JPH081960B2 - Optical coupling device manufacturing method - Google Patents
Optical coupling device manufacturing methodInfo
- Publication number
- JPH081960B2 JPH081960B2 JP29941493A JP29941493A JPH081960B2 JP H081960 B2 JPH081960 B2 JP H081960B2 JP 29941493 A JP29941493 A JP 29941493A JP 29941493 A JP29941493 A JP 29941493A JP H081960 B2 JPH081960 B2 JP H081960B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin body
- light emitting
- optical coupling
- transmitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、被検出物の有無を無接
点で検出する場合等に用いられる透過型光結合装置(フ
オトインタラプタ)の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a transmission type optical coupling device (photointerrupter) used for detecting the presence or absence of an object to be detected without contact.
【０００２】[0002]
【従来の技術】従来の透過型光結合装置(フオトインタ
ラプタ)は、発光素子１および受光素子２を図１４の如
く、夫々リードフレーム３,４に接続し、さらに金線５
によつて内部接続している。そして、各素子１,２を図
１２〜１４の如く、キヤステイングまたはトランスフア
ーモールド方式にて、赤外線を透過する樹脂または可視
光を遮断する染料を加えた透光性の熱硬化性樹脂６によ
り被覆して光の出入りする範囲を制限する凸状部７,８
を有する透光樹脂体９,１０が形成されている。2. Description of the Related Art In a conventional transmission type optical coupling device (photo interrupter), a light emitting element 1 and a light receiving element 2 are connected to lead frames 3 and 4, respectively, as shown in FIG.
It is internally connected by. Then, as shown in FIGS. 12 to 14, each of the elements 1 and 2 is formed by a casting or transfer molding method using a translucent thermosetting resin 6 containing a resin that transmits infrared rays or a dye that blocks visible light. Convex parts 7 and 8 that cover and limit the range of light entering and exiting
The translucent resin bodies 9 and 10 having the are formed.
【０００３】さらに、この透光樹脂体９,１０を図８〜
１１の如く、被検出物の通過路１１挟んで相対向させ、
遮光性の熱可塑性樹脂１２による射出成形にて被覆し一
体封止してケース１３が形成されている。Further, the translucent resin bodies 9 and 10 are shown in FIGS.
As shown in FIG.
A case 13 is formed by being covered by injection molding with a light-shielding thermoplastic resin 12 and integrally sealed.
【０００４】このとき、透光樹脂体９,１０の凸状部７,
８に遮光性樹脂１２が流れ込まないようにし、発光素子
１より発光された光が受光素子２に到達するようにして
いる。At this time, the convex portions 7 of the translucent resin bodies 9 and 10,
The light-shielding resin 12 is prevented from flowing into 8 and the light emitted from the light emitting element 1 reaches the light receiving element 2.
【０００５】なお、この透過型光結合装置の検出位置精
度(以下分解能という)は、透光樹脂体９,１０の凸状部
７,８の幅で決定される。The detection position accuracy (hereinafter referred to as resolution) of this transmissive optical coupling device is determined by the width of the convex portions 7 and 8 of the translucent resin bodies 9 and 10.
【０００６】[0006]
【発明が解決しようとする課題】図８〜１４に示す従来
の光結合装置では、樹脂６にて形成される凸状部７,８
の幅にて光結合装置の分解能が決定されるため、高分解
能にするには、凸状部７,８の幅を狭くする必要があ
る。In the conventional optical coupling device shown in FIGS. 8 to 14, the convex portions 7 and 8 formed of the resin 6 are used.
Since the resolution of the optical coupling device is determined by the width, the width of the convex portions 7 and 8 needs to be narrowed in order to achieve high resolution.
【０００７】しかし、透光樹脂体９,１０は各素子１,２
を樹脂６で被覆形成しているため、凸状部７,８の幅Ｗ
を挾くすると凸状部７,８に亀裂および欠け等が発生
し、凸状部７,８の幅には限界があつた。However, the translucent resin bodies 9 and 10 are used for the elements 1 and 2 respectively.
