JP2734654B2 - Manufacturing method of hollow substrate and thermal head and motor bearing using the hollow substrate - Google Patents
Manufacturing method of hollow substrate and thermal head and motor bearing using the hollow substrateInfo
- Publication number
- JP2734654B2 JP2734654B2 JP17445589A JP17445589A JP2734654B2 JP 2734654 B2 JP2734654 B2 JP 2734654B2 JP 17445589 A JP17445589 A JP 17445589A JP 17445589 A JP17445589 A JP 17445589A JP 2734654 B2 JP2734654 B2 JP 2734654B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- glass
- hollow substrate
- thermal head
- hollow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、回路基板、サーマルヘッド用基板またはモ
ータの軸受等の耐摩耗部品として用い得るホーロ基板の
製造方法に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a hollow substrate that can be used as a wear-resistant component such as a circuit board, a thermal head substrate, or a motor bearing.
従来の技術 従来技術の説明としてサーマルヘッド用ホーロ基板の
製造方法を例に挙げ詳述する。2. Description of the Related Art As a description of the prior art, a method of manufacturing a hollow substrate for a thermal head will be described as an example.
溶融・冷却して作製したガラスフリットをボールミル
でミル引きして平均粒径が２〜３μｍの電着用スラリー
を作製し、このスラリーにホーロ用鋼板などの金属基板
を浸漬し、対極と金属基板間に直流電圧を印可してガラ
スフリット粒子を金属基板上に電着する。その後、基板
を充分に乾燥し、焼成してサーマルヘッド用絶縁ホーロ
基板を形成する。この方法で形成したサーマルヘッド用
絶縁ホーロ基板の表面粗度は、中心線平均粗さRaで0.05
〜0.08μｍであり、従来のホーロ基板（Ra:0.15〜0.3μ
ｍ）に比べて、極めて平滑性に優れている。The glass frit produced by melting and cooling is milled with a ball mill to produce a slurry for electrodeposition having an average particle size of 2 to 3 μm. Is applied with a DC voltage to electrodeposit glass frit particles on a metal substrate. Thereafter, the substrate is sufficiently dried and fired to form an insulating enamel substrate for a thermal head. The surface roughness of the insulating enamel substrate for a thermal head formed by this method has a center line average roughness Ra of 0.05%.
~ 0.08μm, conventional hollow substrate (Ra: 0.15 ~ 0.3μ
Compared with m), it is extremely excellent in smoothness.
発明が解決しようとする課題 しかし、上記従来例によるホーロ基板の平滑性では、
基板表面にサーマルヘッドの導電回路を形成したとき、
抵抗値のバラツキが大きくなるためサーマルヘッド用基
板としては、満足なものではなかった。Problems to be Solved by the Invention However, in the smoothness of the above-mentioned conventional hollow substrate,
When the conductive circuit of the thermal head is formed on the substrate surface,
Since the variation in the resistance value becomes large, it was not satisfactory as a substrate for a thermal head.
課題を解決するための手段 上記従来の問題を解決するために本発明は、結晶化ガ
ラスを金属基板上に被覆し、前記ガラスの結晶化開始点
以下の温度で仮焼成してガラスを非晶質状態にした後、
前記ガラスの屈伏点以上の温度で熱プレスし、さらに、
前記ガラスの結晶化開始点以上の温度で焼成してホーロ
基板を形成するものである。Means for Solving the Problems In order to solve the above-mentioned conventional problems, the present invention provides a method of coating a crystallized glass on a metal substrate, and preliminarily firing the glass at a temperature equal to or lower than the crystallization start point of the glass to make the glass After being in quality,
Hot pressing at a temperature above the yield point of the glass,
The glass is fired at a temperature equal to or higher than the crystallization start point of the glass to form an enamel substrate.
