JPH01315906A - Anisotropic electrically conductive film - Google Patents
Anisotropic electrically conductive filmInfo
- Publication number
- JPH01315906A JPH01315906A JP14721288A JP14721288A JPH01315906A JP H01315906 A JPH01315906 A JP H01315906A JP 14721288 A JP14721288 A JP 14721288A JP 14721288 A JP14721288 A JP 14721288A JP H01315906 A JPH01315906 A JP H01315906A
- Authority
- JP
- Japan
- Prior art keywords
- grains
- conductive film
- film
- particles
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 10
- 238000002844 melting Methods 0.000 claims abstract description 9
- 230000008018 melting Effects 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims description 30
- 239000002923 metal particle Substances 0.000 claims description 16
- 239000004020 conductor Substances 0.000 abstract description 21
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 239000012212 insulator Substances 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910052593 corundum Inorganic materials 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229910052738 indium Inorganic materials 0.000 abstract description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract description 2
- 125000006850 spacer group Chemical group 0.000 abstract description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 2
- 239000011324 bead Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920006122 polyamide resin Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は導体端子とフレキシブル回路板（ＦＰＣ）等を
電気的かつ機械的に接続するための異方性導電膜に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an anisotropic conductive film for electrically and mechanically connecting a conductor terminal and a flexible circuit board (FPC) or the like.
電子機器の小形高能率化にともない回路板端子部などへ
の配線接続もまずます微細かつ高密化しつつある。この
ような微細接続技術の一つに異方性導電膜と呼ばれる接
続部材か実用に供せられている。これ等は熱可塑性樹脂
層中に金属や黒鉛などの導電体粒子（以下、導体粒子と
呼ぶ）を適量分散させたものて、これを被接続部間に挟
み込み加熱と同時に加圧して接続部とうしを接着する。As electronic equipment becomes smaller and more efficient, the wiring connections to circuit board terminals are becoming increasingly finer and denser. As one of such fine connection techniques, a connection member called an anisotropic conductive film has been put into practical use. These are made by dispersing an appropriate amount of conductor particles (hereinafter referred to as conductor particles) such as metal or graphite in a thermoplastic resin layer, which is sandwiched between the parts to be connected and heated and pressurized at the same time to form the connection part. Glue the
このとき樹脂層中に分散していた導体粒子は互に接触し
て加圧方向に導通状態となり、同時に樹脂が硬化して被
接続部とうしを接着・固定する。−方、加圧方向と垂直
な方向では導体粒子の接触が起りにくいため、導体粒子
は接触せず電気的絶縁か保たれる。At this time, the conductor particles dispersed in the resin layer come into contact with each other and become electrically conductive in the pressing direction, and at the same time, the resin hardens to bond and fix the connected portion and the cowl. On the other hand, in the direction perpendicular to the pressurizing direction, contact between the conductor particles is unlikely to occur, so the conductor particles do not come into contact and electrical insulation is maintained.
異方性導電膜はこのような特性を持つため、従来、はん
だ付か困難な高密度プリント基板の端子部の接続や、非
常に多数かつ微細な端子（ランド）に、夫々リート線群
を一括接続する必要があるドツトマトリクス型表示パネ
ルへの利用などが進みつつある。従来、このような異方
性導電膜には、溶剤型アクリル樹脂などの基剤に導体粒
子として、はんだ、ニッケル、黒鉛などのいずれか−種
を混合したものか用いられていた。この内でもはんだ粒
子を用いたものは、粒子が熱可塑性樹脂の流動温度での
加熱により溶融して接触面積が著しく増加するため、接
続抵抗が低く、特性が安定していた。Because anisotropic conductive films have these characteristics, they can be used to connect the terminals of high-density printed circuit boards, which are difficult to solder, and to connect groups of REET wires to extremely large numbers of minute terminals (lands) at once. It is increasingly being used in dot matrix type display panels that require Conventionally, such anisotropic conductive films have been made using a base material such as a solvent-type acrylic resin mixed with conductive particles such as solder, nickel, or graphite. Among these, those using solder particles had low connection resistance and stable characteristics because the particles were melted by heating at the flow temperature of the thermoplastic resin and the contact area increased significantly.
