JP3092118B2 - Conductive particle transfer type anisotropic conductive film and electrical connection method - Google Patents
Conductive particle transfer type anisotropic conductive film and electrical connection methodInfo
- Publication number
- JP3092118B2 JP3092118B2 JP03314014A JP31401491A JP3092118B2 JP 3092118 B2 JP3092118 B2 JP 3092118B2 JP 03314014 A JP03314014 A JP 03314014A JP 31401491 A JP31401491 A JP 31401491A JP 3092118 B2 JP3092118 B2 JP 3092118B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive particles
- circuit board
- conductive
- film
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Wire Bonding (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、2つの回路基板間の端
子の電気的接続方法に関する。さらに詳しくは、本発明
は、回路基板に接続すべき端子が細密なピッチで多数形
成されている場合でも、端子間にショートを発生させる
ことなく2つの回路基板間の端子を確実にかつ容易に接
続できるようにする電気的接続方法、及びこのような電
気的接続方法に使用する導電粒子転写型異方性導電フィ
ルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for electrically connecting terminals between two circuit boards. More specifically, the present invention reliably and easily connects terminals between two circuit boards without causing a short circuit between the terminals even when a large number of terminals to be connected to the circuit boards are formed at a fine pitch. electrical connection method to be able to connect, and relates to a conductive particle transfer type anisotropic conductive Fi <br/> Le beam for use in such electrical connection.
【0002】[0002]
【従来の技術】液晶パネルとTABとを接続する場合の
ように、2つの回路基板間の端子を電気的に接続する方
法としては、従来より、異方性導電性接着剤を使用する
方法が知られている。この方法においては、熱硬化性あ
るいは熱可塑性接着剤中に半田粒子、ニッケル粒子等の
金属粒子や樹脂粒子に金メッキを施した粒子等の導電粒
子を分散させた異方性導電性接着剤を使用し、このよう
な異方性導電性接着剤を2つの回路基板間に介在させ、
加熱加圧することにより相対する2端子間の電気的接続
が得られるようにする(特開昭51−114439号公
報)。2. Description of the Related Art As a method for electrically connecting terminals between two circuit boards, such as when a liquid crystal panel is connected to a TAB, a method using an anisotropic conductive adhesive has conventionally been used. Are known. In this method, an anisotropic conductive adhesive is used in which conductive particles such as metal particles such as solder particles and nickel particles and gold-plated resin particles are dispersed in a thermosetting or thermoplastic adhesive. Then, such an anisotropic conductive adhesive is interposed between the two circuit boards,
By applying heat and pressure, an electrical connection between two opposing terminals can be obtained (Japanese Patent Laid-Open No. 51-114439).
【0003】このような異方性導電性接着剤に類する接
合材として、熱可塑性樹脂からなるシート状絶縁基材中
に導電粒子を、その基材の一方の面に接するかあるいは
基材の一方の面から露出するように埋設したものも知ら
れている。この接合材の使用方法としては、まず第1の
回路基板の端子面と接合材の導電粒子とを加熱溶着させ
る。次に加熱溶着させた接合材上に第2の回路基板を加
熱加圧してその接合材のシート状絶縁基材を溶融させ、
2つの回路基板間を接合すると共に、第1の回路基板の
端子に溶着していた導電粒子と第2の回路基板の端子と
を接合させる(特開昭64−14886号公報)。[0003] As a bonding material similar to such an anisotropic conductive adhesive, conductive particles are placed in a sheet-like insulating base material made of a thermoplastic resin, in contact with one surface of the base material or one side of the base material. Some are buried so as to be exposed from the surface. As a method of using the bonding material, first, the terminal surface of the first circuit board and the conductive particles of the bonding material are heated and welded. Next, the second circuit board is heated and pressurized on the heat-welded joining material to melt the sheet-like insulating base material of the joining material,
The two circuit boards are joined together, and the conductive particles welded to the terminals of the first circuit board are joined to the terminals of the second circuit board (JP-A-64-14886).
【0004】また、ICチップをTABに接続する方法
としては、バンプ形成用基板上にメッキによって金柱を
作成し、これをTABに位置合わせして転写し、接続す
る転写バンプ方式が知られている。As a method of connecting an IC chip to a TAB, a transfer bump method is known in which a gold pillar is formed on a bump-forming substrate by plating, this is aligned with the TAB, transferred, and connected. I have.
