JP2695717B2 - Manufacturing method of transmission type photo interrupter - Google Patents
Manufacturing method of transmission type photo interrupterInfo
- Publication number
- JP2695717B2 JP2695717B2 JP27221891A JP27221891A JP2695717B2 JP 2695717 B2 JP2695717 B2 JP 2695717B2 JP 27221891 A JP27221891 A JP 27221891A JP 27221891 A JP27221891 A JP 27221891A JP 2695717 B2 JP2695717 B2 JP 2695717B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- slit plate
- view
- light receiving
- primary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は被検出物の有無を無接点
で検出する透過型フォトインタラプタ（以下、単にフォ
トインタラプタと記す）の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a transmission type photointerrupter (hereinafter simply referred to as a photointerrupter) for detecting the presence or absence of an object without contact.
【０００２】[0002]
【従来の技術】従来の技術について図７乃至図９を参照
して説明する。図７（ａ），（ｂ），（ｃ）はそれぞれ
従来例による受光側１次モールド体の正面図、側面図、
平面図、図８は従来例による受発光側の両１次モールド
体及びスリット板を２次モールド金型内にインサートし
た状態を示す断面図、図９は従来例によるフォトインタ
ラプタの光路絞り用の突部拡大図である。2. Description of the Related Art A conventional technique will be described with reference to FIGS. FIGS. 7A, 7B and 7C are a front view, a side view and a front view, respectively, of a conventional light receiving side primary molded body.
FIG. 8 is a plan view, FIG. 8 is a cross-sectional view showing a state in which both primary molds and a slit plate on the light receiving and emitting sides according to the conventional example are inserted into a secondary mold, and FIG. It is a protrusion enlarged view.
【０００３】従来のフォトインタラプタは、図７（ａ）
乃至（ｃ）に示す様に受光チップ１をリード端子２へ搭
載し、受光チップ１を他のリード端子３へ金線４で結線
し透光性樹脂５により被覆して受光側１次モールド体を
形成している。このとき透光性樹脂部５の受光チップ上
面が凸状５ａになるように成形している。同様に、前記
受光側１次モールド体の受光チップ１の代わりに発光チ
ップ６を用いて発光側１次モールド体を形成する。[0003] A conventional photointerrupter is shown in FIG.
As shown in (c), the light receiving chip 1 is mounted on the lead terminal 2, the light receiving chip 1 is connected to the other lead terminal 3 with the gold wire 4, covered with the translucent resin 5, and the light receiving side primary molded body Is formed. At this time, the light-receiving chip 5 is formed so that the upper surface of the light-receiving chip of the translucent resin portion 5 has a convex shape 5a. Similarly, a light emitting side primary molded body is formed using the light emitting chip 6 instead of the light receiving chip 1 of the light receiving side primary molded body.
【０００４】次に図８に示す様に、これら両１次モール
ド体を対向させ、これを２次モールド金型７内部に挿入
し１次モールド凸部５ａのＬの部分を２次モールド金型
７に接触させ、これに遮光性樹脂８を充填させ一体成形
する。このときＬ部分は２次モールド金型７に接触して
いる為、２次モールド成形後に遮光性樹脂８に覆われる
ことはなく、１次モールドの光の通路となる。つまりこ
のＬの大きさを変えることにより光の通路の幅を決定し
ていた。[0004] Next, as shown in FIG. 8, these two primary mold bodies are opposed to each other, inserted into the secondary mold 7, and the L portion of the primary mold protrusion 5 a is inserted into the secondary mold 5. 7 and filled with a light-shielding resin 8 to be integrally molded. At this time, since the L portion is in contact with the secondary mold 7, it is not covered with the light-shielding resin 8 after the secondary molding, and serves as a light path for the primary mold. That is, the width of the light path is determined by changing the size of L.
【０００５】[0005]
【発明が解決しようとする課題】ところで、上記従来技
術ではＬ部分の長さを短くすることにより光の通路の幅
（スリット）が狭くなり、より高分解能なフォトインタ
ラプタが得られるが、図９に示す様に図７の５ａ部のコ
ーナーは実際にはいくらかの曲率があり、Ｌに対して２
次モールド金型７に接触する部分Ｌ’は小さくなり、
Ｌ’の寸法は樹脂成形品の為不安定で極端な場合０とな
る可能性もあり、この方法でＬ’を０．１ｍｍ程度に安
定して成形することは難かしい。By the way, in the above-mentioned prior art, the width (slit) of the light path is narrowed by shortening the length of the L portion, so that a higher resolution photointerrupter can be obtained. As shown in FIG. 7, the corner of the portion 5a in FIG. 7 actually has some curvature.