作用 金属基板に結晶化ガラスを被覆し、これを該ガラスの
結晶化開始点以下の温度で仮焼成すると、結晶の析出し
ていないガラス膜となる。この状態の該ガラス表面のRa
は、0.05μｍ〜0.08μｍ程度であり、アルミナグレーズ
基板のRa（0.01μｍ〜0.006μｍ）に比べると非常に大
きいものである。Action When a crystallized glass is coated on a metal substrate and calcined at a temperature equal to or lower than the crystallization start point of the glass, a glass film having no crystal deposited thereon is obtained. Ra of the glass surface in this state
Is about 0.05 μm to 0.08 μm, which is much larger than the Ra (0.01 μm to 0.006 μm) of the alumina glaze substrate.
そこで、該ホーロ基板の温度を、該ガラスの屈伏点以
上、結晶化開始点以下の温度範囲で、表面を鏡面に仕上
げた金型で熱プレスすると、ガラス表面の凹凸がレベリ
ングされ、表面が鏡面状態の平滑なガラス質のホーロ基
板ができる。さらに、結晶化開始点以上の温度で該基板
を焼成すると、微結晶が析出した表面の平滑な結晶化ホ
ーロ基板を形成することができる。Therefore, when the temperature of the hollow substrate is hot pressed with a mold having a mirror-finished surface in a temperature range from the deformation point of the glass to the crystallization start point or less, irregularities on the glass surface are leveled and the surface is mirror-finished. A smooth glassy hollow substrate in a state can be obtained. Furthermore, when the substrate is fired at a temperature equal to or higher than the crystallization start point, a crystallized enamel substrate having a smooth surface on which microcrystals are deposited can be formed.
実 施 例 以下本発明の実施例について説明する。EXAMPLES Examples of the present invention will be described below.
＜実施例１＞ 金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ
・水洗して前処理を行った後、平均粒径が７μｍの第１
表組成のガラス粒子からなるスラリー中に浸漬して、対
極と金属基板間に直流電圧を印加して第１表組成のガラ
ス粒子を金属基板上に150μｍ被覆した。その後、ガラ
スの結晶化開始点以下の温度730℃で10分間仮焼成し、
さらに、基板を680℃にして、表面を鏡面に磨いた金型
（Ra0.006μｍ）で熱プレスした（5kg/cm2で２分間）。
その後、結晶化開始点以上の温度900℃で10分間焼成し
てホーロ基板を形成した。<Example 1> A metal substrate was degreased, washed with water, pickled, washed with water, nickel-plated, washed with water, and subjected to pretreatment.
It was immersed in a slurry composed of glass particles having the composition shown in Table 1, and a DC voltage was applied between the counter electrode and the metal substrate to coat the glass particles having the composition shown in Table 1 on the metal substrate at 150 μm. After that, it is calcined at a temperature of 730 ° C. below the crystallization start point of the glass for 10 minutes,
Furthermore, the substrate was heated to 680 ° C. and hot-pressed (5 kg / cm 2 at 2 minutes) with a mold (Ra0.006 μm) having a mirror-polished surface.
Thereafter, the substrate was baked at a temperature of 900 ° C. or higher at the crystallization starting point for 10 minutes to form an enamel substrate.
この基板上に第１図に示したサーマルヘッドを形成し
た。第１図は本実施例によるホーロ基板を用いたサーマ
ルヘッドの断面図で、１は金属基板、２はニッケルメッ
キ層、３はホーロ層、４は電極、５は発熱抵抗体、６は
オーバーコート層である。 The thermal head shown in FIG. 1 was formed on this substrate. FIG. 1 is a cross-sectional view of a thermal head using a hollow substrate according to the present embodiment, wherein 1 is a metal substrate, 2 is a nickel plating layer, 3 is a hollow layer, 4 is an electrode, 5 is a heating resistor, and 6 is overcoat. Layer.
＜実施例２＞ 金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ
・水洗して前処理を行った後、平均粒径が７μｍの第１
表組成のガラス粒子からなるスラリー中に浸漬して、対
極と金属基板間に直流電圧を印加して第１表組成のガラ
ス粒子を金属基板上に150μｍ被覆した。その後、ガラ
スの結晶化開始点以下の温度730℃で10分間仮焼成し、
さらに、基板を680℃にして、表面を鏡面に磨いた金型
（Ra0.006μｍ）で熱プレスした（5kg/cm2で２分間）。
その後、結晶化開始点以上の温度900℃で10分間焼成し
てホーロ基板を形成した。<Example 2> After the metal substrate was subjected to pretreatment by degreasing, washing with water, pickling, washing with water, nickel plating, and washing with water, the first particle having an average particle size of 7 µm was obtained.