【0005】更に、印刷やディッピング等により導電性
接着剤を回路基板の接続すべきパターン上のみに載せる
方法も知られている。Further, a method is also known in which a conductive adhesive is placed only on a pattern to be connected to a circuit board by printing, dipping, or the like.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、従来の
異方性導電性接着剤を使用する方法では、2つの回路基
板の接続すべき端子を含む接着領域の全面に異方性導電
性接着剤を介在させるので、接続すべき端子間だけでな
く他の隣接する端子間にも導電粒子が存在することとな
る。そのため、端子のピッチが細密になるとショートし
易くなるという問題があった。このような問題に対して
は、異方性導電性接着剤中の導電粒子の配合量を少なく
することも考えられているが、導電粒子の配合量を少な
くすると接続すべき端子間に存在する導電粒子も少なく
なるので導通信頼性が低下するという問題があった。However, in the conventional method using the anisotropic conductive adhesive, the anisotropic conductive adhesive is applied to the entire surface of the bonding area including the terminals to be connected between the two circuit boards. Since they are interposed, the conductive particles exist not only between the terminals to be connected but also between other adjacent terminals. For this reason, there has been a problem that short-circuiting is likely to occur when the terminal pitch is fine. For such a problem, it is considered to reduce the amount of the conductive particles in the anisotropic conductive adhesive. However, if the amount of the conductive particles is reduced, there is a gap between the terminals to be connected. There is a problem that conduction reliability is reduced because the number of conductive particles is reduced.
【0007】また、転写バンプ方式においては、メッキ
によって金柱を作成する工程、およびこれをTABと位
置合わせする工程が必要となるので、工程数が多く作業
性も悪いという問題があった。In addition, the transfer bump method requires a step of forming a gold pillar by plating and a step of aligning the same with TAB, so that there is a problem that the number of steps is large and workability is poor.
【0008】更に、印刷やディッピング等により導電性
接着剤を回路基板の接続すべきパターン上のみに載せる
方法においては、所定のパターン上のみに導電性接着剤
を載せる技術が難しいという問題があった。また、2つ
の回路基板間の接合を端子パターンどうしの接着のみで
行うこととなるので接着強度や信頼性が低下するという
問題もあった。Furthermore, in the method of placing the conductive adhesive only on the pattern to be connected to the circuit board by printing, dipping, or the like, there is a problem that it is difficult to apply the conductive adhesive only on a predetermined pattern. . In addition, since the bonding between the two circuit boards is performed only by bonding between the terminal patterns, there is a problem that the bonding strength and reliability are reduced.
【0009】本発明は以上のような従来技術の課題を解
決しようとするものであり、2つの回路基板間の端子
を、接続すべき端子が回路基板に細密なピッチで多数形
成されている場合でも、ショートを発生させることな
く、高い導通信頼性が得られるように確実にかつ容易に
接続できるようにすることを目的としている。An object of the present invention is to solve the above-mentioned problems of the prior art. When a large number of terminals to be connected to two circuit boards are formed on the circuit board at a fine pitch. However, it is an object of the present invention to enable reliable and easy connection so that high conduction reliability can be obtained without causing a short circuit.
【0010】[0010]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明は、フィルム上に形成されたバインダー層
により1層の導電粒子が保持されており、且つその導電
粒子がバインダー層から突出している導電粒子転写型異
方性導電フィルムにおいて、該バインダー層とそれによ
り保持された導電粒子が、樹脂バインダー中に導電粒子
を分散させた分散液を、バインダー層の厚さが導電粒子
の粒径以下となるようにフィルム上に塗布することによ
り設けられたものであることを特徴とする導電粒子転写
型異方性導電フィルムを提供する。In order to achieve the above-mentioned object, the present invention provides a method in which one layer of conductive particles is held by a binder layer formed on a film, and the conductive particles are separated from the binder layer. Protruding conductive particle transfer type
In an anisotropic conductive film, the binder layer and the
Conductive particles held in the resin binder
Is dispersed in a binder layer having a thickness of conductive particles.
By coating on the film so that the particle size is
The present invention provides a conductive particle transfer type anisotropic conductive film, characterized in that the film is provided.
【0011】また、この導電粒子転写型異方性導電フィ
ルムを使用して第1の回路基板の端子と第2の回路基板
の端子とを電気的に接続する本発明の電気的接続方法と
して、第1の回路基板の端子面と上述の導電粒子転写型
異方性導電フィルムの導電粒子が保持されている面とを
重ね合わせ、両者を加熱圧着し、剥離して第1の回路基
板の端子上に導電粒子のみを転写させ、次いで、導電粒
子を転写させた第1の回路基板の端子面と第2の回路基
板の端子面とを接着剤を介して加熱圧着することを特徴
とする電気的接続方法を提供する。 The conductive particle transfer type anisotropic conductive film
As an electrical connection method of the present invention in which the terminal of the first circuit board and a terminal of the second circuit board are electrically connected using Lum, conductive particles of the terminal surface and the upper predicate of the first circuit board Transfer type
The surface on which the conductive particles of the anisotropic conductive film are held
Overlapping, thermocompression bonding both, peeling to only the conductive particles are transferred to the first circuit board of the terminal, then the terminal surfaces of the first circuit board is transferred to the conductive particles and the second circuit board The present invention provides an electrical connection method characterized in that the terminal surface is heated and press-bonded with an adhesive via an adhesive.
【0012】以下、本発明の電気的接続方法を図面に基
づいて具体的に説明する。なお、図中、同一符号は同一
または同等の構成要素を表している。Hereinafter, the electrical connection method of the present invention will be specifically described with reference to the drawings. In the drawings, the same reference numerals represent the same or equivalent components.
【0013】図1および図2は、それぞれ本発明の電気
的接続方法の工程説明図であり、図1の(a)および図
2の(a)は共に本発明の方法に使用する導電粒子転写
型異方性導電フィルムの一例の断面図である。同図のよ
うに、本発明の導電粒子転写型異方性導電フィルム1
は、フィルム2上に導電粒子3を1層保持させたものと
なっている。このように導電粒子を1層保持させること
により、後述するようにこの転写フィルムを回路基板に
1次圧着した時に回路基板の端子に均一に導電粒子を融
着させることが可能となる。FIG. 1 and FIG. 2 are process explanatory diagrams of the electrical connection method of the present invention, respectively. FIG. 1 (a) and FIG. 2 (a) both show conductive particle transfer used in the method of the present invention.
It is sectional drawing of an example of a type | mold anisotropic conductive film. As shown in the figure, the conductive particle transfer type anisotropic conductive film 1 of the present invention
Is a film in which one layer of conductive particles 3 is held on a film 2. By holding one layer of the conductive particles in this way, it is possible to uniformly fuse the conductive particles to the terminals of the circuit board when the transfer film is first pressure-bonded to the circuit board as described later.
【0014】この導電粒子転写型異方性導電フィルム1
の形成方法としては、例えば、樹脂バインダー液中に導
電粒子3を分散させ、そのバインダー液をフィルム2上
にバインダー層4の厚さが導電粒子3の粒径以下となる
ように塗布すればよい。これにより図示したように、1
層の導電粒子3がバインダー層4によりフィルム2上に
突出するように保持された形態の導電粒子転写型異方性
導電フィルム1を得ることができる。This conductive particle transfer type anisotropic conductive film 1
For example, the conductive particles 3 may be dispersed in a resin binder liquid, and the binder liquid may be applied on the film 2 so that the thickness of the binder layer 4 is equal to or less than the particle diameter of the conductive particles 3. . As a result, as shown in FIG.
The conductive particle transfer type anisotropic conductive film 1 in a form in which the conductive particles 3 of the layer are held so as to protrude above the film 2 by the binder layer 4 can be obtained.
【0015】導電粒子転写型異方性導電フィルム1に使
用するフィルム2としては、耐熱性のものが好ましく、
例えばポリイミドフィルム、テフロン等を使用すること
ができる。The film 2 used for the conductive particle transfer type anisotropic conductive film 1 is preferably a heat-resistant film.
For example, a polyimide film, Teflon, or the like can be used.
【0016】また、導電粒子転写型異方性導電フィルム
1に使用する導電粒子3としては、金属表面を有する種
々の粒子を使用することができるが、接続する回路基板
の端子の素材に応じて選択することが好ましい。例え
ば、図1の(b)に示すように、回路基板5の端子5a
上に金メッキ層あるいはニッケルメッキ層5bが形成さ
れている場合や端子がグリコートで処理されている場合
には、導電粒子としては半田粒子、錫粒子、インジウム
粒子、その他これらの合金粒子、もしくは半田メッキ、
錫メッキ、インジウムメッキ等を施した粒子を使用す
る。また、回路基板の端子がアルミニウムからなる場合
には、金粒子または金メッキ粒子を使用する。さらに、
図2の(b)に示すように、回路基板5の端子5a上に
半田メッキ層あるいは錫メッキ層5cが形成されている
場合には、導電粒子3としては半田付け可能な金属粒子
または金属メッキ粒子を使用する。As the conductive particles 3 used in the conductive particle transfer type anisotropic conductive film 1, various particles having a metal surface can be used, but depending on the material of the terminal of the circuit board to be connected. It is preferable to select. For example, as shown in FIG.
When a gold plating layer or a nickel plating layer 5b is formed thereon, or when the terminal is treated with glycoat, the conductive particles are solder particles, tin particles, indium particles, other alloy particles thereof, or solder plating. ,
Use particles plated with tin or indium. When the terminals of the circuit board are made of aluminum, gold particles or gold-plated particles are used. further,
As shown in FIG. 2B, when a solder plating layer or a tin plating layer 5c is formed on the terminals 5a of the circuit board 5, the conductive particles 3 may be solderable metal particles or metal plating. Use particles.
【0017】導電粒子3の形状としては、球形、針状、
柱状、板状、不定形など種々のものを使用できるが球形
のものを使用するのが好ましい。また、粒径としては、
0.5〜50μmのものを使用することが好ましく、粒
径分布はできるだけ均一であることが好ましい。The shape of the conductive particles 3 is spherical, acicular,
Various types such as columnar, plate-like and irregular shapes can be used, but it is preferable to use spherical ones. Also, as the particle size,
It is preferable to use one having a size of 0.5 to 50 μm, and it is preferable that the particle size distribution is as uniform as possible.
【0018】本発明の電気的接続方法においては、ま
ず、上記のような導電粒子転写型異方性導電フィルム1
を用いて電気的接続用回路基板を作成する。すなわち、
図1の(b)あるいは図2の(b)に示したように、第
1の回路基板5の接続すべき端子5aと導電粒子転写型
異方性導電フィルム1の導電粒子3が保持されている面
とを重ね合わせ、両者を加熱圧着(1次圧着)する。こ
の1次圧着の加熱加圧条件は、回路基板5の端子5aや
導電粒子3の種類に応じて、端子5aと導電粒子3とが
融着するように適宜設定すればよい。例えば図1の
(b)に示したように、金メッキ処理されている端子5
aに対して、導電粒子3として半田粒子を保持した導電
粒子転写型異方性導電フィルム1を1次圧着する場合に
は、半田粒子からなる導電粒子3が溶融して端子5aと
導電粒子3とが融着するようにすればよく、また、図2
の(b)に示したように、半田メッキ処理されている端
子5aに対して導電粒子転写型異方性導電フィルム1を
1次圧着する場合には、端子5a上の半田層5cが溶融
して端子5aと導電粒子3とが融着するようにすればよ
い。In the electrical connection method of the present invention, first, the conductive particle transfer type anisotropic conductive film 1 as described above is used.
To create a circuit board for electrical connection using. That is,
As shown in FIG. 1B or FIG. 2B, the terminal 5a to be connected to the first circuit board 5 is connected to the conductive particle transfer type.
Superimposed and surface conductive particles 3 of the anisotropic conductive film 1 is held, thermocompression bonding of both (primary bonding). The heating and pressurizing conditions for the first pressure bonding may be appropriately set according to the type of the terminal 5a and the conductive particles 3 of the circuit board 5 so that the terminal 5a and the conductive particles 3 are fused. For example, as shown in FIG.
against a, conductive holding the solder particles as the conductive particles 3
When the particle transfer type anisotropic conductive film 1 is first pressure-bonded, the conductive particles 3 made of solder particles may be melted so that the terminal 5a and the conductive particles 3 are fused.
As shown in (b), when the conductive particle transfer type anisotropic conductive film 1 is first pressure-bonded to the solder-plated terminal 5a, the solder layer 5c on the terminal 5a melts. The terminal 5a and the conductive particles 3 may be fused together.
【0019】1次圧着後は、図1の(c)あるいは図2
の(c)に示したように、第1の回路基板5と導電粒子
転写型異方性導電フィルム1とを互いに剥離して第1の
回路基板5の端子5a上に導電粒子3のみを転写させ、
端子5a上にのみ導電粒子3が存在している電気的接続
用回路基板6を得る。After the first pressure bonding, FIG.
(C), the first circuit board 5 and the conductive particles
The transfer type anisotropic conductive film 1 is separated from each other, and only the conductive particles 3 are transferred onto the terminals 5a of the first circuit board 5,
The circuit board 6 for electrical connection in which the conductive particles 3 exist only on the terminal 5a is obtained.
【0020】次いで、図1の(d)あるいは図2の
(d)に示したように、端子5a上にのみ導電粒子3が
存在している電気的接続用回路基板6と第2の回路基板
7とをそれらの端子5a、7aを内側にし、間に接着剤
として接着フィルム8を置いて重ね合わせ、加熱圧着
(本圧着)する。これにより、第1の回路基板5と第2
の回路基板7とは、その全面が接着フィルムで接着され
るので強い接着強度で接続される。しかも、第1の回路
基板5には、その端子5aにのみ導電粒子3が存在して
いるので、第1の回路基板5の端子5aと第2の回路基
板7の端子7aとはショート等の導通不良を起こすこと
無く確実に接続される。Next, as shown in FIG. 1 (d) or FIG. 2 (d), the circuit board 6 for electrical connection in which the conductive particles 3 are present only on the terminal 5a and the second circuit board 7 are placed with their terminals 5a and 7a on the inside, an adhesive film 8 is placed as an adhesive between them, and they are superimposed and heat-pressed (finally pressed). As a result, the first circuit board 5 and the second
The circuit board 7 is bonded with a strong adhesive strength because the entire surface thereof is adhered with an adhesive film. Moreover, since the conductive particles 3 are present only in the terminals 5a of the first circuit board 5, the terminals 5a of the first circuit board 5 and the terminals 7a of the second circuit board 7 may not be short-circuited. The connection is ensured without causing conduction failure.
【0021】ここで、接着フィルム8としては、熱硬化
性あるいは熱可塑性の樹脂フィルムを使用することがで
きる。また、接着剤としてこのようなフィルムを使用す
ることなく、従来の異方性導電性接着剤に使用されてい
た熱硬化性あるいは熱可塑性の樹脂液を2つの回路基板
間に塗布してもよい。Here, as the adhesive film 8, a thermosetting or thermoplastic resin film can be used. Further, without using such a film as an adhesive, a thermosetting or thermoplastic resin liquid used for a conventional anisotropic conductive adhesive may be applied between two circuit boards. .
【0022】また、本圧着の加熱加圧条件は、両回路基
板の端子素材、導電粒子3の種類、接着剤の種類等に応
じて、適宜設定すればよい。The heating and pressurizing conditions for the final press bonding may be appropriately set according to the terminal materials of the two circuit boards, the type of the conductive particles 3 and the type of the adhesive.
【0023】[0023]
【作用】本発明の導電粒子転写型異方性導電フィルム
は、熱可塑性樹脂からなるシート状絶縁基材の表面付近
に導電粒子を埋設した従来の接合材(特開昭64−14
886号公報)と同様に使用することができ、それによ
り従来の異方性導電性接着剤を使用していた電気的接続
方法よりも導通信頼性を向上させることが可能となる
が、本発明の電気的接続方法にしたがって使用すること
により、回路基板に端子が細密なピッチで多数形成され
ている場合でも、ショートを発生させることなく接続す
ることを可能とする。すなわち、本発明の電気的接続方
法によれば、フィルム上に導電粒子を1層に保持させた
導電粒子転写型異方性導電フィルムを使用し、この導電
粒子転写型異方性導電フィルムの導電粒子を第1の回路
基板の接続すべき端子上のみに転写し、次いで、接着剤
を介して第1の回路基板と第2の回路基板とを接着する
ので、導電粒子は回路基板の接続すべき端子以外の部分
には存在しないこととなる。したがって、ショートが起
こらなくなる。また、導電粒子転写型異方性導電フィル
ムの導電粒子の密度を上げることにより2つの回路基板
の端子間を接続する導電粒子の数を多くすることができ
るので、導通信頼性を向上させることが可能となる。The conductive particle-transfer-type anisotropic conductive film of the present invention is a conventional bonding material in which conductive particles are embedded near the surface of a sheet-like insulating base material made of a thermoplastic resin (Japanese Patent Application Laid-Open No. Sho 64-14).
886 JP) and can be used as well, whereby it becomes possible to improve the continuity reliability than electric connection method that used the conventional anisotropic conductive adhesive, the present invention By using the electrical connection method described above, even if a large number of terminals are formed on the circuit board at a fine pitch, the connection can be made without causing a short circuit. That is, according to the electrical connection method of the present invention, the conductive particles are held in one layer on the film.
Using conductive particles transfer type anisotropic conductive film, the conductive
The conductive particles of the particle transfer type anisotropic conductive film are transferred only to the terminals to be connected on the first circuit board, and then the first circuit board and the second circuit board are bonded via an adhesive. Therefore, the conductive particles do not exist in portions other than the terminals to be connected on the circuit board. Therefore, no short circuit occurs. Also, by increasing the density of the conductive particles of the conductive particle transfer type anisotropic conductive film, the number of conductive particles connecting between the terminals of the two circuit boards can be increased, so that the conduction reliability can be increased. Can be improved.
【0024】さらに、従来の転写バンプ方式と異なり、
ICチップにバンプを形成することやバンプと回路基板
との位置合わせをすることが不要となるので、2つの回
路基板の電気的接続工程が容易となる。Further, unlike the conventional transfer bump method,
Since it is not necessary to form a bump on the IC chip or to position the bump and the circuit board, an electrical connection process between the two circuit boards is facilitated.
【0025】[0025]
【実施例】以下、本発明を実施例に基づいて具体的に説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on embodiments.