The portion L ′ contacting the next mold 7 becomes smaller,
The dimension of L 'is unstable due to the resin molded product and may be 0 in extreme cases. It is difficult to stably mold L' to about 0.1 mm by this method.
【０００６】又Ｌ’が小さくできたとしても２次モール
ドの際、Ｌ’部が金型７に接触するよう７ａにて後から
押圧しているので５ａ部強度的にも成形が難かしくなる
という課題があった。Even if L 'can be reduced, the L' portion is pressed afterward at 7a so as to contact the mold 7 during the secondary molding, so that it is difficult to mold the 5a portion in terms of strength. There was a problem that.
【０００７】そこで本発明の目的は、上記問題点に鑑
み、製造工程が簡易で、しかも光路を絞る狭いスリット
幅を確実に確保できるフォトインタラプタの製造方法を
提供することにある。In view of the above problems, an object of the present invention is to provide a method of manufacturing a photointerrupter which has a simple manufacturing process and can reliably secure a narrow slit width for narrowing an optical path.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するため
に本発明は、共通フレームに同一ピッチで接続された複
数の発光側リード端子及び複数の受光側リード端子に受
発光チップをそれぞれ搭載し、透光性樹脂で１次モール
ドした両１次モールド連接体を備え、前記両１次モール
ド連接体の発光面と受光面の内、少なくとも受光面側
に、前記受発光チップに対応する複数のスリット板を前
記共通フレームと同一ピッチで連接したスリット板連接
体を重ね、該スリット板連接体を含めて前記両１次モー
ルド連接体を相対向するように遮光性樹脂で一体的に２
次モールドしてなることを特徴とする。In order to achieve the above object, the present invention provides a light emitting and receiving chip mounted on a plurality of light emitting side lead terminals and a plurality of light receiving side lead terminals connected to a common frame at the same pitch. A light-transmitting resin, and a primary mold connecting body that is primary-molded with a light-transmitting resin, and a plurality of light-emitting and light-receiving surfaces of the two primary mold connecting bodies, at least on the light-receiving surface side, corresponding to the light-receiving and light-emitting chips. A slit plate connecting body in which the slit plates are connected with the common frame at the same pitch is overlapped, and the two primary mold connecting bodies including the slit plate connecting body are integrally formed of a light shielding resin so as to face each other.
It is characterized by being molded next.
【０００９】[0009]
【作用】複数の受発光チップをそれぞれ１次モールドし
て連接した１次モールド連接体に対して、前記受発光チ
ップに対応する複数の金属製スリット板を連接したスリ
ット板連接体を重ね、その後受発光側の両１次モールド
連接体を相対向するように２次モールドするので、スリ
ット板のセットが容易な上、位置精度が正確で一度の工
程で複数個のフォトインタラプタを形成でき生産効率を
向上できる。A plurality of light receiving and emitting chips are firstly molded and connected to a primary mold connecting member, and a plurality of metal slit plates corresponding to the light receiving and emitting chips are connected to a slit plate connecting member. Since the two primary mold connecting bodies on the light receiving and emitting sides are secondary molded so as to face each other, the slit plate can be easily set, the positional accuracy is accurate, and a plurality of photointerrupters can be formed in a single process, resulting in production efficiency. Can be improved.
【００１０】また、スリット板は金属製なので、スリッ
ト幅を狭く形成でき、しかも変形することがなく高分解
能且つ高信頼性のフォトインタラプタが得られる。In addition, since the slit plate is made of metal, a narrow slit width can be formed, and a high-resolution and high-reliability photointerrupter without deformation can be obtained.
【００１１】[0011]
【実施例】本発明の一実施例について、図１乃至図６を
参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS.
【００１２】図１（ａ），（ｂ），（ｃ）はそれぞれ、
本実施例によるフォトインタラプタの受光側１次モール
ド体の正面図、側面図、平面図、図２（ａ），（ｂ），
（ｃ）はそれぞれ、光の通路を制限するスリット板の正
面図、側面図、平面図、図３は受発光側の両１次モール
ド体及びスリット板を２次モールド金型内にインサート
した状態を示す断面図、図４は図３のＡ−Ａ’線断面
図、図５は本実施例によるフォトインタラプタの斜視
図、図６は本実施例によるフォトインタラプタの１次モ
ールド連接体とスリット板連接体を組合せる工程を示す
斜視図である。FIGS. 1 (a), 1 (b) and 1 (c) respectively show
A front view, a side view, a plan view, and FIGS. 2A, 2B, and 2C of a light receiving side primary molded body of the photointerrupter according to the present embodiment.
