JPH0316940A - Base plate, production thereof and thermal head using same base plate - Google Patents
Base plate, production thereof and thermal head using same base plateInfo
- Publication number
- JPH0316940A JPH0316940A JP15178789A JP15178789A JPH0316940A JP H0316940 A JPH0316940 A JP H0316940A JP 15178789 A JP15178789 A JP 15178789A JP 15178789 A JP15178789 A JP 15178789A JP H0316940 A JPH0316940 A JP H0316940A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- substrate
- plate
- thermal head
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011521 glass Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 239000005357 flat glass Substances 0.000 abstract description 5
- 239000002245 particle Substances 0.000 description 14
- 239000005388 borosilicate glass Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000005361 soda-lime glass Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は サーマルヘッド用基板解に用いる基板とその
製造法およびこの基板を用いたサーマルヘッドに関する
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a substrate used for a thermal head substrate solution, a method for manufacturing the same, and a thermal head using this substrate.
従来の技術
従来技術−の説明として特願昭６．１−２５２２１２号
に記載されているサーマルヘッド用ホーロ基板の製造法
を例に挙げ詳述する。BACKGROUND ART As a description of the prior art, a method for manufacturing a hollow substrate for a thermal head described in Japanese Patent Application No. 6.1-252212 will be described in detail as an example.
溶融・冷却して作製したガラスフリットをボルミルでミ
ル引きして平均粒径が２〜３μｍの電着用スラリーを作
製し このスラリーにホーロ用鋼板などの金属基板を浸
漬し 対極と金属基板間に直流電圧を印加してガラスフ
リット粒子を金属基板上に電著すも その樵 基板を充
分に乾燥し焼或してサーマルヘッド用絶縁ホーロ基板を
形或する。この方法で形成したサーマルヘッド用絶縁ホ
ーロ基板の表面粗皮は 中心線平均粗さＲａで０．０
５ 〜０．（１８ ，ｕ’ｍであり、従来の基板’（Ｒ
ｍＯ，１５〜０，３μｍ）に比べて、極めて平滑性に優
れている。The glass frit prepared by melting and cooling is milled using a Volmill to create a slurry for electrodeposition with an average particle size of 2 to 3 μm. A metal substrate such as a steel plate for hollow holes is immersed in this slurry, and a direct current is applied between the counter electrode and the metal substrate. Glass frit particles are electroprinted onto a metal substrate by applying a voltage, and the substrate is sufficiently dried and baked to form an insulating hollow substrate for a thermal head. The surface roughness of the insulating hollow substrate for the thermal head formed by this method has a center line average roughness Ra of 0.0.
5 ~ 0. (18, u'm, and the conventional substrate'(R
mO, 15 to 0.3 μm), it has extremely excellent smoothness.
発明が解決しようとする課題
上記従来例による基板表面にサーマルヘッドの導電回路
を形成すると、抵抗値のバラッギは小さくなる。Problems to be Solved by the Invention When the conductive circuit of the thermal head is formed on the surface of the substrate according to the conventional example described above, the variation in resistance value is reduced.
しかし アルミナグレーズ基板に比べると表面粗度が大
きく、また ザーマルヘッドとしたときの抵抗値のバラ
ツキも大きいものであったさらに従来例による基板を用
いたサーマルヘッド（よ 基板から泡が発生するため所
々で電極が膨れたり、断線したりした
課題を解決するための手段
本発明は 金属基板上に板状のガラスを接着した基板を
用いることによって」二記従来の問題を解消するもので
ある。However, compared to an alumina glaze substrate, the surface roughness was greater, and the resistance value varied widely when used as a thermal head. Means for Solving the Problems of Bulging and Breaking of Electrodes The present invention solves the two conventional problems by using a substrate in which a plate-shaped glass is bonded to a metal substrate.
作 用
本発明の基板（よ 金属基板上に板状のガラスを載せ、
そのガラスの軟化点以上の温度で熱処理しガラスを金属
基板に融着させて、表面性に優れ泡の少ない基板を形或
するものである。Function: A plate-shaped glass is placed on a metal substrate of the present invention.
The glass is heat-treated at a temperature higher than the softening point of the glass to fuse the glass to the metal substrate, forming a substrate with excellent surface properties and fewer bubbles.