しかし、上述した従来の異方性導電膜には次の様な欠点
があった。それは、加熱、加圧条件を極めて精密に制御
する必要かあることて、その理由を第３図および第４図
により説明する。第３図は、従来の異方性導電膜４０の
断面を模式的に示す図、第４図はこの異方性導電膜４０
を用い、２枚の回路板２０および３０の相対する端子２
１と３１を電気的に接続した場合を示す図である。この
異方性導電膜４０において熱可塑性樹脂層４］はアクリ
ル系樹脂でアクリルポリマーに可塑剤などを加えたもの
てあり、一方、金属粒子４２は、直径的１０〜２０ μ
ｍのＰｂ−３ｍ−Ｉｎ系はんだボールである。また、回
路板２０は銀箔とポリイミドから成るフレキシブル回路
板（ＦＰＣ）てあり、回路板３０は通常のプリント配線
板（ＰＷＢ）である。これ等を接続する異方性導電膜４
０の全体の厚さは、約２５μｍ〜５０μｍ程度で、厚さ
は端子２１．３１の厚みの合計と端子の巾寸法と端子間
隔の比率なとによって適宜選択する。However, the conventional anisotropic conductive film described above has the following drawbacks. The reason for this is that it is necessary to control the heating and pressurizing conditions extremely precisely, and the reason for this will be explained with reference to FIGS. 3 and 4. FIG. 3 is a diagram schematically showing a cross section of a conventional anisotropic conductive film 40, and FIG. 4 is a diagram showing this anisotropic conductive film 40.
using the opposite terminals 2 of the two circuit boards 20 and 30.
1 and 31 are electrically connected. FIG. In this anisotropic conductive film 40, the thermoplastic resin layer 4] is made of an acrylic resin with a plasticizer added to the acrylic polymer, while the metal particles 42 have a diameter of 10 to 20 μm.
This is a Pb-3m-In based solder ball. Further, the circuit board 20 is a flexible circuit board (FPC) made of silver foil and polyimide, and the circuit board 30 is a normal printed wiring board (PWB). Anisotropic conductive film 4 connecting these
The overall thickness of the terminal 0 is about 25 μm to 50 μm, and the thickness is appropriately selected depending on the total thickness of the terminals 21, 31, the width of the terminals, and the ratio of the terminal spacing.
これ等を加熱、加圧して接着する場合、特に圧縮率か接
続抵抗および隣接端子間の絶縁性に極めて重要な影響を
及ばず。すなわち、圧縮率が小さけれは接続抵抗は大き
くなり、圧縮率が大きすぎると、第４図に示す通り、金
属粒子４２か流動する熱可塑性樹脂４１とともに流れ出
る量が多くなり隣接端子どうしが短絡するかもしくは絶
縁性が損なわれる危険が大きくなる。一般に、接着後の
端子間寸法は３〜５μｍ程度であるから圧縮寸法許容値
も同程度以下に抑える必要がある。このため接続部品の
反りや端子厚のバラツキおよび加熱加圧工具の熱変形や
傾斜などを３〜５μｍ以下とする必要が生じる。しなか
って、作業条件や、設備面て細心の注意か必要となり、
作業能率の低下や接続の信頼性品質への悪影響か生し問
題となっていた。When these are bonded by heating and pressurizing, there is no significant effect on compressibility, connection resistance, or insulation between adjacent terminals. That is, if the compression ratio is small, the connection resistance will be large, and if the compression ratio is too large, as shown in FIG. 4, a large amount of the metal particles 42 will flow out together with the flowing thermoplastic resin 41, leading to short circuits between adjacent terminals. Otherwise, there is a greater risk of loss of insulation. Generally, the dimension between the terminals after bonding is about 3 to 5 μm, so the compression dimension tolerance must also be kept to the same level or less. For this reason, it is necessary to limit warpage of the connecting parts, variation in terminal thickness, thermal deformation and inclination of the heating and pressing tool to 3 to 5 μm or less. Otherwise, extreme care must be taken in terms of working conditions and equipment.