(C) is a front view, a side view, and a plan view of a slit plate for restricting a light passage, and FIG. 3 is a state in which both the primary mold body and the slit plate on the light receiving and emitting sides are inserted into a secondary mold. 4, FIG. 4 is a sectional view taken along line AA 'of FIG. 3, FIG. 5 is a perspective view of a photo interrupter according to the present embodiment, and FIG. 6 is a primary mold connecting member and a slit plate of the photo interrupter according to the present embodiment. It is a perspective view which shows the process of combining an articulation body.
【００１３】なお、図７乃至図９に示した従来例と同一
機能部分には同一記号を付している。The same symbols are given to the same functional parts as those in the conventional example shown in FIGS.
【００１４】本実施例によるフォトインタラプタの製造
は、後述の図６に示すように複数個を連接した状態で形
成するが、図１乃至図５では単一のフォトインタラプタ
をとり挙げて説明する。Although the photointerrupter according to the present embodiment is manufactured in a state where a plurality of photointerrupters are connected as shown in FIG. 6 described later, a single photointerrupter will be described with reference to FIGS.
【００１５】図１に示すようにリード端子２へ受光チッ
プ１を搭載し、他方のリード端子３へ金線４により内部
結線し、熱硬化性の透光性樹脂９、例えばエポキシ樹脂
で注型又はトランスファモールド方式により１次モール
ドした受光側透光樹脂体を形成する。これと同様に、受
光チップ１の代わりに発光チップ６を用いた発光側透光
樹脂体を形成する。As shown in FIG. 1, the light-receiving chip 1 is mounted on the lead terminal 2 and internally connected to the other lead terminal 3 by the gold wire 4 and cast with a thermosetting translucent resin 9, for example, an epoxy resin. Alternatively, a light-receiving side light-transmitting resin body which is primarily molded by a transfer molding method is formed. Similarly, a light emitting side translucent resin body using the light emitting chip 6 instead of the light receiving chip 1 is formed.
【００１６】ここで、両透光樹脂体の光の通路となる面
９ａは平坦になっている。又図６に示す様に、リード端
子２，３は先端部で位置決め穴１３ａを備えた共通フレ
ーム１３により一体的に接続されている。Here, the surfaces 9a of the two light-transmitting resin bodies serving as light passages are flat. As shown in FIG. 6, the lead terminals 2 and 3 are integrally connected by a common frame 13 having a positioning hole 13a at the tip.
【００１７】次に、金属板で光の通路となるスリット１
０ｂを備えたスリット板１０を形成する。このスリット
板１０は左右両端にＬ型の部分１０ａを備え、又２次モ
ールド金型１１へインサート成形する為リード部１０ｃ
を備えている。このリード部１０ｃは、先端部で前記透
光樹脂体の共通フレーム１３の位置決め穴１３ａと同一
の径、ピッチの位置決め穴１４ａを備えた共通フレーム
１４に対して一体的に接続されている。Next, a slit 1 serving as a light passage in a metal plate.
The slit plate 10 provided with Ob is formed. This slit plate 10 has L-shaped portions 10a at both left and right ends, and a lead portion 10c for insert molding into the secondary molding die 11.
It has. The lead portion 10c is integrally connected at a distal end thereof to a common frame 14 having a positioning hole 14a having the same diameter and pitch as the positioning hole 13a of the common frame 13 made of the transparent resin body.
【００１８】次に、図６に示すように、前記受発光側の
両１次モールド連接体Ａとスリット板連接体Ｂとをそれ
ぞれの共通フレーム１３，１４の位置決め穴１３ａ，１
４ａが重なるように重ね合わせて、この状態で図３のよ
うに２次モールド金型１１内へ挿入し、熱可塑性の遮光
性樹脂１２、例えばＰＰＳ（ポリフェニレンサルファイ
ド）で射出成形を行ない一体化する（図６では受発光部
の一方のみを示している）。Next, as shown in FIG. 6, the two primary mold connecting members A and the slit plate connecting members B on the light receiving / emitting side are connected to the positioning holes 13a, 1 of the common frames 13, 14, respectively.