従来例のように 粉砕したガラス粒子を金属基板に被覆
して形或した基板（よ ガラス粒子間に多数のエアーを
咬んでいるたム ホーロ層は泡の多いものとなる。その
結果従来の基板上にザーマルヘッド等の導電回路を形成
すると、ホーロ層内から泡が発生し その泡が電極回路
パターンを断線させたり、膨れさせたりしてい亀
本発明のように 溶融状態のガラスを引き延ばして作っ
た板ガラス（よ ガラス内に泡が少なく、しかも、表面
性も優れているので、この板ガラスを金属基板に融着し
た基板も泡が少なく、表面性の優れたものとなる。As in the conventional example, a metal substrate is formed by coating crushed glass particles on a metal substrate. When a conductive circuit such as a thermal head is formed on top of the glass, bubbles are generated from within the hollow layer, causing the electrode circuit pattern to break or swell.As in the present invention, sheet glass is made by stretching molten glass. (Yo) Since there are few bubbles in the glass and its surface properties are excellent, a substrate made by fusing this plate glass to a metal substrate also has fewer bubbles and has excellent surface properties.
実施例 以下本発明の実施例について説明する。Example Examples of the present invention will be described below.
く実施例ｌ〉
図に示したように厚さ２ｍｍのステンレス鋼板１ （膨
張係数１．１４Ｘ１０−７）上に厚さ５０μｍの表面の
平滑性に優れた（中心線平均粗さＲａが０． ００６μ
ｍ）ソーダ石灰ガラス板（膨張係数１１０ｘ １０−７
）を設置し８００℃で１０分間焼或し ソーダ石灰ガラ
スから戒る板状のガラス２を接着した
このようにして作戊した基板上に図に示した構或断面を
有するサーマルヘッドを試作しｆ−０ ３は電鳳 ４は
発熱抵抗体 ５はオーバーコート層である。Example 1 As shown in the figure, a 50 μm thick surface was formed on a 2 mm thick stainless steel plate 1 (expansion coefficient 1.14×10-7) with excellent smoothness (center line average roughness Ra of 0. 006μ
m) Soda lime glass plate (expansion coefficient 110x 10-7
) was installed and baked at 800°C for 10 minutes.A thermal head having the structure or cross section shown in the figure was prototyped on the thus prepared substrate to which a plate-shaped glass 2 made of soda-lime glass was adhered. f-0 3 is an electric wire, 4 is a heating resistor, and 5 is an overcoat layer.
〈実施例２〉
実施例１と同様に厚さ２ｍｍのステンレス鋼板■ （膨
張係数１１４Ｘ １０−７）上に厚さ１ｍｍの表面の平
滑性に優れた（中心線平均粗さＲａが０． ００６μ（
社）ソーダ石灰ガラス板（膨張係数１１０ｘ １０−７
）を設置し８００℃で１０分間焼或し ソーダ石灰ガラ
スから或る板状のガラス２を接着した。<Example 2> As in Example 1, a 1 mm thick surface was formed on a 2 mm thick stainless steel plate ■ (expansion coefficient 114 x 10-7) with excellent smoothness (center line average roughness Ra was 0.006μ). (
) soda lime glass plate (expansion coefficient 110x 10-7
) was installed and baked at 800°C for 10 minutes, and a plate-shaped glass 2 made of soda lime glass was adhered.
このようにして作或したホーロ基板上に図に示した構戒
断面を有するサーマルヘッドを試作した３は電凰 ４は
発熱抵抗体 ５はオーバーコート層である。A thermal head having the cross section shown in the figure was fabricated on a hollow substrate thus prepared. 3 is an electric hood, 4 is a heating resistor, and 5 is an overcoat layer.
〈実施例３〉
実施例１と同様に厚さ２ｍｍのステンレス鋼板ｌ （膨
張係数１１４Ｘ １０−７）上に厚さ５０μｍの表面の
平滑性に優れたく中心線平均粗さＲａが０． ００６μ
ｍ）ホウ珪酸ガラス板（膨張係数７７ｘ １０−７）を
設置Ｌ ８５０℃で１０分間焼成し ホウ珪酸ガラスか
ら或る板状のガラス２を接着した
このようにして作或した基板上に図に示した構或断面を
有するザーマルヘッドを試作しｔラ３は電楓 ４は発熱
抵抗体 ５はオーバーコート層である。<Example 3> As in Example 1, a 50 μm thick surface was formed on a 2 mm thick stainless steel plate l (expansion coefficient 114×10−7) with an excellent center line average roughness Ra of 0. 006μ
m) A borosilicate glass plate (expansion coefficient 77 x 10-7) was installed and baked at 850°C for 10 minutes, and a plate-shaped glass 2 was bonded from the borosilicate glass. A thermal head having the structure shown in FIG.
