JPH02301574A - Heat accumulating enameled substrate and production thereof - Google Patents
Heat accumulating enameled substrate and production thereofInfo
- Publication number
- JPH02301574A JPH02301574A JP12322489A JP12322489A JPH02301574A JP H02301574 A JPH02301574 A JP H02301574A JP 12322489 A JP12322489 A JP 12322489A JP 12322489 A JP12322489 A JP 12322489A JP H02301574 A JPH02301574 A JP H02301574A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- glasses
- glass particles
- metal substrate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 77
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011521 glass Substances 0.000 claims abstract description 65
- 239000002245 particle Substances 0.000 claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- 239000002002 slurry Substances 0.000 claims abstract description 18
- 150000003839 salts Chemical class 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 238000005338 heat storage Methods 0.000 claims description 16
- 238000010304 firing Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000004070 electrodeposition Methods 0.000 abstract description 4
- 210000003298 dental enamel Anatomy 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 238000005406 washing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 239000002659 electrodeposit Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明ζ上 回路基板やサーマルヘッド用基板として用
いる蓄熱性ホーロ基板およびその製造法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention ζ1 relates to a heat storage hollow substrate used as a circuit board or a substrate for a thermal head, and a method for manufacturing the same.
従来の技術
従来のサーマルヘッド用蓄熱性ホーロ基板の製造法を例
に挙げ詳述す４
溶融・冷却して作製したガラスフリットをボールミルで
ミル引きして平均粒径が２〜３μｍの電着用スラリーを
作製し このスラリーにホーロ用鋼板などの金属基板を
浸漬し 対極と金属基板間に直流電圧を印加してガラス
フリット粒子を金属基板上に電着すも その後、基板を
充分に乾燥し焼成してホーロ基板を形成すも この方法
で形成したホーロ基板の表面粗度（↓ 中心線平均粗さ
Ｒａで０．０５〜０．０８μｍであり、従来のホーロ基
板（Ｒａ： ０．１５〜０．３ｕｍ）に比べて極めて
平滑性に優れていも
発明が解決しようとする課題
上記従来例によるホーロ基板表面にサーマルヘッドの導
電回路を形成すると、抵抗値のバラツキは小さくなる。2. Prior Art A conventional method for manufacturing a heat storage hollow substrate for a thermal head will be explained in detail by taking an example. 4 A glass frit produced by melting and cooling is milled with a ball mill to create a slurry for electrodeposition with an average particle size of 2 to 3 μm. A metal substrate such as a steel plate for hollow holes is immersed in this slurry, and a DC voltage is applied between the counter electrode and the metal substrate to electrodeposit glass frit particles onto the metal substrate.Then, the substrate is thoroughly dried and fired. The surface roughness of the hollow substrate formed by this method (↓ Center line average roughness Ra is 0.05 to 0.08 μm, compared to the conventional hollow substrate (Ra: 0.15 to 0.08 μm). Problems to be Solved by the Invention Even though the smoothness is extremely superior compared to that of 3 um), when the conductive circuit of the thermal head is formed on the surface of the hollow substrate according to the conventional example described above, the variation in resistance value becomes smaller.
しかし 印字を行なうとガラスの熱伝導率が大きいため
熱が蓄熱され難く、その結果多くの電力を必要とＬ ア
ルミナグレーズ基板上に形成したサーマルヘッドに比べ
ると熱効率の悪いものでありへ
課題を解決するための手段
上記従来の問題点を解消するために本発明（友界面動電
位の符号が同一である２つ以上の異なる組成のガラス粒
子を混在させて同時に電着した後、焼成を行うことによ
って、ホーロ層中に多数の結晶を析出させた蓄熱性ホー
ロ基板を製造することを特徴とする。However, when printing, it is difficult for heat to be stored due to the high thermal conductivity of glass, and as a result, a large amount of electricity is required, and the thermal efficiency is lower than that of a thermal head formed on an alumina glaze substrate.This problem was solved. In order to solve the above-mentioned conventional problems, the present invention (in which glass particles of two or more different compositions with the same sign of the friend surface dynamic potential are mixed and simultaneously electrodeposited and then fired) The method is characterized in that a heat storage hollow substrate having a large number of crystals precipitated in a hollow layer is manufactured.
