JP2982139B2 - Electronic circuit board transfer device - Google Patents
Electronic circuit board transfer deviceInfo
- Publication number
- JP2982139B2 JP2982139B2 JP3214328A JP21432891A JP2982139B2 JP 2982139 B2 JP2982139 B2 JP 2982139B2 JP 3214328 A JP3214328 A JP 3214328A JP 21432891 A JP21432891 A JP 21432891A JP 2982139 B2 JP2982139 B2 JP 2982139B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- station
- electronic circuit
- circuit board
- counting means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は電子回路基板搬送装置
に関し、より具体的にはベルトコンベア状の基板搬送装
置において基板を順次搬送してその上に電子部品を搭載
するものにおいて、基板を搭載位置に待ち時間なく順次
搬送し、電子部品を効率良く搭載する様にしたものに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board transfer device, and more particularly, to a device for transferring electronic substrates sequentially on a belt conveyor-type substrate transfer device and mounting electronic components thereon. The present invention relates to a device in which electronic components are efficiently transported to a position without waiting time and electronic components are efficiently mounted.
【０００２】[0002]
【従来の技術】ベルトコンベア状の搬送装置を備え、上
流側から基板を搬送し、待機ステーションで待機せしめ
たのち搭載ステーションに送り、そこで必要な電子部品
を装着して列外に送る電子回路基板搬送装置は従来から
知られており、その一例としては特開平３─３０４９６
号記載の技術を挙げることができる。2. Description of the Related Art An electronic circuit board provided with a belt-conveyor-type transfer device, which transfers a substrate from an upstream side, waits at a standby station, and then sends it to a mounting station, where necessary electronic components are mounted and sent out of line. Transporting apparatuses have been known in the art, and an example thereof is disclosed in JP-A-3-30496.
Can be mentioned.
【０００３】図４はその従来装置を示す説明図である
が、この種の装置にあっては基板の有無を検出し、搭載
ステーションが空いたら待機ステーションから直ちに基
板を搬送すると共に、待機ステーションには上流側の図
示しない基板供給ステーションから新しい基板を搬送す
る必要がある。そのために従来技術においては待機ステ
ーションと搭載ステーションとにセンサＳ１，Ｓ２を配
置して基板の有無を検出していた。この場合、センサと
しては光反射式、乃至は遮光式の光学式のものを用い、
通例、図５に一点鎖線で示す基板のエッジ付近で受光
（遮光）があるときはＨレベル信号を出力する様にして
基板の有無を検出していた。FIG. 4 is an explanatory view showing the conventional apparatus. In this type of apparatus, the presence or absence of a substrate is detected, and when the mounting station is vacant, the substrate is immediately transferred from the standby station, and is transferred to the standby station. Needs to transport a new substrate from a substrate supply station (not shown) on the upstream side. Therefore, in the related art, sensors S1 and S2 are arranged at the standby station and the mounting station to detect the presence or absence of the substrate. In this case, a light reflection type or a light shielding type optical sensor is used as the sensor,
Usually, when light is received (shielded) near the edge of the substrate indicated by the dashed line in FIG. 5, the presence or absence of the substrate is detected by outputting an H level signal.
【０００４】ところで基板の形状は必ずしも正矩形状で
はなく、図５に示す様にエッジ中央部が切り欠かれたも
の等、種々の形状があって一様ではない。この図５に示
す様な形状の基板にあっても誤りなくその有無を検出す
るために、従来は遅延回路付のセンサを使用し、基板を
前端位置などでいったん検出すると所定時間、即ち基板
が通過し終わる時間Ｈレベル信号を保持させ、後端側の
突起部を誤って検出することがない様にしていた。Incidentally, the shape of the substrate is not necessarily a regular rectangular shape, but has various shapes such as a shape in which the center of the edge is cut off as shown in FIG. In order to detect the presence or absence of a board having a shape as shown in FIG. 5 without error, a sensor with a delay circuit is conventionally used. The H level signal is held during the time when the passage is completed, so that the protrusion on the rear end side is not erroneously detected.