【0026】実施例1 ポリエステル樹脂(VE3220、ユニチカ製)のME
K15%溶液100重量部に、イソシアネート(コロネ
ートL、日本ポリウレタン(株)製)0.15重量部、
ベンゾグアナミン粒子にニッケル、金メッキを施した導
電粒子(ブライト20GNR10EH、直径10μm、
日本化学工業(株)製)1.5重量部を均一に分散し、
この分散液を厚さ25μmのポリイミドフィルムに平均
厚さが5μmとなるように塗布し、導電粒子転写型異方
性導電フィルム(導電粒子面積率、約21%)を作成し
た。Example 1 ME of polyester resin (VE3220, manufactured by Unitika)
0.15 parts by weight of isocyanate (Coronate L, manufactured by Nippon Polyurethane Co., Ltd.) was added to 100 parts by weight of a K15% solution,
Benzoguanamine particles are nickel and gold-plated conductive particles (Bright 20GNR10EH, diameter 10 μm,
1.5 parts by weight of Nippon Chemical Industry Co., Ltd.
The average thickness of the polyimide film having a thickness of 25μm The dispersion was coated with a 5 [mu] m, the conductive particles transfer type anisotropically
A conductive film (area ratio of conductive particles, about 21%) was prepared.
【0027】次に、この導電粒子転写型異方性導電フィ
ルムを適当な大きさにカットしてTAB(厚さ75μm
のポリイミドフィルム基材上、厚さ35μmの銅に厚さ
1μmの半田メッキ(錫:鉛=8:2)を施した端子が
0.1mmピッチで形成されているもの)の上に置き、
190℃、5Kg/cm2、5秒で1次圧着した。冷却
後、TABから導電粒子転写型異方性導電フィルムを剥
離した。この様子を画像処理装置で観察したところ、導
電粒子転写型異方性導電フィルムの導電粒子の約7割が
TABに転着し、端子上の導電粒子の面積率は15%と
なっていた。Next, this conductive particle transfer type anisotropic conductive film is cut into an appropriate size to obtain TAB (thickness: 75 μm).
Placed on a polyimide film substrate having terminals formed by applying a solder plating (tin: lead = 8: 2) having a thickness of 1 μm to a copper having a thickness of 35 μm at a pitch of 0.1 mm,
The first compression bonding was performed at 190 ° C., 5 kg / cm 2 for 5 seconds. After cooling, the conductive particle transfer type anisotropic conductive film was peeled off from the TAB. Observation of the appearance in the image processing apparatus, guide
About 70% of the conductive particles of the electroconductive particle transfer type anisotropic conductive film were transferred to TAB, and the area ratio of the conductive particles on the terminal was 15%.
【0028】次ぎに、このTABに表1の組成のエポキ
シ系接着フィルムを仮圧着し、その後0.1mmピッチ
のITOパターンが形成されているガラス基板と170
℃、40Kg/cm2、20秒で本圧着した。Next, an epoxy-based adhesive film having the composition shown in Table 1 was preliminarily pressure-bonded to the TAB, and then a glass substrate on which an ITO pattern having a pitch of 0.1 mm was formed.
° C., and the pressure bonding at 40Kg / cm 2, 20 sec.
【0029】[0029]
【表1】 (エポキシ系接着フィルム組成) (成分) (重量部) ビスフェノールA型エポキシ(Ep1007、油化シェル製) 36.02 ビスフェノールA型エポキシ(Ep828、油化シェル製) 36.02 エポキシシランカップリング剤(A187、日本ユニカ) 1.95 変性イミダゾール(Hx3748、旭化成工業) 26.00 (Epoxy adhesive film composition) (Components) (parts by weight) Bisphenol A type epoxy (Ep1007, manufactured by Yuka Shell) 36.02 Bisphenol A type epoxy (Ep828, manufactured by Yuka Shell) 36.02 Epoxysilane Coupling agent (A187, Nippon Yunika) 1.95 Modified imidazole (Hx3748, Asahi Kasei Kogyo) 26.00
【0030】その結果、TABとITOパターンの初期
抵抗は最大9Ωであり、MIL STD 202F10
6Eによる1000時間のエージング後も最大15Ωと
安定していた。また、ショートの発生はなかった。As a result, the initial resistance of the TAB and ITO patterns is 9Ω at the maximum, and the MIL STD 202F10
After aging for 1000 hours by 6E, the resistance was stable at 15Ω at the maximum. No short circuit occurred.
【0031】実施例2 導電粒子として直径10μmの半田粒子(スパークルミ
ロンNo.1635MF、千住金属(株)製)を6部使
用した以外は実施例1と同様にして導電粒子転写型異方
性導電フィルムを作成した。Example 2 A conductive particle transfer type anisotropic material was used in the same manner as in Example 1 except that 6 parts of solder particles (Sparkle Milon No. 1635MF, manufactured by Senju Metal Co., Ltd.) having a diameter of 10 μm were used as the conductive particles.
A conductive film was prepared.