あるい１上 界面動電位の符号が同一である２つ以上の
異なる組成のガラス粒子と金属塩を混在させて同時に電
着した後、焼成を行って、ホーロ層中に多数の結晶を析
出させ、さらに 金属塩から多数の泡を発生させた蓄熱
性ホーロ基板を製造することを特徴とするものであも
作 用
本発明のホーロ基板６表 ２つ以上の異なる組成のガラ
ス粒子を混在させて同時に金属基板上に被覆し 乾燥
焼成して、数種類の結晶をホーロ層中に析出させること
によって熱伝導率を小さくさせるものであａ
一般的く 熱伝導率は単純な結晶構造のものほど大きく
、結晶構造の複雑なもへ あるいは多成分なものほど小
さ１℃ 以上のことより、組成の異なるガラスか収 そ
れぞれ 結晶を数種類析出させることによって、多成分
な結晶構造とじ その結果 熱伝導率を小さくして、サ
ーマルヘッドとしたときの熱効率を良くさせたものであ
ムまｆ、 ２つ以上の異なる組成のガラス粒子を金属
基板上に混在させて同時に電着させるためにζ上それぞ
れのガラス粒子の界面動電位の符号を同一にする必要が
あａ 符号が異なるとガラス粒子かの極側とｅ極側に分
かれて電着してしま（＼ 同一の金属基板上に数種類の
ガラス粒子を混在させて電着することが不可能となも
実施例
以上 本発明の実施例について説明す４〈実施例１〉
金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った後、平均粒径が７μｍの第１表
の組成Ａのガラス粒子と組成りのガラス粒子からなるス
ラリー中に浸漬して、対極と金属基板間に直流電圧を印
加して第１表の組成Ａ、 Ｂのガラス粒子を金属基板
上に同時に１５０μｍ電着し丸 その後、乾燥焼成して
絶縁ホーロ基板を形成した
第１表
この基板上に図に示したサーマルヘッドを形成した 図
は本実施例における蓄熱性ホーロ基板を用いたサーマル
ヘッドの断面図で、 ｌは金属基板２はニッケルメッキ
ｆｉ３ａ、 ３ｂは第１と第２の絶縁ホーロ胤 ４は電
機 ５は発熱抵抗対 ６はオーバーコート層であ４ 両
この実施例の絶縁ホーロ基板では第１の絶縁ホーロ層
３ａのみを形成している。Or 1 above: Two or more glass particles and metal salts of different compositions with the same sign of interfacial potential are mixed and electrodeposited at the same time, and then fired to precipitate a large number of crystals in the hollow layer. The hollow substrate of the present invention is characterized in that it produces a heat storage hollow substrate in which a large number of bubbles are generated from a metal salt. At the same time, coat it on a metal substrate and dry it.
It is a method that reduces thermal conductivity by precipitating several types of crystals in the hollow layer during firing.Generally, the thermal conductivity is higher for those with a simpler crystal structure, and higher for those with a more complex crystal structure. Since the temperature of glass with different compositions is smaller than 1°C, the more components there are, the higher the temperature is. This method improves thermal efficiency, and in order to mix two or more glass particles with different compositions on a metal substrate and simultaneously electrodeposit them, the sign of the interfacial potential of each glass particle is made the same on ζ. If the signs are different, the glass particles will be electrodeposited separately on the pole side and the e pole side (＼ It is impossible to mix and electrodeposit several types of glass particles on the same metal substrate) Tonamo Examples and More Examples of the present invention will be explained 4 <Example 1> Metal substrates were degreased, washed with water, pickled, washed with water, nickel plated, etc.
After washing with water and performing pretreatment, it is immersed in a slurry consisting of glass particles of composition A in Table 1 and glass particles of composition with an average particle size of 7 μm, and a DC voltage is applied between the counter electrode and the metal substrate. Glass particles of compositions A and B shown in Table 1 were simultaneously electrodeposited to a thickness of 150 μm on a metal substrate, and then dried and fired to form an insulating hollow substrate. The formed figure is a cross-sectional view of a thermal head using a heat storage hollow substrate in this example, where l is the metal substrate 2 plated with nickel fi3a, 3b is the first and second insulating hollow plate, 4 is an electric device, and 5 is a heating resistor. Pair 6 is an overcoat layer.In the insulating hollow substrate of this embodiment, only the first insulating hollow layer 3a is formed.