Since the resin is covered with resin 6, the width W of the convex portions 7 and 8
When the ridges were squeezed, cracks and chips were generated in the convex portions 7 and 8, and the width of the convex portions 7 and 8 was limited.
【０００８】本発明は、上記に鑑み、高分解能の光結合
装置を容易に製造できる製造方法を提供することを目的
とする。In view of the above, an object of the present invention is to provide a manufacturing method capable of easily manufacturing a high resolution optical coupling device.
【０００９】[0009]
【課題を解決するための手段】本発明による課題解決手
段は、発光素子２１と受光素子２５とをそれぞれ個別の
リードフレーム２０，２４に搭載し、前記発光素子２１
と受光素子２５とをそれぞれ透光性樹脂２２にて被覆し
て発光側透光樹脂体２３および受光側透光樹脂体２６を
一次成形し、前記発光側透光樹脂体２３の発光面２３ａ
側と受光側透光樹脂体２６の受光面２６ａ側に対向する
ようにそれぞれ凸部が形成された成形金型に両透光樹脂
体２３，２６を挿入して対向配置させ、前記発光面２３
ａおよび受光面２６ａの反対側より各透光樹脂体２３，
２６を押して、前記発光面２３ａおよび受光面２６ａの
一部を前記成形金型の各凸部に当接させ、遮光性樹脂２
７により透光樹脂体２３，２６の発光面２３ａおよび受
光面２６ａの前記凸部に当接する一部を除いて前記発光
側透光樹脂体２３および受光側透光樹脂体２６を一体的
に被覆してケース２８を二次成形するとともに、前記ケ
ース２８の凸部対応部に長手方向の片側が開放されたス
リツト２９，３０を形成したものである。In the means for solving the problems according to the present invention, the light emitting element 21 and the light receiving element 25 are mounted on separate lead frames 20 and 24, respectively, and the light emitting element 21 is
The light-receiving side light-transmitting resin body 23 and the light-receiving side light-transmitting resin body 26 are primarily molded by coating the light-receiving element 25 and the light-receiving element 25 with the light-transmitting resin 22.
Side and the light-receiving side light-transmitting resin body 26 so as to face the light-receiving surface 26a side.
a and the translucent resin bodies 23 from the opposite side of the light receiving surface 26a,
26, the light-emitting surface 23a and the light-receiving surface 26a are partially brought into contact with the respective convex portions of the molding die, and the light-shielding resin 2
7. The light-emitting side light-transmitting resin body 23 and the light-receiving side light-transmitting resin body 26 are integrally covered with the light-transmitting resin bodies 23 and 26 except for a portion of the light-transmitting surface 23a and the light-receiving surface 26a which are in contact with the convex portions. Then, the case 28 is secondarily formed, and the slits 29, 30 having one open side in the longitudinal direction are formed at the corresponding portions of the convex portion of the case 28.
【００１０】[0010]
【作用】上記課題解決手段において、発光側および受光
側透光樹脂体２３，２６の発光面２３ａおよび受光面２
６ａの一部に成形金型の凸部を押し付けることによつ
て、受発光面２３ａ，２６ａの一部と凸部との間に遮光
性樹脂２７が流れ込むことなくスリツト２９，３０が形
成される。これによつて、スリツト２９，３０の幅は成
形金型の凸部の幅にて決定されることになり、透光樹脂
体に光の出入りする範囲を制限する凸状部を形成した従
来の光結合装置に比べ、スリツトに亀裂および欠けを発
生させずにスリツトの幅を狭くすることができる。しか
も、成形金型の凸部の幅を変更するだけでスリツトの幅
を変更でき、分解能の異なる光結合装置の製造が可能と
なる。In the means for solving the above problems, the light emitting surface 23a and the light receiving surface 2 of the light emitting side and light receiving side translucent resin bodies 23 and 26 are used.