【0032】この導電粒子転写型異方性導電フィルムを
実施例1と同様にTABに1次圧着し、剥離した。その
結果TABの端子上の導電粒子の面積率は18%となっ
ていた。This conductive particle transfer type anisotropic conductive film was first pressure-bonded to TAB in the same manner as in Example 1 and peeled off. As a result, the area ratio of the conductive particles on the terminals of the TAB was 18%.
【0033】次ぎに、実施例1と同様にしてTABとI
TOパターンが形成されているガラス基板とを本圧着し
た。その結果、初期抵抗は最大8Ωであり、MIL S
TD202F106Eによる1000時間のエージング
後も最大19Ωと安定していた。また、ショートの発生
はなかった。Next, in the same manner as in the first embodiment, TAB and I
The glass substrate on which the TO pattern was formed was completely pressure bonded. As a result, the initial resistance is up to 8Ω and the MIL S
After aging by TD202F106E for 1000 hours, the maximum value was stable at 19Ω. No short circuit occurred.
【0034】参考例1 ポリエステル剥離フィルムを布でこすり帯電させた後、
実施例2と同様の半田粒子を載せ、余分な半田粒子を払
い落としてポリエステル剥離フィルム上に1層の半田粒
子を付着させた。この半田粒子を耐熱性粘着テープ(P
ET8083、ソニーケミカル(株)製)にハンドロー
ラを用いて転着させ、導電粒子転写型異方性導電フィル
ムを作成した。 Reference Example 1 After rubbing and charging a polyester release film with a cloth,
The same solder particles as in Example 2 were placed, and excess solder particles were wiped off to attach one layer of solder particles onto the polyester release film. The solder particles are converted into a heat-resistant adhesive tape (P
ET8083 (manufactured by Sony Chemical Co., Ltd.) using a hand roller to prepare a conductive particle transfer type anisotropic conductive film .
【0035】次ぎに、実施例1と同様にしてTABとI
TOパターンが形成されているガラス基板とを本圧着し
た。その結果、初期抵抗は最大5Ωであり、MIL S
TD202F106Eによる1000時間のエージング
後も最大15Ωと安定していた。また、ショートの発生
はなかった。Next, TAB and I
The glass substrate on which the TO pattern was formed was completely pressure bonded. As a result, the initial resistance is at most 5Ω and the MIL S
Even after aging for 1000 hours by TD202F106E, it was stable at a maximum of 15Ω. No short circuit occurred.
【0036】比較例1 実施例1で使用したエポキシ系接着フィルムと同様の組
成の樹脂バインダーに実施例2と同様の半田粒子を30
phr配合し、異方性導電膜を作成した。この異方性導
電膜の粒子面積率を測定したところ20%であった。COMPARATIVE EXAMPLE 1 30 resin particles similar to those in Example 2 were added to a resin binder having the same composition as the epoxy adhesive film used in Example 1.
phr was blended to prepare an anisotropic conductive film. When the particle area ratio of this anisotropic conductive film was measured, it was 20%.
【0037】次に、この異方性導電膜を、実施例1と同
様のTABとITOパターンが形成されているガラス基
板との間に挟み、170℃、40Kg/cm2、20秒
で圧着した。その結果、パターン上の粒子面積率は17
%であった。また、初期抵抗は最大7Ωであり、MIL
STD 202F106Eによる1000時間のエー
ジング後も最大19Ωと安定していたが、パターン間で
粒子が連なり、ショートが120ピン中4箇所発生して
いた。Next, this anisotropic conductive film was sandwiched between the same TAB as in Example 1 and a glass substrate having an ITO pattern formed thereon, and pressed at 170 ° C., 40 kg / cm 2 for 20 seconds. As a result, the particle area ratio on the pattern was 17
%Met. The initial resistance is 7Ω at the maximum, and MIL
Even after aging by STD 202F106E for 1000 hours, the maximum value was stable at 19Ω, but the particles continued between the patterns, and short-circuiting occurred at four places in 120 pins.
【0038】[0038]
【発明の効果】本発明によれば、2つの回路基板間の端
子を接続するにあたり、接続すべき端子が回路基板に細
密なピッチで多数形成されている場合でも、ショートを
発生させることなく、高い導通信頼性が得られるように
確実にかつ容易に接続することが可能となる。According to the present invention, when connecting terminals between two circuit boards, even if a large number of terminals to be connected are formed at a fine pitch on the circuit board, short-circuiting does not occur. The connection can be reliably and easily made so that high conduction reliability can be obtained.
【図1】本発明の電気的接続方法の工程説明図である。FIG. 1 is a process explanatory view of an electrical connection method of the present invention.
【図2】本発明の電気的接続方法の工程説明図である。FIG. 2 is a process explanatory view of the electrical connection method of the present invention.
