JPH07157720A - Film having anisotropic electrical conductivity - Google Patents
Film having anisotropic electrical conductivityInfo
- Publication number
- JPH07157720A JPH07157720A JP5303148A JP30314893A JPH07157720A JP H07157720 A JPH07157720 A JP H07157720A JP 5303148 A JP5303148 A JP 5303148A JP 30314893 A JP30314893 A JP 30314893A JP H07157720 A JPH07157720 A JP H07157720A
- Authority
- JP
- Japan
- Prior art keywords
- film
- resin
- particles
- connection
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、微細な回路同志の電気
的接続、更に詳しくはＬＣＤ（液晶ディスプレイ）とフ
レキシブル回路基板の接続や、半導体ＩＣとＩＣ搭載用
基板のマイクロ接合等に用いることのできる異方導電フ
ィルムに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for electrical connection between minute circuits, more specifically for connection between an LCD (liquid crystal display) and a flexible circuit board, and micro joining between a semiconductor IC and an IC mounting board. The present invention relates to an anisotropic conductive film that can be manufactured.
【０００２】[0002]
【従来の技術】最近の電子機器の小型化・薄型化に伴
い、微細な回路同志の接続、微小部分と微細な回路の接
続等の必要性が飛躍的に増大してきており、その接続方
法として、半田接合技術の進展とともに、新しい材料と
して、異方性の導電性接着剤やフィルムが使用されてい
る。（例えば、特開昭５９−１２０４３６、６０−８４
７１８、６０−１９１２２８、６１−５５８０９、６１
−２７４３９４、６１−２８７９７４、６２−２４４１
４２、６３−１５３５３４、６３−３０５５９１、６４
−４７０８４、６４−８１８７８、特開平１−４６５４
９、１−２５１７８７各号公報等）2. Description of the Related Art With the recent miniaturization and thinning of electronic equipment, the need for connecting minute circuits to each other, connecting minute parts to minute circuits, etc. has been dramatically increasing. With the progress of soldering technology, anisotropic conductive adhesives and films are used as new materials. (For example, JP-A-59-120436, 60-84
718, 60-191228, 61-55809, 61
-274394, 61-287974, 62-2441
42, 63-153534, 63-305591, 64
-47084, 64-81878, Japanese Patent Laid-Open No. 1-4654.
9, 1-251787, etc.)
【０００３】この方法は、接続しようとする回路間に所
定量の導電性粒子を含有する接着剤またはフィルムを挟
み、所定の温度・圧力・時間により熱圧着することによ
って回路間の電気的接続を行うと同時に隣接する回路間
には絶縁性を確保させるものである。In this method, an adhesive or film containing a predetermined amount of conductive particles is sandwiched between the circuits to be connected, and thermocompression bonding is performed at a predetermined temperature, pressure, and time to electrically connect the circuits. At the same time, the insulation is secured between the adjacent circuits.
【０００４】この異方導電接着剤やフィルムに含まれて
いる導電粒子には、一般的には、金属粒子や高分子核材
に金属被覆を施したものが用いられている。As the conductive particles contained in the anisotropic conductive adhesive or the film, metal particles or polymer core material coated with a metal are generally used.
【０００５】金属粒子の場合、半田粒子などの柔らかい
ものが用いられる場合が多く、相対する回路端子間の間
隔バラツキを吸収して回路端子間の接触面積を大きくと
ることができ、安定した導通性が得られるという長所が
あった。また、接続温度を金属粒子の溶融温度よりも高
くすることにより、導電粒子と電極端子との接続を強固
にすることが可能となり、より接続信頼性を高めること
ができるものであった。しかしながら、反面、微細な回
路同志の接続をするために導電粒子の粒度分布を揃え隣
接端子間の電気的短絡を防ぐことが困難であり、金属粒
子を溶融させると端子間短絡が発生したり、高温高湿度
放置試験や高温放置試験などの処理を施した場合に金属
粒子の酸化等が生じ接続が不安定になるなどの問題があ
った。In the case of metal particles, soft particles such as solder particles are often used, and it is possible to absorb the variation in the spacing between the opposing circuit terminals to obtain a large contact area between the circuit terminals and to provide stable conductivity. The advantage was that Further, by setting the connection temperature higher than the melting temperature of the metal particles, the connection between the conductive particles and the electrode terminals can be strengthened, and the connection reliability can be further improved. However, on the other hand, it is difficult to align the particle size distribution of the conductive particles in order to connect the fine circuits to each other and prevent an electrical short circuit between adjacent terminals, and when the metal particles are melted, a short circuit between terminals occurs, When subjected to a high temperature and high humidity storage test or a high temperature storage test, there was a problem that the metal particles were oxidized and the connection became unstable.
