JPH0537187A - Conveyer for electronic circuit board - Google Patents
Conveyer for electronic circuit boardInfo
- Publication number
- JPH0537187A JPH0537187A JP3214328A JP21432891A JPH0537187A JP H0537187 A JPH0537187 A JP H0537187A JP 3214328 A JP3214328 A JP 3214328A JP 21432891 A JP21432891 A JP 21432891A JP H0537187 A JPH0537187 A JP H0537187A
- Authority
- JP
- Japan
- Prior art keywords
- station
- substrate
- sensor
- board
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は電子回路基板搬送装置
に関し、より具体的にはベルトコンベア状の基板搬送装
置において基板を順次搬送してその上に電子部品を搭載
するものにおいて、基板を搭載位置に待ち時間なく順次
搬送し、電子部品を効率良く搭載する様にしたものに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board transfer apparatus, and more specifically, to a board transfer apparatus in the form of a belt conveyor for sequentially transferring the boards and mounting electronic components thereon. The present invention relates to a device in which electronic components are efficiently carried to a position without waiting time and electronic components are efficiently mounted.
【０００２】[0002]
【従来の技術】ベルトコンベア状の搬送装置を備え、上
流側から基板を搬送し、待機ステーションで待機せしめ
たのち搭載ステーションに送り、そこで必要な電子部品
を装着して列外に送る電子回路基板搬送装置は従来から
知られており、その一例としては特開平３─３０４９６
号記載の技術を挙げることができる。2. Description of the Related Art An electronic circuit board provided with a belt conveyor-like transfer device, which transfers a board from an upstream side, waits at a standby station, and then sends it to a mounting station where necessary electronic components are mounted and sent out of a row. A carrier device has been known in the past, and one example thereof is JP-A-3-30496.
The techniques described in No. can be mentioned.
【０００３】図４はその従来装置を示す説明図である
が、この種の装置にあっては基板の有無を検出し、搭載
ステーションが空いたら待機ステーションから直ちに基
板を搬送すると共に、待機ステーションには上流側の図
示しない基板供給ステーションから新しい基板を搬送す
る必要がある。そのために従来技術においては待機ステ
ーションと搭載ステーションとにセンサＳ１，Ｓ２を配
置して基板の有無を検出していた。この場合、センサと
しては光反射式、乃至は遮光式の光学式のものを用い、
通例、図５に一点鎖線で示す基板のエッジ付近で受光
（遮光）があるときはＨレベル信号を出力する様にして
基板の有無を検出していた。FIG. 4 is an explanatory view showing the conventional apparatus. In this type of apparatus, the presence / absence of a substrate is detected, and when the mounting station is vacant, the substrate is immediately transferred from the standby station and also to the standby station. Needs to transfer a new substrate from a substrate supply station (not shown) on the upstream side. Therefore, in the prior art, sensors S1 and S2 are arranged in the standby station and the mounting station to detect the presence or absence of the substrate. In this case, a light reflection type or a light shielding type optical sensor is used as the sensor,
Usually, when there is light reception (light shielding) near the edge of the substrate shown by the one-dot chain line in FIG. 5, the presence or absence of the substrate is detected by outputting an H level signal.
【０００４】ところで基板の形状は必ずしも正矩形状で
はなく、図５に示す様にエッジ中央部が切り欠かれたも
の等、種々の形状があって一様ではない。この図５に示
す様な形状の基板にあっても誤りなくその有無を検出す
るために、従来は遅延回路付のセンサを使用し、基板を
前端位置などでいったん検出すると所定時間、即ち基板
が通過し終わる時間Ｈレベル信号を保持させ、後端側の
突起部を誤って検出することがない様にしていた。By the way, the shape of the substrate is not necessarily a rectangular shape, and there are various shapes such as a notched portion at the center of the edge as shown in FIG. 5, which is not uniform. In order to detect the presence / absence of a substrate having a shape as shown in FIG. 5 without error, conventionally, a sensor with a delay circuit is conventionally used, and once the substrate is detected at a front end position or the like, a predetermined time, that is, the substrate is The H-level signal is held for the time when the passage is completed so that the protrusion on the rear end side is not erroneously detected.
