JP3175381B2 - Electrical contact material and its manufacturing method - Google Patents
Electrical contact material and its manufacturing methodInfo
- Publication number
- JP3175381B2 JP3175381B2 JP02477193A JP2477193A JP3175381B2 JP 3175381 B2 JP3175381 B2 JP 3175381B2 JP 02477193 A JP02477193 A JP 02477193A JP 2477193 A JP2477193 A JP 2477193A JP 3175381 B2 JP3175381 B2 JP 3175381B2
- Authority
- JP
- Japan
- Prior art keywords
- pure
- electrical contact
- layer
- contact material
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は電気接点材料とその製造
方法に関するものであり、さらに詳しくはＡｇ合金電気
接点材料の耐磨耗性をそのまま維持して耐食性を大幅に
改善した電気接点材料とその製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical contact material and a method for producing the same, and more particularly, to an electrical contact material which has significantly improved corrosion resistance while maintaining the wear resistance of an Ag alloy electrical contact material. The present invention relates to the manufacturing method.
【０００２】[0002]
【従来の技術】ＡｇおよびＡｇ合金は、優れた耐食性、
半田接合性、電気接合性を有するため、単体、あるいは
強度および経済性の観点から導電性基体上に被覆された
状態で電気、電子部品材料として広く用いられている。
電気接点材料としても多用されているが、Ａｇは硬度が
低く耐磨耗性に劣るため、主に軽負荷の開閉接点に用い
られ、Ａｇ合金は硬度が高く耐磨耗性に優れているた
め、高負荷の開閉接点や摺動接点材料等に用いられてい
る。そして電気接点材料としてはＡｇ合金が用いられる
ことが多く、合金成分としてはＣｕ、Ｎｉ、Ｓｎ、Ｓｂ
等のイオン化傾向がＡｇよりも大きい金属が通常使用さ
れている。2. Description of the Related Art Ag and Ag alloys have excellent corrosion resistance,
Since it has solder bonding property and electric bonding property, it is widely used as a material for electric or electronic parts, alone or coated on a conductive substrate from the viewpoint of strength and economy.
Although it is often used as an electrical contact material, Ag has low hardness and poor abrasion resistance, so it is mainly used for light load switching contacts, and Ag alloy has high hardness and excellent wear resistance. It is used for high load switching contacts and sliding contact materials. An Ag alloy is often used as an electrical contact material, and Cu, Ni, Sn, Sb
Metals having a higher ionization tendency than Ag are usually used.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、Ａｇ合
金の合金成分がＡｇよりもイオン化傾向の大きい金属の
場合、Ａｇに比べて耐食性が劣り、経時的に腐食が進行
して接触抵抗が増加するという問題があった。耐食性を
改善する手段としては、種々の防錆処理が提案されてい
るが、Ａｇ合金を形成する成分の全てに吸着して防錆効
果が得られるものがなく、僅かな効果しか得られていな
いのが現状である。However, when the alloy component of the Ag alloy is a metal having a greater ionization tendency than Ag, the corrosion resistance is inferior to that of Ag, and the corrosion proceeds with time, and the contact resistance increases. There was a problem. As a means for improving corrosion resistance, various rust preventive treatments have been proposed, but none of them can adsorb all of the components forming the Ag alloy to provide a rust preventive effect, and only a slight effect is obtained. is the current situation.