4a are overlapped so as to overlap with each other, and in this state, they are inserted into the secondary mold 11 as shown in FIG. 3, and are integrated by injection molding with a thermoplastic light-shielding resin 12, for example, PPS (polyphenylene sulfide). (Only one of the light receiving / emitting sections is shown in FIG. 6).
【００１９】その後、射出成形後、２次モールド金型１
１より離型して、図５のようなフォトインタラプタを得
る。このとき、スリット板１０の左右両端にＬ型部１０
ａがあり、図４に示す様にこのＬ型部１０ａ遮光性樹脂
１２の内部に埋め込まれることになるので、スリット板
１０は透光樹脂体と確実にかみ合い離れることはない。Then, after injection molding, the secondary mold 1
Release from the mold 1 to obtain a photo interrupter as shown in FIG. At this time, L-shaped portions 10 are provided at both left and right ends of the slit plate 10.
As shown in FIG. 4, the slit plate 10 is embedded in the light-shielding resin 12 as shown in FIG.
【００２０】以上の説明から明らかな通り、本実施例に
よれば光の通路を制限するスリット板１０を金属により
作製する為スリット幅Ｓを０．１ｍｍ以下に小さくする
ことが可能（スリット幅Ｓはスリット板の厚さと同じに
まで狭くできる）であり、又、スリット板１０は位置決
め穴を備えたフレーム状の為、スリット板のフォトイン
タラプタ外形に対する位置精度もよく高分解能（分解能
０．１ｍｍ以下）フォトインタラプタが得られる。さら
に多数個が一度に成形できるという利点があり生産性の
向上にも通ずる。As is clear from the above description, according to the present embodiment, the slit width S can be reduced to 0.1 mm or less because the slit plate 10 for limiting the light path is made of metal. Can be as narrow as the thickness of the slit plate), and since the slit plate 10 is a frame having positioning holes, the position accuracy of the slit plate with respect to the outer shape of the photointerrupter is high and the resolution is high (0.1 mm or less). ) A photo interrupter is obtained. Further, there is an advantage that a large number of pieces can be molded at once, which leads to an improvement in productivity.
【００２１】なお、本実施例においては、受発光両側に
スリット板を設けた例を示しているが、本実施例より効
果は下がるが、受光側のみにスリット板を設けてもよ
い。In this embodiment, an example is shown in which slit plates are provided on both the light receiving and emitting sides. However, although the effect is lower than in this embodiment, a slit plate may be provided only on the light receiving side.
【００２２】[0022]
【発明の効果】以上説明したように本発明によれば、受
発光側の各１次モールド連接体と金属製のスリット板連
接体とを、それぞれを支持する共通フレームによって多
連式に同時に２次モールドするので、スリット板のセッ
トが容易で位置精度が正確な上、複数個のフォトインタ
ラプタを同時に形成でき生産効率を向上できる。As described above, according to the present invention, each of the primary mold connecting members on the light receiving / emitting side and the metallic slit plate connecting member are simultaneously connected in a multiple-unit manner by the common frame supporting each of them. Since the subsequent molding is performed, the setting of the slit plate is easy, the positional accuracy is accurate, and a plurality of photointerrupters can be simultaneously formed, so that the production efficiency can be improved.
【００２３】また、スリット板は金属製なので、スリッ
ト幅を狭く形成でき、しかも変形することがなく高分解
能、高信頼性のフォトインタラプタを実現できる。Further, since the slit plate is made of metal, a narrow slit width can be formed, and a high-resolution and high-reliability photointerrupter without deformation can be realized.
【図１】（ａ），（ｂ），（ｃ）はそれぞれ、本発明の
一実施例によるフォトインタラプタの受光側１次モール
ド体の正面図、側面図、平面図である。FIGS. 1A, 1B, and 1C are a front view, a side view, and a plan view, respectively, of a light-receiving-side primary molded body of a photointerrupter according to an embodiment of the present invention.
【図２】（ａ），（ｂ），（ｃ）はそれぞれ、光の通路
を制限する本発明の一実施例のスリット板の正面図、側
面図、平面図である。FIGS. 2A, 2B, and 2C are a front view, a side view, and a plan view, respectively, of a slit plate according to an embodiment of the present invention that restricts a light passage;
【図３】本発明の一実施例による受発光側の両１次モー
ルド体及びスリット板を２次モールド金型内にインサー
トした状態を示す断面図である。FIG. 3 is a cross-sectional view showing a state where both primary mold bodies and a slit plate on a light receiving and emitting side according to an embodiment of the present invention are inserted into a secondary mold.
