JP2021190634A - 基板処理装置および基板処理方法 - Google Patents
基板処理装置および基板処理方法 Download PDFInfo
- Publication number
- JP2021190634A JP2021190634A JP2020096601A JP2020096601A JP2021190634A JP 2021190634 A JP2021190634 A JP 2021190634A JP 2020096601 A JP2020096601 A JP 2020096601A JP 2020096601 A JP2020096601 A JP 2020096601A JP 2021190634 A JP2021190634 A JP 2021190634A
- Authority
- JP
- Japan
- Prior art keywords
- unit
- substrate processing
- substrate
- detection unit
- respect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 250
- 238000012545 processing Methods 0.000 title claims abstract description 176
- 238000003672 processing method Methods 0.000 title claims description 5
- 238000001514 detection method Methods 0.000 claims abstract description 193
- 238000000034 method Methods 0.000 claims abstract description 39
- 238000012546 transfer Methods 0.000 claims description 32
- 238000012937 correction Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 description 62
- 239000007788 liquid Substances 0.000 description 23
- 230000003028 elevating effect Effects 0.000 description 14
- 230000002093 peripheral effect Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 238000011084 recovery Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/021—Optical sensing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
最初に、図1を参照しながら、実施形態に係る基板処理システム1の概略構成について説明する。図1は、実施形態に係る基板処理システム1の概略構成を示す模式図である。
次に、実施形態に係る洗浄ユニット16の構成について、図2を参照しながら説明する。図2は、実施形態に係る洗浄ユニット16の具体的な構成例を示す模式図である。図2に示すように、洗浄ユニット16は、チャンバ71と、基板処理部72と、洗浄液吐出部73と、回収カップ74とを備える。
つづいては、実施形態に係る基板搬送装置17の構成について、図3〜図11を参照しながら説明する。図3は、実施形態に係る基板搬送装置17の平面図である。基板搬送装置17は、上下に重なって配置される2つのフォーク25(一方は図示せず)を有する。フォーク25は、基板搬送部の一例である。
θ=tan−1((Ya−Yb)/Xa) ・・・(1)
次に、洗浄ユニット16の基板処理部72に対して、基板搬送装置17を用いてウェハWを搬入する処理の詳細について、先に説明した図6などを参照しながら説明する。
つづいて、洗浄ユニット16へのウェハWの搬入処理の詳細について、図12〜図14を参照しながら説明する。図12〜図14は、実施形態に係るウェハWの搬入処理について説明するための図である。
つづいて、実施形態に係る搬入処理の手順について、図17を参照しながら説明する。図17は、実施形態に係る基板処理システム1が実行する搬入処理の手順を示すフローチャートである。
1 基板処理システム(基板処理装置の一例)
6 制御部
16 洗浄ユニット
17 基板搬送装置
25 フォーク(基板搬送部の一例)
28A、28B、28C 貫通孔
51 第1検出部
51a 発光部
51b 受光部
52 第2検出部
52a 発光部
52b 受光部
53 第3検出部
53a 発光部
53b 受光部
72 基板処理部
Claims (7)
- 基板を保持して処理する基板処理部と、
回転軸を有し、前記基板処理部に前記基板を搬入する基板搬送部と、
進行方向に向けて前記基板を前記基板処理部に搬入する際に、前記基板処理部に対する前記基板搬送部の前記進行方向の位置を検出する第1検出部と、
前記基板処理部に対する前記基板搬送部の前記進行方向とは垂直な方向の位置を検出する第2検出部と、
前記基板処理部に対する前記基板搬送部の前記回転軸の傾きを検出する第3検出部と、
を備える基板処理装置。 - 前記第3検出部は、前記第2検出部に対して前記進行方向とは垂直な方向に沿わないように配置される
請求項1に記載の基板処理装置。 - 前記第1検出部と前記第2検出部とは、前記基板処理部の搬入口に隣接して設けられ、
前記第3検出部は、前記基板処理部に対して前記第1検出部および前記第2検出部よりも内側または外側に設けられる
請求項1または2に記載の基板処理装置。 - 前記第1検出部、前記第2検出部および前記第3検出部は、いずれも発光部と受光部とを有する光学式センサであり、
前記基板搬送部の位置を検出する際には、前記発光部と前記受光部とが前記基板搬送部に設けられる貫通孔を挟んで配置される
