JP2940070B2 - Joining method of ceramics and metal - Google Patents
Joining method of ceramics and metalInfo
- Publication number
- JP2940070B2 JP2940070B2 JP2127656A JP12765690A JP2940070B2 JP 2940070 B2 JP2940070 B2 JP 2940070B2 JP 2127656 A JP2127656 A JP 2127656A JP 12765690 A JP12765690 A JP 12765690A JP 2940070 B2 JP2940070 B2 JP 2940070B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- metal
- nickel
- ceramic
- manganese
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、セラミックスと金属との接合方法に関する
ものである。Description: TECHNICAL FIELD The present invention relates to a method for joining ceramics and metal.
従来、セラミックス等の粉末成形体と金属とを接合す
るには、先ず、セラミックスの表面をMo−Mn法（テレフ
ケン法）で金属化（メタライズ）し、その後にニッケル
（Ni）鍍金を施し、必要に応じて応力緩衝のための中間
材を用い、銀（Ag）ろう等で金属にろう接している。Conventionally, in order to join a powder compact such as ceramics and a metal, the surface of the ceramics must first be metallized (metallized) by the Mo-Mn method (Telefken method) and then nickel (Ni) plated. An intermediate material for stress buffering is used in accordance with the method, and the metal is brazed with silver (Ag) brazing or the like.
特開昭60−145972号公報には、セラミックスと熱膨張
係数が近似している銅、モリブテン板を緩衝材として使
用したセラミックスと金属の接合体が提案されている。Japanese Patent Application Laid-Open No. 60-145972 proposes a ceramic-metal joint using a copper or molybdenum plate having a thermal expansion coefficient similar to that of ceramics as a cushioning material.
これら従来のセラミックスと金属の接合方法では、セ
ラミックスと金属をろう接する前に、セラミックス表面
の金属化及び、鍍金工程が必要となるので作業能率が悪
く、また、銀ろうを使用した場合には、銀の融点が低い
ため、接合体の耐熱性が低くなる。In these conventional methods of joining ceramics and metals, before brazing the ceramics and the metal, metallization of the ceramics surface and a plating process are required, so the work efficiency is poor, and when silver brazing is used, Since the melting point of silver is low, the heat resistance of the joined body is reduced.
この点を改善するため、本出願人は、片面のみにクロ
ーム鍍金を施したニッケル箔を用いてメタライズと同時
に接合する発明について、先に特許出願（特願平１−31
3223号）している。In order to improve this point, the present applicant has previously filed a patent application (Japanese Patent Application No. 1-31) for an invention in which metallization is simultaneously performed by using a chrome-plated nickel foil on one side only.
No. 3223).
〔発明が解決しようとする課題〕 前記先願の発明では、接合のため高温で60分程度の長
時間保持する必要があるため、接合サイクル時間が長く
なり、生産性に問題がある。[Problem to be Solved by the Invention] In the invention of the prior application, since it is necessary to hold at a high temperature for a long time of about 60 minutes for bonding, the bonding cycle time becomes long, and there is a problem in productivity.
本発明は前記の課題を解決し、セラミックスと金属を
高能率で接合でき、しかも耐熱性が高く、接合品質の向
上を図ることを目的とするものである。An object of the present invention is to solve the above-mentioned problems and to achieve high-efficiency bonding of ceramics and metal, high heat resistance, and improvement of bonding quality.
本発明は、セラミックスと金属との間に両側をニッケ
ル板とした応力緩衝材を介在させ、セラミックスと前記
応力緩衝材との間にクローム鍍金を施しその上にマンガ
ンを塗布したニッケル箔を配設し、所定の真空状態で加
熱、加工すすセラミックスと金属との接合方法である。The present invention interposes a stress buffer material having nickel plates on both sides between a ceramic and a metal, and arranges a chromium plating between the ceramic and the stress buffer material and a nickel foil coated with manganese thereon. Then, it is a bonding method of heating and processing soot ceramics and metal in a predetermined vacuum state.