【図４】図３のＡ−Ａ’線断面図である。FIG. 4 is a sectional view taken along line A-A ′ of FIG. 3;
【図５】本発明の一実施例によるフォトインタラプタの
斜視図である。FIG. 5 is a perspective view of a photointerrupter according to one embodiment of the present invention.
【図６】本発明の一実施例によるフォトインタラプタの
１次モールド連接体とスリット板連接体を組み合せる工
程を示す斜視図である。FIG. 6 is a perspective view showing a process of assembling a primary mold connecting member and a slit plate connecting member of a photo interrupter according to an embodiment of the present invention.
【図７】（ａ），（ｂ），（ｃ）はそれぞれ従来例によ
る受光側１次モールド体の正面図、側面図、平面図であ
る。FIGS. 7A, 7B, and 7C are a front view, a side view, and a plan view, respectively, of a light-receiving-side primary molded body according to a conventional example.
【図８】従来例による受発光側の両１次モールド体及び
スリット板を２次モールド金型内にインサートした状態
を示す断面図である。FIG. 8 is a cross-sectional view showing a state where both primary mold bodies and a slit plate on the light receiving / emitting side according to a conventional example are inserted into a secondary mold.
【図９】従来例によるフォトインタラプタの光路絞り用
の突部拡大図である。FIG. 9 is an enlarged view of a projection for an optical path stop of a conventional photointerrupter.
１ 受光チップ ２，３ リード端子 ６ 発光チップ ９ 透光性樹脂 １０ スリット板 １１ 遮光性樹脂 １３，１４ 共通フレーム Ａ １次モールド連接体 Ｂ スリット板連接体 REFERENCE SIGNS LIST 1 light receiving chip 2, 3 lead terminal 6 light emitting chip 9 translucent resin 10 slit plate 11 light shielding resin 13, 14 common frame A primary mold connecting body B slit plate connecting body
Claims (1)
複数の発光側リード端子及び複数の受光側リード端子に
受発光チップをそれぞれ搭載し、透光性樹脂で１次モー
ルドした両１次モールド連接体を備え、 前記両１次モールド連接体の発光面と受光面の内、少な
くとも受光面側に、前記受発光チップに対応する複数の
スリット板を前記共通フレームと同一ピッチで連接した
スリット板連接体を重ね、該スリット板連接体を含めて
前記両１次モールド連接体を相対向するように遮光性樹
脂で一体的に２次モールドしてなることを特徴とする透
過型フォトインタラプタの製造方法。1. A primary mold connection in which a plurality of light emitting / receiving chips are mounted on a plurality of light emitting side lead terminals and a plurality of light receiving side lead terminals connected at the same pitch to a common frame, respectively, and primary molded with a translucent resin. A slit plate connection in which a plurality of slit plates corresponding to the light receiving and emitting chips are connected at the same pitch to the common frame on at least the light receiving surface side of the light emitting surface and the light receiving surface of the two primary mold connecting members. Wherein the two primary mold connecting members including the slit plate connecting member are integrally and secondarily molded with a light-shielding resin so as to face each other. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27221891A JP2695717B2 (en) | 1991-10-21 | 1991-10-21 | Manufacturing method of transmission type photo interrupter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27221891A JP2695717B2 (en) | 1991-10-21 | 1991-10-21 | Manufacturing method of transmission type photo interrupter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05110129A JPH05110129A (en) | 1993-04-30 |
| JP2695717B2 true JP2695717B2 (en) | 1998-01-14 |
Family
ID=17510763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27221891A Expired - Fee Related JP2695717B2 (en) | 1991-10-21 | 1991-10-21 | Manufacturing method of transmission type photo interrupter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2695717B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070065455A (en) * | 1999-11-01 | 2007-06-22 | 로무 가부시키가이샤 | Semiconductor light-emitting device |
| KR100474389B1 (en) * | 2001-12-29 | 2005-03-08 | 한국 고덴시 주식회사 | Photo interrupt making method |
| KR100511633B1 (en) * | 2002-10-28 | 2005-09-02 | 전홍수 | Apparatus expelling magpie for a telegraph pole |
-
1991
- 1991-10-21 JP JP27221891A patent/JP2695717B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05110129A (en) | 1993-04-30 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |