JP3114162B2 - Electrical connection method - Google Patents

Electrical connection method

Info

Publication number
JP3114162B2
JP3114162B2 JP31401591A JP31401591A JP3114162B2 JP 3114162 B2 JP3114162 B2 JP 3114162B2 JP 31401591 A JP31401591 A JP 31401591A JP 31401591 A JP31401591 A JP 31401591A JP 3114162 B2 JP3114162 B2 JP 3114162B2
Authority
JP
Japan
Prior art keywords
circuit board
particles
electrical connection
conductive particles
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP31401591A
Other languages
Japanese (ja)
Other versions
JPH0575250A (en
Inventor
幸男 山田
尚 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of JPH0575250A publication Critical patent/JPH0575250A/en
Application granted granted Critical
Publication of JP3114162B2 publication Critical patent/JP3114162B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】この発明は、２つの回路基板間の
端子の電気的接続方法に関する。さらに詳しくは、この
発明は、回路基板に接続すべき端子が細密なピッチで多
数形成されている場合でも、端子間にショートを発生さ
せることなく２つの回路基板間の端子を確実にかつ容易
に接続できるようにする電気的接続方法、並びにこのよ
うな電気的接続方法に使用する電気的接続用フィルムお
よび電気的接続用回路基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for electrically connecting terminals between two circuit boards. More specifically, the present invention reliably and easily connects terminals between two circuit boards without causing a short circuit between the terminals even when a large number of terminals to be connected to the circuit boards are formed at a fine pitch. The present invention relates to an electrical connection method for enabling connection, and an electrical connection film and an electrical connection circuit board used in such an electrical connection method.

【０００２】[0002]

【従来の技術】液晶パネルとＴＡＢとを接続する場合の
ように、２つの回路基板間の端子を電気的に接続する方
法としては、従来より、異方性導電性接着剤を使用する
方法が知られている。この方法においては、熱硬化性あ
るいは熱可塑性接着剤中に半田粒子、ニッケル粒子等の
金属粒子や樹脂粒子に金メッキを施した粒子等の導電粒
子を分散させた異方性導電性接着剤を使用し、このよう
な異方性導電性接着剤を２つの回路基板間に介在させ、
加熱加圧することにより相対する２端子間の電気的接続
が得られるようにする（特開昭５１−１１４４３９号公
報）。2. Description of the Related Art As a method for electrically connecting terminals between two circuit boards, such as when a liquid crystal panel is connected to a TAB, a method using an anisotropic conductive adhesive has conventionally been used. Are known. In this method, an anisotropic conductive adhesive is used in which conductive particles such as metal particles such as solder particles and nickel particles and gold-plated resin particles are dispersed in a thermosetting or thermoplastic adhesive. Then, such an anisotropic conductive adhesive is interposed between the two circuit boards,
By applying heat and pressure, an electrical connection between two opposing terminals can be obtained (Japanese Patent Laid-Open No. 51-114439).

【０００３】このような異方性導電性接着剤に類する接
合材として、熱可塑性樹脂からなるシート状絶縁基材の
表面付近に導電粒子を埋設したものも知られている。こ
の接合材の使用方法としては、まず第１の回路基板の端
子面と接合材の導電粒子とを加熱溶着させ、次に加熱溶
着させた接合材上に第２の回路基板を加熱加圧してその
接合材のシート状絶縁基材を溶融させ、２つの回路基板
間を接合すると共に、第１の回路基板の端子に溶着して
いた導電粒子と第２の回路基板の端子とを接合させる
（特開昭６４−１４８８６号公報）。As a bonding material similar to such an anisotropic conductive adhesive, a bonding material in which conductive particles are embedded near the surface of a sheet-like insulating base material made of a thermoplastic resin is also known. As a method of using this bonding material, first, the terminal surface of the first circuit board and the conductive particles of the bonding material are heat-welded, and then the second circuit board is heated and pressed on the heat-welded bonding material. The sheet-shaped insulating base material of the bonding material is melted, and the two circuit boards are joined together, and the conductive particles welded to the terminals of the first circuit board and the terminals of the second circuit board are joined ( JP-A-64-14886).

【０００４】また、ＩＣチップをＴＡＢに接続する方法
としては、バンプ形成用基板上にメッキによって金柱を
作成し、これをＴＡＢに位置合わせして転写し、接続す
る転写バンプ方式が知られている。As a method of connecting an IC chip to a TAB, a transfer bump method is known in which a gold pillar is formed on a bump-forming substrate by plating, this is aligned with the TAB, transferred, and connected. I have.

【０００５】さらに、印刷やディッピング等により導電
性接着剤を回路基板の接続すべきパターン上のみに載せ
る方法も知られている。Further, a method is also known in which a conductive adhesive is placed only on a pattern to be connected to a circuit board by printing, dipping, or the like.

【０００６】[0006]

【発明が解決しようとする課題】しかしながら、従来の
異方性導電性接着剤を使用する方法では、回路基板の接
続すべき端子を含む接着領域の全面に異方性導電性接着
剤を介在させるので、接続すべき端子間だけでなく他の
隣接する端子間にも導電粒子が存在することとなる。そ
のため、端子のピッチが細密になるとショートし易くな
るという問題があった。このような問題に対しては、異
方性導電性接着剤中の導電粒子の配合量を少なくするこ
とも考えられているが、導電粒子の配合量を少なくする
と接続すべき端子間に存在する導電粒子も少なくなるの
で導通信頼性が低下するという問題があった。However, in the conventional method using the anisotropic conductive adhesive, the anisotropic conductive adhesive is interposed on the entire surface of the bonding area including the terminal to be connected on the circuit board. Therefore, the conductive particles exist not only between the terminals to be connected but also between other adjacent terminals. For this reason, there has been a problem that short-circuiting is likely to occur when the terminal pitch is fine. For such a problem, it is considered to reduce the amount of the conductive particles in the anisotropic conductive adhesive. However, if the amount of the conductive particles is reduced, there is a gap between the terminals to be connected. There is a problem that conduction reliability is reduced because the number of conductive particles is reduced.

【０００７】熱可塑性樹脂からなるシート状絶縁基材の
表面付近に導電粒子を埋設した接合材を使用する方法
（特開昭６４−１４８８６号公報）によれば導通信頼性
をある程度向上させることはできるが、接合材中の導電
粒子の粒径のばらつきが大きい等のために、回路基板と
接合材との加熱圧着時に僅かでも圧着面が傾くと均一に
圧着圧力がかからなくなり、導通不良が生じるという問
題があった。また、この方法においても、従来の異方性
導電性接着剤を使用する方法と同様に、回路基板の接続
すべき端子を含む接着領域の全面に導電粒子が存在する
こととなるので、端子のピッチが細密になるとショート
し易くなるという問題点は解消されなかった。According to a method of using a bonding material in which conductive particles are buried near the surface of a sheet-shaped insulating base material made of a thermoplastic resin (Japanese Patent Laid-Open No. 64-14886), it is impossible to improve conduction reliability to some extent. However, due to the large variation in the particle size of the conductive particles in the bonding material, etc., even if the bonding surface is slightly inclined during heating and bonding between the circuit board and the bonding material, the bonding pressure will not be evenly applied, resulting in poor conduction. There was a problem that would occur. Also, in this method, similarly to the conventional method using an anisotropic conductive adhesive, the conductive particles are present on the entire surface of the bonding area including the terminal to be connected on the circuit board, so that the terminal The problem that short pitches tend to occur when the pitch is fine has not been solved.

【０００８】また、転写バンプ方式においては、メッキ
によって金柱を作成する工程、及びこれをＴＡＢと位置
合わせする工程が必要となるので、工程数が多く作業性
も悪いという問題があった。In addition, the transfer bump method requires a step of forming a gold column by plating and a step of aligning the same with TAB, so that there is a problem that the number of steps is large and workability is poor.

【０００９】さらに、印刷やディッピング等により導電
性接着剤を回路基板の接続すべきパターン上のみに載せ
る方法においては、所定のパターン上のみに導電性接着
剤を載せる技術が難しいという問題があった。また、２
つの回路基板間の接合を端子パターンどうしの接着のみ
で行うこととなるので接着強度や信頼性が低下するとい
う問題もあった。Further, in the method of placing the conductive adhesive only on the pattern to be connected to the circuit board by printing, dipping, or the like, there is a problem that the technique of placing the conductive adhesive only on a predetermined pattern is difficult. . Also, 2
Since the bonding between the two circuit boards is performed only by bonding the terminal patterns, there has been a problem that the bonding strength and reliability are reduced.

【００１０】この発明は以上のような従来技術の課題を
解決しようとするものであり、２つの回路基板間の端子
を、接続すべき端子が回路基板に細密なピッチで多数形
成されている場合でも、ショートを発生させることな
く、高い導通信頼性が得られるように、均一な圧着によ
り確実にかつ容易に接続できるようにすることを目的と
している。[0010] The present invention is to solve the above-mentioned problems of the prior art, and in the case where a large number of terminals to be connected to each other between two circuit boards are formed on the circuit board at a fine pitch. However, it is an object of the present invention to ensure reliable and easy connection by uniform crimping so as to obtain high conduction reliability without causing a short circuit.

【００１１】[0011]

【課題を解決するための手段】上記の目的を達成するた
めに、この発明は、電気的接続方法に使用する接合材と
して、フィルム上に導電粒子と、導電粒子よりも耐熱性
でかつ導電粒子の粒径の２０〜８０％の粒径を有するス
ペーサー粒子とを均一に１層に保持させたことを特徴と
する電気的接続用フィルムを提供する。In order to achieve the above-mentioned object, the present invention relates to a bonding material for use in an electrical connection method, comprising: a conductive particle on a film; And a spacer particle having a particle size of 20 to 80% of the particle size of (1) is uniformly held in one layer.

【００１２】また、電気的接続方法に使用する回路基板
として、回路基板上の端子面と、上記の電気的接続用フ
ィルムの導電粒子とスペーサー粒子が保持されている面
とを合わせ、両者を加熱圧着し、剥離することにより回
路基板の端子上に導電粒子を転写させて得られる、回路
基板の端子上のみに１層の導電粒子が融着している電気
的接続用回路基板を提供する。Further, as a circuit board used in the electrical connection method, the terminal surface on the circuit board and the surface of the above-mentioned electrical connection film on which the conductive particles and the spacer particles are held are aligned, and both are heated. Provided is a circuit board for electrical connection in which one layer of conductive particles is fused only on the terminals of the circuit board, which is obtained by transferring the conductive particles onto the terminals of the circuit board by pressing and peeling.