【０００４】[0004]
【課題を解決するための手段】本発明はこのような状況
に鑑み鋭意検討の結果開発されたもので、その第１発明
は、Ａｇ合金の表面に厚さ０．０１〜０．５μｍの純Ａ
ｇ層を設け、さらにその上に脂肪族アミン、メルカプタ
ンのいずれかまたは両者の混合物からなる有機被膜を設
けたことを特徴とする電気接点材料であり、第２発明は
Ａｇ合金の表面に電気メッキまたは置換メッキにより厚
さ０．０１〜０．５μｍの純Ａｇ層を形成した後、脂肪
族アミン、メルカプタンのいずれかまたは両者を含む溶
液中に浸漬することにより純Ａｇ層の表面に有機被膜を
形成することを特徴とする電気接点材料の製造方法であ
る。SUMMARY OF THE INVENTION The present invention has been developed as a result of intensive studies in view of such circumstances, and its first invention is to provide a pure Ag having a thickness of 0.01 to 0.5 .mu.m on the surface of an Ag alloy. A
g contact layer comprising an organic coating comprising an aliphatic amine, a mercaptan or a mixture of both, and a second invention provides an electroplating material on the surface of an Ag alloy. Alternatively, after forming a pure Ag layer having a thickness of 0.01 to 0.5 μm by displacement plating, an organic film is formed on the surface of the pure Ag layer by dipping in a solution containing one or both of an aliphatic amine and mercaptan. A method for producing an electrical contact material, characterized by being formed.
【０００５】[0005]
【作用】本発明電気接点材料において、Ａｇ合金の表面
に純Ａｇ層を設けたのはＡｇ合金の成分同士の電食作用
を防止するためである。その厚さを０．０１〜０．５μ
ｍと限定した理由は、０．０１μｍ未満ではメッキにピ
ンホール欠陥が多く、上記効果が不十分であり、０．５
μｍを超えると摺動接点として使用した場合、摺動によ
り有機被膜が破れた後、軟らかい純Ａｇ層との摺動とな
るため、摩擦係数が増加して作動力が変動するためであ
る。好ましい厚さは０．０５〜０．２μｍである。純Ａ
ｇ層の上に脂肪族アミン、メルカプタンのいずれかまた
は両者の混合物からなる有機被膜を設けたのは、純Ａｇ
層の耐磨耗性を改善するためである。本発明で用いる脂
肪族アミン、メルカプタンとしては、ドデシルアミン、
アイコシルアミン、ノニルアミン、ドデシルメルカプタ
ン、オクタデシルメルカプタン、アイコシルメルカプタ
ン、ノニルメルカプタン等である。また本発明に適用で
きるＡｇ合金としては、ＡｇーＣｕ、ＡｇーＮｉ、Ａｇ
ーＳｎ、ＡｇーＳｂ、ＡｇーＣｄ、ＡｇーＦｅ、Ａｇー
Ｉｎ、ＡｇーＺｎ、ＡｇーＬｉ、ＡｇーＣｏ、ＡｇーＳ
ｅ、ＡｇーＰｂ等が挙げられる。本発明電気接点材料
は、Ａｇ合金の表面に純Ａｇ層を設けたことにより、Ａ
ｇに対して吸着しやすい脂肪族アミン、メルカプタンに
よる表面処理を可能とし、有機被膜と純Ａｇ層の組み合
わせが摩擦係数を小さくし、摺動および開閉動作によっ
て純Ａｇ層が消耗、脱落した後、本来のＡｇ合金との接
触となる。接点材料の接点部分は、ほんの一部であるの
が通常であり、接点部分以外で腐食が進行して、クリー
プ作用により腐食生成物が接点部分を覆ってしまうこと
をも本発明電気接点材料では防止できる。電気接点材料
の形状は特に限定されるものではなく、例えば、線材、
条材、棒材、管材等を挙げることができる。The reason why the pure Ag layer is provided on the surface of the Ag alloy in the electrical contact material of the present invention is to prevent the electrolytic corrosion of the components of the Ag alloy. The thickness is 0.01-0.5μ
The reason for limiting to m is that if it is less than 0.01 μm, there are many pinhole defects in the plating and the above effect is insufficient,
If the thickness exceeds μm, when used as a sliding contact, the organic film is broken by sliding and then slides with a soft pure Ag layer, so that the friction coefficient increases and the operating force fluctuates. The preferred thickness is between 0.05 and 0.2 μm. Pure A
The organic film made of an aliphatic amine or a mercaptan or a mixture of both is provided on the g layer by pure Ag.
