JPS5935074A - Ceramic sheet - Google Patents
Ceramic sheetInfo
- Publication number
- JPS5935074A JPS5935074A JP14532382A JP14532382A JPS5935074A JP S5935074 A JPS5935074 A JP S5935074A JP 14532382 A JP14532382 A JP 14532382A JP 14532382 A JP14532382 A JP 14532382A JP S5935074 A JPS5935074 A JP S5935074A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic
- brazing
- bonded
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Products (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は目的とする金属を、セラミックスに接合するこ
とができるセラミック素地、即ちセラミック板に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a ceramic base, that is, a ceramic plate, which can bond a target metal to ceramics.
従来、セラミックス(例えばアルミナ)に直接目的とす
る金属をろう付会属を介[7てろう付けすると熱膨張係
数が異なる為、その界面に残留応力が生じ、セラミック
ス自体に割れを起因させることけ既に知られている。Conventionally, when a target metal is directly attached to ceramics (e.g. alumina) via a brazing material [7], the coefficients of thermal expansion are different, so residual stress is generated at the interface, which can cause cracks in the ceramic itself. Already known.
それ故、従来はセラミックスと熱膨張係数が近似するコ
バール金円を選択して接合しているものの、このコ・バ
ール金属は耐熱性、耐蝕性に劣る為極めて用途範囲が狭
い。Therefore, conventionally, a Kovar gold circle with a coefficient of thermal expansion similar to that of ceramics has been selected and bonded, but this Kovar metal has poor heat resistance and corrosion resistance, so its range of applications is extremely narrow.
本発明は」:記従来事情に鋸みてなされたもので、その
目的とする処は耐熱性、耐蝕性に優れコスト的にも安価
なステンレス等の所望の金属を接合する仁とができるセ
ラミック板を提供せんとする本のである。The present invention has been made in view of the conventional circumstances, and its purpose is to form a ceramic plate that can be bonded to a desired metal such as stainless steel, which has excellent heat resistance and corrosion resistance and is inexpensive. This is a book that aims to provide.
以下、本発明の実施の態様を図面に基づいて説明する。Embodiments of the present invention will be described below based on the drawings.
第1工程は、セラミックス、例えばアルミナ基板に)に
、タングステン−モリブデン、モリブデン−マンガン或
いはタングステン単味のペーストを印刷し、加湿還元雰
囲気中にて1400〜1600℃で焼付けてアルミナ基
板0)表面にメタライジング層(1)を形成し、更にニ
ッケルメッキ層(4)を麹層する。The first step is to print a paste of tungsten-molybdenum, molybdenum-manganese, or tungsten alone on a ceramic (for example, an alumina substrate) and bake it at 1400 to 1600°C in a humidified reducing atmosphere to form a paste on the surface of the alumina substrate. A metallizing layer (1) is formed, and a nickel plating layer (4) is further applied as a koji layer.
次に第2工程としてそのニッケルメッキ層(4)K緩衝
金へ(?)をろう付会p4(馳)を介してろう付けする
。Next, as a second step, the nickel plating layer (4) is brazed to the K buffer gold (?) via a brazing joint p4.
緩135 金M (7) t、l、ステンレス板、ニッ
ケル板等の金F!板の薄板(肉厚0.05簡)を熔融温
度約960℃のe]↓ろう(馳)′を介して前記ニッケ
ルメッキ層(4) K接合する。Loose 135 Gold M (7) Gold F for T, L, stainless steel plates, nickel plates, etc.! A thin plate (thickness: 0.05 mm) is bonded to the nickel plated layer (4) via a solder having a melting temperature of approximately 960°C.
との時ろう付は時の鮎によりアルミナ基板囚及び緩備金
属(2) +i熱膨張係数(セラミックス、75−・8
5X10−7/℃、ステンレス110〜185X10−
V℃)の差によシその界面に残留応力が生ずるも、絡)
隅金ff4 (2)の容易なる弾性変形により緩和され
、メタライジング層(1)、アルミナ基板(A)には伝
達されず、メタライジング層(1)からの剥離、アルミ
ナ7i(i板い)の割れを阻止する。When brazing with alumina substrate and loose metal (2) +i thermal expansion coefficient (ceramics, 75-8
5X10-7/℃, stainless steel 110~185X10-
Although residual stress is generated at the interface due to the difference in V℃),
It is relaxed by the easy elastic deformation of corner metal FF4 (2) and is not transmitted to the metallizing layer (1) and alumina substrate (A), resulting in peeling from the metallizing layer (1) and alumina 7i (i plate). prevents cracking.
この状態で目的とする金14ω)、例えれ[,1テンレ
ス(J、B)を接合するセラミ2り板の成形工程は終了
し、後の工程として低融点のろう利金F↓(:5b)
(銀、銅合金系)を介してニッケルメッキ層(4)を旋
層した目的とする金MO3)を接合すれば何の支障もな
く目的とする金属を校舎できる。(記8工程)ちなみに
、第8工程において、緩往i金属(2)と、目的とする
金JRω)との熱膨張係数が同一である場合杜問題ない
が、熱膨張係数が只なるとそのrによりW面に残留応力
が生じるも両金属(A)(B)が弾性変形して緩和する
為、剥離する心配は々い。In this state, the forming process of the two ceramic plates that join the target gold (14ω), for example [,1 stainless steel (J, B), is completed, and the subsequent process is to form a low melting point brazing metal F↓ (:5b).