【００１３】そして、この発明の電気的接続方法とし
て、第１の回路基板の端子面と上記の電気的接続用フィ
ルムの導電粒子とスペーサー粒子が保持されている面と
を合わせ、両者を加熱圧着し、剥離して第１の回路基板
の端子上に導電粒子を転写させ、次いで、導電粒子を転
写させた第１の回路基板の端子面と第２の回路基板の端
子面とを接着剤を介して加熱圧着することを特徴とする
電気的接続方法を提供する。As an electrical connection method according to the present invention, the terminal surface of the first circuit board and the surface of the electrical connection film on which the conductive particles and the spacer particles are held are brought into contact with each other, and both are heated and pressed. Then, the conductive particles are transferred to the terminals of the first circuit board by peeling, and then the terminal surfaces of the first and second circuit boards to which the conductive particles have been transferred are bonded with an adhesive. And an electrical connection method characterized in that the electrical connection method is performed by thermocompression bonding.

【００１４】この発明が接合材として使用する電気的接
続用フィルムは、従来の異方性導電性接着剤あるいはそ
れに類する接合材と同様に、接合材中の導電粒子により
導通性を確保するものであるが、この発明の接合材は導
電粒子に加えて導電粒子よりも耐熱性のスペーサー粒子
を含有することを特徴としている。そして、導電粒子の
粒径のばらつきが大きい等のために回路基板と接合材と
の加熱圧着時に圧着面が傾いても、このスペーサー粒子
が存在することにより均一に加熱圧着がなされるように
し、回路基板間の導通信頼性を向上させる。The electrical connection film used as a bonding material in the present invention is a film that secures electrical conductivity by conductive particles in the bonding material, similarly to a conventional anisotropic conductive adhesive or a similar bonding material. However, the bonding material according to the present invention is characterized in that in addition to the conductive particles, the bonding material contains spacer particles having higher heat resistance than the conductive particles. And, even if the pressure-bonding surface is inclined at the time of heat-pressure bonding of the circuit board and the bonding material due to a large variation in the particle diameter of the conductive particles, even by the presence of the spacer particles, the heat-pressure bonding is performed uniformly, Improve conduction reliability between circuit boards.

【００１５】以下、この発明の電気的接続方法を図面に
基づいて具体的に説明する。なお、図中、同一符号は同
一または同等の構成要素を表している。Hereinafter, the electrical connection method of the present invention will be specifically described with reference to the drawings. In the drawings, the same reference numerals represent the same or equivalent components.

【００１６】図１および図２は、それぞれこの発明の電
気的接続方法の工程説明図であり、図１の（ａ）および
図２の（ａ）は共にこの発明の電気的接続用フィルム１
０の一例の断面図である。これらの図のように、この電
気的接続用フィルム１０は、フィルム１上に導電粒子３
およびスペーサー粒子４を均一に１層保持させたものと
なっている。このように導電粒子３およびスペーサー粒
子４を１層保持させることにより、後述するこの電気的
接続用フィルムと回路基板との１次圧着時に回路基板の
端子に均一に導電粒子を融着させることが可能となる。FIGS. 1 and 2 are process explanatory views of the electrical connection method of the present invention, respectively. FIGS. 1A and 2A both show the electrical connection film 1 of the present invention.
0 is a cross-sectional view of an example. As shown in these figures, the electrical connection film 10 has conductive particles 3 on a film 1.
In addition, one layer of the spacer particles 4 is uniformly held. By holding one layer of the conductive particles 3 and the spacer particles 4 in this manner, the conductive particles can be uniformly fused to the terminals of the circuit board at the time of the first pressure bonding of the electrical connection film and the circuit board, which will be described later. It becomes possible.

【００１７】このような電気的接続用フィルム１０の形
成方法としては、例えば、樹脂バインダー液中に導電粒
子３とスペーサー粒子４とを分散させ、そのバインダー
液をフィルム１上に厚さが導電粒子３の粒径以下となる
ように塗布すればよい。これにより図示したように、１
層の導電粒子３とスペーサー粒子４とがバインダー層２
によってフィルム１上に保持された形態の電気的接続用
フィルム１０を得ることができる。As a method for forming such an electrical connection film 10, for example, the conductive particles 3 and the spacer particles 4 are dispersed in a resin binder solution, and the binder solution is coated on the film 1 with a thickness of the conductive particles. What is necessary is just to apply | coat so that it may become below 3 particle diameters. As a result, as shown in FIG.
Layer conductive particles 3 and spacer particles 4
Accordingly, the electrical connection film 10 held on the film 1 can be obtained.

【００１８】また、この電気的接続用フィルムにおい
て、フィルム上に導電粒子およびスペーサー粒子を１層
保持させた形態としては種々の態様をとることができ、
例えば粘着テープ上に導電粒子やスペーサー粒子を付着
させたものとしてもよい。このような電気的接続用フィ
ルムの形成方法としては、剥離フィルム上に導電粒子と
スペーサー粒子を静電気により１層付着させ、これを耐
熱性粘着テープに転着させればよい。In the electrical connection film, various modes can be adopted as a mode in which one layer of conductive particles and spacer particles is held on the film.
For example, conductive particles and spacer particles may be attached to an adhesive tape. As a method for forming such an electrical connection film, a layer of conductive particles and spacer particles may be attached to a release film by static electricity and then transferred to a heat-resistant adhesive tape.