By pressing the convex portion of the molding die against a part of 6a, the slits 29, 30 are formed without flowing the light-shielding resin 27 between a part of the light emitting / receiving surfaces 23a, 26a and the convex portion. . As a result, the widths of the slits 29 and 30 are determined by the width of the convex portion of the molding die, which is different from the conventional case in which the convex portion that limits the range of light entering and exiting the transparent resin body is formed. Compared with the optical coupling device, the width of the slit can be reduced without causing cracks and chips in the slit. Moreover, the width of the slit can be changed only by changing the width of the convex portion of the molding die, which makes it possible to manufacture optical coupling devices having different resolutions.
【００１１】また、スリツト２９，３０の長手方向の片
側２９ａ，３０ａを開放して形成しているので、二次成
形終了時に成形金型を容易に抜去できる。そのため、透
光樹脂体およびケースを他連式にすることにより量産可
能となる。Further, since the slits 29, 30 are formed such that one side 29a, 30a in the longitudinal direction of the slit 29, 30 is opened, the molding die can be easily removed at the end of the secondary molding. Therefore, it is possible to mass-produce the translucent resin body and the case by connecting them separately.
【００１２】[0012]
【実施例】以下、本発明の実施例について図面により説
明する。図１は本発明第一実施例からなる光結合装置の
縦断側面図、図２は同じくその斜視図、図３は図２のＡ
−Ａ横断平面図、図４は同じくその透光樹脂体を示す斜
視図、図５は同じくその透光樹脂体を多連式で製造する
場合の斜視図、図６は同じくそのケースを多連式で製造
する場合の斜視図である。Embodiments of the present invention will be described below with reference to the drawings. 1 is a vertical sectional side view of an optical coupling device according to a first embodiment of the present invention, FIG. 2 is a perspective view thereof, and FIG.
-A cross-sectional plan view, FIG. 4 is also a perspective view showing the translucent resin body, FIG. 5 is a perspective view when the translucent resin body is also manufactured in a multiple manner, and FIG. It is a perspective view at the time of manufacturing by a formula.
【００１３】図示の如く、本発明からなる透過型光結合
装置(フオトインタラプタ)は、リードフレーム２０に搭
載された発光素子２１を透光性の熱硬化性樹脂２２で被
覆して形成された発光側透光樹脂体２３と、前記リード
フレーム２０とは別のリードフレーム２４に搭載された
受光素子２５を前記熱硬化性樹脂２２で被覆して形成さ
れた受光側透光樹脂体２６と、前記発光側透光樹脂体２
３および受光側透光樹脂体２６を所定間隔Ｄで対向並置
し透光樹脂体２３,２６の発光面２３aおよび受光面２６
aの一部を除いて遮光性の熱可塑性樹脂２７で一体的に
被覆して形成されたケース２８とから構成され、該ケー
ス２８の光通過面２８a,２８bにスリツト２９,３０が設
けられ、該スリツト２９,３０の長手方向の片側２９a,
３０aが開放して形成されたものである。As shown in the figure, the transmissive optical coupling device (photointerrupter) according to the present invention emits light by forming a light emitting element 21 mounted on a lead frame 20 with a translucent thermosetting resin 22. A side light-transmitting resin body 23; a light-receiving side light-transmitting resin body 26 formed by coating a light-receiving element 25 mounted on a lead frame 24 different from the lead frame 20 with the thermosetting resin 22; Light emitting side transparent resin body 2
3 and the light-receiving side light-transmitting resin body 26 are arranged in parallel at a predetermined interval D so as to face each other.
and a case 28 integrally formed with a light-shielding thermoplastic resin 27 except for a part of a, and slits 29, 30 are provided on the light passage surfaces 28a, 28b of the case 28. One side 29a of the slit 29, 30 in the longitudinal direction,
The opening 30a is formed.