By joining the target gold MO3 layered with the nickel plating layer (4) via (silver, copper alloy system), the target metal can be made without any problems. (Step 8) By the way, in the 8th step, there is no problem if the coefficient of thermal expansion of the metal (2) and the target gold JRω) are the same, but if the coefficient of thermal expansion is the same, then the r Although residual stress is generated on the W surface, both metals (A) and (B) are elastically deformed and relaxed, so there is no risk of peeling.
尚、緩衝金M(2)は、アルミナ基板(6)との界面に
発生する残留応力に対して弾性変形するものであればパ
ンヂンダメタルであっても網状、繊維状に編組した本の
でも勿論任意である。Note that the buffer metal M (2) may be made of panned metal, or may be made of wire braided into a net or fiber shape, as long as it is elastically deformed in response to the residual stress generated at the interface with the alumina substrate (6). It is.
ちなみに上述の工程をもって金へを接合したセラミック
板を800℃から室温迄の急冷加熱サイクルを数十回繰
シ返えしても接合部分には何らの異常も見うけられない
ことが実験によシ立証された。By the way, experiments have shown that even after repeating the rapid cooling and heating cycle from 800°C to room temperature several dozen times on a ceramic plate bonded to gold using the process described above, no abnormality was observed in the bonded area. This has been proven.
本発明は叙上の如くメタライジング層を旋層したセラミ
ックスに、ろう付会属を介して薄い緩衝金属を接合して
いるので、ろう付会属を介してろう付けするとセラミッ
クスと緩衝金属との熱膨張係数の差によシ界面に残留応
力が生じるもその応力は緩衝金8の容易々る弾性変形に
て緩和される為、セラミックへは伝達せず、セラミック
表面に緩衝金属を接合したセラミック板を形成し得る。In the present invention, as described above, a thin buffer metal is bonded to ceramics laminated with a metallizing layer through a brazing metal, so when brazing through a brazing metal, the ceramic and the buffer metal are bonded together. Although residual stress occurs at the interface due to the difference in coefficient of thermal expansion, the stress is alleviated by the easy elastic deformation of the buffer metal 8, so it is not transmitted to the ceramic, and the ceramic is bonded with the buffer metal to the ceramic surface. A plate can be formed.
故に、この緩衝金属に目的とする金属をろう付会属を介
して接合すれば容易に目的の金属を接合できるセラミッ
ク板を供することができる。Therefore, by joining the target metal to this buffer metal via a brazing metal, a ceramic plate to which the target metal can be easily joined can be provided.
依って所期の目的を達成し得る。Therefore, the intended purpose can be achieved.
第1図は本発明セラミツタ板の部分拡大断面図第2図は
同セラミック板に目的とする金属を接合した状態を示す
部分拡大断面図である。
尚図中
(A)はアルミナ基板 (りはメタライジング層ω)
tま目的とする金属 (2)は緩衝金属(:sa) (
31)) tJ:ろう付会属特許出願人 東陶機器株
式会社
賢
いFIG. 1 is a partially enlarged cross-sectional view of a ceramic ivy plate according to the present invention. FIG. 2 is a partially enlarged cross-sectional view showing a state in which a target metal is bonded to the ceramic plate. In the figure, (A) is an alumina substrate (re is a metallizing layer ω)
The target metal (2) is the buffer metal (:sa) (
31)) tJ: Brazing Affiliated Patent Applicant Toto Kiki Co., Ltd. Smart
Claims (1)
F1を介して薄い緩衝金属を接合してなるセラミック板
。A ceramic plate made by bonding a thin buffer metal to ceramics laminated with a metallized layer via a brazing joint F1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14532382A JPS5935074A (en) | 1982-08-20 | 1982-08-20 | Ceramic sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14532382A JPS5935074A (en) | 1982-08-20 | 1982-08-20 | Ceramic sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5935074A true JPS5935074A (en) | 1984-02-25 |
Family
ID=15382497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14532382A Pending JPS5935074A (en) | 1982-08-20 | 1982-08-20 | Ceramic sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5935074A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6140879A (en) * | 1984-08-03 | 1986-02-27 | 日本碍子株式会社 | Metal ceramic bonded body and manufacture |
JPS61127674A (en) * | 1984-11-22 | 1986-06-14 | 日本特殊陶業株式会社 | Structure of bonding ceramic and metal |
JPH0446067A (en) * | 1990-06-12 | 1992-02-17 | Agency Of Ind Science & Technol | Joined body composed of ceramic body and metal body |
JP2006346739A (en) * | 2005-06-20 | 2006-12-28 | Daia Tool Kogaku Kk | Rotary cutting tool |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5659682A (en) * | 1979-10-20 | 1981-05-23 | Kogyo Gijutsuin | Manufacture of composite material consisting of ceramic and metal |
-
1982
- 1982-08-20 JP JP14532382A patent/JPS5935074A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5659682A (en) * | 1979-10-20 | 1981-05-23 | Kogyo Gijutsuin | Manufacture of composite material consisting of ceramic and metal |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6140879A (en) * | 1984-08-03 | 1986-02-27 | 日本碍子株式会社 | Metal ceramic bonded body and manufacture |
JPH0360794B2 (en) * | 1984-08-03 | 1991-09-17 | Nippon Gaishi Kk | |
JPS61127674A (en) * | 1984-11-22 | 1986-06-14 | 日本特殊陶業株式会社 | Structure of bonding ceramic and metal |
JPH0339991B2 (en) * | 1984-11-22 | 1991-06-17 | ||
JPH0446067A (en) * | 1990-06-12 | 1992-02-17 | Agency Of Ind Science & Technol | Joined body composed of ceramic body and metal body |
JP2006346739A (en) * | 2005-06-20 | 2006-12-28 | Daia Tool Kogaku Kk | Rotary cutting tool |
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