This has caused problems such as a decrease in work efficiency and an adverse effect on the reliability and quality of the connection.
本発明の異方性導電膜は、鉛、錫、インジウム等の純金
属やはんな等の合金など低融点金属から成る粒子の表面
に有機又は無機質の電気絶縁性物質、例えばエポキシや
メラミン樹脂およびＳｉＯ２、Ａｌ２Ｏ３、カラスなと
の被膜を施した金属粒子と金属粒子より小さな粒径の電
気絶縁性の粒子例えはカラスヒーズ、球状アルミナ、熱
硬化性樹脂の粒子等から成る絶縁体粒子とを熱可塑性樹
脂層中に混合・分散させたものである。The anisotropic conductive film of the present invention includes an organic or inorganic electrically insulating material, such as epoxy or melamine resin, on the surface of particles made of pure metals such as lead, tin, indium, etc. or low melting point metals such as alloys such as solder. Metal particles coated with SiO2, Al2O3, glass etc. and electrically insulating particles with a particle size smaller than the metal particles, such as glass heat, spherical alumina, thermosetting resin particles, etc., are heated. It is mixed and dispersed in the plastic resin layer.
金属粒子は電気的接続に用い、その表面の絶縁性被膜は
不要の横方向の電気絶縁性を保ち、隣接端子間の短絡を
防ぐ働きをする。一方、絶縁体粒子は金属粒子より高融
点の付値のものを選ひ、加熱圧着時も変形しないため、
接続部間隔を一定に保つスペーサとしての働きをする。The metal particles are used for electrical connections, and the insulating coating on their surface provides unnecessary lateral electrical insulation and serves to prevent short circuits between adjacent terminals. On the other hand, the insulator particles are selected to have a higher melting point than the metal particles, and do not deform during heat-pressing.
It acts as a spacer to keep the connection distance constant.
このため、加熱や加圧条件を従来に比べ厳密に制御する
必要が無くなり、接続作業のや容易化や設備の簡素化が
可能となる。Therefore, it is no longer necessary to control heating and pressurizing conditions more strictly than in the past, making connection work much easier and equipment simpler.
次に、本発明について図面により詳細に説明する。第１
図は本発明の第１の実施例による異方性導電膜の断面図
である。この異方性導電膜１は以下の様にして製造する
。まず、金属粒子１２として市販の粒径か２０〜５０
ｕ、 ｍの６０８ｎ−４０ｐｂはんだ粒子１２ａを用意
する。別に、はんだ粒子１ ’２ ａに電気絶縁性被膜
１２１）を被覆するため、表１に示すエポキシ／ポリア
ミド樹脂（アミン硬化型）を以下により塗布する。Next, the present invention will be explained in detail with reference to the drawings. 1st
The figure is a cross-sectional view of an anisotropic conductive film according to a first embodiment of the present invention. This anisotropic conductive film 1 is manufactured as follows. First, as the metal particles 12, commercially available particle size is 20 to 50.
608n-40pb solder particles 12a of sizes u and m are prepared. Separately, in order to coat the electrically insulating film 121) on the solder particles 1'2a, an epoxy/polyamide resin (amine curing type) shown in Table 1 is applied as follows.
表１ エポキシ／ポリアミド樹脂の調合組成（ａ）ラッ
カーヘース
エピコート］ ＯＯ］、 ５０部メチルーイ
ソフチルケ１〜ン ２５部
ギシレン ２５部
（ｂ）ポリアミド樹脂溶液
ポリアミド樹脂 ５０部
インプロパツール ２５部
１ヘルエン ２５部
（ｃ）シンナー
メヂル イソブヂルケ１〜ン ２０重量％オキシトール
（セロソルブ）２０重量％フチルオキシトール
１０重量％ｎ−ブタノール ５重量％１〜
ルエン ４５重１％以上の（ａ）液お
よび（ｂ）液を７５２５の割合で調合した液に（Ｃ）液
を加え粘度をおよそ２００センチボイスにする。Table 1 Preparation composition of epoxy/polyamide resin (a) Lacquer Hese Epicoat] OO], 50 parts Methyl-Isophthylkene 1~25 parts Gysilene 25 parts (b) Polyamide resin solution Polyamide resin 50 parts Impropatool 25 parts 1 Heluene 25 parts (c) Thinner Medyl Isobutylken 1-20% by weight Oxytol (Cellosolve) 20% by weight Phthyloxytol
10% by weight n-butanol 5% by weight 1~
Luene 45 Add liquid (C) to a liquid prepared by blending liquid (a) and liquid (b) at a ratio of 7525 at least 1% by weight to a viscosity of approximately 200 centibois.