ニッケル箔の表面層のマンガンがセラミックスと接触
してその表面を迅速に金属化し、同時にニッケル板が金
属とセラミックスとをろう接する。クローム鍍金は、ニ
ッケルがセラミックス側に侵入してニッケル−シリコン
化合物を生成するのを防止し、接合部の接合強度と耐熱
性が向上する。The manganese in the surface layer of the nickel foil comes into contact with the ceramic and quickly metallizes the surface, and at the same time, the nickel plate brazes the metal and the ceramic. The chrome plating prevents nickel from entering the ceramics side to form a nickel-silicon compound, and improves the bonding strength and heat resistance of the bonding portion.
本発明の実施例を図面について説明する。 An embodiment of the invention will be described with reference to the drawings.
第１図は、本発明の一実施例の説明図、第２図はセラ
ミックスに対するクローム及びマンガンの反応性を示す
ものである。FIG. 1 is an explanatory view of one embodiment of the present invention, and FIG. 2 shows the reactivity of chromium and manganese to ceramics.
先ず、本発明の着目点について説明する。第２図は、
窒化珪素（Si3N4）セラミックス成形体に対するクロー
ム（Cr）及びマンガン（Mn）のメタライズ時間と形成さ
れるメタライズ層厚さの関係を示すもので、図のはマ
ンガンを、はフローム示すもので、メタライズ温度を
1000℃とし、横軸のメタライズ時間Ｔの単位は、Ｔ1/2/
KS1/2としてある。First, the points of interest of the present invention will be described. Fig. 2
This figure shows the relationship between the metallization time of chromium (Cr) and manganese (Mn) and the thickness of the metallized layer formed on a silicon nitride (Si 3 N 4 ) ceramic molded body. , Metallizing temperature
1000 ° C. The unit of metallization time T on the horizontal axis is T 1/2 /
Available as KS 1/2 .
図から明らかなように、セラミックスとマンガンとの
反応性がクロームに比べて極めて良好であり、本発明
は、この点に着目してセラミックス成形体との接触面に
マンガンを用いるようにしたものである。As is clear from the figure, the reactivity between ceramics and manganese is much better than chrome, and the present invention focuses on this point and uses manganese for the contact surface with the ceramic molded body. is there.
第１図に示すように、セラミックスとして窒化珪素
（Si3N4）セラミックス成形体１と、金属としてステン
レス（SUS304）２を接合対象材に選び、両者の間に厚さ
2.0mmのタングステン（Ｗ）板３をはさんでその両側に
厚さ0.3と0.5mmのニッケル板４、５を配置し、また、セ
ラミックス成形体１とニッケル板５との間に、厚さ0.2m
mのニッケル箔の片面に４〜５μｍのクローム鍍金を施
し、更にその上にマンガンをスクリーン印刷等により塗
布した箔６を、マンガン層がセラミックス成形体１に当
接するようにはさみ、これらを５×10-5 Torrの真空中で
1100℃に加熱し、0.53Kg/mm2で加圧して30分間保持し
た。As shown in FIG. 1, a silicon nitride (Si 3 N 4 ) ceramic molded body 1 as a ceramic and stainless steel (SUS304) 2 as a metal are selected as materials to be joined, and a thickness between the two is selected.
Nickel plates 4 and 5 having a thickness of 0.3 and 0.5 mm are disposed on both sides of a 2.0 mm tungsten (W) plate 3, and a thickness of 0.2 mm is provided between the ceramic molded body 1 and the nickel plate 5. m
chrome plating of 4 to 5 μm on one side of a nickel foil having a thickness of 5 m, and manganese applied thereon by screen printing or the like is sandwiched between foils 6 such that the manganese layer is in contact with the ceramic molded body 1. In a vacuum of 10 -5 Torr
It was heated to 1100 ° C., pressurized at 0.53 kg / mm 2 , and held for 30 minutes.
その結果、平均接合強度 30Kg/mm2、耐熱温度400℃
が得られた。As a result, the average bonding strength is 30Kg / mm 2 , and the heat resistance temperature is 400 ℃
was gotten.