【０００５】[0005]
【発明が解決しようとする課題】しかし、かかるセンサ
は高価であると共に、例えば後端側で検出したときは基
板が通過した後も所定時間は基板の移動を検出できない
不都合があった。その点からセンサの配置位置を変え、
基板の中央位置で検出することも考えられるが、中央位
置付近が穿孔された基板もあり、いずれにしても従来技
術においては基板の形状の多様性に対して安定した検出
精度を常時得ることが困難であった。However, such a sensor is expensive and, for example, when it is detected on the rear end side, there is a disadvantage that the movement of the substrate cannot be detected for a predetermined time after the substrate has passed. From that point, change the position of the sensor,
It is conceivable to detect at the center position of the substrate, but some substrates are perforated near the center position, and in any case, in the related art, it is always possible to always obtain stable detection accuracy with respect to the variety of substrate shapes. It was difficult.
【０００６】従って、本発明の目的は上記した欠点を解
消し、多種多様な基板の形状にも即応して精度良く基板
の存在の有無を検出し、結果的に効率良く搬送して部品
搭載作業の待ち時間を減らして作業能率を向上させると
共に、構成においても廉価である電子回路基板搬送装置
を提供することにある。Accordingly, an object of the present invention is to solve the above-mentioned drawbacks, detect the presence or absence of a board with high accuracy in response to a variety of board shapes, and consequently efficiently transport and mount components. It is an object of the present invention to provide an electronic circuit board transfer device which can reduce the waiting time to improve the work efficiency and is inexpensive in the configuration.
【０００７】[0007]
【課題を解決するための手段】上記の目的を解決するた
めに本発明は例えば請求項１項に示すように、少なくと
も待機ステーションとその下流に位置する搭載ステーシ
ョンとを備え、搭載ステーションで待機ステーションか
ら搬送された基板上に電子回路部品を搭載するようにし
た電子回路基板搬送装置において、前記待機ステーショ
ンと搭載ステーションとに、基板の所定の搬送方向縦断
線上での基板部位の存在を検出してその回数を計数する
計数手段をそれぞれ配置し、両計数手段の計数値の一致
をもって１個もしくは複数個の基板がその間を通過した
ことを確認する如く構成した。 As shown in the present invention, for example according to claim 1, wherein in order to solve the above object, SUMMARY OF], and a loading station located at least wait station and downstream thereof, the waiting station loading station in the electronic circuit board transfer apparatus designed to mount the electronic circuit components on a substrate transferred from the the standby station and the loading station, to detect the presence of a substrate site at a predetermined conveying direction vertical line of the substrate A counting means for counting the number of times is arranged, and it is configured such that it is confirmed that one or a plurality of substrates have passed between them when the count values of both counting means coincide.
【０００８】[0008]
【作用】図５を参照して説明すると、一点鎖線で示す基
板搬送縦断線上の基板突起部位の個数を計数する訳であ
るが、計数することによって１個もしくは複数個の基板
の形状を特定することができる。従って上流側の待機ス
テーションの計数値と下流側の搭載ステーションの計数
値が一致すれば、特定された基板がその間を通過したこ
とを確実に検出することができ、よって基板の不在を直
ちに確認して迅速に補充することができるので、搭載ス
テーションでの作業の待ち時間が減少して効率良く部品
を搭載することができる。The operation will be described with reference to FIG. 5. The number of the substrate projections on the vertical line of the substrate transfer indicated by the one-dot chain line is counted. By counting, the shape of one or a plurality of substrates is specified. be able to. Therefore, if the count value of the standby station on the upstream side matches the count value of the mounting station on the downstream side, it is possible to reliably detect that the specified board has passed between them, and immediately confirm the absence of the board. Since the replenishment can be performed quickly, the waiting time of the operation at the mounting station can be reduced, and the parts can be mounted efficiently.
【０００９】[0009]
【実施例】以下、添付図面に即して本発明の実施例を説
明する。図１は本発明に係る電子回路基板搬送装置を概
略的に示す説明図である。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an explanatory view schematically showing an electronic circuit board transport device according to the present invention.
【００１０】図１において符号１０は第１のベルトコン
ベアを、符号Ｍ１はそれを駆動する第１のモータを示
す。このベルトコンベア１０とモータＭ１とで、上流側
の同種構成の基板供給ステーション（図示せず）から基
板１２の供給を受けて待機する待機ステーション（実施
例では「バッファ」と称する）を構成する。またその下
流側には第２のベルトコンベア１４と第２のモータＭ２
とで構成される搭載ステーション（実施例では「部品搭
載部」と称する）が接続され、ここで搬送された基板１
２上にチップマウンタ部（図１で図示せず）を介して所
要部品が装着され、更に下流側のステーション（図示せ
ず）に搬送される。尚、基板１２の形状は図５に示すも
のとする。In FIG. 1, reference numeral 10 indicates a first belt conveyor, and reference numeral M1 indicates a first motor for driving the first belt conveyor. The belt conveyor 10 and the motor M1 constitute a standby station (referred to as a "buffer" in the embodiment) for receiving a supply of the substrate 12 from a substrate supply station (not shown) of the same configuration on the upstream side and waiting. On the downstream side, the second belt conveyor 14 and the second motor M2
(In the embodiment, referred to as “component mounting section”), and the substrate 1 conveyed here is connected.
The required components are mounted on the chip 2 via a chip mounter unit (not shown in FIG. 1), and are further transported to a downstream station (not shown). The shape of the substrate 12 is as shown in FIG.
【００１１】ここでバッファと部品搭載部には図示の如
く、光反射式からなるセンサＳ１，Ｓ２，Ｓ３が、搬送
方向において図示の位置に配置される。即ち、バッファ
の下流端付近にはセンサＳ１が、部品搭載部には部品装
着位置の基板前端付近にセンサＳ２がそれぞれ配置され
ると共に、バッファの上流端付近には第１のセンサＳ１
に対して搬送する基板の搬送方向長さより大なる距離Ｄ
をおいて第３のセンサＳ３が配置される。尚、これらセ
ンサは横方向にあっては図５に示す一点鎖線の位置で検
出できる様な位置に配置される。Here, as shown in the drawing, sensors S1, S2 and S3 of the light reflection type are arranged at the positions shown in the transport direction in the buffer and the component mounting portion. That is, the sensor S1 is arranged near the downstream end of the buffer, the sensor S2 is arranged near the front end of the board at the component mounting position in the component mounting portion, and the first sensor S1 is arranged near the upstream end of the buffer.
Distance D greater than the length of the substrate to be transported in the transport direction
, A third sensor S3 is arranged. In addition, these sensors are arranged in such a position that they can be detected at the position indicated by the dashed line shown in FIG. 5 in the horizontal direction.
【００１２】図２はこれらセンサの出力を受けて装置の
動作を制御する制御装置を示すブロック図である。図に
おいてセンサＳ１，Ｓ２，Ｓ３の出力は処理回路２０に
送られ、そこでセンサが基板突起部位で反射光を受ける
たびにＨレベルの信号が生成されて次段のＣＰＵ２２に
送出される。ＣＰＵ２２は図５に示すようにＨレベル信
号の出力回数を計数し、モータＭ１，Ｍ２にオン，オフ
の信号を送出し、モータＭ１，Ｍ２を駆動する。ＲＯＭ
２４には図３に示すプログラムが格納され、ＲＡＭ２６
とによりプログラムを実行する。またセンサＳ２が基板
の到着を検出したときは駆動回路２８を介してチップマ
ウンタ部３０を駆動して部品の搭載を指令すると共に、
部品搭載プログラムの終了により搭載完了を検知する。FIG. 2 is a block diagram showing a control device for controlling the operation of the device in response to the outputs of these sensors. In the drawing, the outputs of the sensors S1, S2 and S3 are sent to a processing circuit 20, where an H-level signal is generated each time the sensor receives reflected light at the projection of the substrate and sent to the CPU 22 at the next stage. CPU22 counts the number of output times of the H-level signal as shown in FIG. 5, on the motor M1, M2, sends a signal off, driving the motor M1, M2. ROM
Program shown in FIG. 3 is stored in the 24, RAM 26
And execute the program. When the sensor S2 detects the arrival of the board, the chip mounter unit 30 is driven via the drive circuit 28 to instruct the mounting of components,
The completion of mounting is detected by the end of the component mounting program.
【００１３】次いで、図３を参照して本装置の動作を説
明する。Next, the operation of the present apparatus will be described with reference to FIG.
【００１４】先ずＳ１０でセンサＳ３の受光、即ち上流
側の基板供給ステーションから基板がバッファ上流端に
到着したか否かを確認する。尚、後で説明する様にこの
ときＳ４２でモータＭ１はオン（回転中）である。到着
が確認されるとＳ１２に進み、そこでバッファ上に基板
が搬送されつつあるので、上流側の基板供給ステーショ
ンの送り出しを中止し、次いでＳ１４でセンサＳ３のＨ
レベル出力を計数する。実施例の場合には図５に示す様
な形状から、矢印の方向に搬送するとき計数値は”２”
となる。First, in step S10, it is confirmed whether or not the substrate has arrived at the upstream end of the buffer from the substrate supply station on the upstream side, that is, whether or not the substrate has arrived at the sensor S3. At this time, the motor M1 is turned on (during rotation) at S42 as described later. When the arrival is confirmed, the process proceeds to S12, where the substrate is being conveyed onto the buffer, so that the sending out of the substrate supply station on the upstream side is stopped.