く実施例４〉
実施例１と同様に厚さ２ｍｍのステンレス鋼板１ （膨
張係数１１４Ｘ １０−’）上に厚さ７００μｍの表面
の平滑性に優れた（中心線平均粗さＲａが０、ＯＯ６μ
ｍ）ホウ珪酸ガラス板（膨張係数７７Ｘｌ．０−’）を
設置Ｌ， ８５０℃で１０分間焼戒し ホウ珪酸ガラ
スから或る板状のガラス２を接着した
このようにして作或した基板上に図に示した構或断面を
有するザーマルヘッドを試作しｆ−，， ３は電楓
４は発熱抵抗体 ５はオーバーコート層である。Example 4 As in Example 1, a 700 μm thick surface with excellent smoothness (center line average roughness Ra of 0, OO6μ
m) Install a borosilicate glass plate (expansion coefficient 77Xl.0-') and bake it at 850°C for 10 minutes.A certain plate-shaped glass 2 made of borosilicate glass is glued onto the substrate made in this way. We made a prototype thermal head with the cross section shown in the figure.
4 is a heating resistor, and 5 is an overcoat layer.
〈比較例１〉
実施例ｌと同様に厚さ２ｍｍのステンレス鋼板ｌ （膨
張係数１１４Ｘ １０−７）上に厚さ８００μｍの表面
の平滑性に優れた（中心線平均粗さＲａが０． ００６
μｍ）ホウ珪酸ガラス板（膨張係数７７Ｘ １０−７）
を設置し ８５０℃でＩＯ分間焼戊した しかし ホウ
珪酸ガラス層内にクラックが生改 ガラスが金属基板１
から剥離してしまった
〈実施例５〉
実施例１と同様に厚さ２ｍｍのステンレス鋼板ｌ （膨
張係数１１４ｘ １０−７）上に厚さ５０μｍの表面の
平滑性に優れた（中心線平均粗さＲａが０． ００６μ
ｍ）ホウ珪酸ガラス板（膨張係数７７Ｘ １０−７、軟
化点：７２５℃）を設置し７４０℃で１０分間焼或しホ
ウ珪酸ガラスから戒る板状のガラス２を接着した
このようにして作或した基板上に図に示した構或断面を
有するサーマルヘッドを試作し７−０ ３は電梃 ４は
発熱抵抗恢 ５はオーバーコート層である。<Comparative Example 1> Similar to Example 1, an 800 μm thick surface was formed on a 2 mm thick stainless steel plate l (expansion coefficient 114×10−7) with excellent smoothness (center line average roughness Ra was 0.006).
μm) Borosilicate glass plate (expansion coefficient 77X 10-7)
was installed and annealed at 850℃ for IO minutes.However, cracks were formed in the borosilicate glass layer.
<Example 5> Similar to Example 1, a 50 μm thick surface with excellent smoothness (center line average roughness) was placed on a 2 mm thick stainless steel plate l (expansion coefficient 114 x 10-7). Ra is 0.006μ
m) A borosilicate glass plate (expansion coefficient 77 x 10-7, softening point: 725°C) was installed and baked at 740°C for 10 minutes, or a plate-shaped glass 2 made of borosilicate glass was bonded. A thermal head having the cross section shown in the figure was prototyped on a certain substrate, and 7-0 3 is an electric lever, 4 is a heating resistor, and 5 is an overcoat layer.