It was immersed in a slurry composed of glass particles having the composition shown in Table 1, and a DC voltage was applied between the counter electrode and the metal substrate to coat the glass particles having the composition shown in Table 1 on the metal substrate at 150 μm. After that, it is calcined at a temperature of 730 ° C. below the crystallization start point of the glass for 10 minutes,
Furthermore, the substrate was heated to 680 ° C. and hot-pressed (5 kg / cm 2 at 2 minutes) with a mold (Ra0.006 μm) having a mirror-polished surface.
Thereafter, the substrate was baked at a temperature of 900 ° C. or higher at the crystallization starting point for 10 minutes to form an enamel substrate.
この基板を第２図に示したコンパクトティスク用モー
タの軸受とした。第２図は本実施例によるコンパクトデ
ィスク用モータの断面図で、７は本実施例のホーロ基板
からなるモータの軸受、８は整流子、９はシャフト、10
はモータケースである。This substrate was used as a bearing for the compact disk motor shown in FIG. FIG. 2 is a sectional view of a motor for a compact disk according to the present embodiment, in which 7 is a bearing of a motor made of a hollow substrate of the present embodiment, 8 is a commutator, 9 is a shaft, 10
Denotes a motor case.
＜比較例１＞ 金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ
・水洗して前処理を行った後、平均粒径が７μｍの第１
表組成のガラス粒子からなるスラリー中に浸漬して、対
極と金属基板間に直流電圧を印加して第１表組成のガラ
ス粒子を金属基板上に150μｍ電着し、乾燥焼成（900
℃）してホーロ基板とした。さらに、その上に実施例１
と同様にサーマルヘッドの導電回路を形成した。<Comparative Example 1> A metal substrate was degreased, washed with water, pickled, washed with water, nickel-plated, washed with water, and subjected to a pretreatment.
The glass particles having the composition shown in Table 1 were immersed in a slurry composed of glass particles having the composition shown in Table 1, and a direct current voltage was applied between the counter electrode and the metal substrate to deposit 150 μm of the glass particles having the composition shown in Table 1 on the metal substrate.
° C) to obtain a hollow substrate. Furthermore, Example 1
A conductive circuit of a thermal head was formed in the same manner as described above.
＜比較例２＞ アルミナグレーズ基板上に実施例１と同様にサーマル
ヘッドの導電回路を形成した。Comparative Example 2 A conductive circuit of a thermal head was formed on an alumina glaze substrate in the same manner as in Example 1.
＜比較例３＞ 金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ
・水洗して前処理を行った後、平均粒径が７μｍの第１
表組成のガラス粒子からなるスラリー中に浸漬して、対
極と金属基板間に直流電圧を印加して第１表組成のガラ
ス粒子を金属基板上に150μｍ電着し、乾燥焼成（900
℃）してホーロ基板とした。さらに、実施例２と同様に
コンパクトディスク用モータの軸受とした。<Comparative Example 3> The metal substrate was degreased, washed with water, pickled, washed with water, nickel-plated, washed with water, and subjected to a pretreatment.
The glass particles having the composition shown in Table 1 were immersed in a slurry composed of glass particles having the composition shown in Table 1, and a DC voltage was applied between the counter electrode and the metal substrate.
° C) to obtain a hollow substrate. Further, a bearing for a motor for a compact disk was used as in the second embodiment.
＜比較例４＞ 実施例２と同様に軸受部にポリエステルフィルムを用
いてコンパクトディスク用モータとした。<Comparative Example 4> As in Example 2, a motor for a compact disk was formed using a polyester film for the bearing portion.