【０００６】これに対し、高分子核材に金属被覆を施し
た粒子の場合、作製方法によっては高分子核材粒子の粒
度分布を極めてシャープにできるため、微細な回路接続
にも対応でき、更に金被覆が用いられる場合が多いこと
もあり、前述のような長期環境処理による粒子表面の酸
化等が少ないという長所があった。しかしながら、反
面、電極端子と導電粒子の接触は機械的な接触だけであ
るため、周辺の接着剤樹脂が長期環境試験の湿度や温度
によって劣化し、導電粒子と電極端子の接触が不安定に
なるという欠点もあった。また、相対する回路端子間の
間隔バラツキが大きい場合には、接続直後でも導電粒子
の端子への接触が不安定になり、安定した接続性が得ら
れないという問題もあった。On the other hand, in the case of particles obtained by coating the polymer core material with a metal, the particle size distribution of the polymer core material particles can be made extremely sharp depending on the manufacturing method, so that fine circuit connection can be achieved, and In many cases, a gold coating is used, and there is an advantage that the particle surface is less oxidized by the long-term environmental treatment as described above. On the other hand, however, the contact between the electrode terminals and the conductive particles is only mechanical, so the surrounding adhesive resin deteriorates due to humidity and temperature in the long-term environmental test, and the contact between the conductive particles and the electrode terminals becomes unstable. There was also a drawback. In addition, when the gap between the opposing circuit terminals is large, the contact of the conductive particles to the terminals becomes unstable even immediately after the connection, and there is also a problem that stable connectivity cannot be obtained.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、このような
従来の欠点に鑑みて種々の検討の結果なされたものであ
り、その目的とするところは、微細な回路接続にも対応
でき、接続信頼性の高い異方導電フィルムを提供するこ
とにある。SUMMARY OF THE INVENTION The present invention has been made as a result of various studies in view of such conventional drawbacks, and an object of the present invention is to cope with fine circuit connection and to provide connection. An object is to provide a highly reliable anisotropic conductive film.
【０００８】[0008]
【課題を解決するための手段】即ち、本発明は、絶縁性
接着剤樹脂中に導電性粒子を分散させた異方導電フィル
ムにおいて、該導電性粒子が、その中心核が高分子核材
で、その表面に金属膜を有し、該金属膜の更に外層に該
金属膜よりも低融点の金属膜を有することを特徴とする
異方導電フィルムである。That is, the present invention provides an anisotropic conductive film in which conductive particles are dispersed in an insulating adhesive resin, wherein the conductive particles have a central nucleus of a polymer nucleus material. An anisotropic conductive film having a metal film on its surface, and a metal film having a melting point lower than that of the metal film as an outer layer of the metal film.
【０００９】以下、図面により本発明を詳細に説明す
る。図１は、本発明による異方導電フィルムの断面模式
図であり、図２は、本発明による異方導電フィルムを用
いた回路の接続状態を示す断面図である。The present invention will be described in detail below with reference to the drawings. FIG. 1 is a schematic sectional view of an anisotropic conductive film according to the present invention, and FIG. 2 is a sectional view showing a connected state of a circuit using the anisotropic conductive film according to the present invention.
【００１０】この異方導電フィルムは、図１に示すよう
に、高分子核材１の表面に金属膜２を施した粒子の表面
に、更に低融点の金属膜３を被覆した粒子が絶縁性接着
剤４に分散されたものであることが特徴である。In this anisotropically conductive film, as shown in FIG. 1, particles having a metal film 2 formed on the surface of a polymer core material 1 and further having a metal film 3 having a low melting point coated thereon are insulating. The feature is that it is dispersed in the adhesive 4.
【００１１】図２のように回路基板５，５’をこの異方
導電フィルムを用いて接続した場合、電極端子６，６’
間の導電性粒子は最外層の金属膜３が溶融し、電極端子
と導電粒子を強固に接続し、上下間の安定した電気的接
続を得ることができる。When the circuit boards 5 and 5'are connected using this anisotropic conductive film as shown in FIG. 2, electrode terminals 6 and 6'are provided.
The outermost metal film 3 of the conductive particles in between melts, and the electrode terminals and the conductive particles are firmly connected to each other, so that stable electrical connection between the upper and lower sides can be obtained.
【００１２】本発明で用いられる、金属膜２は、最外層
の金属膜３よりも融点が高いものであれば、特にその種
類を制限するものではない。組成としては従来よりこの
分野において使用されている、例えば、金、銀、銅、亜
鉛、錫、半田、インジウム、パラジウム等が挙げられ、
これらを単独あるいは混合して用いてもよい。もちろん
この金属被膜の選択には、中心核となる高分子核材との
密着力等を考慮して組合せた方がよいことはいうまでも
ない。金属膜の厚さには特に制限はないが、薄すぎると
導電性が不安定になり、厚すぎると粒子変形が困難にな
ったり凝集などが生じるため、０．０１〜１μｍ程度が
好ましい。無電解メッキなどにより均一に被覆されてい
る方が望ましいことはいうまでもない。The metal film 2 used in the present invention is not particularly limited as long as it has a melting point higher than that of the outermost metal film 3. The composition has been conventionally used in this field, for example, gold, silver, copper, zinc, tin, solder, indium, palladium and the like,
You may use these individually or in mixture. Of course, it is needless to say that it is better to combine the metal coatings in consideration of the adhesion with the polymer core material as the central core. The thickness of the metal film is not particularly limited, but if it is too thin, the conductivity becomes unstable, and if it is too thick, it becomes difficult to deform the particles or aggregation occurs. Needless to say, it is preferable to be uniformly coated by electroless plating or the like.
【００１３】また、高分子核材１は特に組成など制限は
なく、例えば、エポキシ樹脂、ウレタン樹脂、メラミン
樹脂、フェノール樹脂、アクリル樹脂、ポリエステル樹
脂、スチレン樹脂、スチレンブタジエン共重合体等のポ
リマー中から選択し、単独あるいは混合して用いてもよ
い。いずれの粒子でも、接続する被着体に合わせ、最適
な粒子径・粒度分布・配合量を選択した方がよいことは
言うまでもない。例えば、異方導電フィルムの主要な用
途である液晶ディスプレイパネルとＦＰＣ（フレキシブ
ル回路基板）との接続では、粒子径は０．５〜５０μｍ
程度で、特に０．２ｍｍピッチ程度以下のファインピッ
チ回路の接続においては、３〜１０μｍ程度が望まし
い。もちろん、粒度分布がシャープな方が好ましいこと
は言うまでもなく、平均粒径±１０％以内であればなお
好ましい。絶縁性接着剤に対する配合量は、１〜１０体
積％である方が好ましい。これよりも粒子径が小さい場
合や配合量が少ない場合には接続面積が少なくなるため
接続信頼性が低下し、逆に粒子径が大きい場合や配合量
が多い場合には隣接端子間の絶縁性が低下し短絡の発生
にもつながる。The composition of the polymer core material 1 is not particularly limited, and examples thereof include polymers such as epoxy resin, urethane resin, melamine resin, phenol resin, acrylic resin, polyester resin, styrene resin, and styrene-butadiene copolymer. They may be selected from the above and used alone or in combination. Needless to say, it is better to select the optimum particle diameter, particle size distribution, and compounding amount of any of the particles according to the adherend to be connected. For example, in the connection between a liquid crystal display panel and an FPC (flexible circuit board), which is a main application of the anisotropic conductive film, the particle diameter is 0.5 to 50 μm.
In particular, about 3 to 10 μm is desirable in connection with a fine pitch circuit having a pitch of 0.2 mm or less. Needless to say, it is preferable that the particle size distribution is sharp, and it is more preferable that the average particle size is within ± 10%. The compounding amount with respect to the insulating adhesive is preferably 1 to 10% by volume. If the particle size is smaller than this or if the compounding amount is small, the connection area will be small and the connection reliability will be reduced. Lowers and leads to the occurrence of short circuits.
【００１４】本発明に用いられる最外層の金属膜３は、
高分子核材の表面に施された金属膜２よりも融点が低い
ものであれば、特にその組成に制限はないが、例えば、
ニッケル、銀、銅、亜鉛、錫、インジウム、パラジウ
ム、アルミニウムなどが挙げられ、これらを組み合せて
も良い。もちろん、これらの金属膜の選択には、金属膜
２や被着体の回路端子６との密着力などを考慮して組合
せた方がよいことはいうまでもない。また、通常のＬＣ
ＤとＦＰＣとの接続の場合などでは、接続時の被着体の
熱膨張や接着剤樹脂の硬化を考慮して１２０〜２００℃
程度の融点を有するものが好ましい。金属膜３の厚さに
は特に制限はないが、薄すぎると溶融した場合に、電極
端子側に溶融物がとられてしまい導電性が不安定にな
り、逆に厚すぎると粒子変形が困難になったり端子間シ
ョートの危険性などが生じるため、０．１〜５μｍ程度
が好ましい。また、無電解メッキなどにより均一に被覆
されている方が望ましいことは言うまでもない。The outermost metal film 3 used in the present invention is
The composition is not particularly limited as long as it has a melting point lower than that of the metal film 2 formed on the surface of the polymer core material.
Nickel, silver, copper, zinc, tin, indium, palladium, aluminum, etc. are mentioned, and these may be combined. Of course, it goes without saying that these metal films should be selected in consideration of the adhesion to the metal film 2 and the circuit terminal 6 of the adherend, and the like. Also, normal LC
In the case of connecting D and FPC, etc., 120 to 200 ° C. in consideration of thermal expansion of the adherend and hardening of the adhesive resin at the time of connection.
Those having a melting point of the order of magnitude are preferable. There is no particular limitation on the thickness of the metal film 3, but if it is too thin, the melted substance will be taken off on the electrode terminal side to make the conductivity unstable, and if it is too thick, particle deformation will be difficult. Therefore, the risk of short-circuiting between terminals may occur, so 0.1 to 5 μm is preferable. Further, it goes without saying that it is desirable to be uniformly coated by electroless plating or the like.
【００１５】本発明に用いられる接着剤４は、絶縁性を
示すものであれば、熱可塑性、熱硬化性、光硬化性など
特に制限はない。例えば、スチレンブタジエン樹脂、ス
チレン樹脂、エチレン酢酸ビニル樹脂、アクリルニトリ
ルブタジエンゴム、シリコン樹脂、アクリル樹脂、エポ
キシ樹脂、ウレンタン樹脂、フェノール樹脂、アミド樹
脂、エポキシメタクリレート系をはじめとするアクリレ
ート系樹脂などが挙げられ、必要に応じて２種以上の樹
脂を組み合わせれば良い。また、必要に応じて、粘着付
与剤、架橋剤、老化防止剤、カップリング剤等を併用し
ても良い。The adhesive 4 used in the present invention is not particularly limited as long as it has an insulating property, such as thermoplasticity, thermosetting and photocuring. For example, styrene-butadiene resin, styrene resin, ethylene vinyl acetate resin, acrylonitrile-butadiene rubber, silicon resin, acrylic resin, epoxy resin, urethane resin, phenol resin, amide resin, acrylate resin including epoxy methacrylate resin, etc. Therefore, two or more kinds of resins may be combined if necessary. Moreover, you may use together a tackifier, a crosslinking agent, an antioxidant, a coupling agent, etc. as needed.
【００１６】[0016]
【実施例】以下、本発明による実施例及び従来方法によ
る比較例を示す。 実施例１ エポキシ樹脂（エピコート１００４、油化シェルエポキ
シ（株）製）８０重量部、アクリルニトリルブタジエン
共重合体（ＪＳＲ（株）製）１５重量部、１−ベンジル
２−メチルイミダゾール（四国化成（株）製）５重量部
を混合した接着剤に、メラミン樹脂を核材とし、厚さ
０．３μｍのニッケルをメッキし、更に最外層として半
田（６３／３７＝Ｓｎ／Ｐｂ）被覆を０．５μｍ形成し
た平均粒径８μｍ、最大粒径１５μｍの分布を有する導
電性粒子を２体積％分散させ、異方導電フィルムを作製
した。EXAMPLES Examples according to the present invention and comparative examples according to the conventional method will be shown below. Example 1 80 parts by weight of an epoxy resin (Epicoat 1004, manufactured by Yuka Shell Epoxy Co., Ltd.), 15 parts by weight of an acrylonitrile-butadiene copolymer (manufactured by JSR Co., Ltd.), 1-benzyl 2-methylimidazole (Shikoku Chemical ( Co., Ltd.) 5 parts by weight of an adhesive were mixed, a melamine resin was used as a core material, nickel having a thickness of 0.3 μm was plated, and a solder (63/37 = Sn / Pb) coating was used as the outermost layer. Conductive particles having a distribution of 5 μm in average particle diameter of 8 μm and maximum particle diameter of 15 μm were dispersed in 2% by volume to prepare an anisotropic conductive film.