請求項1〜3のいずれか一つに記載の基板処理装置。 - 前記貫通孔は、前記第1検出部、前記第2検出部および前記第3検出部に対応する位置に複数設けられる
請求項4に記載の基板処理装置。 - 各部を制御する制御部をさらに備え、
前記制御部は、
前記基板搬送部で前記基板を前記基板処理部に搬入する際に、前記第1検出部、前記第2検出部および前記第3検出部によって、前記基板処理部に対する前記基板搬送部の前記進行方向の位置と、前記基板処理部に対する前記基板搬送部の前記進行方向とは垂直な方向の位置と、前記基板処理部に対する前記基板搬送部の前記回転軸の傾きとを検出し、
前記第1検出部、前記第2検出部および前記第3検出部で検出された各検出値に基づいて、基準位置に対する補正量を算出し、
算出された前記補正量に基づいて、前記基板処理部に対する前記基板搬送部の前記進行方向の位置と、前記基板処理部に対する前記基板搬送部の前記進行方向とは垂直な方向の位置とを補正する
請求項1〜5のいずれか一つに記載の基板処理装置。 - 回転軸を有する基板搬送部を用いて、進行方向に向けて基板を基板処理部に搬入する際に、前記基板処理部に対する前記基板搬送部の前記進行方向の位置と、前記基板処理部に対する前記基板搬送部の前記進行方向とは垂直な方向の位置と、前記基板処理部に対する前記基板搬送部の前記回転軸の傾きとを検出する検出工程と、
前記検出工程で検出された各検出値に基づいて、基準位置に対する補正量を算出する算出工程と、
前記算出工程で算出された前記補正量に基づいて、前記基板処理部に対する前記基板搬送部の前記進行方向の位置と、前記基板処理部に対する前記基板搬送部の前記進行方向とは垂直な方向の位置とを補正する補正工程と、
を含む基板処理方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020096601A JP7482689B2 (ja) | 2020-06-03 | 2020-06-03 | 基板処理装置および基板処理方法 |
TW110118439A TW202212232A (zh) | 2020-06-03 | 2021-05-21 | 基板處理裝置及基板處理方法 |
KR1020210066017A KR20210150283A (ko) | 2020-06-03 | 2021-05-24 | 기판 처리 장치 및 기판 처리 방법 |
CN202110585650.7A CN113764319A (zh) | 2020-06-03 | 2021-05-27 | 基片处理装置和基片处理方法 |
US17/336,322 US20210384058A1 (en) | 2020-06-03 | 2021-06-02 | Substrate processing apparatus and substrate processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020096601A JP7482689B2 (ja) | 2020-06-03 | 2020-06-03 | 基板処理装置および基板処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021190634A true JP2021190634A (ja) | 2021-12-13 |
JP7482689B2 JP7482689B2 (ja) | 2024-05-14 |
Family
ID=78787234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020096601A Active JP7482689B2 (ja) | 2020-06-03 | 2020-06-03 | 基板処理装置および基板処理方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210384058A1 (ja) |
JP (1) | JP7482689B2 (ja) |
KR (1) | KR20210150283A (ja) |
CN (1) | CN113764319A (ja) |
TW (1) | TW202212232A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115241111A (zh) * | 2022-09-05 | 2022-10-25 | 广州纳动半导体设备有限公司 | 一种芯片巨量转移封装纠偏对位***及其应用方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6546307B1 (en) * | 1999-08-20 | 2003-04-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for detecting proper orientation of a semiconductor wafer in a wafer transfer system |
US6040585A (en) * | 1999-08-20 | 2000-03-21 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for detecting wafer orientation during transport |
JP2006351883A (ja) | 2005-06-16 | 2006-12-28 | Tokyo Electron Ltd | 基板搬送機構及び処理システム |
CN102112274B (zh) | 2008-08-01 | 2014-11-19 | 爱发科股份有限公司 | 搬运机器人的示教方法 |
JP2010162611A (ja) | 2009-01-13 | 2010-07-29 | Ulvac Japan Ltd | 相対ティーチング方法 |
JP6352133B2 (ja) * | 2014-09-26 | 2018-07-04 | 株式会社Screenホールディングス | 位置検出装置、基板処理装置、位置検出方法および基板処理方法 |