この液にはんだ粒子１２ａを入れ、この混合液を８０〜
１００℃のＮ２力°ス中に噴霧してシンナー分を蒸発さ
せ樹脂を予備硬化する。その後さらに１５０〜１７０℃
のＮ２ガス中で約１ｏ分間浮遊攪拌して樹脂層を完全に
硬化させ電気絶縁性被膜］２１〕とする。Add the solder particles 12a to this liquid, and add this mixed liquid to 80~
The thinner is evaporated by spraying in a N2 gas at 100°C to pre-cure the resin. Then further 150-170℃
The resin layer is completely cured by floating and stirring in N2 gas for about 10 minutes to form an electrically insulating coating [21].
一方、絶縁体粒子］−３として市販の最大粒径が１０μ
ｍの球状シリカ（ＳｊＯ２）を用意する。On the other hand, the maximum particle size of commercially available insulator particles]-3 is 10μ
m spherical silica (SjO2) is prepared.
電気絶縁被膜１２ｂを施した金属粒子１２を１゜０部に
対し球状シリカを１０部（いずれも重量比）の割合で混
合する。これ等混合粒子を従来の異方性導電膜の製造と
同様にメタクリル酸エステル重合体（アクリルポリマー
）とキシレンく溶剤）およびシフヂルフタレ−１・（可
塑剤）がら成る溶液に混合し、パラフィンコーチインク
したクラフト紙（台紙）に塗布、乾燥してフィルム化す
る。このようにして完成した異方性導電：膜１の厚さは
４０μｍであった。Spherical silica is mixed at a ratio of 10 parts (both weight ratios) to 1.0 parts of the metal particles 12 coated with the electrically insulating coating 12b. These mixed particles are mixed in a solution consisting of methacrylic acid ester polymer (acrylic polymer), xylene (solvent) and sydylphthale-1 (plasticizer) in the same way as in the production of conventional anisotropic conductive films. It is applied to kraft paper (mounting paper), dried and made into a film. The thickness of the anisotropic conductive film 1 thus completed was 40 μm.
次に、前記の方法によって製造した異方性導電Ｍ１を用
いて、ドツトマトリクス型表示パネルの厚膜印刷による
回路板３の端子３１にＦＰＣ（フレキシブル回路板）２
を以下の様にして接続する（第２図）。まず、クラフト
紙（図示せず）上に形成された異方性導電膜１をＦＰＣ
２の導体端子２１の配列郡全体を覆う様な寸法のテープ
状に切断し貼付ける。異方性導電膜１は、熱可塑性樹脂
１１を構成するアクリル樹脂中の可塑剤の働きにより、
わずかなタック性があり、押圧すること又は約１００〜
１２０°Ｃのアイロン等て圧着して仮接着てきる。その
後、クラフト紙を剥離除去する。次に異方性導電膜１か
仮接着されたＦＰＣ２を厚膜印刷回路板３の導体端子３
１に精密に位置合わせする。その後熱圧着装置を用い温
度１７５°Ｃ圧力３０〜６０ ｋｇ／ ｃｍ２て５秒間
熱圧着する。Next, using the anisotropic conductive material M1 manufactured by the above method, FPC (flexible circuit board) 2 is attached to the terminal 31 of the circuit board 3 by thick film printing of the dot matrix type display panel.
Connect as follows (Figure 2). First, an anisotropic conductive film 1 formed on kraft paper (not shown) is printed on an FPC.