【００１４】前記発光素子２１には、赤外線発光ダイオ
ードが用いられ、前記受光素子２５には、フオトトラン
ジスタが用いられている。該発光素子２１および受光素
子２５は、図４の如く、前記リードフレーム２０,２４
の一側端子２０a,２４aに接続され、また他側端子２０
b,２４bに接続された金線等のボンデイングワイヤー３
１によつて内部結線が施されている。An infrared light emitting diode is used for the light emitting element 21, and a phototransistor is used for the light receiving element 25. The light emitting element 21 and the light receiving element 25 are, as shown in FIG.
Connected to the one side terminals 20a, 24a, and the other side terminal 20
Bonding wire 3 such as gold wire connected to b and 24b
Internal wiring is provided by 1.
【００１５】前記透光樹脂体２３,２６は、図１，４の
如く、前記発光素子２１および受光素子２５を、前記熱
硬化性樹脂２２を用いてキヤステイング方式、あるいは
トランスフアー方式等により直方体状に被覆形成されて
いる。そして、該透光樹脂体２３,２６は、図１，２の
如く、発光素子２１および受光素子２５間で光を送受で
きるよう被検出物の通過路３２を間に挾んで対向配置さ
れている。As shown in FIGS. 1 and 4, the translucent resin bodies 23 and 26 are rectangular parallelepipeds obtained by casting the light emitting element 21 and the light receiving element 25 using the thermosetting resin 22 by a casting method or a transfer method. It is formed like a coating. Then, as shown in FIGS. 1 and 2, the translucent resin bodies 23 and 26 are arranged so as to face each other with a passage 32 of an object to be detected in between so that light can be transmitted and received between the light emitting element 21 and the light receiving element 25. .
【００１６】前記熱硬化性樹脂２２は、発光素子２１お
よび受光素子２５間で送受する光に対して透光性であれ
ば良く、エポキシ樹脂等が使用されている。The thermosetting resin 22 only needs to transmit light transmitted and received between the light emitting element 21 and the light receiving element 25, and epoxy resin or the like is used.
【００１７】前記ケース２８は、図１〜３の如く、前記
透光樹脂体２３,２６を所定間隔Ｄで対向並置して凸部
を有する成形金型に挿入し、前記透光樹脂体２３,２６
の発光面２３aおよび受光面２６aの一部を除いた全周面
を覆うよう前記熱可塑性樹脂２７を射出して、図１，２
の如く、略縦断面倒立凹字型に形成されている。そし
て、該ケース２８の光通過面２８a,２８bの中央上部の
成形金型の凸部に対応した部分には、夫々上下方向に沿
つて短冊形の前記スリツト２９,３０が設けられ、該ス
リツト２９,３０の長手方向の片側すなわち上側２９a,
３０aは、上方向に開放して形成されることにより、成
形が容易となるよう構成されている。In the case 28, as shown in FIGS. 1 to 3, the translucent resin bodies 23 and 26 are arranged side by side at a predetermined interval D and inserted into a molding die having a convex portion. 26
1, the thermoplastic resin 27 is injected so as to cover the entire peripheral surface except a part of the light emitting surface 23a and the light receiving surface 26a.
As described above, the vertical cross section is formed in an inverted concave shape. Then, the strip-shaped slits 29, 30 are provided along the vertical direction at the portions corresponding to the convex portions of the molding die at the upper center of the light passing surfaces 28a, 28b of the case 28, respectively. , 30 on one side in the longitudinal direction, that is, on the upper side 29a,
30a is formed so as to be open in the upward direction, and is configured to facilitate molding.
【００１８】前記熱可塑性樹脂２７には、化学構造的に
は線状の高分子であるポリブチレンテレフタレート(Ｐ
・Ｂ・Ｔ)および耐熱性に優れたポリフエニレンサルフ
アイド(Ｐ・Ｐ・Ｓ)等の樹脂が使用され、射出成形によ
つて能率的に加工できるものである。The thermoplastic resin 27 contains polybutylene terephthalate (P) which is a linear polymer in terms of chemical structure.
