JPH02263524A - Press working device - Google Patents
Press working deviceInfo
- Publication number
- JPH02263524A JPH02263524A JP8445489A JP8445489A JPH02263524A JP H02263524 A JPH02263524 A JP H02263524A JP 8445489 A JP8445489 A JP 8445489A JP 8445489 A JP8445489 A JP 8445489A JP H02263524 A JPH02263524 A JP H02263524A
- Authority
- JP
- Japan
- Prior art keywords
- die
- punched
- punch
- hole
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 35
- 238000004080 punching Methods 0.000 claims description 27
- 238000003825 pressing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Punching Or Piercing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体リードフレーム等のように、細い線を
残すような加工を行うプレス装置のプレス加工装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a press processing device for processing semiconductor lead frames and the like by leaving thin lines.
従来の技術
従来のプレス加工装置は、第３図に示すような構成にな
っていた。ここで、１はダイと呼ばれるプレス金型で、
打ち抜きたい部分の孔を有しており、打ち抜き材料を載
置する。２はストリッパーと呼ばれるもので、ダイ１と
同じように、打ち抜きたい部分の孔を有しており、ダイ
１に載置された打ち抜き材料４を押し着けている。３は
パンチで、ダイ１に載せられた打ち抜き材料４をストリ
ッパー２で押し着けてから押し下げられると、ストリッ
パー２に設けられた孔を通過し、打ち抜き材料４に当た
シ、ダイ１に設けられた孔に挿入される。このときに、
打ち抜き材料４は抜かれる。BACKGROUND ART A conventional press working apparatus has a configuration as shown in FIG. Here, 1 is a press mold called a die,
It has a hole for the part to be punched out, and the punching material is placed therein. 2 is called a stripper, and like the die 1, it has a hole for the part to be punched, and presses the punching material 4 placed on the die 1. 3 is a punch which presses the punching material 4 placed on the die 1 with the stripper 2 and then, when pressed down, passes through a hole provided in the stripper 2, hits the punching material 4, and is inserted into the die 1. inserted into the hole. At this time,
The punching material 4 is punched out.
発明が解決しようとする課題
打ち抜き材料となるリードフレームは第３図に示すよう
に連続したパターンを一度に打ち抜けないので、一端人
の部を打ち抜いた後、Ｂの部分を打ち抜いていた。この
場合、人の部分を打ち抜くことは問題とならないが、そ
の後でＢの部分を打ち抜く場合、第５図に示すように、
ストリッパー２で強く打ち抜き材料４を押し着けている
にも拘らず、打ち抜き材料４内に応力が残ってしまって
いた。この為、打ち抜き材料４を取シ外しだときに、イ
ンターナルリード部やアウターリード部がねじれてしま
うことがあった。Problems to be Solved by the Invention Since the lead frame used as the punching material cannot be punched out in a continuous pattern at once as shown in Figure 3, after punching out the human part, the part B is punched out. In this case, punching out the human part is not a problem, but if you punch out part B afterwards, as shown in Figure 5,
Even though the stripper 2 was strongly pressing the punching material 4, stress remained in the punching material 4. For this reason, when the punching material 4 is removed, the internal lead portion and the outer lead portion may be twisted.
課題を解決するだめの手段
この課題を解決するために本発明は、ダイに設けられた
パンチ挿入孔を挾む位置に、パンチ動作時に打ち抜き材
料が拡がるのを防止する突起を設ける。Means for Solving the Problem In order to solve this problem, the present invention provides a protrusion that prevents the punched material from spreading during the punching operation, at a position sandwiching the punch insertion hole provided in the die.
作用
この構成にすることにより、パンチ動作時に、打ち抜き
材料がダイの載置面方向に拡がることを防止する。Function: This configuration prevents the punched material from spreading in the direction of the mounting surface of the die during the punching operation.
実施例
以下、本発明の一実施例におけるパンチ加工装置につい
て図面を参照して詳細に説明する。Embodiment Hereinafter, a punching apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.
先ず、第１図は、本発明の実施例のパンチ加°工装置の
斜視図である。ここで１は、ダイであり打ち抜き材料４
を載置するものである。このダイは、打ち抜きたい部分
に対応した孔６を有している。First, FIG. 1 is a perspective view of a punching device according to an embodiment of the present invention. Here, 1 is a die and the punching material 4
It is intended to place This die has a hole 6 corresponding to the part to be punched out.
４は打ち抜き材料でありリードフレームの材料である。4 is a punching material and a lead frame material.
この打ち抜き材料４は、既に孔７（第４図ではＡに対応
する部分）がパンチによって塑成されたものである。３
はパンチで、ダイ１に向って下降し、ダイ１に設けられ
た孔６に挿入されることで、打ち抜き材料４を加工する
。尚、打ち抜き材料４の上に、ストリッパーが重ねられ
て打ち抜き材料４を押し着けるが、これは従来のものと
同様であるので省略している。５は、ダイ１に一体に設
けられた突起であり、打ち抜き材料４に設けられた孔７
に丁度はまるよう々形状であり、その上部は孔７に入シ
やすいようにテーバ或いはＲ加工を施している。This punched material 4 has holes 7 (portions corresponding to A in FIG. 4) already formed by a punch. 3
is a punch, which descends toward the die 1 and is inserted into a hole 6 provided in the die 1 to process the punched material 4. Note that a stripper is placed on top of the punching material 4 to press the punching material 4, but since this is the same as in the conventional method, it is omitted. 5 is a projection provided integrally with the die 1, and a hole 7 provided in the punching material 4.
The upper part is tapered or rounded so that it fits into the hole 7 easily.
第２図は、本実施例のプレス加工装置の断面図である。FIG. 2 is a sectional view of the press processing apparatus of this embodiment.
この状態からパンチ３を更に下降させると、打ち抜き材
料４は応力を受けながらもダイ１に設けられた孔に従っ
て切り取られる。切り取られるとき、そのネジリ応力に
より、打ち抜き材料４は、ダイ１に接した部位において
は図に向って左右に拡がることになるが、突起已によっ
て阻止される。この為、パンチ３とストリッパー２とを
引き挙げて、打ち抜き材料４を取り外してもネジレは生
じない。When the punch 3 is further lowered from this state, the punched material 4 is cut out according to the hole provided in the die 1 while being subjected to stress. When cut out, due to the torsional stress, the punched material 4 will spread laterally in the drawing at the portion in contact with the die 1, but this is prevented by the protrusion rim. Therefore, even if the punch 3 and the stripper 2 are pulled up and the punched material 4 is removed, twisting will not occur.
発明の効果
以上のように、本発明は、ダイに、打ち抜き動作時の打
ち抜き材料の拡がりを防止する突起を設け、打ち抜き部
材の応力の発生を防止するようにしたので、半導体のリ
ードフレームのように細い線を残すプレス加工を行って
もネジレが発生することを防止することができる。Effects of the Invention As described above, in the present invention, the die is provided with a protrusion that prevents the punching material from spreading during the punching operation, and the generation of stress in the punched member is prevented. It is possible to prevent twisting from occurring even if press processing is performed that leaves thin lines on the surface.
第１図は本発明の一実施例におけるプレス加工装置の斜
視図、第２図は本実施例のプレス加工装置の断面図、第
３図は従来のプレス加工装置の断面図、第４図は半導体
リードフレームの概略図、第６図はプレス加工時の打ち
抜き材料内の応力を示す断面図である。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名１−
一一デイ
１−一−η゛１
第
図
＆−−−イシダーｒ尾リード
７−−−アウダーリーに
１−−−η“イFIG. 1 is a perspective view of a press working device according to an embodiment of the present invention, FIG. 2 is a sectional view of the press working device of this embodiment, FIG. 3 is a sectional view of a conventional press working device, and FIG. 4 is a sectional view of a conventional press working device. FIG. 6, which is a schematic diagram of a semiconductor lead frame, is a cross-sectional view showing stress in the punched material during press working. Name of agent: Patent attorney Shigetaka Awano and 1 other person1-