It is cut into a tape shape with a size that covers the entire array of conductor terminals 21 of No. 2 and pasted. The anisotropic conductive film 1 is formed by the action of the plasticizer in the acrylic resin constituting the thermoplastic resin 11.
It has a slight tackiness and cannot be pressed or about 100 ~
Temporarily adhere by pressing with an iron at 120°C. After that, the kraft paper is peeled off and removed. Next, the anisotropic conductive film 1 or the temporarily bonded FPC 2 is attached to the conductor terminal 3 of the thick film printed circuit board 3.
1. Align precisely. Thereafter, thermocompression bonding is performed using a thermocompression bonding device at a temperature of 175° C. and a pressure of 30 to 60 kg/cm2 for 5 seconds.
この過程で異方性導電膜１中の熱可塑性樹脂１］か軟化
し、圧力によって接続部の導体端子２１．３１の間隔か
加圧前の約１／４の１０μｍに狭められる。この時、金
属粒子１２中の６０Ｓｎ−４０Ｐｂはんた粒子］２ａ（
融点１６８°Ｃ）は溶融しているので加圧力により電気
絶縁性被膜］２ｂ（エポキシ／ポリアミド樹脂）を破っ
て流れ出る。これによってＦＰＣ２の導体端子２１と厚
膜印刷回路板３の導体端子３１がはんだ１２ａ″て接合
状態となり電気的接続が達成される。In this process, the thermoplastic resin 1 in the anisotropic conductive film 1 is softened, and the distance between the conductor terminals 21 and 31 of the connection portion is narrowed to 10 μm, which is about 1/4 of that before the pressure is applied. At this time, 60Sn-40Pb solder particles in metal particles 12 ] 2a (
Since the resin (melting point: 168°C) is molten, it ruptures the electrically insulating coating 2b (epoxy/polyamide resin) due to pressure and flows out. As a result, the conductor terminals 21 of the FPC 2 and the conductor terminals 31 of the thick film printed circuit board 3 are joined by the solder 12a'', thereby achieving electrical connection.
一方、導体端子２１．３１の間隔以外の部分に位置する
金属粒子１２は加圧力を受ける割合が小さいため、電気
絶縁性被膜１２ｂは破壊されずそのまま冷却する。従っ
て、電気的接続は起らず隣接する導体端子（図示せず）
間の絶縁性が保たれる。この時、絶縁体粒子１３である
球状シリカは加熱加圧によって溶融や破壊することが無
い。従って、導体端子２１と３１の間隙寸法はその間に
挟まれた絶縁体粒子の直径寸法以下になり得ないため、
加圧力を従来の異方性導電膜のそれに比べ約２倍まで高
めても良好な接続が達成できた。もちろん導体端子間以
外の部分に流れ出た絶縁体粒子］３は電気的接続には全
く無関係であり無害である。On the other hand, since the metal particles 12 located outside the spacing between the conductor terminals 21 and 31 receive only a small proportion of the pressurizing force, the electrically insulating coating 12b is not destroyed and is cooled as it is. Therefore, no electrical connection occurs and the adjacent conductor terminal (not shown)
The insulation between them is maintained. At this time, the spherical silica which is the insulator particles 13 is not melted or destroyed by heating and pressurization. Therefore, the gap between the conductor terminals 21 and 31 cannot be smaller than the diameter of the insulator particles sandwiched between them.
A good connection was achieved even when the pressure was increased to about twice that of conventional anisotropic conductive films. Of course, the insulator particles] 3 flowing out to areas other than between the conductor terminals have no relation to electrical connection and are harmless.
以上説明したように本発明の異方性導電膜を用いた電気
的接続方法によれば、従来の裸の金属粒子だけを用いた
接続方法に比べ隣接端子間の短絡不良の発生率を極めて
小さくできる。このため、例えば液晶テレヒジョン用Ｘ
−Ｙドツトマトリクス表示パネルの例では、４００Ｘ６
４０本の導体端子が０．３＋ｎｍ以下の間隔て配列して
いるものを夫々ＦＰＣの端子と接続する工程で、従来の
接続不良の発生率を５分１以下に改善し得な。As explained above, according to the electrical connection method using the anisotropic conductive film of the present invention, the incidence of short circuit failures between adjacent terminals is extremely reduced compared to the conventional connection method using only bare metal particles. can. For this reason, for example,
-Y dot matrix display panel example is 400X6
In the process of connecting 40 conductor terminals arranged at intervals of 0.3+nm or less to the terminals of the FPC, it is not possible to improve the conventional connection failure rate to 1/5 or less.