【０００５】[0005]
【発明が解決しようとする課題】しかし、かかるセンサ
は高価であると共に、例えば後端側で検出したときは基
板が通過した後も所定時間は基板の移動を検出できない
不都合があった。その点からセンサの配置位置を変え、
基板の中央位置で検出することも考えられるが、中央位
置付近が穿孔された基板もあり、いずれにしても従来技
術においては基板の形状の多様性に対して安定した検出
精度を常時得ることが困難であった。However, such a sensor is expensive and there is a disadvantage that the movement of the substrate cannot be detected for a predetermined time even after the substrate has passed when it is detected on the rear end side, for example. From that point, change the placement position of the sensor,
Although it may be possible to detect at the central position of the substrate, there are some substrates in which the vicinity of the central position is perforated, and in any case, in the prior art, it is possible to always obtain stable detection accuracy against the variety of substrate shapes. It was difficult.
【０００６】従って、本発明の目的は上記した欠点を解
消し、多種多様な基板の形状にも即応して精度良く基板
の存在の有無を検出し、結果的に効率良く搬送して部品
搭載作業の待ち時間を減らして作業能率を向上させると
共に、構成においても廉価である電子回路基板搬送装置
を提供することにある。Therefore, the object of the present invention is to solve the above-mentioned drawbacks, to detect the presence or absence of a substrate with high accuracy by quickly adapting to various shapes of the substrate, and as a result, to carry the component efficiently for component mounting work. Another object of the present invention is to provide an electronic circuit board carrying device which reduces the waiting time and improves the work efficiency and is inexpensive in the configuration.
【０００７】[0007]
【課題を解決するための手段】上記の目的を解決するた
めに本発明は例えば請求項１項に示す様に、少なくとも
待機ステーションとその下流に位置する搭載ステーショ
ンとを備え、搭載ステーションで待機ステーションから
搬送された基板上に電子回路部品を搭載する様にした電
子回路基板搬送装置において、前記待機ステーションと
搭載ステーションとに、基板の所定の搬送方向縦断線上
での基板部位の存在を検出してその回数を計数する計数
手段をそれぞれ配置し、両計数手段の計数値の一致をも
って基板がその間を通過したことを確認する如く構成し
た。In order to solve the above-mentioned problems, the present invention comprises at least a standby station and a mounting station located downstream thereof, as set forth in claim 1, and the standby station is the standby station. In an electronic circuit board transfer device in which electronic circuit parts are mounted on a board transferred from, the presence of a board part on a predetermined longitudinal direction of the board in the standby station and the mounting station is detected. Counting means for counting the number of times are arranged respectively, and it is configured to confirm that the substrate has passed between them by coincidence of the count values of both counting means.
【０００８】[0008]
【作用】図５を参照して説明すると、一点鎖線で示す基
板搬送縦断線上の基板突起部位の個数を計数する訳であ
るが、計数することによって基板の形状を特定すること
ができる。従って上流側の待機ステーションの計数値と
下流側の搭載ステーションの計数値が一致すれば、特定
された基板がその間を通過したことを確実に検出するこ
とができ、よって基板の不在を直ちに確認して迅速に補
充することができるので、搭載ステーションでの作業の
待ち時間が減少して効率良く部品を搭載することができ
る。Describing with reference to FIG. 5, the number of substrate projecting portions on the vertical line for conveying the substrate indicated by the alternate long and short dash line is counted. By counting, the shape of the substrate can be specified. Therefore, if the count value of the standby station on the upstream side and the count value of the mounting station on the downstream side match, it can be surely detected that the specified board has passed between them, and thus the absence of the board can be immediately confirmed. Since it can be quickly replenished, the waiting time of the work at the mounting station is reduced and the parts can be efficiently mounted.
【０００９】[0009]
【実施例】以下、添付図面に即して本発明の実施例を説
明する。図１は本発明に係る電子回路基板搬送装置を概
略的に示す説明図である。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an explanatory view schematically showing an electronic circuit board carrying device according to the present invention.
