JP2800243B2 - Press processing equipment - Google Patents
Press processing equipmentInfo
- Publication number
- JP2800243B2 JP2800243B2 JP1084454A JP8445489A JP2800243B2 JP 2800243 B2 JP2800243 B2 JP 2800243B2 JP 1084454 A JP1084454 A JP 1084454A JP 8445489 A JP8445489 A JP 8445489A JP 2800243 B2 JP2800243 B2 JP 2800243B2
- Authority
- JP
- Japan
- Prior art keywords
- die
- punching material
- punching
- hole
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Punching Or Piercing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、半導体リードフレーム等のように、細い線
を残すような加工を行うプレス装置のプレス加工装置に
関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a press processing apparatus for a press apparatus that performs processing such as leaving a fine line, such as a semiconductor lead frame.
従来の技術 従来のプレス加工装置は、第３図に示すような構成に
なっていた。ここで、１はダイと呼ばれるプレス金型
で、打ち抜きたい部分の孔を有しており、打ち抜き材料
を載置する。２はストリッパーと呼ばれるもので、ダイ
１と同じように、打ち抜きたい部分の孔を有しており、
ダイ１に載置された打ち抜き材料４を押し着けている。
３はパンチで、ダイ１に載せられた打ち抜き材料４をス
トリッパー２で押し着けられてから押し下げられると、
ストリッパー２に設けられた孔を通過し、打ち抜き材料
４に当たり、ダイ１に設けられた孔に挿入される。この
ときに、打ち抜き材料４は抜かれる。2. Description of the Related Art A conventional press working apparatus has a configuration as shown in FIG. Here, reference numeral 1 denotes a press die called a die, which has a hole at a portion to be punched, and on which a punching material is placed. Reference numeral 2 denotes a stripper, which has a hole at a portion to be punched, like the die 1,
The punching material 4 placed on the die 1 is pressed.
Reference numeral 3 denotes a punch. When the punching material 4 placed on the die 1 is pressed down by the stripper 2 and then pressed down,
After passing through a hole provided in the stripper 2 and hitting the punching material 4, it is inserted into a hole provided in the die 1. At this time, the punching material 4 is removed.
発明が解決しようとする課題 打ち抜き材料となるリードフレームは第３図に示すよ
うに連続したパターンを一度に打ち抜けないので、一端
Ａの部を打ち抜いた後、Ｂの部分を抜ち抜いていた。こ
の場合、Ａの部分を打ち抜くことは問題とならないが、
その後でＢの部分を打ち抜く場合、第５図に示すよう
に、ストリッパー２で強く打ち抜き材料４を押し着けて
いるにも拘らず、打ち抜き材料４内に応力が残ってしま
っていた。その為、打ち抜き材料４を取り外したときに
インターナルリード部やアウターリード部がねじれてし
まうことがあった。Problems to be Solved by the Invention Since a lead frame to be a punching material does not punch through a continuous pattern at a time as shown in FIG. 3, one end A was punched out, and then a part B was punched out. . In this case, punching out part A is not a problem,
Thereafter, when the portion B is punched, as shown in FIG. 5, stress remains in the punching material 4 despite the fact that the punching material 4 is strongly pressed by the stripper 2. Therefore, when the punching material 4 is removed, the internal lead portion and the outer lead portion may be twisted.
課題を解決するための手段 この課題を解決するために本発明は、ダイに設けられ
たパンチ挿入孔を挾む位置に、パンチ動作時に打ち抜き
材料が拡がるのを防止する突起を設ける。Means for Solving the Problems In order to solve the problems, the present invention provides, at a position sandwiching a punch insertion hole provided in a die, a projection for preventing the punching material from spreading during a punching operation.
作用 この構成にすることにより、パンチ動作時に、打ち抜
き材料がダイの載置面方向に拡がることを防止する。Operation With this configuration, the punching material is prevented from spreading in the direction of the mounting surface of the die during the punch operation.
実施例 以下、本発明の一実施例におけるパンチ加工装置につ
いて図面を参照して詳細に説明する。Embodiment Hereinafter, a punching apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.
先ず、第１図は、本発明の実施例のパンチ加工装置の
斜視図である。ここで１は、ダイであり打ち抜き材料４
を載置するものである。このダイは、打ち抜いた部分に
対応した孔６を有している。４は打ち抜き材料でありリ
ードフレームの材料である。この打ち抜き材料４は、既
に孔７（第４図ではＡに対応する部分）がパンチによっ
て型成されたものである。３はパンチで、ダイ１に向っ
て下降し、ダイ１に設けられた孔６に挿入されること
で、打ち抜き材料４を加工する。尚、打ち抜き材料４の
上に、ストリッパーが重ねられて打ち抜き材料４を押し
着けるが、これは従来のものと同様であるので省略して
いる。５は、ダイ１に一体に設けられた突起であり、打
ち抜き材料４に設けられた孔７は丁度はまるような形状
であり、その上部は孔７に入りやすいようにテーパ或い
はＲ加工を施している。First, FIG. 1 is a perspective view of a punching apparatus according to an embodiment of the present invention. Here, reference numeral 1 denotes a die and a punching material 4
Is placed. This die has a hole 6 corresponding to the punched portion. Reference numeral 4 denotes a punching material, which is a lead frame material. The punched material 4 has a hole 7 (a portion corresponding to A in FIG. 4) already formed by a punch. Reference numeral 3 denotes a punch, which descends toward the die 1 and is inserted into a hole 6 provided in the die 1 to process the punched material 4. A stripper is superimposed on the punching material 4 to press the punching material 4, but this is omitted because it is the same as the conventional one. Reference numeral 5 denotes a projection provided integrally with the die 1. The hole 7 provided in the punching material 4 has a shape that just fits, and the upper part thereof is tapered or R-processed so as to easily enter the hole 7. I have.
第２図は、本実施例のプレス加工装置の断面図であ
る。この状態からパンチ３を更に下降させると、打ち抜
き材料４は応力を受けながらもダイ１に設けられた孔に
従って切り取られる。切り取られるとき、そのネジリ応
力により、打ち抜き材料４は、ダイ１に接した部位にお
いては図に向って左右に拡がることになるが、突起５に
よって阻止される。この為、パンチ３とストリッパー２
とを引き挙げて、打ち抜き材料４を取り外してもネジレ
は生じない。FIG. 2 is a sectional view of the press working apparatus of the present embodiment. When the punch 3 is further lowered from this state, the punched material 4 is cut out according to the holes provided in the die 1 while receiving stress. When cut off, the torsion stress causes the punched material 4 to spread right and left at the portion in contact with the die 1 as shown in the figure, but is blocked by the projection 5. Therefore, punch 3 and stripper 2
Therefore, even if the punching material 4 is removed, twisting does not occur.
発明の効果 以上のように、本発明は、ダイに、打ち抜き動作時の
打ち抜き材料の拡がりを防止する突起を設け、打ち抜き
部材の応力の発生を防止するようにしたので、半導体の
リードフレームのように細い線を残すプレス加工を行っ
てもネジレが発生することを防止することができ、さら
に突起と突起の間にレードフレームの打ち抜き部分を載
置して位置決めを行うので、位置ずれを防止することが
でき、また位置ずれが起きても容易に確認することがで
きるため、パンチミスを防止することができる。Effect of the Invention As described above, according to the present invention, the die is provided with the projection for preventing the spread of the punching material at the time of the punching operation, so as to prevent the generation of the stress of the punching member. The twisting can be prevented even if the press processing that leaves a thin line is performed, and the positioning is performed by placing the punched portion of the rade frame between the projections and positioning, thereby preventing the misalignment. In addition, since misalignment can be easily confirmed even when a displacement occurs, a punch error can be prevented.
第１図は本発明の一実施例におけるプレス加工装置の斜
視図、第２図は本実施例のプレス加工装置の断面図、第
３図は従来のプレス加工装置の断面図、第４図は半導体
リードフレームの概略図、第５図はプレス加工時の打ち
抜き材料内の応力を示す断面図である。FIG. 1 is a perspective view of a press working device in one embodiment of the present invention, FIG. 2 is a cross-sectional view of the press working device of the present embodiment, FIG. 3 is a cross-sectional view of a conventional press working device, and FIG. FIG. 5 is a schematic view of a semiconductor lead frame, and FIG. 5 is a sectional view showing stress in a punched material at the time of press working.
フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) B21D 28/14 B21D 28/34 B21D 28/00 H01L 23/50 H01L 23/48Continued on the front page (58) Fields surveyed (Int. Cl. 6 , DB name) B21D 28/14 B21D 28/34 B21D 28/00 H01L 23/50 H01L 23/48
Claims (1)
イと、第２の孔を有し前記ダイに載置された打ち抜き材
料を前記ダイに押し着けるストリッパーと、前記ストリ
ッパーと前記ダイとに設けられた第１および第２の孔に
挿入されて、打ち抜き材料を打ち抜くパンチと、前記ダ
イに立設された突起とを備え、前記突起にて打ち抜き材
料を保持することによって、前記第１の孔の上に打ち抜
き材料を配置し、前記パンチが前記第２の孔から前記第
１の孔の方に移動することで打ち抜き材料をプレスする
ことを特徴とするプレス加工装置。A die having a first hole on which a punching material is placed; a stripper having a second hole for pressing a punching material placed on the die against the die; A punch that is inserted into first and second holes provided in a die and punches a punching material; and a projection that is provided upright on the die, and that holds the punching material with the projection. A press working apparatus, wherein a punching material is arranged on a first hole, and the punch moves by moving the punch from the second hole toward the first hole to press the punching material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1084454A JP2800243B2 (en) | 1989-04-03 | 1989-04-03 | Press processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1084454A JP2800243B2 (en) | 1989-04-03 | 1989-04-03 | Press processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02263524A JPH02263524A (en) | 1990-10-26 |
| JP2800243B2 true JP2800243B2 (en) | 1998-09-21 |
Family
ID=13831070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1084454A Expired - Lifetime JP2800243B2 (en) | 1989-04-03 | 1989-04-03 | Press processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2800243B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6450222B2 (en) * | 2015-03-06 | 2019-01-09 | 株式会社三井ハイテック | Method for forming punched piece, laminate using punched piece formed by the method, and method for manufacturing laminated core |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6077449A (en) * | 1983-10-04 | 1985-05-02 | Toshiba Corp | Mold for semiconductor lead frame |
-
1989
- 1989-04-03 JP JP1084454A patent/JP2800243B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02263524A (en) | 1990-10-26 |
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