〈実施例２〉
金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った後、平均粒径が７μｍの第１表
の組成Ａ、 Ｂのガラス粒子および炭酸力ルシュウム
粒子からなるスラリー中に浸漬して、対極と金属基板間
に直流電圧を印加して第１表の組成Ａ、 Ｂのガラス
粒子と炭酸カルシュラム粒子を金属基板上に同時に１５
０μｍ電着し九その後、乾燥 焼成して、炭酸カルシュ
ラムから多数の泡を発生させた第１の絶縁ホーロ層３ａ
を有する絶縁ホーロ基板を形成し九 この基板上にサー
マルヘッドを形成した
〈実施例３〉
金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った後、平均粒径が７μｍの第１表
の組成Ａ、 Ｂのガラス粒子と炭酸力ルシュウム粒子
からなるスラリー中に浸漬して、対極と金属基板間に直
流電圧を印加して第１表の組成Ａ、 Ｂのガラス粒子
および炭酸力ルシュウム粒子を金属基板上に１００μｍ
電着し九 その後、第１表Ｂのガラスの軟化点以下の温
度６８０℃で１０分間熱処理して、第１の絶縁ホーロ層
３ａを形成し さらに 平均粒径が０．７μｍの第１表
の組成Ａ、 Ｂのガラス粒子からなるスラリーに浸漬
して、ガラス粒子を５０μｍ電着Ｌ 乾燥 焼成して第
２の絶縁ホーロ層３ｂを形成し 蓄熱性ホーロ基板とし
μ さらく その上に実施例Ｉと同様にサーマルヘッド
の導電回路を形成し九〈実施例４〉
平均粒径が７μｍの第１表の組成Ａ、 Ｂのガラス粒
子と炭酸カルシュラムからなるスラリーに前処理を行っ
た金属基板を浸漬して前記組成Ａ、 Ｂのガラス粒子
および炭酸力ルシュウム粒子を１００μｍ電着した そ
の後、 ６８０℃で熱処理して第１の絶縁ホーロ層３ａ
を形成し さら艮 平均０．７μｍで、第２表の組成か
らなる第２のガラス粒子のスラリーに浸漬してガラス粒
子を５０μｍ第２表
粒径が電着し 乾燥して、第２表のガラスの作業温度で
・焼成して第２の絶縁ホーロ層３ｂを形成ヒ蓄熱性ホー
ロ基板を形成し九 その上に実施例１と同様にサーマル
ヘッドの導電回路を形成し丸く比較例１〉
金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った眞 平均粒径が７μｍのガラス
粒子からなるスラリー中に浸漬して、対極と金属基板間
に直流電圧を印加して第１表の組成Ａのガラス粒子を金
属基板上に１５０μｍ電着し九 その後、乾燥 焼成し
て蓄熱性ホーロ基板を形成しム さらへ その上に実施
例１と同様にサーマルヘッドの導電回路を形成したく比
較例２〉
金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った後、平均粒径が７μｍのガラス
粒子からなるスラリー中に浸漬して、対極と金属基板間
に直流電圧を印加して第１表の組成りのガラス粒子を金
属基板上に１５０μｍ電着した その後、乾燥 焼成し
て蓄熱性ホーロ基板を形成し九 さらに その上に実施
例１と同様にサーマルヘッドの導電回路を形成したく比
較例３〉
金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った後、平均粒径が７μ・ｍの第１
表の組成Ａの第１のガラス粒子からなるスラリー中に浸
漬して、対極と金属基板間に直流電圧を印加して第１の
ガラス粒子を金属基板上に１００μｍ電着し九 その後
、第１表の組成Ａのガラスの軟化点以下の温度７００℃
で１ｏ分間熱処理し さらに 平均粒径が０．７μｍの
第１表の組成Ａの第２のガラス粒子からなるスラリーに
浸ン青して、第２のガラス粒子を５０μｍ電着し乾燥
焼成して絶縁ホーロ基板を形成し丸 さらに その上に
実施例１と同様にサーマルヘッドの導電回路を形成し九
〈比較例４〉
平均粒径が７μｍの第１表の組成Ａの第１のガラス粒子
からなるスラリーに前処理を行った金属基板を浸漬して
第１のガラス粒子を１００μｍ電着し丸 その後、 ７
００℃で熱処理Ｌ さら低平均粒径が０．７μｍで、第
２表の組成からなる第２のガラス粒子のスラリーに浸漬
してガラス粒子を５０μｍ電着し 乾燥して、第２表の
ガラスの作業温度で焼成し 絶縁ホーロ基板を形成した
その上に実施例１と同様にサーマルヘッドの導電回路を
形成した
く比較例５〉
アルミナグレーズ基板上に実施例１と同様にサーマルヘ
ッドの導電回路を形成しに
以上の実施例■〜４、比較例１〜５について、基板表面
上の中心線平均粗さＲａ、サーマルヘッドの発熱抵抗体
の抵抗値ばらつき、サーマルヘッドの印字濃度（熱効率
）を測定し 比較し九 この結果を第３表、第４表に示
す。<Example 2> Metal substrate was degreased, washed with water, pickled, washed with water, nickel plated,
After pretreatment by washing with water, the sample was immersed in a slurry consisting of glass particles and Lucium carbonate particles having compositions A and B in Table 1 with an average particle diameter of 7 μm, and a DC voltage was applied between the counter electrode and the metal substrate. By applying an electric current, glass particles and calcium carbonate particles having compositions A and B shown in Table 1 were simultaneously placed on the metal substrate for 15 minutes.
The first insulating hollow layer 3a is electrodeposited to a thickness of 0 μm and then dried and fired to generate a large number of bubbles from calcium carbonate.
A thermal head was formed on this substrate (Example 3) The metal substrate was degreased, washed with water, pickled, washed with water, nickel plated, and
After pretreatment by washing with water, the sample was immersed in a slurry consisting of glass particles and Lucium carbonate particles having compositions A and B in Table 1 with an average particle diameter of 7 μm, and a DC voltage was applied between the counter electrode and the metal substrate. Glass particles and lucium carbonate particles having compositions A and B in Table 1 were applied to a metal substrate with a thickness of 100 μm.