【００１７】この異方導電フィルムを、回路幅０．１ｍ
ｍ、回路ピッチ０．２ｍｍ、１６０端子を有するＦＰＣ
と、表面にインジウムを蒸着したガラス基板との間に挟
み、１７５℃、３０ｋｇ／ｃｍ2、２０秒の条件で熱圧
着することにより接続した。ここで用いたＦＰＣは、７
５μｍのポリイミド基材と３５μｍの銅箔からできたも
のであり、回路加工後表面をＳｎメッキしたものであ
る。A circuit width of 0.1 m is obtained by using this anisotropic conductive film.
m, circuit pitch 0.2 mm, FPC with 160 terminals
And a glass substrate on the surface of which indium was vapor-deposited, and thermocompression bonding was performed under the conditions of 175 ° C., 30 kg / cm 2 , and 20 seconds for connection. The FPC used here is 7
It is made of a polyimide base material of 5 μm and a copper foil of 35 μm, and the surface thereof is Sn-plated after circuit processing.
【００１８】この接続体を高温高湿度試験（８５℃、８
５％ＲＨ）に投入し、隣接端子間の接続抵抗値を観察し
た結果、１０００時間処理後も初期からの接続抵抗上昇
も全端子で３Ω以下と良好な接続性が得られた。This connected body was subjected to a high temperature and high humidity test (85 ° C., 8
5% RH) and observed the connection resistance value between adjacent terminals. As a result, even after 1000 hours of treatment, the increase in connection resistance from the initial stage was 3Ω or less at all terminals, indicating good connectivity.
【００１９】比較例１ 実施例と同じ接着剤に、半田（６３／３７＝Ｓｎ／Ｐ
ｂ）を組成とする、平均粒径１０μｍ、最大粒径３０μ
ｍの分布を有する金属粒子を２体積％分散させたものを
作製し、実施例１と同様の高温高湿度試験による評価を
行った結果、１０００時間処理後の接続抵抗値が初期に
比較して全端子で１０Ω以上上昇した。 比較例２ 実施例１と同じ接着剤に、メラミン樹脂を核材とし、厚
さ０．３μｍのニッケルをメッキした、平均粒径８μ
ｍ、最大粒径１５μｍの分布を有する金属被覆粒子を２
体積％分散させたものを作製し、実施例１と同様の高温
高湿度試験による評価を行った結果、１０００時間処理
後の接続抵抗値が初期に比較して、２／３の端子は５Ω
以下であったが、約１／３の端子は１０Ω以上上昇し、
各端子間で接続信頼性に差が見られた。COMPARATIVE EXAMPLE 1 Solder (63/37 = Sn / P) was applied to the same adhesive as in the example.
b) composition, average particle size 10 μm, maximum particle size 30 μm
2% by volume of metal particles having a distribution of m was prepared and evaluated by the same high temperature and high humidity test as in Example 1. As a result, the connection resistance value after 1000 hours of treatment was compared to the initial value. All terminals increased by 10Ω or more. Comparative Example 2 The same adhesive as in Example 1 was plated with nickel having a melamine resin as a core material and a thickness of 0.3 μm.
m, the maximum particle size is 15 μm.
As a result of making a dispersion in volume% and performing an evaluation by the same high temperature and high humidity test as in Example 1, the connection resistance value after 1000 hours of treatment was compared to the initial value, and 2/3 terminals were 5Ω.
It was below, but about 1/3 of the terminals increased by 10Ω or more,
There was a difference in connection reliability between the terminals.