以上の実施例１、比較例１、２については、基板表面
上の中心線平均粗さRa、サーマルヘッドの発熱抵抗体の
抵抗値バラツキを測定し、比較した。この結果を第２表
に示す。In Example 1 and Comparative Examples 1 and 2 described above, the center line average roughness Ra on the substrate surface and the resistance value variation of the heating resistor of the thermal head were measured and compared. Table 2 shows the results.
また、実施例２、比較例３、４については、モータに
500gの荷重を加えて、500rpmの速さで回転させ、2000時
間後の軸受の摩耗量を測定した。この結果を第３表に示
す。 In Example 2 and Comparative Examples 3 and 4, the motor was used.
A load of 500 g was applied, the rotor was rotated at a speed of 500 rpm, and the amount of wear of the bearing after 2000 hours was measured. Table 3 shows the results.
以上のように、熱プレスによってガラス表面をレベリ
ングして基板の表面粗さを小さくした結果、サーマルヘ
ッドとしたときの抵抗値バラツキも極めて小さくするこ
とができた。As described above, as a result of reducing the surface roughness of the substrate by leveling the glass surface by hot pressing, variation in the resistance value when a thermal head was formed could be extremely reduced.
また、同様に本発明のホーロ基板をコンパクトディス
ク用モータの軸受として応用することによって、軸受の
摩耗特性も向上させ得ることが確認できた。Similarly, it was confirmed that by applying the hollow substrate of the present invention as a bearing for a motor for a compact disk, the wear characteristics of the bearing could be improved.
本発明において仮焼成の温度範囲、熱プレスの温度範
囲は非常に重要であり、これら以外の温度では表面性に
優れたホーロ基板は形成できない。In the present invention, the temperature range of the preliminary firing and the temperature range of the hot press are very important, and at other temperatures, an enamel substrate having excellent surface properties cannot be formed.
仮焼成の温度を結晶化開始点以上にすると、結晶が析
出してしまうためガラスが軟化し難くなり、それ以降ど
んな温度で熱プレスしてもガラスの表面はレベリングさ
れない。If the calcination temperature is higher than the crystallization start point, the glass is hardly softened because crystals are precipitated, and the surface of the glass is not leveled even if hot pressing is performed at any temperature thereafter.
また、熱プレスの温度を結晶化開始点以上にすると結
晶が析出するためレベリングされず、同様に、屈伏点以
下の温度にするとガラスが軟化しないのでレベリングさ
れない。If the temperature of the hot press is higher than the crystallization start point, crystals are deposited, and leveling is not performed. Similarly, if the temperature is lower than the yield point, the glass is not softened and leveling is not performed.
これらのことより、仮焼成温度は結晶化開始点以下、
熱プレス温度は屈伏点から結晶化開始点の温度範囲です
る必要がある。From these, the calcination temperature is below the crystallization start point,
The hot pressing temperature must be within the temperature range from the yield point to the crystallization start point.
発明の効果 以上の説明から明らかなように本発明は、結晶化ガラ
スを金属基板上に被覆し、前記ガラスの結晶化開始点以
下の温度で仮焼成してガラスを非晶質状態にした後、前
記ガラスの屈伏点以上の温度で熱プレスし、さらに、前
記ガラスの結晶化開始点以上の温度で焼成してホーロ基
板を形成したことによって、ホーロ基板の表面性を向上
させ、その結果、サーマルヘッドとしたときの抵抗値バ
ラツキやモータの軸受としたときの摩耗特性も向上させ
得ることができる。Effect of the Invention As is clear from the above description, the present invention provides a method of coating a crystallized glass on a metal substrate and temporarily firing the glass at a temperature equal to or lower than the crystallization start point of the glass to make the glass amorphous. By hot pressing at a temperature equal to or higher than the yield point of the glass, and further firing at a temperature equal to or higher than the crystallization start point of the glass to form a hollow substrate, thereby improving the surface properties of the hollow substrate, and as a result, It is also possible to improve resistance value variation when a thermal head is used and wear characteristics when a motor bearing is used.