【００１０】図１において符号１０は第１のベルトコン
ベアを、符号Ｍ１はそれを駆動する第１のモータを示
す。このベルトコンベア１０とモータＭ１とで、上流側
の同種構成の基板供給ステーション（図示せず）から基
板１２の供給を受けて待機する待機ステーション（実施
例では「バッファ」と称する）を構成する。またその下
流側には第２のベルトコンベア１４と第２のモータＭ２
とで構成される搭載ステーション（実施例では「部品搭
載部」と称する）が接続され、ここで搬送された基板１
２上にチップマウンタ部（図１で図示せず）を介して所
要部品が装着され、更に下流側のステーション（図示せ
ず）に搬送される。尚、基板１２の形状は図５に示すも
のとする。In FIG. 1, reference numeral 10 indicates a first belt conveyor, and reference numeral M1 indicates a first motor for driving it. The belt conveyor 10 and the motor M1 constitute a standby station (referred to as a "buffer" in the embodiment) that receives a substrate 12 from a substrate supply station (not shown) of the same type on the upstream side and stands by. Further, on the downstream side of the second belt conveyor 14 and the second motor M2
The substrate 1 transported here is connected to a mounting station (referred to as “component mounting portion” in the embodiment) configured by
Required components are mounted on the chip 2 via a chip mounter section (not shown in FIG. 1), and are transported to a further downstream station (not shown). The shape of the substrate 12 is as shown in FIG.
【００１１】ここでバッファと部品搭載部には図示の如
く、光反射式からなるセンサＳ１，Ｓ２，Ｓ３が、搬送
方向において図示の位置に配置される。即ち、バッファ
の下流端付近にはセンサＳ１が、部品搭載部には部品装
着位置の基板前端付近にセンサＳ２がそれぞれ配置され
ると共に、バッファの上流端付近には第１のセンサＳ１
に対して搬送する基板の搬送方向長さより大なる距離Ｄ
をおいて第３のセンサＳ３が配置される。尚、これらセ
ンサは横方向にあっては図５に示す一点鎖線の位置で検
出できる様な位置に配置される。Here, as shown in the drawing, light reflecting sensors S1, S2 and S3 are arranged in the buffer and the component mounting portion at positions shown in the drawing in the transport direction. That is, the sensor S1 is arranged near the downstream end of the buffer, the sensor S2 is arranged near the front end of the board at the component mounting position in the component mounting portion, and the first sensor S1 is arranged near the upstream end of the buffer.
A distance D greater than the length of the substrate to be transported in the transport direction
A third sensor S3 is arranged with a gap. Incidentally, these sensors are arranged in a lateral position so that they can be detected at the position indicated by the alternate long and short dash line in FIG.
【００１２】図２はこれらセンサの出力を受けて装置の
動作を制御する制御装置を示すブロック図である。図に
おいてセンサＳ１，Ｓ２，Ｓ３の出力は処理回路２０に
送られ、そこでセンサが基板突起部位で反射光を受ける
たびにＨレベルの信号が生成されて次段のＣＰＵ２２に
送出される。ＣＰＵ２２は図５に示す様にＨレベル信号
の出力回数を計数し、モータＭ１，Ｍ２にオン，オフの
信号を送出し、モータＭ１，Ｍ２を駆動する。ＲＯＭ２
４は図３に示すプログラムが格納され、ＲＡＭ２６とに
よりプログラムを実行する。またセンサＳ２が基板の到
着を検出したときは駆動回路２８を介してチップマウン
タ部３０を駆動して部品の搭載を指令すると共に、部品
搭載プログラムの終了により搭載完了を検知する。FIG. 2 is a block diagram showing a control device which receives the outputs of these sensors and controls the operation of the device. In the figure, the outputs of the sensors S1, S2, S3 are sent to a processing circuit 20, where an H level signal is generated and sent to the CPU 22 in the next stage every time the sensor receives the reflected light at the substrate protrusion portion. As shown in FIG. 5, the CPU 22 counts the number of times the H level signal is output, sends ON / OFF signals to the motors M1 and M2, and drives the motors M1 and M2. ROM2
4 stores the program shown in FIG. 3, and executes the program with the RAM 26. When the sensor S2 detects the arrival of the board, the chip mounter unit 30 is driven via the drive circuit 28 to instruct the mounting of the component, and the mounting completion is detected by the end of the component mounting program.
【００１３】次いで、図３を参照して本装置の動作を説
明する。Next, the operation of this apparatus will be described with reference to FIG.
【００１４】先ずＳ１０でセンサＳ３の受光、即ち上流
側の基板供給ステーションから基板がバッファ上流端に
到着したか否かを確認する。尚、後で説明する様にこの
ときＳ４２でモータＭ１はオン（回転中）である。到着
が確認されるとＳ１２に進み、そこでバッファ上に基板
が搬送されつつあるので、上流側の基板供給ステーショ
ンの送り出しを中止し、次いでＳ１４でセンサＳ３のＨ
レベル出力を計数する。実施例の場合には図５に示す様
な形状から、矢印の方向に搬送するとき計数値は”２”
となる。First, in S10, it is confirmed whether or not the light is received by the sensor S3, that is, whether the substrate has arrived at the upstream end of the buffer from the upstream substrate supply station. As will be described later, at this time, the motor M1 is on (rotating) in S42. When the arrival is confirmed, the process proceeds to S12, in which the substrate is being transferred onto the buffer, so the delivery of the substrate supply station on the upstream side is stopped, and then at S14, the sensor S3 H
Count level output. In the case of the embodiment, from the shape as shown in FIG. 5, the count value is "2" when it is conveyed in the direction of the arrow.