【００１９】電気的接続用フィルム１０に使用する導電
粒子３としては、金属表面を有する種々の粒子を使用す
ることができるが、接続する回路基板の端子の素材に応
じて選択することが好ましい。例えば、図１の（ａ）に
示すように、回路基板５の端子５ａ上に金メッキ層ある
いはニッケルメッキ層５ｂが形成されている場合や端子
がグリコートで処理されている場合には半田粒子、錫粒
子、インジウム粒子、その他これらの合金粒子、もしく
は半田メッキ、錫メッキ、インジウムメッキ等を施した
粒子を使用する。また、回路基板の端子がアルミニウム
からなる場合には、金粒子または金メッキ粒子を使用す
る。さらに、図２の（ｂ）に示すように、回路基板５の
端子５ａ上に半田メッキ層あるいは錫メッキ層５ｃが形
成されている場合には、導電粒子３としては半田付け可
能な金属粒子または金属メッキ粒子を使用する。As the conductive particles 3 used in the electrical connection film 10, various particles having a metal surface can be used, but it is preferable to select them according to the material of the terminal of the circuit board to be connected. For example, as shown in FIG. 1A, when a gold plating layer or a nickel plating layer 5b is formed on the terminal 5a of the circuit board 5 or when the terminal is treated with glycoat, solder particles, tin Particles, indium particles, other alloy particles thereof, or particles subjected to solder plating, tin plating, indium plating, or the like are used. When the terminals of the circuit board are made of aluminum, gold particles or gold-plated particles are used. Further, as shown in FIG. 2B, when a solder plating layer or a tin plating layer 5c is formed on the terminals 5a of the circuit board 5, the conductive particles 3 may be solderable metal particles or Use metal plated particles.

【００２０】また、導電粒子３の形状としては、球形、
針状、柱状、板状、不定形など種々のものを使用できる
が球形のものを使用するのが好ましい。また、粒径とし
ては、０．５〜５０μｍのものを使用することが好まし
く、粒径分布はできるだけ均一であることが好ましい。The shape of the conductive particles 3 is spherical,
Various shapes such as a needle shape, a column shape, a plate shape, and an irregular shape can be used, but a spherical shape is preferable. The particle size is preferably 0.5 to 50 μm, and the particle size distribution is preferably as uniform as possible.

【００２１】スペーサー粒子４としては、導電粒子より
も耐熱性の粒子を使用する。すなわち、回路基板と電気
的接続用フィルムとの加熱圧着時に導電粒子と回路基板
の端子とが融着する際に、十分に当初の粒子形状を維持
する硬度を有するものを使用する。したがって、スペー
サー粒子４の種類は、導電粒子や回路基板の端子材料の
種類に応じて定められるが、一般には例えばポリスチレ
ン、ジビニルベンゼン、ベンゾグアナミン等の樹脂粒子
を使用することができる。また回路基板の端子に金メッ
キ、ニッケルメッキ等が施されている場合には、銅やニ
ッケル等の金属粒子を使用することができる。As the spacer particles 4, particles having higher heat resistance than conductive particles are used. That is, when the conductive particles and the terminals of the circuit board are fused at the time of thermocompression bonding between the circuit board and the electrical connection film, a material having sufficient hardness to maintain the initial particle shape is used. Therefore, the type of the spacer particles 4 is determined according to the type of the conductive particles and the type of the terminal material of the circuit board. In general, for example, resin particles such as polystyrene, divinylbenzene, and benzoguanamine can be used. When the terminals of the circuit board are plated with gold or nickel, metal particles such as copper or nickel can be used.

【００２２】また、スペーサー粒子４の大きさとして
は、導電粒子の粒径の２０〜８０％の粒径とし、好まし
くは３μｍ以上とするが好ましい。スペーサー粒子４の
粒径がこの範囲外であると、回路基板と接合材との加熱
圧着時に圧着面が傾いた場合に、均一に圧着することが
困難となる。The size of the spacer particles 4 is 20 to 80% of the particle size of the conductive particles, preferably 3 μm or more. If the particle size of the spacer particles 4 is out of this range, it becomes difficult to uniformly press-bond when the press-bonding surface is inclined during the heat-press-pressing of the circuit board and the bonding material.

【００２３】この発明の電気的接続方法においては、ま
ず、上記のような電気的接続用フィルム１０を用いてこ
の発明の電気的接続用回路基板を作成する。すなわち、
図１の（ｂ）あるいは図２の（ｂ）に示したように、第
１の回路基板５の端子５ａと電気的接続用フィルム１０
の導電粒子３とスペーサー粒子４が保持されている面と
を合わせ、両者を加熱圧着（１次圧着）する。この１次
圧着の加熱加圧条件は、回路基板５の端子５ａや導電粒
子３の種類に応じて、端子５ａと導電粒子３とが融着す
るように適宜設定すればよい。例えば図１の（ｂ）に示
したように、金メッキ処理されている端子５ａに対し
て、導電粒子３として半田粒子を保持した電気的接続用
転写フィルム１０を１次圧着する場合には、半田粒子か
らなる導電粒子３が溶融して端子５ａと導電粒子３とが
融着するようにすればよく、また、図２の（ｂ）に示し
たように、半田メッキ処理されている端子５ａに対して
電気的接続用転写フィルム１０を１次圧着する場合に
は、端子５ａ上の半田層５ｃが溶融して端子５ａと導電
粒子３とが融着するようにすればよい。In the electrical connection method of the present invention, first, the electrical connection circuit board of the present invention is prepared using the electrical connection film 10 as described above. That is,
As shown in FIG. 1B or FIG. 2B, the terminal 5a of the first circuit board 5 and the electrical connection film 10
Of the conductive particles 3 and the surface on which the spacer particles 4 are held, and heat-pressing (primary pressing) them. The heating and pressurizing conditions for the first pressure bonding may be appropriately set according to the type of the terminal 5a and the conductive particles 3 of the circuit board 5 so that the terminal 5a and the conductive particles 3 are fused. For example, as shown in FIG. 1B, when the transfer film 10 for electrical connection holding the solder particles as the conductive particles 3 is first pressure-bonded to the terminal 5a which has been subjected to the gold plating, The conductive particles 3 made of particles may be melted so that the terminals 5a and the conductive particles 3 may be fused together. Further, as shown in FIG. On the other hand, when the transfer film for electrical connection 10 is first pressure-bonded, the solder layer 5c on the terminal 5a may be melted and the terminal 5a and the conductive particles 3 may be fused.