This is for improving the wear resistance of the layer. As the aliphatic amine and mercaptan used in the present invention, dodecylamine,
Eikosylamine, nonylamine, dodecylmercaptan, octadecylmercaptan, eicosylmercaptan, nonylmercaptan and the like. Ag alloys applicable to the present invention include Ag-Cu, Ag-Ni, Ag
-Sn, Ag-Sb, Ag-Cd, Ag-Fe, Ag-In, Ag-Zn, Ag-Li, Ag-Co, Ag-S
e, Ag-Pb and the like. The electrical contact material according to the present invention is characterized in that the pure Ag layer is provided on the surface of the Ag alloy,
After the surface treatment with an aliphatic amine and mercaptan that are easily adsorbed to g, the combination of the organic film and the pure Ag layer reduces the friction coefficient, and after the pure Ag layer is consumed and falls off by sliding and opening and closing operations, It comes into contact with the original Ag alloy. The contact part of the contact material is usually only a small part, and the corrosion of the corrosion part over the contact part due to the creep action progresses at the part other than the contact part. Can be prevented. The shape of the electrical contact material is not particularly limited, for example, a wire,
Strips, rods, pipes and the like can be mentioned.
【０００６】本発明電気接点材料の製造方法は、前記し
たＡｇ合金を常法により脱脂、活性化の前処理を施した
後、通常の電気メッキまたは置換メッキにより厚さ０．
０１〜０．５μｍの純Ａｇ層を形成した後、脂肪族アミ
ン、メルカプタンのいずれかまたは両者を含む溶液中に
浸漬処理して、純Ａｇ層の上に有機被膜を形成するもの
である。溶液中の脂肪族アミン、メルカプタンの濃度は
特に限定することはないが、概ね０．０１〜５重量％と
なるように、トルエン、アセトン、トリクロロエタン等
の適当な溶剤により溶解して用いることができる。浸漬
処理の方法は、純Ａｇ層を形成した材料を浸漬するだけ
でよい。処理時間は特に限定することはなく、概ね０．
１秒以上で目的とする有機被膜が形成される。In the method for producing an electrical contact material according to the present invention, the above-mentioned Ag alloy is subjected to a pretreatment for degreasing and activation by a conventional method, and then to a thickness of 0.1 mm by ordinary electroplating or displacement plating.
After forming a pure Ag layer of 01 to 0.5 μm, the organic film is formed on the pure Ag layer by immersion treatment in a solution containing either or both of aliphatic amine and mercaptan. The concentration of the aliphatic amine or mercaptan in the solution is not particularly limited, but it can be dissolved in a suitable solvent such as toluene, acetone, or trichloroethane so as to be approximately 0.01 to 5% by weight. . The method of the immersion treatment only needs to immerse the material on which the pure Ag layer is formed. The processing time is not particularly limited.
The desired organic coating is formed in 1 second or longer.