Becomes
【００１５】続いて、Ｓ１６でセンサＳ１の受光確認、
即ち基板がバッファ下流端に達したか否か確認し、確認
されるとＳ１８に進んでセンサＳ３計数値をＲＡＭ２６
にメモリ１として格納する。即ち、センサＳ１，Ｓ３間
は距離Ｄだけ離してあることから、基板がセンサＳ１配
置位置に到達したことは基板がセンサＳ３配置位置を完
全に通過し終わった、換言すれば基板突起部位の計数を
終えて形状を通じて１個の基板の特定が可能となったこ
とを意味するので、この時点で計数値を記憶する。Subsequently, in S16, the light reception of the sensor S1 is confirmed,
That is, it is confirmed whether or not the substrate reaches the downstream end of the buffer, and if it is confirmed, the process proceeds to S18 and the sensor S3 count value is stored in the RAM 26.
Stored in memory 1 as memory 1. That is, since the sensors S1 and S3 are separated by the distance D, the fact that the substrate has reached the sensor S1 placement position means that the substrate has completely passed the sensor S3 placement position, in other words, the number of substrate protrusion portions is counted. Since it means that it is possible to specify one substrate through the shape after the above, the count value is stored at this point.
【００１６】次いで、Ｓ２０でＳ１４と同様にセンサＳ
１の出力値を計数し、Ｓ２２で計数値がメモリ１（セン
サＳ３計数値）と一致するか否か判断する。Ｓ２２で一
致が確認されると、特定された形状の基板がバッファを
完全に通過し終わり、次段の部品搭載部に移送されつつ
あることが確認できるので、Ｓ２４で空いたバッファへ
の送り出しを許可すると共に、Ｓ２６でモータＭ１を停
止して部品搭載部への搬送を中断する。次いでＳ２８で
センサＳ２配置位置への到着を待ってＳ３０に進み、そ
こでセンサＳ１計数値をＲＡＭ２６にメモリ２として格
納する。次いで、Ｓ３２に進んで、モータＭ２を停止
し、下流への送り出しを停止し、Ｓ３３に進んで部品の
搭載を開始する。Then, in S20, the sensor S
The output value of 1 is counted, and it is determined in S22 whether the counted value matches the memory 1 (sensor S3 counted value). When the match is confirmed in S22, it can be confirmed that the board of the specified shape has completely passed through the buffer and is being transferred to the component mounting unit in the next stage. Therefore, in S24, the board is sent to the empty buffer. At the same time as permitting, the motor M1 is stopped in S26 to interrupt the transportation to the component mounting portion. Next, in S28, after waiting for arrival at the sensor S2 arrangement position, the process proceeds to S30, where the sensor S1 count value is stored in the RAM 26 as the memory 2. Next, proceeding to S32, the motor M2 is stopped, feeding to the downstream is stopped, and proceeding to S33, mounting of components is started.
【００１７】次いで、Ｓ３４で部品搭載プログラムの終
了により部品搭載完了を確認した後Ｓ３６に進み、そこ
でモータＭ２を再始動し、Ｓ３８に進んでセンサＳ２出
力を計数し、Ｓ４０でその計数値とメモリ２（センサＳ
１計数値）が一致したか否か判断する。一致すれば特定
された形状の基板がセンサＳ２配置位置を完全に通過し
終わった、即ち基板が列外に送り出されたことを意味す
るので、Ｓ４２に進んでモータＭ１を再始動し、Ｓ１０
に戻ってバッファから部品搭載部への基板の搬送を実行
し、以後かかるステップを繰り返す。Then, in S34, after the completion of the component mounting program is confirmed, the process proceeds to S36, the motor M2 is restarted there, the process proceeds to S38, the sensor S2 output is counted, and the counted value and the memory are stored in S40. 2 (Sensor S
(1 count value) is determined whether or not they match. If they match, it means that the substrate of the specified shape has completely passed the sensor S2 arrangement position, that is, the substrate has been sent out of the row, so the process proceeds to S42 and the motor M1 is restarted, and S10
Then, the substrate is carried from the buffer to the component mounting portion, and the above steps are repeated thereafter.