Count the level output. In the case of the embodiment, the count value is "2" when the sheet is conveyed in the direction of the arrow from the shape as shown in FIG.
Becomes
【００１５】続いて、Ｓ１６でセンサＳ１の受光確認、
即ち基板がバッファ下流端に達したか否か確認し、確認
されるとＳ１８に進んでセンサＳ３計数値をＲＡＭ２６
にメモリ１として格納する。即ち、センサＳ１，Ｓ３間
は距離Ｄだけ離してあることから、基板がセンサＳ１配
置位置に到達したことは基板がセンサＳ３配置位置を完
全に通過し終わった、換言すれば基板突起部位の計数を
終えて形状を通じて１個の基板の特定が可能となったこ
とを意味するので、この時点で計数値を記憶する。Subsequently, in step S16, the light reception of the sensor S1 is confirmed.
That is, it is confirmed whether or not the substrate has reached the downstream end of the buffer.
As the memory 1. That is, since the sensors S1 and S3 are separated by the distance D, the arrival of the substrate at the position where the sensor S1 is disposed means that the substrate has completely passed the position where the sensor S3 is disposed, in other words, the counting of the substrate protrusions. This means that one substrate can be specified through the shape after the completion of the above operation, and the count value is stored at this time.
【００１６】次いで、Ｓ２０でＳ１４と同様にセンサＳ
１の出力値を計数し、Ｓ２２で計数値がメモリ１（セン
サＳ３計数値）と一致するか否か判断する。Ｓ２２で一
致が確認されると、特定された形状の基板がバッファを
完全に通過し終わり、次段の部品搭載部に移送されつつ
あることが確認できるので、Ｓ２４で空いたバッファへ
の送り出しを許可すると共に、Ｓ２６でモータＭ１を停
止して部品搭載部への搬送を中断する。次いでＳ２８で
センサＳ２配置位置への到着を待ってＳ３０に進み、そ
こでセンサＳ１計数値をＲＡＭ２６にメモリ２として格
納する。次いで、Ｓ３２に進んで、モータＭ２を停止
し、下流への送り出しを停止し、Ｓ３３に進んで部品の
搭載を開始する。Next, in step S20, the sensor S
1 is counted, and in S22, it is determined whether or not the counted value matches the memory 1 (the counted value of the sensor S3). If a match is confirmed in S22, it can be confirmed that the board of the specified shape has completely passed through the buffer and is being transferred to the next component mounting section. At the same time as permitting, the motor M1 is stopped in S26 to interrupt the transportation to the component mounting unit. Next, in S28, the process proceeds to S30 after waiting for arrival at the sensor S2 arrangement position, where the count value of the sensor S1 is stored in the RAM 26 as the memory 2. Next, the process proceeds to S32, in which the motor M2 is stopped, and the downstream delivery is stopped, and the process proceeds to S33 to start mounting components.
【００１７】次いで、Ｓ３４で部品搭載プログラムの終
了により部品搭載完了を確認した後Ｓ３６に進み、そこ
でモータＭ２を再始動し、Ｓ３８に進んでセンサＳ２出
力を計数し、Ｓ４０でその計数値とメモリ２（センサＳ
１計数値）が一致したか否か判断する。一致すれば特定
された形状の基板がセンサＳ２配置位置を完全に通過し
終わった、即ち基板が列外に送り出されたことを意味す
るので、Ｓ４２に進んでモータＭ１を再始動し、Ｓ１０
に戻ってバッファから部品搭載部への基板の搬送を実行
し、以後かかるステップを繰り返す。Next, after confirming the completion of the component mounting by ending the component mounting program in S34, the process proceeds to S36, in which the motor M2 is restarted, the process proceeds to S38, and the sensor S2 output is counted. 2 (Sensor S
(1 count value) is determined. If they match, it means that the board of the specified shape has completely passed the sensor S2 arrangement position, that is, the board has been sent out of the row, so the process proceeds to S42, where the motor M1 is restarted.