【００２０】[0020]
【発明の効果】本発明の異方導電性フィルムを用いるこ
とにより、従来問題であった微細な回路同士の接続や、
回路端子の厚さにバラツキがある場合にも、全端子にわ
たって高い接続信頼性が得ることができる。また、ガラ
ス基板とＦＰＣの接続だけでなく、ＰＣＢ（プリント回
路基板）とＦＰＣの接続やＩＣと基板の接続も容易に高
い接続信頼性を得ることできる。EFFECT OF THE INVENTION By using the anisotropic conductive film of the present invention, connection between fine circuits which has been a problem in the past, and
Even if the thickness of the circuit terminals varies, high connection reliability can be obtained over all terminals. Further, not only the connection between the glass substrate and the FPC, but also the connection between the PCB (printed circuit board) and the FPC and the connection between the IC and the substrate can be easily obtained with high connection reliability.
【図１】本発明による異方導電フィルムを説明するため
の断面模式図である。FIG. 1 is a schematic sectional view for explaining an anisotropic conductive film according to the present invention.
【図２】本発明による異方導電フィルムを用いた回路の
接続状態を示す断面図である。FIG. 2 is a cross-sectional view showing a connected state of a circuit using the anisotropic conductive film according to the present invention.
１ 高分子核材 ２ 金属膜 ３ 金属膜 ４ 接着剤 ５ 回路基板 ５’回路基板 ６ 電極端子 ６’電極端子 1 Polymer Core Material 2 Metal Film 3 Metal Film 4 Adhesive 5 Circuit Board 5'Circuit Board 6 Electrode Terminal 6'Electrode Terminal
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/14 Ｊ 8824−4Ｅ 3/32 Ｂ 7128−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location H05K 1/14 J 8824-4E 3/32 B 7128-4E
Claims (1)
させた異方導電フィルムにおいて、該導電性粒子が、そ
の中心核が高分子核材で、その表面に金属膜を有し、該
金属膜の更に外層に該金属膜よりも低融点の金属膜を有
することを特徴とする異方導電フィルム。1. An anisotropic conductive film in which conductive particles are dispersed in an insulating adhesive resin, wherein the conductive particles have a polymer core as a central core and a metal film on the surface thereof. An anisotropic conductive film having a metal film having a melting point lower than that of the metal film as an outer layer of the metal film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5303148A JPH07157720A (en) | 1993-12-03 | 1993-12-03 | Film having anisotropic electrical conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5303148A JPH07157720A (en) | 1993-12-03 | 1993-12-03 | Film having anisotropic electrical conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07157720A true JPH07157720A (en) | 1995-06-20 |
Family
ID=17917465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5303148A Pending JPH07157720A (en) | 1993-12-03 | 1993-12-03 | Film having anisotropic electrical conductivity |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07157720A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918121A (en) * | 1995-06-27 | 1997-01-17 | S I I R D Center:Kk | Electronic component mounted body and production thereof |
| JPH09199206A (en) * | 1996-01-19 | 1997-07-31 | Sony Chem Corp | Anisotropic conductive bonding film |
| US6214446B1 (en) | 1998-03-03 | 2001-04-10 | Nec Corporation | Resin film and a method for connecting electronic parts by the use thereof |
| JP2004149923A (en) * | 2003-10-23 | 2004-05-27 | Sekisui Chem Co Ltd | Electrically-conductive particulate and substrate |
| JP2004156145A (en) * | 1995-11-16 | 2004-06-03 | Sekisui Chem Co Ltd | Conductive particle |
| JP2004165659A (en) * | 2003-11-07 | 2004-06-10 | Hitachi Chem Co Ltd | Method of connecting electrodes and connecting structure of electrodes obtained by the same |
| JP2004273401A (en) * | 2003-03-12 | 2004-09-30 | Matsushita Electric Ind Co Ltd | Electrode connecting member, circuit module using it and manufacturing method therefor |
| WO2007061125A1 (en) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Industrial Co., Ltd. | Electronic component soldering structure and electronic component soldering method |
| JP2009231266A (en) * | 2007-07-06 | 2009-10-08 | Sekisui Chem Co Ltd | Conductive microparticle, anisotropic conductive material, and connection structural body |
| KR101138519B1 (en) * | 2009-09-30 | 2012-04-25 | 삼성전기주식회사 | Conductive paste and manufacturing method for printed circuit board using thereof |
| JP2012174357A (en) * | 2011-02-17 | 2012-09-10 | Sekisui Chem Co Ltd | Connection structure and method of manufacturing the same |