Resins such as B / T) and polyphenylene sulphide (P / P / S) having excellent heat resistance are used, and can be efficiently processed by injection molding.
【００１９】なお、図中３３は、金型成形時の透光樹脂
体２３,２６固定用(押え用)ピン穴、３４,３５はリード
フレーム２０,２４を連結するタイバーである。In the figure, reference numeral 33 is a pin hole for fixing (holding down) the translucent resin bodies 23, 26 at the time of molding the mold, and 34, 35 are tie bars for connecting the lead frames 20, 24.
【００２０】上記光結合装置は、以下のようにして製造
される。まず、リードフレーム２０,２４の一側端子２
０a,２４aに夫々発光素子２１および受光素子２５を接
続し、また他側端子２０b,２４bへボンデイングワイヤ
ー３１により内部結線を施す。次に、これらを被覆する
ように熱硬化性樹脂２２を用いてキヤステイング方式あ
るいはトランスフアー方式等により分離独立した透光樹
脂体２３,２６を一次成形する。そして、この透光樹脂
体２３,２６を必要に応じて成形バリを除去する工程を
経て成形金型に挿入し、熱可塑性樹脂２７により透光樹
脂体２３,２６の発光面２３aおよび受光面２６aの一部
を除いた全周面を被覆するように二次成形してケース２
８とする。The above optical coupling device is manufactured as follows. First, one side terminal 2 of the lead frames 20 and 24
The light emitting element 21 and the light receiving element 25 are connected to 0a and 24a, respectively, and the other side terminals 20b and 24b are internally connected by the bonding wire 31. Next, the translucent resin bodies 23 and 26 which are separated and independent by the casting method or the transfer method are primarily formed using the thermosetting resin 22 so as to cover them. Then, the transparent resin bodies 23, 26 are inserted into a molding die through a step of removing molding burrs as required, and the light emitting surface 23a and the light receiving surface 26a of the transparent resin bodies 23, 26 are inserted by the thermoplastic resin 27. Case 2 by secondary molding so as to cover the entire peripheral surface except a part of
8
【００２１】このとき、成形金型に、ケース２８の光通
過面２８a,２８bにスリツト２９,３０を形成するととも
に発光面および受光面の一部に当接する凸部を設け、ま
たケース２８のスリツト２９,３０に熱可塑性樹脂２７
が流入しないように透光樹脂体２３,２６の発光面２３a
および受光面２６aの反対側より透光樹脂体２３,２６を
押し当て固定する。そして、一対の透光樹脂体２３,２
６が所定間隔Ｄで同一方向に並んだ状態となるように熱
可塑性樹脂２７を射出してケース２８を成形して完成す
る。At this time, in the molding die, the slits 29, 30 are formed on the light passage surfaces 28a, 28b of the case 28, and the projections are provided so as to contact a part of the light emitting surface and the light receiving surface, and the slits of the case 28 are formed. Thermoplastic resin 27 for 29 and 30
Light-emitting surface 23a of the translucent resin bodies 23, 26 so that the light does not flow in.
Then, the translucent resin bodies 23 and 26 are pressed and fixed from the opposite side of the light receiving surface 26a. Then, the pair of translucent resin bodies 23, 2
The case 28 is molded by injecting the thermoplastic resin 27 so that 6 are aligned in the same direction at the predetermined interval D, and the case 28 is completed.
【００２２】このように、透光樹脂体２３,２６を熱硬
化性樹脂２２により形成し、この透光樹脂体２３,２６
を一体的に被覆形成するケース２８を熱可塑性樹脂２７
により形成しているので、透光樹脂体２３,２６および
ケース２８を射出成形することが可能となる。また、透
光樹脂体に光の出入りする範囲を制限する凸状部を形成
した従来の光結合装置に比べ、スリツト２９,３０の幅
を成形金型の凸部の幅にて決定する方式をとることによ
り、スリツトに亀裂および欠けの発生なしにスリツトの
幅を狭くすることができる。In this way, the translucent resin bodies 23, 26 are formed of the thermosetting resin 22, and the translucent resin bodies 23, 26 are formed.
The case 28 for integrally forming the
Since it is formed of, the translucent resin bodies 23, 26 and the case 28 can be injection-molded. In addition, compared to the conventional optical coupling device in which a convex portion that limits the range of light entering and exiting is formed in the translucent resin body, a method in which the width of the slits 29, 30 is determined by the width of the convex portion of the molding die is used. By doing so, the width of the slit can be narrowed without cracking or chipping of the slit.
【００２３】また、透光樹脂体にスリツトを形成しない
でケース２８にスリツト２９,３０を形成しているの
で、スリツト幅の異なる(分解能の異なる)光結合装置の
製造時においても成形金型の増設だけで、透光樹脂体お
よびその他設備をそのまま利用できる。Further, since the slits 29 and 30 are formed in the case 28 without forming the slits in the translucent resin body, even when the optical coupling devices having different slit widths (different resolutions) are manufactured, the molding die can be manufactured. The translucent resin body and other equipment can be used as they are just by adding more.
【００２４】さらに、スリツト２９,３０の長手方向の
片側２９a,３０aが開放して形成されているため、二次
成形終了時に成形金型の抜去が容易となり、図５，６の
ように透光樹脂体２３,２６およびケース２８を多連式
にして量産することができる。Further, since the slits 29, 30 are formed so that one side 29a, 30a in the longitudinal direction thereof is opened, the molding die can be easily removed at the end of the secondary molding, and the light transmission as shown in FIGS. The resin bodies 23 and 26 and the case 28 can be mass-produced in a multi-unit manner.
【００２５】以上のことにより、製造が容易にでき、ま
た品質が安定し、しかも高分解能の光結合装置の提供が
可能となる。From the above, it is possible to provide an optical coupling device which can be easily manufactured, has stable quality, and has high resolution.
【００２６】次に、本発明の第二実施例について図面に
より説明する。図７は本発明第二実施例からなる光結合
装置の縦断側面図である。Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a vertical sectional side view of an optical coupling device according to a second embodiment of the present invention.
【００２７】図示の如く、本実施例からなる光結合装置
は、前記透光樹脂体２３,２６の発光面２３a、受光面２
６aの一部および底面２３b,２６bを除いた周面を前記熱
可塑性樹脂で一体的に被覆形成して前記ケース２８を構
成したものである。その他の構成および作用、効果は、
第一実施例と同様である。As shown in the figure, in the optical coupling device according to this embodiment, the light emitting surface 23a and the light receiving surface 2 of the translucent resin bodies 23 and 26 are provided.
The case 28 is configured by integrally forming a part of 6a and a peripheral surface excluding the bottom surfaces 23b and 26b with the thermoplastic resin. Other configurations, functions, and effects are
It is similar to the first embodiment.
【００２８】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。The present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.
【００２９】例えば、上記実施例において、受光素子２
５には、フオトトランジスタを用いているが、その他増
幅回路等を集積化した受光素子であつても良い。For example, in the above embodiment, the light receiving element 2
Although a phototransistor is used for 5, a light receiving element in which an amplifier circuit or the like is integrated may be used.
【００３０】また、透光性の熱硬化性樹脂２２には、透
明あるいは可視光線を透過するものだけではなく、例え
ば赤外光を透過し、可視光を遮光するようなものであつ
ても良い。Further, the translucent thermosetting resin 22 is not limited to one that is transparent or transmits visible light, but may be one that transmits infrared light and blocks visible light, for example. .