1 導電粒子転写型異方性導電フィルム 2 フィルム 3 導電粒子 4 バインダー層 5 第1の回路基板 5a 第1の回路基板の端子 6 電気的接続用回路基板 7 第2の回路基板 7a 第2の回路基板の端子 8 接着フィルム1 conductive particle transfer type anisotropic conductive film 2 film 3 conductive particles 4 binder layer 5 first circuit board 5a terminal of first circuit board 6 circuit board for electrical connection 7 second circuit board 7a second circuit Board terminals 8 Adhesive film
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI // H01R 12/06 H01R 9/09 C (56)参考文献 特開 平2−54932(JP,A) 特開 昭63−53805(JP,A) 特開 平3−16147(JP,A) 特開 平4−30532(JP,A) 実開 平3−128937(JP,U) (58)調査した分野(Int.Cl.7,DB名) H01L 21/60 311 H01L 21/60 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI // H01R 12/06 H01R 9/09 C (56) References JP-A-2-54932 (JP, A) JP-A-63- 53805 (JP, A) JP-A-3-16147 (JP, A) JP-A-4-30532 (JP, A) JP-A-3-128937 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/60 311 H01L 21/60
Claims (2)
より1層の導電粒子が保持されており、且つその導電粒
子がバインダー層から突出している導電粒子転写型異方
性導電フィルムにおいて、該バインダー層とそれにより
保持された導電粒子が、樹脂バインダー中に導電粒子を
分散させた分散液を、バインダー層の厚さが導電粒子の
粒径以下となるようにフィルム上に塗布することにより
設けられたものであることを特徴とする導電粒子転写型
異方性導電フィルム。1. An anisotropic conductive particle transfer type in which one layer of conductive particles is held by a binder layer formed on a film, and the conductive particles protrude from the binder layer.
Conductive film, the binder layer and thereby
The held conductive particles form the conductive particles in the resin binder.
Dispersed dispersion liquid, the thickness of the binder layer of the conductive particles
By applying on the film so that the particle size is less than
The conductive particles transfer type anisotropic conductive film, characterized in that those provided.
の端子とを電気的に接続する方法において、第1の回路
基板の端子面と請求項1記載の導電粒子転写型異方性導
電フィルムの導電粒子が保持されている面とを重ね合わ
せ、両者を加熱圧着し、剥離して第1の回路基板の端子
上に導電粒子のみを転写させ、次いで、導電粒子を転写
させた第1の回路基板の端子面と第2の回路基板の端子
面とを接着剤を介して加熱圧着することを特徴とする電
気的接続方法。2. A method of terminal of the first circuit board and a terminal of the second circuit board are electrically connected, the conductive particles transfer type anisotropically of claim 1, wherein the terminal surface of the first circuit board Gender
Conductive film conductive particles causes <br/> superimposing a plane that is held in, and thermocompression bonding the two, only the conductive particles are transferred to the first circuit board of the terminal was peeled off, and then, the conductive particles A terminal surface of the first circuit board and the terminal surface of the second circuit board, onto which the surface has been transferred, is heated and pressed via an adhesive.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3-199966 | 1991-07-14 | ||
JP19996691 | 1991-07-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0574846A JPH0574846A (en) | 1993-03-26 |
JP3092118B2 true JP3092118B2 (en) | 2000-09-25 |
Family
ID=16416567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03314014A Expired - Lifetime JP3092118B2 (en) | 1991-07-14 | 1991-10-31 | Conductive particle transfer type anisotropic conductive film and electrical connection method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3092118B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0565216U (en) * | 1992-02-20 | 1993-08-31 | 光郎 大田 | Umbrella handle and its accessories |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4958417B2 (en) * | 2005-08-12 | 2012-06-20 | 旭化成イーマテリアルズ株式会社 | Conductive particle transfer sheet and connection structure |
JP5049176B2 (en) * | 2008-03-27 | 2012-10-17 | ソニーケミカル&インフォメーションデバイス株式会社 | BONDED BODY AND ITS MANUFACTURING METHOD, AND ANISOTROPIC CONDUCTIVE MATERIAL AND ITS MANUFACTURING METHOD |
JP5375708B2 (en) * | 2010-03-29 | 2013-12-25 | パナソニック株式会社 | Manufacturing method of semiconductor device |
CN103180079B (en) | 2010-11-08 | 2016-03-30 | 松下知识产权经营株式会社 | The manufacture method of solder transfer substrate, solder pre-coating method and solder transfer substrate |
-
1991
- 1991-10-31 JP JP03314014A patent/JP3092118B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0565216U (en) * | 1992-02-20 | 1993-08-31 | 光郎 大田 | Umbrella handle and its accessories |
Also Published As
Publication number | Publication date |
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JPH0574846A (en) | 1993-03-26 |
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