After electrodeposition, the first insulating hollow layer 3a was formed by heat treatment for 10 minutes at a temperature of 680° C. below the softening point of the glass shown in Table 1 B. A second insulating hollow layer 3b was formed by immersing the glass particles in a slurry consisting of glass particles having compositions A and B, and drying and firing the glass particles to a thickness of 50 μm. A conductive circuit for a thermal head was formed in the same manner as in Example 4. A pretreated metal substrate was immersed in a slurry consisting of glass particles having compositions A and B in Table 1 and calcium carbonate having an average particle size of 7 μm. Glass particles and lucium carbonate particles having compositions A and B were electrodeposited to a thickness of 100 μm, and then heat treated at 680° C. to form the first insulating hollow layer 3a.
The glass particles were immersed in a slurry of second glass particles having an average diameter of 0.7 μm and the composition shown in Table 2, and the glass particles were electrodeposited to a particle size of 50 μm. A second insulating hollow layer 3b is formed by firing at the working temperature of glass, and a heat storage hollow substrate is formed.A conductive circuit for a thermal head is formed thereon in the same manner as in Example 1, and a round metal layer is formed.Comparative Example 1> Metal Degrease the board, wash it with water, pickle it, wash it with water, nickel plate it,
Glass particles having composition A in Table 1 were immersed in a slurry of glass particles having an average particle size of 7 μm, and a DC voltage was applied between the counter electrode and the metal substrate. A 150 μm thick metal substrate was electrodeposited on top of the metal substrate, and then dried and fired to form a heat storage hollow substrate.Comparative Example 2: The metal substrate was degreased and a conductive circuit for a thermal head was formed thereon in the same manner as in Example 1. Water washing, pickling, water washing, nickel plating,
After pretreatment by washing with water, the glass particles having the composition shown in Table 1 were immersed in a slurry made of glass particles with an average particle size of 7 μm, and a DC voltage was applied between the counter electrode and the metal substrate to remove the glass particles having the composition shown in Table 1. A 150 μm thick metal substrate was electrodeposited on the substrate, and then dried and fired to form a heat-storage hollow substrate.Comparative Example 3: The metal substrate was degreased and washed with water.・Pickling・Water washing・Nickel plating・
After washing with water and pre-treatment, the first powder with an average particle size of 7 μm
The first glass particles were immersed in a slurry consisting of the first glass particles having the composition A shown in the table, and a DC voltage was applied between the counter electrode and the metal substrate to electrodeposit the first glass particles to a thickness of 100 μm on the metal substrate. Temperature 700℃ below the softening point of glass with composition A in the table
Then, it was immersed in a slurry consisting of second glass particles of composition A in Table 1 with an average particle size of 0.7 μm, electrodeposited with second glass particles of 50 μm, and dried.