【００３１】[0031]
【発明の効果】以上の説明から明らかな通り、本発明に
よると、発光側および受光側透光樹脂体を一次成形し
て、発光側透光樹脂体の発光面と受光側透光樹脂体の受
光面に対向するようにそれぞれ凸部が形成された成形金
型を用い、発光面および受光面の反対側より各透光樹脂
体を押して、発光面および受光面の一部を成形金型の各
凸部に当接させて両透光樹脂体を所定の間隔だけあけ、
遮光性樹脂により透光樹脂体の発光面および受光面の一
部を除いて被覆することによりケースを二次成形してい
るので、従来の透光樹脂体に凸部を形成した場合には、
凸部の幅を狭くすると亀裂および欠けが発生しやすくな
っていたが、上記方法により受発光面を平坦にしたまま
亀裂および欠けを発生させずにスリツトの幅を狭くする
ことができ、高分解能の光結合装置を容易に製造できる
とともに欠陥が少なくなり品質の向上を図れる。しか
も、分解能の異なる光結合装置を製造する場合において
も、成形金型の凸部の幅を変更するだけでスリツトの幅
を変更でき、透光樹脂体およびその他設備をそのまま利
用できるため、分解能の異なる光結合装置の製造も容易
となる。As is apparent from the above description, according to the present invention, the light-transmitting-side and light-receiving-side light-transmitting resin bodies are primarily molded to form the light-emitting surface of the light-emitting side light-transmitting resin body and the light-receiving side light-transmitting resin body. Using a molding die with convex portions formed so as to face the light-receiving surface, press each translucent resin body from the opposite side of the light-emitting surface and the light-receiving surface, and partially form the light-emitting surface and the light-receiving surface of the molding die. Abutting on each convex part, opening both translucent resin bodies at a predetermined interval,
Since the case is secondarily molded by covering a part of the light-emitting surface and the light-receiving surface of the light-transmitting resin body with the light-shielding resin, when a convex portion is formed on the conventional light-transmitting resin body,
If the width of the convex portion was narrowed, cracks and chips were likely to occur, but with the above method, it is possible to narrow the slit width without causing cracks and chips while keeping the light receiving and emitting surface flat, and high resolution is achieved. The optical coupling device can be easily manufactured, and defects can be reduced to improve quality. Moreover, even when manufacturing optical coupling devices with different resolutions, the width of the slit can be changed simply by changing the width of the convex portion of the molding die, and the transparent resin body and other equipment can be used as they are. It also facilitates the manufacture of different optical coupling devices.
【００３２】また、スリツトの長手方向の片側を開放し
て形成しているので、二次成形終了時に成形金型を容易
に抜去できる。そのため、透光樹脂体およびケースを他
連式にすることにより光結合装置が量産可能となる。Further, since the slit is formed so that one side in the longitudinal direction is opened, the molding die can be easily removed at the end of the secondary molding. Therefore, the optical coupling device can be mass-produced by making the translucent resin body and the case different from each other.
【図１】本発明第一実施例の光結合装置の縦断側面図FIG. 1 is a vertical sectional side view of an optical coupling device according to a first embodiment of the present invention.
【図２】同じくその斜視図FIG. 2 is a perspective view of the same.
【図３】図２のＡ−Ａ横断平面図3 is a cross-sectional plan view taken along the line AA of FIG.
【図４】同じくその透光樹脂体を示す斜視図FIG. 4 is a perspective view showing the translucent resin body.
【図５】同じくその透光樹脂体を多連式で製造する場合
の斜視図FIG. 5 is a perspective view of the case where the translucent resin body is also manufactured by a multi-row method.
【図６】同じくそのケースを多連式で製造する場合の斜
視図FIG. 6 is a perspective view of a case where the case is also manufactured in a multiple manner.
【図７】本発明第二実施例の光結合装置の縦断側面図FIG. 7 is a vertical sectional side view of an optical coupling device according to a second embodiment of the present invention.
【図８】従来の光結合装置の平面図FIG. 8 is a plan view of a conventional optical coupling device.