セラミックス１とステンレス２との間にタングステン
板３及びニッケル板4,5を配設してNi−Ｗ−Ni層を設け
たのは、接合による熱応力の緩和を図ったものであり、
ニッケル箔６にクローム鍍金を施したのは、ろう材とし
てのニッケルがセラミックス側に侵入してNi−Siの化合
物を生成するのを防止するためである。The reason why the tungsten plate 3 and the nickel plates 4, 5 are provided between the ceramics 1 and the stainless steel 2 to provide the Ni-W-Ni layer is to reduce the thermal stress due to the joining.
The chromium plating is applied to the nickel foil 6 in order to prevent nickel as a brazing material from entering the ceramics side and generating a Ni-Si compound.
ろう材として銀を用いずニッケルを使用したことによ
り、接合部の耐熱性が向上し、マンガン層を設けたこと
によりセラミックスの金属化が迅速に行えるので、接合
に要する時間が大幅に短縮できる。The use of nickel instead of silver as the brazing material improves the heat resistance of the joint, and the provision of the manganese layer allows the ceramic to be quickly metallized, thereby greatly reducing the time required for joining.
上記の接合条件は、真空度を10-4〜10-5 Torr、加圧力
を５〜7Kg/cm2、加熱温度を1000〜1200℃、保持時間を
１〜30分の範囲で変更することができ、また、ステンレ
ス以外の金属とセラミックスの接合にも適用できる。The above bonding conditions are as follows: the degree of vacuum is 10 -4 to 10 -5 Torr , the pressure is 5 to 7 kg / cm 2 , the heating temperature is 1000 to 1200 ° C., and the holding time is 1 to 30 minutes. It can also be applied to the joining of ceramics with metals other than stainless steel.
本発明は、セラミックスと金属を短時間で効率良く接
合でき、しかも耐熱性が高く、接合品質が向上する効果
が有る。ADVANTAGE OF THE INVENTION This invention can join a ceramics and a metal efficiently in a short time, and also has the effect of having high heat resistance and improving joining quality.
第１図は本発明の一実施例の説明図、第２図はセラミッ
クスに対するクローム及びマンガンの反応性を示す図で
ある。 1:セラミックス成形体、2:ステンレス 3:タングステン板、4,5:ニッケル板 6:マンガンコートクローム鍍金ニッケル箔FIG. 1 is an explanatory view of one embodiment of the present invention, and FIG. 2 is a view showing the reactivity of chromium and manganese to ceramics. 1: Ceramic body, 2: Stainless steel 3: Tungsten plate, 4, 5: Nickel plate 6: Manganese coated chrome plated nickel foil
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) C04B 37/02 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) C04B 37/02
Claims (1)
ル板とした応力緩衝材を介在させ、セラミックスと前記
応力緩衝材との間にクローム鍍金を施しその上にマンガ
ンを塗布したニッケル箔を配設し、所定の真空状態で加
熱、加圧することを特徴とするセラミックスと金属との
接合方法。1. A nickel foil coated with chromium and coated with manganese between the ceramic and the metal is provided with a stress buffer material having nickel plates on both sides between the ceramic and the metal. And heating and pressurizing in a predetermined vacuum state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2127656A JP2940070B2 (en) | 1990-05-17 | 1990-05-17 | Joining method of ceramics and metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2127656A JP2940070B2 (en) | 1990-05-17 | 1990-05-17 | Joining method of ceramics and metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0426571A JPH0426571A (en) | 1992-01-29 |
| JP2940070B2 true JP2940070B2 (en) | 1999-08-25 |
Family
ID=14965486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2127656A Expired - Lifetime JP2940070B2 (en) | 1990-05-17 | 1990-05-17 | Joining method of ceramics and metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2940070B2 (en) |
-
1990
- 1990-05-17 JP JP2127656A patent/JP2940070B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0426571A (en) | 1992-01-29 |
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