く比較例２〉
実施例１と同様に厚さ２ｍｍのステンレス鋼板１ （膨
張係数１１４Ｘ １０”’）上に厚さ５０μｍの表面の
平滑性に優れた（中心線平均粗さＲ ａ ７５＜ ０．
００６μｍ）ホウ珪酸ガラス板（膨張係数７７ｘ １
０−７ 軟化点＝７２５℃）を設置よ ７２０℃でｌ
Ｏ分間焼或した しかＬ 糸ウ珪酸ガラス２は接着しな
かっｔラ〈比較例３〉
金属基板１を脱脂・水洗・酸洗・水洗・ニッケルメッキ
・水洗して前処理を行った後、平均粒径が２．５μｍの
第１表のガラス粒子からなるスラリー中に浸漬して、対
極と金属基板１との開に直流電圧を印加して第１表組戒
めガラス粒子を金属基板１上に１５０μｍ電着した そ
の後、乾思 焼戒して基板を形威した さらに その上
に実施例１と同様にサーマルヘッドの導電回路を形或し
たく比較例４〉
金属基板ｌを脱脂・水洗・酸洗・水洗・ニッケルメッキ
・水洗して前処理を行った後、平均粒径が２．５μｍの
第１表組或のガラス粒子からなるスラリー中に浸漬して
、対極と金属基板ｌとの間に直流電圧を印加して第Ｉ表
組戒のガラス粒子を金属基板１上に１００μｍ電着し九
その後、第ｌ表のガラスの軟化点以下の温度７００℃
で１０分間熱処理し さらに 平均粒径が０．７μｍの
第１表組戒のガラス粒子からなるスラリーに浸漬して、
第１表組戊のガラス粒子を５０μｍ電着レ 乾凰焼戒し
て絶縁基板を形或した さらに その上に実施例１と同
様にサーマルヘッドの導電回路を形威しｔも
第１表
く比較例５〉
アルミナグレーズ基板上に実施例１と同様にサーマルヘ
ッドの導電回路を形或した
以上の実施例１〜５、比較例３〜５について、基板表面
上の中心線平均粗さＲａ、サーマルヘツ第２表
１〇一
第３表
ドの発熱抵抗体４の抵抗値バラッキ、サーマルヘッドの
電極３の断線および膨れ部分の個数を測定し 比較しｉ
’Ｑ＋ この結果を第２表、第３表に示す。Comparative Example 2 As in Example 1, a 50 μm thick surface was formed on a 2 mm thick stainless steel plate 1 (expansion coefficient 114×10”) with excellent smoothness (center line average roughness R a 75<0). ．．
006μm) borosilicate glass plate (expansion coefficient 77x 1
0-7 Softening point = 725℃) At 720℃
The silicate glass 2 did not adhere after being baked for O minutes (Comparative Example 3) After the metal substrate 1 was pretreated by degreasing, water washing, pickling, water washing, nickel plating, and water washing, the average The glass particles shown in Table 1 were immersed in a slurry consisting of the glass particles shown in Table 1 with a particle size of 2.5 μm, and a DC voltage was applied across the counter electrode and the metal substrate 1 to place the glass particles shown in Table 1 on the metal substrate 1. After 150 μm of electrodeposition, the substrate was shaped by dry etching. Furthermore, the conductive circuit of the thermal head was formed on it in the same manner as in Example 1. Comparative Example 4> The metal substrate l was degreased, washed with water, and acidified. After pretreatment by washing, washing with water, nickel plating, and washing with water, it was immersed in a slurry consisting of the glass particles shown in Table 1 with an average particle size of 2.5 μm, and the electrode was immersed in a slurry between the counter electrode and the metal substrate l. Apply a DC voltage to electrodeposit the glass particles listed in Table I on the metal substrate 1 to a thickness of 100 μm.9 Then, heat the glass particles listed in Table I at a temperature of 700°C below the softening point of the glasses listed in Table I.
The glass was heat-treated for 10 minutes, and then immersed in a slurry made of glass particles of Table 1 with an average particle size of 0.7 μm.
The glass particles shown in Table 1 were electrodeposited with a thickness of 50 μm, and an insulating substrate was formed by dry pyrolysis.Furthermore, the conductive circuit of the thermal head was formed on top of it in the same manner as in Example 1. Comparative Example 5> Regarding Examples 1 to 5 and Comparative Examples 3 to 5, in which a conductive circuit of a thermal head was formed on an alumina glaze substrate in the same manner as in Example 1, the center line average roughness Ra on the substrate surface, Measure the resistance value variation of the heating resistor 4 in Table 2 101 and Table 3 C, and the number of disconnections and bulges in the electrode 3 of the thermal head and compare them.
'Q+ The results are shown in Tables 2 and 3.
以上のように溶融状態から引き延はして作或した板ガラ
スを金属基板に融着させて基板を形威しこの基板をサー
マルヘッド用基板として用いることに依って電極パター
ンの断線や膨れがなくなり、しかも、アルミナグレーズ
基板と同等な表面性を有し ザーマルヘッドの抵抗値バ
ラッキも小さいことがｌｉＯ′認できた
また 板ガラスの板厚については金属とガラスの膨張率
が同程度の場・合（よ ７００μｎ１以上でも構わない
力丈 膨張率が異なる場合ｉＬ７００μｍ以下にする必
要かある。融着温度について（よ ガラスの軟化点以上
の温度で熱処理するのが好ましい。As described above, by melting and bonding a sheet glass produced by drawing it from a molten state to a metal substrate to form a substrate and using this substrate as a substrate for a thermal head, disconnection and bulges in the electrode pattern can be eliminated. Moreover, it was confirmed that liO' has a surface property equivalent to that of an alumina glaze substrate, and the resistance value variation of the thermal head is small. The force length may be 700 μn1 or more. If the expansion coefficients are different, it is necessary to make the iL 700 μm or less. Regarding the fusion temperature (see below), it is preferable to perform heat treatment at a temperature equal to or higher than the softening point of the glass.