【図９】同じくそのＢ−Ｂ縦断正面図FIG. 9 is a front view of the same BB vertical section.
【図１０】同じくそのＣ−Ｃ縦断側面図FIG. 10 is a side view of the same, taken along the line C-C.
【図１１】同じくその受光素子側から見た背面図FIG. 11 is a rear view of the same as seen from the light receiving element side.
【図１２】同じくその透光樹脂体の平面図FIG. 12 is a plan view of the translucent resin body.
【図１３】同じくその正面図FIG. 13 is a front view of the same.
【図１４】同じくその縦断側面図FIG. 14 is a vertical side view of the same.
２０,２４ リードフレーム ２１ 発光素子 ２２ 透光性樹脂 ２３,２６ 透光樹脂体 ２３a 発光面 ２５ 受光素子 ２６a 受光面 ２７ 遮光性樹脂 ２８ ケース ２８a,２８b 光通過面 ２９,３０ スリツト 20, 24 Lead frame 21 Light emitting element 22 Light transmitting resin 23,26 Light transmitting resin body 23a Light emitting surface 25 Light receiving element 26a Light receiving surface 27 Light shielding resin 28 Case 28a, 28b Light passing surface 29, 30 slit
Claims (1)
リードフレームに搭載し、前記発光素子と受光素子とを
それぞれ透光性樹脂にて被覆して発光側透光樹脂体およ
び受光側透光樹脂体を一次成形し、前記発光側透光樹脂
体の発光面側と受光側透光樹脂体の受光面側に対向する
ようにそれぞれ凸部が形成された成形金型に両透光樹脂
体を挿入して対向配置させ、前記発光面および受光面の
反対側より各透光樹脂体を押して、前記発光面および受
光面の一部を前記成形金型の各凸部に当接させ、遮光性
樹脂により透光樹脂体の発光面および受光面の前記凸部
に当接する一部を除いて前記発光側透光樹脂体および受
光側透光樹脂体を一体的に被覆してケースを二次成形す
るとともに、前記ケースの凸部対応部に長手方向の片側
が開放されたスリツトを形成したことを特徴とする光結
合装置の製造方法。1. A light emitting element and a light receiving element are mounted on separate lead frames, respectively, and the light emitting element and the light receiving element are covered with a light transmissive resin to form a light emitting side light transmitting resin body and a light receiving side light transmitting side. The resin body is primarily molded, and both translucent resin bodies are formed in a molding die in which convex portions are formed so as to face the light emitting surface side of the light emitting side translucent resin body and the light receiving surface side of the light receiving side translucent resin body, respectively. To be opposed to each other, and push each translucent resin body from the opposite side of the light emitting surface and the light receiving surface to bring a part of the light emitting surface and the light receiving surface into contact with each convex portion of the molding die to shield light. Of the light-transmitting resin body and the light-receiving side light-transmitting resin body integrally with the light-transmitting resin body except for a portion of the light-transmitting resin body that abuts on the convex portions of the light-transmitting surface and the light-receiving surface. A slit that is formed and is open on one side in the longitudinal direction at the corresponding part of the convex part of the case. A method for manufacturing an optical coupling device, wherein the optical coupling device is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29941493A JPH081960B2 (en) | 1993-11-30 | 1993-11-30 | Optical coupling device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29941493A JPH081960B2 (en) | 1993-11-30 | 1993-11-30 | Optical coupling device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06204553A JPH06204553A (en) | 1994-07-22 |
| JPH081960B2 true JPH081960B2 (en) | 1996-01-10 |
Family
ID=17872257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29941493A Expired - Lifetime JPH081960B2 (en) | 1993-11-30 | 1993-11-30 | Optical coupling device manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH081960B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06101581B2 (en) * | 1988-07-29 | 1994-12-12 | 松下電器産業株式会社 | Method of forming photo interrupter |
-
1993
- 1993-11-30 JP JP29941493A patent/JPH081960B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06204553A (en) | 1994-07-22 |
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