An insulating hollow substrate was formed by firing, and a conductive circuit for a thermal head was formed thereon in the same manner as in Example 1. The pretreated metal substrate was immersed in a slurry made of glass particles, and the first glass particles were electrodeposited to a thickness of 100 μm. Then, 7
Heat treated at 00° C. Further, 50 μm of glass particles were electrodeposited by dipping in a slurry of second glass particles having a lower average particle size of 0.7 μm and the composition shown in Table 2, and dried to form the glass shown in Table 2. Comparative Example 5 A conductive circuit for a thermal head was formed on an alumina glaze substrate in the same manner as in Example 1.Comparative Example 5 For the above Examples 1 to 4 and Comparative Examples 1 to 5, the center line average roughness Ra on the substrate surface, the resistance value variation of the heating resistor of the thermal head, and the printing density (thermal efficiency) of the thermal head were determined. The results are shown in Tables 3 and 4.
第３表
第４表
２つの異なる組成のガラスを同時に電着被覆して形成し
た実施例１°のホーロ基板（よ アルミナグレーズと同
等な熱効率を示しており、比較例１．２の１つの組成か
らなるホーロ基板より優れた熱効率を示していることが
わかム また ２つの異なる組成のガラスと炭酸力ルシ
ュウムから発生した泡を多数有する実施例２は最も熱効
率が良ｔ、Ｘ。Table 3 Table 4 Example 1 hollow substrate formed by simultaneously electrodepositing glasses with two different compositions (showing thermal efficiency equivalent to that of alumina glaze, one composition of Comparative Example 1.2) Furthermore, Example 2, which has a large number of bubbles generated from two different compositions of glass and lucium carbonate, has the highest thermal efficiency.
しかし この基板は表面粗さが大きいので抵抗値バラツ
キも大きくなっていも これに対して実施例３、４は２
層構造で、泡の多い層と少ない層に分け、表面粗さを小
さくしているので、実施例１より抵抗値バラツキは小さ
くなっている力＜、熱効率悪くなっていも
以上のように２つ以上の異なる組成のガラスを混在させ
て電着被覆し 焼成して形成したホーロ基板は熱効率に
優れていることがわかａ さらく金属塩から発生した泡
を多数有するホーロ基板（Ｌ極めて蓄熱性に優れている
ことがわかも本発明に適用される金属塩は水に不溶解の
炭酸塩が最も適しており、水に溶解する金属塩はスラリ
ー中に小量存在する水に溶解してガスが発生難くなるの
で適さなｔ℃
発明の効果
以上の説明から明らかなように本発明は金属基板に２つ
以上の組成の異なるガラス粒子を混在させて電着して、
乾燥 焼成してホーロ基板を形成したものであり、この
ようにすることによって、ホーロ基板に蓄熱性をもたせ
、サーマルヘッドとしたときの熱効率を向上させること
ができる。However, since this board has a large surface roughness, the resistance value variation is also large.
The layered structure is divided into a layer with many bubbles and a layer with few bubbles, and the surface roughness is reduced, so the resistance value variation is smaller than in Example 1. It can be seen that the hollow substrate formed by electrodepositing and firing a mixture of glasses with different compositions as mentioned above has excellent thermal efficiency. The most suitable metal salt to be applied to the present invention is a carbonate that is insoluble in water, and the metal salt that is soluble in water is dissolved in a small amount of water present in the slurry to form a gas. Advantages of the Invention As is clear from the above explanation, the present invention involves electrodepositing a mixture of two or more glass particles with different compositions on a metal substrate.
A hollow substrate is formed by drying and firing, and by doing so, the hollow substrate can have heat storage properties and improve thermal efficiency when used as a thermal head.
図は本発明の一実施例における蓄熱性ホーロ基板を使用
したサーマルヘッドの断面構成図であム１９１．金属基
板 ３ａ、、、第１の絶縁ホーロ凰３ｂ、、、第２の絶
縁ホーロ凰
代理人の氏名 弁理士 粟野重孝 はか１名１−ｍ−金
凰 蚤 仮
３ａ−９−躬１の！ｌ！キ踪ホー０層
３６− 第２の絶縁ボーロ層Figure 191 is a cross-sectional configuration diagram of a thermal head using a heat storage hollow substrate according to an embodiment of the present invention. Metal substrate 3a,..., first insulating hollow phosphor 3b,..., second insulating hollow 凑 Agent's name Patent attorney Shigetaka Awano Haka 1 person 1-m-Kin 凰 Flea Temporary 3a-9-躬1! l! Kishuho 0 layer 36- Second insulating boro layer
Claims (1)
基板上に電着被覆してなることを特徴とする蓄熱性ホー
ロ基板。 （２）２つ以上の異なる組成のガラスを混在させて金属
基板上に電着被覆してなり、かつガラスに金属塩から発
生した多数の泡を有することを特徴とする蓄熱性ホーロ
基板。 （３）２つ以上のガラスが結晶化ガラスである請求項１
又は２記載の畜熱性ホーロ基板。（４）金属塩が水に不
溶解である請求項２記載の畜熱性ホーロ基板。 （５）界面動電位の極性が同一である２つ以上の異なる
組成のガラス粒子を分散させたスラリーに金属基板を入
れ、上記ガラス粒子を同時に金属基板上に電着し、乾燥
、焼成して製造することを特徴とする蓄熱性ホーロ基板
の製造法。 （６）界面動電位の極性が同一である２つ以上の異なる
組成のガラス粒子を分散させたスラリーに金属塩を添加
し、上記ガラス粒子と金属塩を同時に金属基板上に電着
し、乾燥、焼成して製造することを特徴とする蓄熱性ホ
ーロ基板の製造法。 （７）２つ以上のガラスが結晶化ガラスである請求項５
又は６記載の蓄熱性ホーロ基板の製造法。 （８）金属塩が水に不溶解である請求項６記載の蓄熱性
ホーロ基板の製造法。[Scope of Claims] (1) A heat storage hollow substrate characterized by being formed by electrodepositing a mixture of two or more glasses of different compositions on a metal substrate. (2) A heat-storage hollow substrate characterized by comprising two or more glasses of different compositions mixed and electrodeposited on a metal substrate, and having a large number of bubbles generated from metal salts on the glass. (3) Claim 1 wherein the two or more glasses are crystallized glass
Or the heat-storing hollow substrate according to 2. (4) The heat-accumulating hollow substrate according to claim 2, wherein the metal salt is insoluble in water. (5) A metal substrate is placed in a slurry in which glass particles of two or more different compositions with the same polarity of interfacial potential are dispersed, and the glass particles are simultaneously electrodeposited onto the metal substrate, dried, and fired. A method for manufacturing a heat storage hollow substrate. (6) A metal salt is added to a slurry in which two or more glass particles of different compositions with the same polarity of interfacial potential are dispersed, and the glass particles and metal salt are simultaneously electrodeposited onto a metal substrate and dried. A method for producing a heat-storage hollow substrate, characterized in that it is produced by firing. (7) Claim 5, wherein the two or more glasses are crystallized glass.
Or the method for producing a heat storage hollow substrate according to 6. (8) The method for producing a heat storage hollow substrate according to claim 6, wherein the metal salt is insoluble in water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12322489A JPH02301574A (en) | 1989-05-17 | 1989-05-17 | Heat accumulating enameled substrate and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12322489A JPH02301574A (en) | 1989-05-17 | 1989-05-17 | Heat accumulating enameled substrate and production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02301574A true JPH02301574A (en) | 1990-12-13 |
Family
ID=14855277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12322489A Pending JPH02301574A (en) | 1989-05-17 | 1989-05-17 | Heat accumulating enameled substrate and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02301574A (en) |
-
1989
- 1989-05-17 JP JP12322489A patent/JPH02301574A/en active Pending
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