【００１８】本実施例は上記の如く搬送方向に３個のセ
ンサを配置し、基板の突起部位の個数を計数して形状を
通じて１個の基板を特定し、計数値を互いに比較し合っ
て特定された形状の基板の通過を確認しつつ搬送する様
にしたので、各ステーションに基板が不在するときは直
ちに上流側から基板を補充することができ、結果的に部
品搭載部で順次部品を搭載することができて搭載作業の
待ち時間が低減し、効率よく基板を搬送して部品を搭載
することができる。In this embodiment, three sensors are arranged in the carrying direction as described above, one substrate is specified through the shape by counting the number of protruding portions of the substrate, and the counted values are compared with each other to specify. Since the board is conveyed while confirming the passage of the board of the specified shape, when there is no board at each station, the board can be immediately replenished from the upstream side, and as a result, the parts are sequentially mounted in the parts mounting section. This makes it possible to reduce the waiting time for mounting work, and efficiently convey the substrate to mount components.
【００１９】[0019]
【発明の効果】請求項１項は、少なくとも待機ステーシ
ョンとその下流に位置する搭載ステーションとを備え、
搭載ステーションで待機ステーションから搬送された基
板上に電子回路部品を搭載する様にした電子回路基板搬
送装置において、前記待機ステーションと搭載ステーシ
ョンとに、基板の所定の搬送方向縦断線上での基板部位
の存在を検出してその回数を計数する計数手段をそれぞ
れ配置し、両計数手段の計数値の一致をもって基板がそ
の間を通過したことを確認する如く構成したので、多種
多様な基板であっても計数値から形状を通じて１個の基
板を特定することができると共に計数値からその特定さ
れた形状の１個の基板の移動を確実に検出することがで
きて、いずれかのステーションで基板が不在するときは
直ちに補充することが可能となって基板を効率良く搬送
することができ、結果的に部品搭載作業での待ち時間を
短縮して部品搭載作業能率を向上させることができる。According to the first aspect of the present invention, at least the waiting station and the mounting station located downstream thereof are provided,
In an electronic circuit board transfer device in which electronic circuit components are mounted on the board transferred from the standby station at the mounting station, the standby station and the mounting station are provided with Counting means for detecting the existence and counting the number of times are respectively arranged, and it is configured to confirm that the substrate has passed between them by the coincidence of the count values of both counting means, so that even various types of boards can be counted. When one substrate can be specified from the numerical value through the shape and the movement of the one substrate having the specified shape can be reliably detected from the count value, and the substrate is absent at any station. Can be replenished immediately and the board can be transported efficiently, resulting in a shorter waiting time for component mounting work. It is possible to improve the work efficiency.
【００２０】請求項２項は、前記計数手段を前記待機ス
テーションの上流端付近と下流端付近とにそれぞれ配置
し、両計数手段の計数値の一致をもって基板が待機ステ
ーションを通過したことを確認する如く構成したので、
前記した理由から基板が待機ステーションから搭載ステ
ーションに移動したことを確実かつ迅速に検出すること
ができ、待機ステーションに基板を直ちに補充すること
ができ、結果的に部品搭載作業能率を向上させることが
できる。According to a second aspect of the present invention, the counting means is arranged near the upstream end and near the downstream end of the waiting station, respectively, and it is confirmed that the substrate has passed through the waiting station when the count values of both counting means match. Because it was configured as
For the reasons described above, it is possible to reliably and quickly detect that the substrate has moved from the standby station to the mounting station, and it is possible to immediately replenish the standby station with the substrate, resulting in an improvement in component mounting work efficiency. it can.
【００２１】請求項３項は、前記計数手段を基板の搬送
方向長さより大なる離間距離をおいて配置する如く構成
したので、基板の形状を確実に特定することができ、結
果的に基板の移動を確実に検出して部品搭載作業能率を
向上させることができる。According to the third aspect of the present invention, since the counting means is arranged at a distance larger than the length of the substrate in the carrying direction, the shape of the substrate can be reliably specified, and as a result, the substrate It is possible to reliably detect the movement and improve the component mounting work efficiency.
【図１】本発明に係る電子回路基板搬送装置の概略図で
ある。FIG. 1 is a schematic view of an electronic circuit board transfer device according to the present invention.
【図２】図１装置の制御装置の詳細を示す説明ブロック
図である。FIG. 2 is an explanatory block diagram showing details of a control device of the device shown in FIG.
【図３】図２装置の動作を示すフロー・チャートであ
る。FIG. 3 is a flow chart showing the operation of the apparatus shown in FIG.
【図４】従来技術における電子回路基板搬送装置を示す
概略図である。FIG. 4 is a schematic view showing an electronic circuit board transfer device in the prior art.
【図５】本装置で搬送する基板の形状の一例を示す説明
平面図である。FIG. 5 is an explanatory plan view showing an example of the shape of a substrate conveyed by the present apparatus.
１０ 第１のベルトコンベア １２ 基板 １４ 第２のベルトコンベア ２０ 処理回路 ２２ ＣＰＵ ２４ ＲＯＭ ２６ ＲＡＭ ２８ 駆動回路 ３０ チップマウンタ部 Ｍ１ 第１のモータ Ｍ２ 第２のモータ Ｓ１ 第１のセンサ Ｓ２ 第２のセンサ Ｓ３ 第３のセンサ 10 First belt conveyor 12 substrates 14 Second belt conveyor 20 Processing circuit 22 CPU 24 ROM 26 RAM 28 Drive circuit 30 Chip mounter M1 first motor M2 second motor S1 First sensor S2 second sensor S3 Third sensor
Claims (3)
に位置する搭載ステーションとを備え、搭載ステーショ
ンで待機ステーションから搬送された基板上に電子回路
部品を搭載する様にした電子回路基板搬送装置におい
て、前記待機ステーションと搭載ステーションとに、基
板の所定の搬送方向縦断線上での基板部位の存在を検出
してその回数を計数する計数手段をそれぞれ配置し、両
計数手段の計数値の一致をもって基板がその間を通過し
たことを確認する様に構成したことを特徴とする電子回
路基板搬送装置。1. An electronic circuit board transporting device comprising at least a standby station and a mounting station located downstream thereof, wherein electronic circuit components are mounted on a substrate transported from the standby station at the mounting station, the standby. Each of the station and the mounting station is provided with a counting unit that detects the presence of a substrate portion on a predetermined vertical direction of the substrate in the transfer direction and counts the number of times, and the substrate is placed between the two when the count values of both counting units match. An electronic circuit board transfer device characterized in that it is configured to confirm that it has passed.
上流端付近と下流端付近とにそれぞれ配置し、両計数手
段の計数値の一致をもって基板が待機ステーションを通
過したことを確認する様にしたことを特徴とする請求項
１項記載の電子回路基板搬送装置。2. The counting means is arranged near the upstream end and near the downstream end of the waiting station, respectively, and it is confirmed that the substrate has passed through the waiting station by coincidence of the count values of both counting means. The electronic circuit board transfer device according to claim 1, wherein:
大なる離間距離をおいて配置したことを特徴とする請求
項２項記載の電子回路基板搬送装置。3. The electronic circuit board carrying device according to claim 2, wherein the counting means is arranged at a distance larger than a length of the board in the carrying direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3214328A JP2982139B2 (en) | 1991-07-31 | 1991-07-31 | Electronic circuit board transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3214328A JP2982139B2 (en) | 1991-07-31 | 1991-07-31 | Electronic circuit board transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0537187A true JPH0537187A (en) | 1993-02-12 |
| JP2982139B2 JP2982139B2 (en) | 1999-11-22 |
Family
ID=16653934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3214328A Expired - Fee Related JP2982139B2 (en) | 1991-07-31 | 1991-07-31 | Electronic circuit board transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2982139B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010033262A (en) * | 2008-07-28 | 2010-02-12 | Yazaki Corp | Number-of-terminal counting method and number-of-terminal counting device |
| WO2022185428A1 (en) * | 2021-03-03 | 2022-09-09 | 株式会社Fuji | Substrate transfer apparatus and substrate transfer method |
-
1991
- 1991-07-31 JP JP3214328A patent/JP2982139B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010033262A (en) * | 2008-07-28 | 2010-02-12 | Yazaki Corp | Number-of-terminal counting method and number-of-terminal counting device |
| WO2022185428A1 (en) * | 2021-03-03 | 2022-09-09 | 株式会社Fuji | Substrate transfer apparatus and substrate transfer method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2982139B2 (en) | 1999-11-22 |
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