【０００７】[0007]
【実施例】次に本発明を実施例により更に詳細に説明す
る。表１に示す各種Ａｇ合金（厚さ０．３ｍｍ、幅２０
ｍｍ、長さ１００ｍｍ）の表面に下記の製造工程で、純
Ａｇ層および有機被膜を形成し、各種電気接点材料を得
た。 製造工程 電解脱脂 （ＮａＯＨ ５０ｇ／ｌ、界面活性剤 １０
ｇ／ｌ、温度 ６０℃、陰極電流密度 ２Ａ／ｄｍ2 、
時間 ３０秒）→水洗→活性化（ＫＣＮ １００ｇ／ｌ
室温 ６０秒）→純Ａｇ層形成（電気メッキ：ＡｇＣ
Ｎ ３ｇ／ｌ、ＫＣＮ ６０ｇ／ｌ、陰極、電流密度
１Ａ／ｄｍ2 。置換メッキ：ＡｇＮＯ3７．５ｇ／ｌ、
アンモニア水 ７５ｇ／ｌ、チオ硫酸ナトリウム １０
０ｇ／ｌ、室温）→水洗→乾燥（温風）→有機被膜形成
（溶剤 トルエン、脂肪族アミン、メルカプタン濃度
０．５重量％、室温３０秒）→乾燥（温風） これらの電気接点材料について、動摩擦係数の測定およ
び硫化試験後の接触抵抗の測定をおこなった。動摩擦係
数については、ヘッド頭部５ｍｍのＡｇ棒を用い、荷重
５０ｇ、摺動距離１０ｍｍで、摺動回数１０回、２０
回、５０回、１００回について測定した。硫化試験は、
ＪＥＩＤＡ２５規格に基づき、Ｈ2 Ｓ３ｐｐｍの雰囲気
中に４０℃で、２４時間暴露した。その後接触抵抗を測
定した。それらの結果を表２に示す。Next, the present invention will be described in more detail by way of examples. Various Ag alloys shown in Table 1 (thickness 0.3 mm, width 20
(mm, length: 100 mm), a pure Ag layer and an organic film were formed on the surface by the following manufacturing process to obtain various electrical contact materials. Manufacturing process Electrolytic degreasing (NaOH 50 g / l, surfactant 10
g / l, temperature 60 ° C., cathode current density 2 A / dm 2 ,
Time 30 seconds) → water washing → activation (KCN 100g / l)
Room temperature 60 seconds) → Pure Ag layer formation (Electroplating: AgC
N 3 g / l, KCN 60 g / l, cathode, current density
1 A / dm 2 . Displacement plating: AgNO 3 7.5 g / l,
Aqueous ammonia 75 g / l, sodium thiosulfate 10
0g / l, room temperature) → water washing → drying (warm air) → organic film formation (solvent concentration of toluene, aliphatic amine, mercaptan)
(0.5% by weight, room temperature for 30 seconds) → drying (hot air) For these electric contact materials, the measurement of the dynamic friction coefficient and the measurement of the contact resistance after the sulfuration test were performed. Regarding the coefficient of kinetic friction, an Ag rod with a head head of 5 mm was used, the load was 50 g, the sliding distance was 10 mm, the number of times of sliding was 10, 20 times.
Times, 50 times and 100 times. The sulfurization test is
Based on JEIDA25 standard, it was exposed to an atmosphere of 3 ppm of H 2 S at 40 ° C. for 24 hours. Thereafter, the contact resistance was measured. Table 2 shows the results.
【０００８】[0008]
【表１】 [Table 1]
【０００９】[0009]
【表２】 [Table 2]
【００１０】表２から明らかなように、本発明例No. １
〜１８は、耐磨耗性を維持しておりかつ従来例No. ２５
に比較して耐食性が大幅に向上していることが判る。こ
れに対し本発明の範囲を外れる比較例No. １９〜２４
は、耐磨耗性、耐食性のいずれかが劣ることが判る。As is clear from Table 2, the present invention No. 1
Nos. 18 to 18 maintain the abrasion resistance and have the conventional example No. 25.
It can be seen that the corrosion resistance is significantly improved as compared to On the other hand, Comparative Examples Nos. 19 to 24 outside the scope of the present invention
Indicates that either of the abrasion resistance and the corrosion resistance is inferior.
【００１１】[0011]
【発明の効果】以上述べたように、本発明によれば耐磨
耗性、耐食性のいずれにも優れた電気接点材料が得られ
るもので工業上顕著な効果を奏するものである。As described above, according to the present invention, an electrical contact material excellent in both abrasion resistance and corrosion resistance can be obtained, and has a remarkable industrial effect.
フロントページの続き (56)参考文献 特開 昭60−228695（ＪＰ，Ａ) 特開 昭48−84743（ＪＰ，Ａ) 特開 平３−252006（ＪＰ，Ａ) 特開 平２−226619（ＪＰ，Ａ) 特開 昭59−205111（ＪＰ，Ａ) 特開 昭57−188700（ＪＰ，Ａ) 特開 昭62−199796（ＪＰ，Ａ) 特開 平３−215697（ＪＰ，Ａ) 特開 平４−370613（ＪＰ，Ａ) 特公 昭27−4859（ＪＰ，Ｂ１) (58)調査した分野(Int.Cl.7，ＤＢ名) C25D 5/00 - 7/12 H01H 1/00 - 1/04 H01H 11/00 - 11/06 Continuation of front page (56) References JP-A-60-228695 (JP, A) JP-A-48-84743 (JP, A) JP-A-3-252006 (JP, A) JP-A-2-22619 (JP) JP-A-59-205111 (JP, A) JP-A-57-188700 (JP, A) JP-A-62-199796 (JP, A) JP-A-3-215697 (JP, A) 4-370613 (JP, A) JP 274859 (JP, B1) (58) Fields investigated (Int. Cl. 7 , DB name) C25D 5/00-7/12 H01H 1/00-1 / 04 H01H 11/00-11/06
Claims (2)
μｍの純Ａｇ層を設け、さらにその上に脂肪族アミン、
メルカプタンのいずれかまたは両者の混合物からなる有
機被膜を設けたことを特徴とする電気接点材料。A thickness of 0.01 to 0.5 on the surface of the Ag alloy.
A pure Ag layer of μm is provided, and an aliphatic amine,
An electrical contact material provided with an organic coating comprising at least one of mercaptan or a mixture of both.
メッキにより厚さ０．０１〜０．５μｍの純Ａｇ層を形
成した後、脂肪族アミン、メルカプタンのいずれかまた
は両者を含む溶液中に浸漬することにより純Ａｇ層の表
面に有機被膜を形成することを特徴とする電気接点材料
の製造方法。2. After a pure Ag layer having a thickness of 0.01 to 0.5 μm is formed on the surface of the Ag alloy by electroplating or displacement plating, it is immersed in a solution containing either or both of an aliphatic amine and mercaptan. Forming an organic film on the surface of the pure Ag layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02477193A JP3175381B2 (en) | 1993-01-20 | 1993-01-20 | Electrical contact material and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02477193A JP3175381B2 (en) | 1993-01-20 | 1993-01-20 | Electrical contact material and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06212491A JPH06212491A (en) | 1994-08-02 |
| JP3175381B2 true JP3175381B2 (en) | 2001-06-11 |
Family
ID=12147436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02477193A Expired - Fee Related JP3175381B2 (en) | 1993-01-20 | 1993-01-20 | Electrical contact material and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3175381B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9425031D0 (en) * | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
| JP2008192610A (en) | 2007-01-12 | 2008-08-21 | Furukawa Electric Co Ltd:The | Electrical contact member, method for producing the same, and electrical contact |
| JP4729064B2 (en) * | 2007-04-03 | 2011-07-20 | 古河電気工業株式会社 | Electrical contact material, manufacturing method thereof, and electrical contact |
| US7972655B2 (en) * | 2007-11-21 | 2011-07-05 | Enthone Inc. | Anti-tarnish coatings |
| US7631798B1 (en) * | 2008-10-02 | 2009-12-15 | Ernest Long | Method for enhancing the solderability of a surface |
| JP2010166044A (en) * | 2008-12-19 | 2010-07-29 | Furukawa Electric Co Ltd:The | Lead frame for optical semiconductor device, and method for manufacturing the same |
| JP6472191B2 (en) * | 2014-02-07 | 2019-02-20 | 神鋼リードミック株式会社 | Plug connector |
| JP6809856B2 (en) * | 2016-09-29 | 2021-01-06 | Ｄｏｗａメタルテック株式会社 | Silver plating material and its manufacturing method |
| JP2020200503A (en) * | 2019-06-10 | 2020-12-17 | 日本電産株式会社 | Electrical contact material, and manufacturing method of electrical contact material |
-
1993
- 1993-01-20 JP JP02477193A patent/JP3175381B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06212491A (en) | 1994-08-02 |
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