【００２４】１次圧着後は、図１の（ｃ）あるいは図２
の（ｃ）に示したように、第１の回路基板５と電気的接
続用フィルム１０とを互いに剥離して第１の回路基板５
の端子５ａ上に導電粒子３を転写させ、端子５ａ上にの
み導電粒子３が存在している電気的接続用回路基板６を
得る。なお、この場合、スペーサー粒子４は電気的接続
用フィルム１０のフィルム１に残存する。After the first pressure bonding, FIG.
(C), the first circuit board 5 and the electrical connection film 10 are peeled off from each other,
The conductive particles 3 are transferred onto the terminals 5a, thereby obtaining a circuit board 6 for electrical connection in which the conductive particles 3 exist only on the terminals 5a. In this case, the spacer particles 4 remain on the film 1 of the electrical connection film 10.

【００２５】次いで、図１の（ｄ）あるいは図２の
（ｄ）に示したように、端子５ａ上にのみ導電粒子３が
存在している電気的接続用回路基板６と第２の回路基板
７とをそれらの端子面５ａ、７ａを内側にし、間に接着
剤として接着フィルム８を置いて重ね合わせ、加熱圧着
（本圧着）する。これにより、第１の回路基板５と第２
の回路基板７とは、その全面が接着フィルムで接着され
るので強い接着強度で接続される。しかも、第１の回路
基板５には、その端子５ａにのみ導電粒子３が存在して
いるので、第１の回路基板５の端子５ａと第２の回路基
板７の端子７ａとはショート等の導通不良を起こすこと
無く確実に接続される。Next, as shown in FIG. 1 (d) or FIG. 2 (d), the electrical connection circuit board 6 and the second circuit board in which the conductive particles 3 exist only on the terminal 5a. 7 are placed with their terminal surfaces 5a, 7a inside, an adhesive film 8 is placed as an adhesive between them, and they are superimposed and heat-pressed (finally pressed). As a result, the first circuit board 5 and the second
The circuit board 7 is bonded with a strong adhesive strength because the entire surface thereof is adhered with an adhesive film. Moreover, since the conductive particles 3 are present only in the terminals 5a of the first circuit board 5, the terminals 5a of the first circuit board 5 and the terminals 7a of the second circuit board 7 may not be short-circuited. The connection is ensured without causing conduction failure.

【００２６】ここで、接着フィルム８としては、熱硬化
性あるいは熱可塑性の樹脂フィルムを使用することがで
きる。また、接着剤としてこのようなフィルムを使用す
ることなく、従来の異方性導電性接着剤に使用されてい
た熱硬化性あるいは熱可塑性の樹脂液を２つの回路基板
間に塗布してもよい。Here, as the adhesive film 8, a thermosetting or thermoplastic resin film can be used. Further, without using such a film as an adhesive, a thermosetting or thermoplastic resin liquid used for a conventional anisotropic conductive adhesive may be applied between two circuit boards. .

【００２７】また、本圧着の加熱加圧条件は、両回路基
板の端子素材、導電粒子３の種類、接着剤の種類等に応
じて、適宜設定すればよい。The heating and pressurizing conditions for the final press bonding may be appropriately set in accordance with the terminal materials of the two circuit boards, the type of the conductive particles 3 and the type of the adhesive.

【００２８】[0028]

【作用】この発明が接合材として提供する電気的接続用
フィルムは、導電粒子の他にスペーサー粒子を有してい
るので、導電粒子の粒径のばらつきが大きい等のために
回路基板と接合材との加熱圧着時に圧着面が傾いた場合
でも均一に圧着がなされるようにし、導通信頼性を向上
させる。このスペーサー粒子の配合による導通信頼性の
向上の効果は、回路基板の端子が半田メッキや錫メッキ
等の柔らかい金属で処理されている場合には、導電粒子
が半田粒子のように柔らかい金属で構成されているとき
に顕著に発揮される。これは、回路基板の端子が柔らか
い金属で処理されている場合に、導電粒子が硬い粒子で
構成されていると回路基板の端子の金属が緩衝材となっ
て圧着面の傾きを吸収するが、導電粒子も柔らかい粒子
で構成されている場合には回路基板の端子の金属が緩衝
材とならないのでスペーサー粒子の果たす作用が大きく
なると考えられるからである。The electrical connection film provided by the present invention as a bonding material has spacer particles in addition to the conductive particles. In this case, even if the crimping surface is inclined at the time of heat-compression bonding, uniform crimping is performed, and conduction reliability is improved. The effect of improving the reliability of conduction by the compounding of the spacer particles is that when the terminals of the circuit board are treated with a soft metal such as solder plating or tin plating, the conductive particles are formed of a soft metal such as solder particles. It is remarkably exhibited when being performed. This is because, when the terminals of the circuit board are treated with a soft metal, if the conductive particles are made of hard particles, the metal of the terminals of the circuit board becomes a buffer material and absorbs the inclination of the crimping surface, This is because if the conductive particles are also made of soft particles, the metal of the terminal of the circuit board does not serve as a buffer, so that the action of the spacer particles is considered to increase.