この外、ファクシミリセンサ、ＣＣＤセンサ、等々、微
細接続の必要性は枚挙のいとまがなく、本発明の接続方
法はこれ等の製造工程歩留りを飛−］〇−
躍的に改善できると同時に絶縁粒子による寸法調節効果
により圧着設備や作業条件が簡略化できるため工業上極
めて有効、かつ重要ある。In addition, the need for microscopic connections is too numerous to mention for facsimile sensors, CCD sensors, etc., and the connection method of the present invention can dramatically improve the manufacturing process yield for these devices and at the same time provide insulation. It is extremely effective and important industrially because the size control effect of the particles can simplify the crimping equipment and working conditions.
第１図（ａ）は本発明の一実施例を示す異方性導電膜の
断面図、第１図（ｂ）は金属粒子の拡大断面図、第２図
は本発明の異方性導電膜を用いて電気的接続した状態を
示す断面図、第３図は従来の異方性導電膜の断面図、第
４図は従来の異方性導電膜を用いて電気的接続をした状
態を示す断面図である。
１．４０・・・異方性導電膜、２．２０・・ＦＰＣ５３
・・・厚膜回路板、３０・・・ＰＷＢ、１１．４］・熱
可塑性樹脂、１２．４２・・・金属粒子、１２ａ・はん
な粒子、１２ｂ・・電気絶縁性被膜、１３・・絶縁体粒
子、２１．３１・・・導体端子。FIG. 1(a) is a cross-sectional view of an anisotropic conductive film showing one embodiment of the present invention, FIG. 1(b) is an enlarged cross-sectional view of metal particles, and FIG. 2 is an anisotropic conductive film of the present invention. Figure 3 is a cross-sectional view of a conventional anisotropic conductive film, and Figure 4 shows an electrical connection made using a conventional anisotropic conductive film. FIG. 1.40...Anisotropic conductive film, 2.20...FPC53
Thick film circuit board, 30 PWB, 11.4] Thermoplastic resin, 12.42 Metal particles, 12a Solder particles, 12b Electrical insulating coating, 13... Insulator particles, 21.31...conductor terminal.
Claims (1)
該低融点金属粒子の粒径より小さい粒径を有しかつ前記
低融点金属粒子とり高い融点を有する絶縁体粒子とを熱
可塑樹脂層中に分散させたことを特徴とする異方性導電
膜。Low melting point metal particles whose surfaces are covered with an electrically insulating film,
An anisotropic conductive film characterized in that insulating particles having a particle size smaller than the particle size of the low melting point metal particles and having a higher melting point than the low melting point metal particles are dispersed in a thermoplastic resin layer. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14721288A JPH01315906A (en) | 1988-06-14 | 1988-06-14 | Anisotropic electrically conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14721288A JPH01315906A (en) | 1988-06-14 | 1988-06-14 | Anisotropic electrically conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01315906A true JPH01315906A (en) | 1989-12-20 |
Family
ID=15425106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14721288A Pending JPH01315906A (en) | 1988-06-14 | 1988-06-14 | Anisotropic electrically conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01315906A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5770305A (en) * | 1994-09-30 | 1998-06-23 | Nec Corporation | Anisotropic conductive film |
| JP2009277652A (en) * | 2008-04-17 | 2009-11-26 | Hitachi Chem Co Ltd | Circuit connection material and connection structure for circuit member |
-
1988
- 1988-06-14 JP JP14721288A patent/JPH01315906A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5770305A (en) * | 1994-09-30 | 1998-06-23 | Nec Corporation | Anisotropic conductive film |
| JP2009277652A (en) * | 2008-04-17 | 2009-11-26 | Hitachi Chem Co Ltd | Circuit connection material and connection structure for circuit member |
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