11 Day 1-1-η゛1 Fig.
Claims (1)
打ち抜き材料を前記ダイに押し着けるストリッパーと、
前記ストリッパーと前記ダイとに設けられた孔に挿入さ
れて、打ち抜き材料を打ち抜くパンチと、前記ダイに設
けられた孔を挾む位置に設けられ、前記パンチによる打
ち抜き動作時の打ち抜き材料の拡がりを防止する突起と
を有することを特徴とするプレス加工装置。a die for placing a punching material thereon; a stripper for pressing the punching material placed on the die against the die;
A punch inserted into holes provided in the stripper and the die to punch out the punching material, and a punch provided at a position sandwiching the hole provided in the die to prevent the spread of the punching material during the punching operation by the punch. A press processing device characterized by having a protrusion for preventing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1084454A JP2800243B2 (en) | 1989-04-03 | 1989-04-03 | Press processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1084454A JP2800243B2 (en) | 1989-04-03 | 1989-04-03 | Press processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02263524A true JPH02263524A (en) | 1990-10-26 |
| JP2800243B2 JP2800243B2 (en) | 1998-09-21 |
Family
ID=13831070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1084454A Expired - Lifetime JP2800243B2 (en) | 1989-04-03 | 1989-04-03 | Press processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2800243B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016163897A (en) * | 2015-03-06 | 2016-09-08 | 株式会社三井ハイテック | Formation method of die-cut piece, laminate using die-cut piece formed by method, and manufacturing method of laminated iron core |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6077449A (en) * | 1983-10-04 | 1985-05-02 | Toshiba Corp | Mold for semiconductor lead frame |
-
1989
- 1989-04-03 JP JP1084454A patent/JP2800243B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6077449A (en) * | 1983-10-04 | 1985-05-02 | Toshiba Corp | Mold for semiconductor lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016163897A (en) * | 2015-03-06 | 2016-09-08 | 株式会社三井ハイテック | Formation method of die-cut piece, laminate using die-cut piece formed by method, and manufacturing method of laminated iron core |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2800243B2 (en) | 1998-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR19980070182A (en) | Bump Formation Method | |
| JPH02263524A (en) | Press working device | |
| JPS62193162A (en) | Method for depression of lead frame | |
| JPH07112399A (en) | Punching method for tape-form member | |
| JP2670013B2 (en) | Draw forming method and draw forming apparatus | |
| JP3588234B2 (en) | Mold apparatus and lead frame manufacturing method | |
| JPH04274828A (en) | Blanking die for lead frame | |
| KR920001243Y1 (en) | Dies | |
| JP2803600B2 (en) | Hanging pin cutting device | |
| JPH11169961A (en) | Manufacture of lead frame | |
| JP2000218598A (en) | Manufacture of perforated foil | |
| JPH04274827A (en) | Blanking die for lead frame | |
| JP3419579B2 (en) | Press die for lead frame | |
| JPS63157729A (en) | Pressing method | |
| JPH0425058A (en) | Lead frame | |
| JP3314504B2 (en) | Caulking method | |
| JPS60180799A (en) | Press punching method of printed wiring board | |
| JPH0444255A (en) | Manufacture of lead frame | |
| JP3051490B2 (en) | Lead frame manufacturing method | |
| KR890006015Y1 (en) | Press punch and die structure for a regular transfer drawing | |
| JPH07120739B2 (en) | Lead cutting method | |
| KR910007367Y1 (en) | Piercing mold for punching a shount of electron gun | |
| JPS6347028U (en) | ||
| JPS62255009A (en) | Shearing method | |
| JPH03429A (en) | Method for punching slender hole |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070710 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080710 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090710 Year of fee payment: 11 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090710 Year of fee payment: 11 |