発明の効果
以上の説明から明らかなように本発明（よ 板ガラスを
金属基板に融着させて基板を形戒することによって、基
板の表面性を向」二させ、 しかもガラス内の泡をなく
すことに依って、ザーマルヘッドとしたときの抵抗値バ
ラッキや不良率を向上させることができる。Effects of the Invention As is clear from the above explanation, the present invention (i.e., by fusing a plate glass to a metal substrate to shape the substrate, the surface properties of the substrate can be improved, and bubbles in the glass can be eliminated). Accordingly, it is possible to improve resistance value variation and defective rate when used as a thermal head.
図は本発明の一実施例における基板を使用したザーマル
ヘッドの断面構或図である。The figure is a cross-sectional view of a thermal head using a substrate according to an embodiment of the present invention.
Claims (5)
特徴とする基板。(1) A substrate characterized by being formed by bonding a plate-shaped glass onto a metal substrate.
とする請求項１記載の基板。(2) The substrate according to claim 1, wherein the glass plate thickness is 0.7 mm or less.
作業温度で熱処理し、ガラスを金属基板に融着させて基
板を形成することを特徴とする請求項１又は２記載の基
板の製造方法。(3) A substrate according to claim 1 or 2, characterized in that a plate-shaped glass is placed on a metal substrate, heat-treated at the working temperature of the glass, and the glass is fused to the metal substrate to form the substrate. Production method.
徴とする請求項３記載の基板の製造方法。(4) The method for manufacturing a substrate according to claim 3, wherein the heat treatment temperature is higher than the softening point of glass.
ーマルヘッド。(5) A thermal head characterized by using the substrate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15178789A JPH0316940A (en) | 1989-06-14 | 1989-06-14 | Base plate, production thereof and thermal head using same base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15178789A JPH0316940A (en) | 1989-06-14 | 1989-06-14 | Base plate, production thereof and thermal head using same base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316940A true JPH0316940A (en) | 1991-01-24 |
Family
ID=15526288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15178789A Pending JPH0316940A (en) | 1989-06-14 | 1989-06-14 | Base plate, production thereof and thermal head using same base plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316940A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2924388A3 (en) | 2007-12-03 | 2009-06-05 | Renault Sas | Storage arrangement for car, has removable carrier unit with horizontal element fixed below part of roof by two adjustable straps for carrying objects and for adjusting distance of panel with respect to roof |
| JP2012162018A (en) * | 2011-02-08 | 2012-08-30 | Alps Electric Co Ltd | Thermal head |
| JP2016521237A (en) * | 2013-04-10 | 2016-07-21 | ショット グラス テクノロジーズ （スゾウ） カンパニー リミテッドＳｃｈｏｔｔ Ｇｌａｓｓ Ｔｅｃｈｎｏｌｏｇｉｅｓ （Ｓｕｚｈｏｕ） Ｃｏ．， Ｌｔｄ． | Flexible glass / metal foil composite article and method for producing the same |
-
1989
- 1989-06-14 JP JP15178789A patent/JPH0316940A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2924388A3 (en) | 2007-12-03 | 2009-06-05 | Renault Sas | Storage arrangement for car, has removable carrier unit with horizontal element fixed below part of roof by two adjustable straps for carrying objects and for adjusting distance of panel with respect to roof |
| JP2012162018A (en) * | 2011-02-08 | 2012-08-30 | Alps Electric Co Ltd | Thermal head |
| JP2016521237A (en) * | 2013-04-10 | 2016-07-21 | ショット グラス テクノロジーズ （スゾウ） カンパニー リミテッドＳｃｈｏｔｔ Ｇｌａｓｓ Ｔｅｃｈｎｏｌｏｇｉｅｓ （Ｓｕｚｈｏｕ） Ｃｏ．， Ｌｔｄ． | Flexible glass / metal foil composite article and method for producing the same |
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