしては、紫
外線硬化型の一般の印刷配線板に用いられるソルダーレ
ジストインキで膜厚も１０〜２０μで十分な絶縁特性が
得られ、従来の熱硬化樹脂の硬化時の加熱による基材の
機械的強度の劣化や反りの発生を抑えることができ、し
かも銀移行防止のためのオーバーコートが不要となり製
造作業工数が従来のものに比べて少なくなり、また銅箔
よりなる導電パターン上に耐錆性の金属めっき層を設け
ることにより導電パターンとカーボンペイントの不十分
な密着性を改善し、銅箔よりなる導電パターンの錆など
の発生による回路抵抗値のばらつきも低くすることがで
きる。That is, the undercoat in the present invention is an ultraviolet curable solder resist ink used for general printed wiring boards, which has a film thickness of 10 to 20 μm and has sufficient insulation properties, and is similar to the conventional thermosetting resin when cured. It is possible to suppress the deterioration of the mechanical strength of the base material and the occurrence of warping due to heating, and there is no need for an overcoat to prevent silver migration, reducing the number of manufacturing steps compared to conventional products, and it is made of copper foil. Providing a rust-resistant metal plating layer on the conductive pattern improves the insufficient adhesion between the conductive pattern and carbon paint, and also reduces variations in circuit resistance caused by rust on the conductive pattern made of copper foil. be able to.
この耐錆性の金属めっき層には通常Ｎｉ−Ａｕめつきを
用いるが実施例としては特殊Ｎｉの６μ以上のめっきを
用いることにより安定した回路を形成することができる
。Ni--Au plating is normally used for this rust-resistant metal plating layer, but in this embodiment, a stable circuit can be formed by using special Ni plating with a thickness of 6 μm or more.
さらに低コストのカーボンペイントをスクリーン印刷に
よりクロスオーバー導体を形成できるため、コスト面で
も著しく有利となりカーボンペイント層の機械的、電気
的な保護として部分的にアンダーコートと同様にスクリ
ーン印刷でオーバーコートを施すことも可能である。Furthermore, since the crossover conductor can be formed by screen printing low-cost carbon paint, it is significantly advantageous in terms of cost, and an overcoat can be partially used to protect the carbon paint layer mechanically and electrically by screen printing in the same way as the undercoat. It is also possible to apply
第１図は従来の印刷配線板の要部断面図、第２図は他の
従来の抵抗印刷配線板の要部断面図、第３図は本発明の
印刷配線板の一実施例を示す要部断面図である。
１２・・・・・・絶縁基板、１３・・・・・・導電パタ
ーン、１４・・・・・・アンダーコート、１５・・・・
・・金属めっき、１６・・・・・・カーボンペイント層
。FIG. 1 is a cross-sectional view of a main part of a conventional printed wiring board, FIG. 2 is a cross-sectional view of a main part of another conventional resistance printed wiring board, and FIG. 3 is a main part showing an embodiment of a printed wiring board of the present invention. FIG. 12... Insulating substrate, 13... Conductive pattern, 14... Undercoat, 15...
...Metal plating, 16...Carbon paint layer.
Claims (1)
パターン面の必要部分にアンダーコートを施し、導電パ
ターンのアンダーコートの施されない部分に耐錆性の金
属めっき層を設け、この金属めっき層間を接続するカー
ボンペイントのクロスオーバーする回路を上記アンダー
コート上に設けたことを特徴とする印刷配線板。1 A conductive pattern is formed on one side of an insulating substrate, an undercoat is applied to the necessary parts of the conductive pattern surface, a rust-resistant metal plating layer is provided on the part of the conductive pattern that is not undercoated, and a layer is formed between the metal plating layers. A printed wiring board characterized in that a crossover circuit of connecting carbon paint is provided on the undercoat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7304880A JPS5841799B2 (en) | 1980-05-30 | 1980-05-30 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7304880A JPS5841799B2 (en) | 1980-05-30 | 1980-05-30 | printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56169397A JPS56169397A (en) | 1981-12-26 |
| JPS5841799B2 true JPS5841799B2 (en) | 1983-09-14 |
Family
ID=13507087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7304880A Expired JPS5841799B2 (en) | 1980-05-30 | 1980-05-30 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5841799B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6172592U (en) * | 1984-10-16 | 1986-05-17 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60170295A (en) * | 1984-02-15 | 1985-09-03 | 東芝ケミカル株式会社 | Method of producing multilayer circuit board |
-
1980
- 1980-05-30 JP JP7304880A patent/JPS5841799B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6172592U (en) * | 1984-10-16 | 1986-05-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56169397A (en) | 1981-12-26 |
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