| JP2013037843A (en) * | 2011-08-05 | 2013-02-21 | Sekisui Chem Co Ltd | Connection structure, and connection structure manufacturing method |
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| JP2018129369A (en) * | 2017-02-07 | 2018-08-16 | 日立化成株式会社 | Connection structure, manufacturing method thereof, manufacturing method of electrode with terminal, and conductive particle, kit and transfer mold used therefor |
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-
1993
- 1993-12-03 JP JP5303148A patent/JPH07157720A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918121A (en) * | 1995-06-27 | 1997-01-17 | S I I R D Center:Kk | Electronic component mounted body and production thereof |
| JP2004156145A (en) * | 1995-11-16 | 2004-06-03 | Sekisui Chem Co Ltd | Conductive particle |
| JPH09199206A (en) * | 1996-01-19 | 1997-07-31 | Sony Chem Corp | Anisotropic conductive bonding film |
| US6214446B1 (en) | 1998-03-03 | 2001-04-10 | Nec Corporation | Resin film and a method for connecting electronic parts by the use thereof |
| US6311888B1 (en) | 1998-03-03 | 2001-11-06 | Nec Corporation | Resin film and a method for connecting electronic parts by the use thereof |
| JP2004273401A (en) * | 2003-03-12 | 2004-09-30 | Matsushita Electric Ind Co Ltd | Electrode connecting member, circuit module using it and manufacturing method therefor |
| JP2004149923A (en) * | 2003-10-23 | 2004-05-27 | Sekisui Chem Co Ltd | Electrically-conductive particulate and substrate |
| JP2004165659A (en) * | 2003-11-07 | 2004-06-10 | Hitachi Chem Co Ltd | Method of connecting electrodes and connecting structure of electrodes obtained by the same |
| US8148253B2 (en) | 2005-11-25 | 2012-04-03 | Panasonic Corporation | Electronic component soldering structure and electronic component soldering method |
| WO2007061125A1 (en) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Industrial Co., Ltd. | Electronic component soldering structure and electronic component soldering method |
| JP2009231266A (en) * | 2007-07-06 | 2009-10-08 | Sekisui Chem Co Ltd | Conductive microparticle, anisotropic conductive material, and connection structural body |
| KR101138519B1 (en) * | 2009-09-30 | 2012-04-25 | 삼성전기주식회사 | Conductive paste and manufacturing method for printed circuit board using thereof |
| JP2012174357A (en) * | 2011-02-17 | 2012-09-10 | Sekisui Chem Co Ltd | Connection structure and method of manufacturing the same |
| JP2013037843A (en) * | 2011-08-05 | 2013-02-21 | Sekisui Chem Co Ltd | Connection structure, and connection structure manufacturing method |
| US20140217450A1 (en) * | 2011-10-07 | 2014-08-07 | Dexerials Corporation | Anisotropic conductive adhesive and method for manufacturing same, and light-emitting device and method for manufacturing same |
| KR20140084076A (en) * | 2011-10-07 | 2014-07-04 | 데쿠세리아루즈 가부시키가이샤 | Anisotropic conductive adhesive and method for producing same, and light-emitting device and method for producing same |
| JP2016021577A (en) * | 2015-08-12 | 2016-02-04 | デクセリアルズ株式会社 | Solar cell module, manufacturing method of solar cell module, conductive adhesive |
| JP2018129369A (en) * | 2017-02-07 | 2018-08-16 | 日立化成株式会社 | Connection structure, manufacturing method thereof, manufacturing method of electrode with terminal, and conductive particle, kit and transfer mold used therefor |
| JPWO2018147429A1 (en) * | 2017-02-13 | 2019-02-14 | タツタ電線株式会社 | Ground member, shield printed wiring board, and method for manufacturing shield printed wiring board |
| JP2019125813A (en) * | 2017-02-13 | 2019-07-25 | タツタ電線株式会社 | Ground member, shield printed wiring board, and manufacturing method of shield printed wiring board |
| CN110958766A (en) * | 2017-02-13 | 2020-04-03 | 拓自达电线株式会社 | Grounding member, shielded printed wiring board, and method for manufacturing shielded printed wiring board |
| US10638598B2 (en) | 2017-02-13 | 2020-04-28 | Tatsuta Electric Wire & Cable Co., Ltd. | Ground member, shielded printed circuit board, and method for manufacturing shielded printed circuit board |
| CN110958766B (en) * | 2017-02-13 | 2023-10-17 | 拓自达电线株式会社 | Grounding member, shielded printed wiring board, and method for manufacturing shielded printed wiring board |
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