【００２９】また、この発明の電気的接続用フィルム
は、熱可塑性樹脂からなるシート状絶縁基材の表面付近
に導電粒子を埋設した従来の接合材（特開昭６４−１４
８８６号公報）と同様に使用することができ、それによ
り従来の異方性導電性接着剤を使用していた電気的接続
方法よりも導通信頼性を向上させることが可能となる
が、この発明の電気的接続方法にしたがって使用するこ
とにより、回路基板に端子が細密なピッチで多数形成さ
れている場合でも、ショートを発生させることなく接続
することを可能とする。すなわち、この発明の電気的接
続方法によれば、フィルム上に導電粒子とスペーサー粒
子を１層に保持させた電気的接続用フィルムの導電粒子
を第１の回路基板の接続すべき端子上のみに転写し、次
いで、接着剤を介して第１の回路基板と第２の回路基板
とを接着するので、導電粒子は回路基板の接続すべき端
子以外の部分には存在しないこととなる。したがって、
ショートが起こらなくなる。また、電気的接続用フィル
ムの導電粒子の密度を上げることにより２つの回路基板
の端子間を接続する導電粒子の数を多くすることができ
るので、導通信頼性を一層向上させることが可能とな
る。The electrical connection film of the present invention is a conventional bonding material having conductive particles embedded near the surface of a sheet-shaped insulating base material made of a thermoplastic resin (JP-A-64-14).
886), which makes it possible to improve the conduction reliability compared to the electrical connection method using a conventional anisotropic conductive adhesive. By using the electrical connection method described above, even if a large number of terminals are formed on the circuit board at a fine pitch, the connection can be made without causing a short circuit. That is, according to the electrical connection method of the present invention, the conductive particles of the electrical connection film in which the conductive particles and the spacer particles are held in one layer on the film are provided only on the terminals to be connected of the first circuit board. Since the transfer is performed and then the first circuit board and the second circuit board are bonded via an adhesive, the conductive particles do not exist in portions other than the terminals to be connected on the circuit board. Therefore,
Short circuit does not occur. Also, by increasing the density of the conductive particles of the electrical connection film, the number of conductive particles connecting between the terminals of the two circuit boards can be increased, so that the conduction reliability can be further improved. .

【００３０】さらに、この発明の電気的接続方法によれ
ば、従来の転写バンプ方式と異なり、ＩＣチップにバン
プを形成することやバンプと回路基板との位置合わせを
することが不要となるので、２つの回路基板の電気的接
続工程が容易となる。Further, according to the electrical connection method of the present invention, unlike the conventional transfer bump method, it is not necessary to form a bump on the IC chip or to align the bump with the circuit board. The electrical connection process between the two circuit boards is facilitated.

【００３１】[0031]

【実施例】以下、この発明を実施例に基づいて具体的に
説明する。 実施例１〜３、比較例１〜３ ポリエステル樹脂（ＶＥ３２２０、ユニチカ製）のＭＥ
Ｋ１５％溶液１００重量部に、イソシアネート（コロネ
ートＬ、日本ポリウレタン（株）製）０．１５重量部、
半田粒子（平均粒径１２μｍ、Ｆ１−６３５Ｍ、千住金
属製）６重量部、表１に示した種々のスペーサー粒子１
重量部を均一に分散し、この分散液を厚さ２５μｍのポ
リイミドフィルムに平均厚さが５μｍとなるように塗布
し、図１の（ａ）と同様の電気的接続用フィルムを作成
した。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on embodiments. Examples 1 to 3, Comparative Examples 1 to 3 ME of polyester resin (VE3220, manufactured by Unitika)
0.15 parts by weight of isocyanate (Coronate L, manufactured by Nippon Polyurethane Co., Ltd.) was added to 100 parts by weight of a K15% solution,
6 parts by weight of solder particles (average particle size: 12 μm, F1-635M, manufactured by Senju Metal), various spacer particles 1 shown in Table 1
Parts by weight were uniformly dispersed, and this dispersion was applied to a polyimide film having a thickness of 25 μm so as to have an average thickness of 5 μm, thereby producing an electrical connection film similar to that shown in FIG.

【００３２】次ぎに、この電気的接続用フィルムを適当
な大きさにカットしてＴＡＢ（厚さ７５μｍのポリイミ
ドフィルム基材上、厚さ３５μｍの銅に厚さ１μｍの半
田メッキ（錫：鉛＝８：２）を施した端子が０．１ｍｍ
ピッチで形成されているもの）の上に置き、１９０℃、
５Ｋｇ／ｃｍ２、５秒で１次圧着した。この場合、図３
に示したようにプレスヘッド３１、受け台３２、マイク
ロジャッキ３３からなるプレス機を使用し、プレスケー
ル（富士化学紙製）を用いて平面性を均一にした後、マ
イクロジャッキ３３により図中右側を３μｍ上昇させ、
圧着面を傾かせた。Next, this electrical connection film was cut into an appropriate size, and TAB (75 μm thick polyimide film substrate, 1 μm thick solder plating on 35 μm thick copper (tin: lead = 8: 2) is 0.1mm
Placed at a pitch of 190 ° C.
The first compression bonding was performed at 5 kg / cm 2 for 5 seconds. In this case, FIG.
As shown in (1), using a press consisting of a press head 31, a receiving stand 32, and a micro jack 33, the flatness is made uniform using a pre-scale (manufactured by Fuji Chemical Paper), and the micro jack 33 is used in the right side of the figure. Is raised by 3 μm,
The crimping surface was inclined.

【００３３】冷却後、ＴＡＢから電気的接続用フィルム
を剥離し、半田粒子をＴＡＢの端子に転写させた。After cooling, the electrical connection film was peeled off from the TAB, and the solder particles were transferred to the terminals of the TAB.

【００３４】ここで、画像処理装置（日本ピーシーシス
テム（株）製）を用いて、初期の電気的接続用フィルム
の２００μｍ角中の半田粒子の面積率とＴＡＢへ半田粒
子を転写させた後の電気的接続用フィルムの２００μｍ
角中の半田粒子の面積率とを測定し、次式(i) にて転写
率を測定した。結果を表１に示した。Here, using an image processing apparatus (manufactured by Nippon PC System Co., Ltd.), the area ratio of the solder particles in the 200 μm square of the initial electrical connection film and the area after the transfer of the solder particles to the TAB were measured. 200μm of electrical connection film
The area ratio of the solder particles in the corner was measured, and the transfer ratio was measured by the following equation (i). The results are shown in Table 1.

【００３５】 また、ＴＡＢへ転写前の半田粒子の形状は直径１２μｍ
の球形であり、転写後は円柱であるとして、転写後の半
田粒子の直径（ｄ）を顕微鏡で測定し、次式(ii)により
その円柱の高さを求めた。結果を表１に示した。[0035] The shape of the solder particles before transfer to TAB is 12 μm in diameter.
The diameter (d) of the transferred solder particles was measured with a microscope, and the height of the cylinder was determined by the following equation (ii). The results are shown in Table 1.

【００３６】 高さ＝半田粒子の体積／（ｄ／２）2 ・π (ii) 次ぎに、このＴＡＢに以下の組成のエポキシ系接着フィ
ルムを仮圧着し、その後０．１ｍｍピッチのＩＴＯパタ
ーンが形成されているガラス基板と１７０℃、４０Ｋｇ
／ｃｍ２、２０秒で本圧着した。Height = volume of solder particles / (d / 2) 2 · π (ii) Next, an epoxy-based adhesive film having the following composition was temporarily pressure-bonded to the TAB, and then an ITO pattern having a pitch of 0.1 mm was formed. 170 ° C, 40Kg with formed glass substrate
/ Cm 2 for 20 seconds.

【００３７】 エポキシ系接着フィルム組成 フェノキシ樹脂（ＹＰ５０、東都化成製） ４２．５部 ビスＡ型エポキシ（Ｅｐ８２８、油化シェル製） ４２．５部 硬化剤（Ｈ×３７４８、旭化成製） １５．０部 その後、ＴＡＢとＩＴＯパターンの初期導通抵抗とＭＩ
Ｌ ＳＴＤ ２０２Ｆ１０６Ｅによる１０００時間のエ
ージング後の導通抵抗、および絶縁抵抗をデジタルマル
チメーターを用いて測定した。結果を表１に示した。[0037]Epoxy adhesive film composition  Phenoxy resin (YP50, manufactured by Toto Kasei) 42.5 parts Bis-A type epoxy (Ep828, manufactured by Yuka Shell) 42.5 parts Curing agent (H × 3748, manufactured by Asahi Kasei) 15.0 parts Then, TAB and ITO pattern Initial conduction resistance and MI
1000 hours by L STD 202F106E
Digital resistance and conduction resistance after
It was measured using a chimeter. The results are shown in Table 1.

【００３８】表１の結果から、半田粒子の粒径の２０〜
８０％の粒径のスペーサー粒子を使用した実施例におい
ては、１次圧着時に圧着面を傾かせたにもかかわらず、
左右の転写粒子の高さがほぼ等しくなっており、均一に
圧着されたことが確認できた。また、ＭＩＬ１０００時
間後の導通抵抗も低く、導通信頼性の高いことが確認で
きた。From the results in Table 1, it is found that the particle size of the solder particles is 20 to
In the embodiment using the spacer particles having a particle size of 80%, the pressure bonding surface was inclined at the time of the primary pressure bonding,
The heights of the left and right transfer particles were almost equal, and it was confirmed that the particles were uniformly pressed. Also, the conduction resistance after 1000 hours of MIL was low, and it was confirmed that the conduction reliability was high.

【００３９】[0039]

【表１】 実施例１ 実施例２ 実施例３ 比較例１ 比較例２ 比較例３ スペーサー粒子 Ｍ＊1 Ｍ 銅粉 − Ｍ Ｍ 粒径（μｍ） 3 5 3 2 10 転写率（％） 42 38 41 43 39 13 粒子高さ (μｍ) 左 5.1 4.8 5.2 6.5 6.0 9.5 右 3.8 4.3 3.9 2 2.5 2.2 導通抵抗Max(Ω) 初期 6 6.5 5.8 1.1 10.5 8 MIL1000hr 後 17 15.8 16.3 1.2k 0.8k 0.4k 絶縁抵抗 ○＊2 ○ ○ ○ ○ ○ 注 ＊1 ベンゾグアナミン樹脂粒子（ミクロパール、触媒化学製） ＊2 １０10Ω以上[Table 1] Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Spacer particles M * 1 M Copper powder-MM Particle size (μm) 3 5 3 2 10 Transfer rate (%) 42 38 41 43 39 13 Particle height (μm) Left 5.1 4.8 5.2 6.5 6.0 9.5 Right 3.8 4.3 3.9 2 2.5 2.2 Conduction resistance Max (Ω) Initial 6 6.5 5.8 1.1 10.5 8 After 1000 hours of MIL 17 15.8 16.3 1.2k 0.8k 0.4k Insulation resistance ○ * 2 ○ ○ ○ ○ ○ Note * 1 Benzoguanamine resin particles (Micropearl, manufactured by Catalyst Chemicals) * 2 10 10 Ω or more

【００４０】[0040]

【発明の効果】この発明によれば、２つの回路基板間の
端子を接続するにあたり、接続すべき端子が回路基板に
細密なピッチで多数形成されている場合でも、ショート
を発生させることなく、高い導通信頼性が得られるよう
に確実にかつ容易に接続することが可能となる。According to the present invention, when connecting terminals between two circuit boards, even if a large number of terminals to be connected are formed at a fine pitch on the circuit board, short-circuiting does not occur. The connection can be reliably and easily made so that high conduction reliability can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図１】この発明の電気的接続方法の工程説明図であ
る。FIG. 1 is a process explanatory view of an electrical connection method of the present invention.

【図２】この発明の電気的接続方法の工程説明図であ
る。FIG. 2 is a process explanatory view of the electrical connection method of the present invention.

【図３】１次圧着に使用したプレス機の概略構成図であ
る。FIG. 3 is a schematic configuration diagram of a press machine used for primary pressure bonding.

【符号の説明】[Explanation of symbols]

１ フィルム ２ バインダー層 ３ 導電粒子 ４ スペーサー粒子 ５ 第１の回路基板 ５ａ 第１の回路基板の端子 ６ 電気的接続用回路基板 ７ 第２の回路基板 ７ａ 第２の回路基板の端子 ８ 接着フィルム １０ 電気的接続用フィルム DESCRIPTION OF SYMBOLS 1 Film 2 Binder layer 3 Conductive particle 4 Spacer particle 5 First circuit board 5a Terminal of first circuit board 6 Circuit board for electrical connection 7 Second circuit board 7a Terminal of second circuit board 8 Adhesive film 10 Electrical connection film

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/36 H01R 11/01 H01R 43/00 H05K 1/14 H05K 3/32 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 3/36 H01R 11/01 H01R 43/00 H05K 1/14 H05K 3/32

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 フィルム上に導電粒子と、導電粒子より
も耐熱性でかつ導電粒子の粒径の２０〜８０％の粒径を
有するスペーサー粒子とを均一に１層保持させたことを
特徴とする電気的接続用フィルム。1. A film, wherein one layer of conductive particles and spacer particles having heat resistance higher than that of the conductive particles and having a particle diameter of 20 to 80% of the particle diameter of the conductive particles are uniformly held on the film. Electrical connection film. 【請求項２】 回路基板上の端子面と請求項１記載の電
気的接続用フィルムの導電粒子とスペーサー粒子が保持
されている面とを合わせ、両者を加熱圧着し、剥離する
ことにより回路基板の端子上に導電粒子を転写させて得
られる、回路基板の端子上のみに１層の導電粒子が融着
している電気的接続用回路基板。2. The circuit board according to claim 1, wherein the terminal surface on the circuit board is aligned with the surface of the film for electrical connection according to claim 1, wherein the conductive particles and the spacer particles are held. A circuit board for electrical connection, wherein one layer of conductive particles is fused only on the terminals of the circuit board, obtained by transferring the conductive particles onto the terminals. 【請求項３】 第１の回路基板の端子と第２の回路基板
の端子とを電気的に接続する方法において、第１の回路
基板の端子面と請求項１記載の電気的接続用フィルムの
導電粒子とスペーサー粒子が保持されている面とを合わ
せ、両者を加熱圧着し、剥離して第１の回路基板の端子
上に導電粒子を転写させ、次いで、導電粒子を転写させ
た第１の回路基板の端子面と第２の回路基板の端子面と
を接着剤を介して加熱圧着することを特徴とする電気的
接続方法。3. A method of electrically connecting terminals of a first circuit board and terminals of a second circuit board, wherein the terminal surface of the first circuit board is electrically connected to the terminal surface of the first circuit board. The conductive particles and the surface on which the spacer particles are held are aligned, the two are heat-pressed, peeled off, and the conductive particles are transferred onto the terminals of the first circuit board, and then the first conductive particles are transferred. An electrical connection method, wherein a terminal surface of a circuit board and a terminal surface of a second circuit board are heat-pressed with an adhesive therebetween.
JP31401591A 1991-07-14 1991-10-31 Electrical connection method Expired - Lifetime JP3114162B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3-199964 1991-07-14
JP19996491 1991-07-14

Publications (2)

Publication Number Publication Date
JPH0575250A JPH0575250A (en) 1993-03-26
JP3114162B2 true JP3114162B2 (en) 2000-12-04

Family

ID=16416534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31401591A Expired - Lifetime JP3114162B2 (en) 1991-07-14 1991-10-31 Electrical connection method

Country Status (1)

Country Link
JP (1) JP3114162B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100574215B1 (en) 1997-04-17 2006-04-27 세키스이가가쿠 고교가부시키가이샤 Conductive particles
US6663799B2 (en) 2000-09-28 2003-12-16 Jsr Corporation Conductive metal particles, conductive composite metal particles and applied products using the same
KR101037229B1 (en) * 2006-04-27 2011-05-25 스미토모 베이클리트 컴퍼니 리미티드 Semiconductor device and semiconductor device manufacturing method
JP5049176B2 (en) * 2008-03-27 2012-10-17 ソニーケミカル＆インフォメーションデバイス株式会社 BONDED BODY AND ITS MANUFACTURING METHOD, AND ANISOTROPIC CONDUCTIVE MATERIAL AND ITS MANUFACTURING METHOD
JP5536899B2 (en) 2010-11-08 2014-07-02 パナソニック株式会社 Solder pre-coating method
KR101979078B1 (en) * 2017-04-10 2019-05-16 한국과학기술원 Anisotropic conductive film using solder coated metal conducting particles

Also Published As

Publication number Publication date
JPH0575250A (en) 1993-03-26

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