Then, the board is transferred from the buffer to the component mounting section, and the steps are repeated thereafter.
【００１８】本実施例は上記の如く搬送方向に３個のセ
ンサを配置し、基板の突起部位の個数を計数して形状を
通じて１個の基板を特定し、計数値を互いに比較し合っ
て特定された形状の基板の通過を確認しつつ搬送するよ
うにしたので、各ステーションに基板が存在しないとき
は直ちに上流側から基板を補充することができ、結果的
に部品搭載部で順次部品を搭載することができて搭載作
業の待ち時間が低減し、効率よく基板を搬送して部品を
搭載することができる。In this embodiment, as described above, three sensors are arranged in the transport direction, the number of projecting portions of the substrate is counted, one substrate is specified through the shape, and the counted values are compared with each other and specified. to transport while confirming the has been the passage of the board of shape
Having in earthenware pots, when there is no substrate in each station may be supplemented with the substrate immediately from the upstream side, resulting in component mounting portion in order to be able to mount the parts to reduce the mounting operation latency Thus, the board can be efficiently transported and components can be mounted.
【００１９】[0019]
【発明の効果】請求項１項は、少なくとも待機ステーシ
ョンとその下流に位置する搭載ステーションとを備え、
搭載ステーションで待機ステーションから搬送された基
板上に電子回路部品を搭載するようにした電子回路基板
搬送装置において、前記待機ステーションと搭載ステー
ションとに、基板の所定の搬送方向縦断線上での基板部
位の存在を検出してその回数を計数する計数手段をそれ
ぞれ配置し、両計数手段の計数値の一致をもって１個も
しくは複数個の基板がその間を通過したことを確認する
如く構成したので、多種多様な基板であっても計数値か
ら形状を通じて１個もしくは複数個の基板を特定するこ
とができると共に計数値からその特定された形状の１個
もしくは複数個の基板の移動を確実に検出することかて
きて、いずれかのステーションに基板が存在しないとき
は直ちに補充することが可能となって基板を効率良く搬
送することができ、結果的に部品搭載作業での待ち時間
を短縮して部品搭載作業能率を向上させることができ
る。According to the first aspect of the present invention, there is provided at least a waiting station and a mounting station located downstream thereof.
In the electronic circuit board transfer apparatus designed to mount the electronic circuit components on the substrate conveyed from the standby station at the loading station, said the waiting station and the loading station, the substrate site at a predetermined conveying direction vertical line of the substrate detecting the presence of the counting means for counting the number of times respectively disposed, even one with a match count values of both counting means
Or, it is configured to confirm that a plurality of substrates have passed between them, so that even for a wide variety of substrates, one or more substrates can be specified through the shape from the count value, and from the count value. One of the specified shapes
Alternatively, it is possible to reliably detect the movement of a plurality of substrates, and when a substrate does not exist in any of the stations , it is possible to immediately replenish the substrate, thereby efficiently transporting the substrate, and as a result, The waiting time in the component mounting operation can be reduced, and the efficiency of the component mounting operation can be improved.
【００２０】請求項２項は、前記計数手段を前記待機ス
テーションの上流端付近と下流端付近とにそれぞれ配置
し、両計数手段の計数値の一致をもって前記１個もしく
は複数個の基板が待機ステーションを通過したことを確
認する如く構成したので、前記した理由から基板が待機
ステーションから搭載ステーションに移動したことを確
実かつ迅速に検出することができ、待機ステーションに
基板を直ちに補充することができ、結果的に部品搭載作
業能率を向上させることができる。Preferably, the counting means is arranged near the upstream end and near the downstream end of the waiting station, respectively, and when the counting values of both counting means coincide with each other, the one or more counting means are arranged.
Is configured to confirm that a plurality of substrates have passed through the standby station, so that it is possible to reliably and quickly detect that the substrate has moved from the standby station to the loading station for the reasons described above. Can be immediately replenished, and as a result, the efficiency of component mounting work can be improved.
【００２１】請求項３項は、前記計数手段を基板の搬送
方向長さより大なる離間距離をおいて配置する如く構成
したので、基板の形状を確実に特定することができ、結
果的に基板の移動を確実に検出して部品搭載作業能率を
向上させることができる。According to a third aspect of the present invention, the counting means is arranged at a separation distance larger than the length of the substrate in the transport direction, so that the shape of the substrate can be specified with certainty. The movement can be reliably detected, and the efficiency of component mounting work can be improved.
【図１】本発明に係る電子回路基板搬送装置の概略図で
ある。FIG. 1 is a schematic view of an electronic circuit board transfer device according to the present invention.
【図２】図１装置の制御装置の詳細を示す説明ブロック
図である。FIG. 2 is an explanatory block diagram showing details of a control device of the apparatus shown in FIG. 1;
【図３】図２装置の動作を示すフロー・チャートであ
る。FIG. 3 is a flowchart showing the operation of the apparatus in FIG. 2;
【図４】従来技術における電子回路基板搬送装置を示す
概略図である。FIG. 4 is a schematic view showing a conventional electronic circuit board transport device.
【図５】本装置で搬送する基板の形状の一例を示す説明
平面図である。FIG. 5 is an explanatory plan view showing an example of the shape of a substrate transferred by the present apparatus.
１０ 第１のベルトコンベア １２ 基板 １４ 第２のベルトコンベア ２０ 処理回路 ２２ ＣＰＵ ２４ ＲＯＭ ２６ ＲＡＭ ２８ 駆動回路 ３０ チップマウンタ部 Ｍ１ 第１のモータ Ｍ２ 第２のモータ Ｓ１ 第１のセンサ Ｓ２ 第２のセンサ Ｓ３ 第３のセンサ Reference Signs List 10 first belt conveyor 12 substrate 14 second belt conveyor 20 processing circuit 22 CPU 24 ROM 26 RAM 28 drive circuit 30 chip mounter unit M1 first motor M2 second motor S1 first sensor S2 second sensor S3 Third sensor
Claims (3)
に位置する搭載ステーションとを備え、搭載ステーショ
ンで待機ステーションから搬送された基板上に電子回路
部品を搭載するようにした電子回路基板搬送装置におい
て、前記待機ステーションと搭載ステーションとに、基
板の所定の搬送方向縦断線上での基板部位の存在を検出
してその回数を計数する計数手段をそれぞれ配置し、両
計数手段の計数値の一致をもって１個もしくは複数個の
基板がその間を通過したことを確認するように構成した
ことを特徴とする電子回路基板搬送装置。1. A comprising at least standby station and a loading station located downstream, in the electronic circuit board transfer apparatus designed to mount the electronic circuit components on the substrate conveyed from the standby station at the loading station, the waiting At the station and the mounting station, counting means for detecting the presence of a substrate portion on a vertical line in the predetermined transport direction of the substrate and counting the number of times are arranged, and one or more counting means are provided when the counting values of both counting means match. electronic circuit board conveying device number of <br/> substrate is characterized by being configured so as to confirm that passed between them.
上流端付近と下流端付近とにそれぞれ配置し、両計数手
段の計数値の一致をもって前記１個もしくは複数個の基
板が待機ステーションを通過したことを確認するように
したことを特徴とする請求項１項記載の電子回路基板搬
送装置。2. The counting means is arranged near the upstream end and near the downstream end of the standby station, respectively, and when one of the counting means coincides with the other, the one or more substrates are in standby. electronic circuit board conveying device according to claim 1, wherein said that so as to verify that has passed through the station.
大なる離間距離をおいて配置したことを特徴とする請求
項２項記載の電子回路基板搬送装置。3. The electronic circuit board carrying device according to claim 2, wherein said counting means is arranged at a separation distance larger than a length of the board in the carrying direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3214328A JP2982139B2 (en) | 1991-07-31 | 1991-07-31 | Electronic circuit board transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3214328A JP2982139B2 (en) | 1991-07-31 | 1991-07-31 | Electronic circuit board transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0537187A JPH0537187A (en) | 1993-02-12 |
| JP2982139B2 true JP2982139B2 (en) | 1999-11-22 |
Family
ID=16653934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3214328A Expired - Fee Related JP2982139B2 (en) | 1991-07-31 | 1991-07-31 | Electronic circuit board transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2982139B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5024964B2 (en) * | 2008-07-28 | 2012-09-12 | 矢崎総業株式会社 | Terminal number counting method and terminal number counting device |
| JP7432058B2 (en) * | 2021-03-03 | 2024-02-15 | 株式会社Fuji | Substrate transfer device and substrate transfer method |
-
1991
- 1991-07-31 JP JP3214328A patent/JP2982139B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537187A (en) | 1993-02-12 |
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