第１図は本発明の第１実施例におけるホーロ基板を使用
したサーマルヘッドの断面構成図、第２図は本発明の第
２実施例におけるホーロ基板を使用したコンパクトディ
スク用モータの断面構成図である。 １……金属基板、２……ニッケルメッキ層、３……ホー
ロ層、４……電極、５……発熱抵抗体、６……オーバー
コート層、７……ホーロ基板からなるモータの軸受、８
……整流子、９……シャフト、10……モータケース。FIG. 1 is a sectional view of a thermal head using a hollow substrate according to a first embodiment of the present invention, and FIG. 2 is a sectional view of a motor for a compact disk using a hollow substrate according to a second embodiment of the present invention. is there. DESCRIPTION OF SYMBOLS 1 ... Metal substrate, 2 ... Nickel plating layer, 3 ... Hollow layer, 4 ... Electrode, 5 ... Heating resistor, 6 ... Overcoat layer, 7 ... Motor bearing consisting of a hollow substrate, 8
... commutator, 9 ... shaft, 10 ... motor case.
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｆ１６Ｃ 33/12 Ｇ１１Ｂ 19/20 Ｅ Ｇ１１Ｂ 19/20 Ｈ０５Ｋ 3/44 Ｃ Ｈ０５Ｋ 3/44 Ｂ４１Ｊ 3/20 １１１Ｃ (72)発明者 池田 正樹 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 西野 敦 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭63−312985（ＪＰ，Ａ) 特開 昭62−230989（ＪＰ，Ａ) 特開 平３−38093（ＪＰ，Ａ)Continuation of the front page (51) Int.Cl. 6 Identification code FI F16C 33/12 G11B 19/20 E G11B 19/20 H05K 3/44 C H05K 3/44 B41J 3/20 111C (72) Inventor Masaki Ikeda Osaka No. 1006, Kazuma, Kadoma, Matsushita Electric Industrial Co., Ltd. (72) Inventor Atsushi Nishino Atsushi, 1006, Kadoma, Kadoma, Osaka A) JP-A-62-230989 (JP, A) JP-A-3-38093 (JP, A)
Claims (3)
ガラスの結晶化開始点以下の温度で仮焼成してガラスを
非晶質状態にした後、前記ガラスの屈伏点以上の温度で
熱プレスし、さらに、前記ガラスの結晶化開始点以上の
温度で焼成することを特徴とするホーロ基板の製造法。A glass substrate is coated with crystallized glass and calcined at a temperature equal to or lower than the crystallization start point of the glass to make the glass amorphous. A method for manufacturing a hollow substrate, comprising hot pressing and firing at a temperature equal to or higher than the crystallization start point of the glass.
基板を用いたことを特徴とするサーマルヘッド。2. A thermal head using an enamel substrate obtained by the method according to claim 1.
基板を用いたことを特徴とするモータの軸受。3. A bearing for a motor, comprising a hollow substrate obtained by the method according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17445589A JP2734654B2 (en) | 1989-07-05 | 1989-07-05 | Manufacturing method of hollow substrate and thermal head and motor bearing using the hollow substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17445589A JP2734654B2 (en) | 1989-07-05 | 1989-07-05 | Manufacturing method of hollow substrate and thermal head and motor bearing using the hollow substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0339490A JPH0339490A (en) | 1991-02-20 |
| JP2734654B2 true JP2734654B2 (en) | 1998-04-02 |
Family
ID=15978789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17445589A Expired - Fee Related JP2734654B2 (en) | 1989-07-05 | 1989-07-05 | Manufacturing method of hollow substrate and thermal head and motor bearing using the hollow substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2734654B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019111997A1 (en) | 2017-12-06 | 2019-06-13 | 三菱マテリアル株式会社 | Insulating heat-transfer substrate, thermoelectric conversion module, and method for manufacturing insulating heat-transfer substrate |
| JP7200616B2 (en) | 2017-12-06 | 2023-01-10 | 三菱マテリアル株式会社 | Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate |
-
1989
- 1989-07-05 JP JP17445589A patent/JP2734654B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339490A (en) | 1991-02-20 |
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