KR102587203B1 (ko) | 2015-07-13 | 2023-10-10 | 브룩스 오토메이션 인코퍼레이티드 | 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치 |
JP6862903B2 (ja) | 2017-02-23 | 2021-04-21 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及び記憶媒体 |
JP7049909B2 (ja) * | 2018-05-11 | 2022-04-07 | 川崎重工業株式会社 | 基板搬送ロボット及び基板保持ハンドの光軸ずれ検出方法 |
-
2020
- 2020-06-03 JP JP2020096601A patent/JP7482689B2/ja active Active
-
2021
- 2021-05-21 TW TW110118439A patent/TW202212232A/zh unknown
- 2021-05-24 KR KR1020210066017A patent/KR20210150283A/ko active Search and Examination
- 2021-05-27 CN CN202110585650.7A patent/CN113764319A/zh active Pending
- 2021-06-02 US US17/336,322 patent/US20210384058A1/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115241111A (zh) * | 2022-09-05 | 2022-10-25 | 广州纳动半导体设备有限公司 | 一种芯片巨量转移封装纠偏对位***及其应用方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202212232A (zh) | 2022-04-01 |
KR20210150283A (ko) | 2021-12-10 |
JP7482689B2 (ja) | 2024-05-14 |
CN113764319A (zh) | 2021-12-07 |
US20210384058A1 (en) | 2021-12-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6862903B2 (ja) | 基板搬送装置、基板搬送方法及び記憶媒体 | |
TWI500107B (zh) | 基板處理裝置及基板處理方法 | |
CN108364898B (zh) | 基板搬送装置、检测位置校正方法及基板处理装置 | |
TWI720945B (zh) | 基板處理裝置及基板處理方法 | |
JP5516482B2 (ja) | 基板搬送方法、基板搬送装置、及び塗布現像装置 | |
JP4137711B2 (ja) | 基板処理装置及び基板搬送手段の位置合わせ方法 | |
TWI613746B (zh) | 基板處理裝置及基板處理方法 | |
CN110729215B (zh) | 基板输送装置和基板输送方法 | |
CN109411379B (zh) | 基板处理装置 | |
CN109560016B (zh) | 基板处理装置 | |
JP2021190634A (ja) | 基板処理装置および基板処理方法 | |
JP2010177650A (ja) | 研削方法 | |
JP2005193303A (ja) | 基板搬送装置 | |
CN108428655B (zh) | 基板搬运装置、基板处理装置以及基板搬运方法 | |
JP5930519B2 (ja) | 加工装置 | |
JP7093255B2 (ja) | 実装装置及び実装方法 | |
JP2009111344A (ja) | スピン処理装置 | |
JP4976811B2 (ja) | 基板処理システム、基板搬送装置、基板搬送方法、および記録媒体 | |
JPWO2014030222A1 (ja) | 電子部品装着機 | |
JP6442596B2 (ja) | 基板搬送装置および基板搬送方法 | |
JP6074325B2 (ja) | 基板処理装置、基板検知方法および記憶媒体 | |
JP4248066B2 (ja) | 表面実装部品搭載機 | |
CN116264175A (zh) | 检测***、检测方法以及存储介质 | |
JP2021090076A (ja) | 部品実装機 | |
JP6532778B2 (ja) | 液滴吐出装置、液滴吐出方法、プログラム及びコンピュータ記憶媒体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230410 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20231227 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240130 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240216 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240227 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240325 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240402 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240430 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7482689 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |