JP2021180244A - 保持機構 - Google Patents
保持機構 Download PDFInfo
- Publication number
- JP2021180244A JP2021180244A JP2020084542A JP2020084542A JP2021180244A JP 2021180244 A JP2021180244 A JP 2021180244A JP 2020084542 A JP2020084542 A JP 2020084542A JP 2020084542 A JP2020084542 A JP 2020084542A JP 2021180244 A JP2021180244 A JP 2021180244A
- Authority
- JP
- Japan
- Prior art keywords
- air
- plate
- bernoulli
- flow rate
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 22
- 230000009471 action Effects 0.000 claims abstract description 9
- 238000007664 blowing Methods 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 description 81
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000523 sample Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0625—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum provided with a valve
- B25J15/0641—Object-actuated valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
4 :リンク機構
6 :第1駆動部
8 :支持部材
10 :第1リンク
11 :ウェーハ
11a :表面
11b :裏面
12 :第2リンク
13 :デバイス
14 :第2駆動部
16 :ハンド
16a :基部
16b :先端部
16c :切り欠き
16d :一面
16e :他面
18a,18b:ベルヌーイパッド
20 :ゴムパッド
22 :センサー
24 :カセット
24a :側面
24b :支持溝
24c :天板
24d :接続部
24e :開口
26 :エアーチューブ
26a :元栓
28 :エアー供給源
30 :電空レギュレータ
32 :制御部
A :距離
Claims (3)
- 板状物にエアーを吹き付けることで生じる負圧の作用によって該板状物を保持するベルヌーイパッドを備える保持機構であって、
該ベルヌーイパッドが配設されたハンドと、
該ハンドに配設され、該板状物が該ベルヌーイパッドで吸引保持されたことを検出するセンサーと、
該ハンドに配設され該板状物の横移動を規制する横移動規制部と、
該ベルヌーイパッドにエアーを供給するエアー源と該ベルヌーイパッドとを連結するチューブと、
該チューブに配設され、該ベルヌーイパッドに供給されるエアーの流量を調整する調整バルブと、
該調整バルブの動作を制御する制御部と、を備え、
該制御部は、該調整バルブから該ベルヌーイパッドに供給されるエアーの流量を徐々に増加させ、該板状物が負圧の作用を受けて該ベルヌーイパッドに吸引保持されたことを該センサーで検出したときに、エアーの流量を固定することを特徴とする保持機構。 - 該センサーは、近接センサーであり、
該センサーと該板状物との距離が所定の長さになったことを該センサーで検出したときに、該制御部は、該板状物が該ベルヌーイパッドに吸引保持されたと判断し、該調整バルブから該ベルヌーイパッドに供給されるエアーの流量を固定することを特徴とする請求項1記載の保持機構。 - 該センサーは、振動センサーであり、
エアーの流量の増加と共に徐々に増加する該板状物の振動の振幅が所定量になったことを該センサーで検出したときに、該制御部は、該板状物が該ベルヌーイパッドに吸引保持されたと判断し、該調整バルブから該ベルヌーイパッドに供給されるエアーの流量を固定することを特徴とする請求項1記載の保持機構。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020084542A JP7418924B2 (ja) | 2020-05-13 | 2020-05-13 | 保持機構 |
KR1020210048869A KR20210139144A (ko) | 2020-05-13 | 2021-04-15 | 유지 기구 |
SG10202104232RA SG10202104232RA (en) | 2020-05-13 | 2021-04-26 | Holding mechanism including bernoulli pad |
US17/240,290 US11935778B2 (en) | 2020-05-13 | 2021-04-26 | Holding mechanism including Bernoulli pad |
TW110115620A TWI850555B (zh) | 2020-05-13 | 2021-04-29 | 保持機構 |
CN202110503926.2A CN113666089A (zh) | 2020-05-13 | 2021-05-10 | 保持机构 |
DE102021204748.3A DE102021204748A1 (de) | 2020-05-13 | 2021-05-11 | Haltemechanismus mit bernoulli-pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020084542A JP7418924B2 (ja) | 2020-05-13 | 2020-05-13 | 保持機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021180244A true JP2021180244A (ja) | 2021-11-18 |
JP7418924B2 JP7418924B2 (ja) | 2024-01-22 |
Family
ID=78280727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020084542A Active JP7418924B2 (ja) | 2020-05-13 | 2020-05-13 | 保持機構 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11935778B2 (ja) |
JP (1) | JP7418924B2 (ja) |
KR (1) | KR20210139144A (ja) |
CN (1) | CN113666089A (ja) |
DE (1) | DE102021204748A1 (ja) |
SG (1) | SG10202104232RA (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7324667B2 (ja) * | 2019-09-20 | 2023-08-10 | 株式会社Screenホールディングス | 基板処理装置 |
CN116417384A (zh) * | 2021-12-30 | 2023-07-11 | 盛美半导体设备(上海)股份有限公司 | 薄片晶圆传输方法 |
CN114454203B (zh) * | 2022-02-17 | 2023-12-29 | 绍兴中芯集成电路制造股份有限公司 | 机械手及吸盘 |
CN116553173A (zh) * | 2023-05-16 | 2023-08-08 | 华中科技大学 | 一种高可靠非接触式芯片拾取装置与在线控制方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6322116B1 (en) * | 1999-07-23 | 2001-11-27 | Asm America, Inc. | Non-contact end effector |
US7100954B2 (en) * | 2003-07-11 | 2006-09-05 | Nexx Systems, Inc. | Ultra-thin wafer handling system |
JP4299104B2 (ja) | 2003-11-10 | 2009-07-22 | 株式会社ディスコ | ウエーハ搬送機構 |
JP4243766B2 (ja) * | 2006-10-02 | 2009-03-25 | Smc株式会社 | 非接触搬送装置 |
US20080129064A1 (en) * | 2006-12-01 | 2008-06-05 | Asm America, Inc. | Bernoulli wand |
JP5040795B2 (ja) | 2008-04-30 | 2012-10-03 | 株式会社Ihi | 非接触搬送装置 |
MY181832A (en) * | 2011-08-24 | 2021-01-08 | Harmotec Co Ltd | Non-contacting conveyance equipment |
US8905680B2 (en) * | 2011-10-31 | 2014-12-09 | Masahiro Lee | Ultrathin wafer transport systems |
US9360772B2 (en) | 2011-12-29 | 2016-06-07 | Nikon Corporation | Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method |
JP2014165470A (ja) | 2013-02-28 | 2014-09-08 | Nikon Corp | 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法 |
WO2017179296A1 (ja) | 2016-04-14 | 2017-10-19 | 三菱電機株式会社 | 基板保持装置 |
JP6858041B2 (ja) * | 2017-03-16 | 2021-04-14 | 川崎重工業株式会社 | 基板搬送装置 |
JP6818660B2 (ja) * | 2017-09-12 | 2021-01-20 | 株式会社東芝 | 物体保持装置 |
JP7187147B2 (ja) * | 2017-12-12 | 2022-12-12 | 東京エレクトロン株式会社 | 搬送装置のティーチング方法及び基板処理システム |
JP6924488B2 (ja) * | 2018-04-12 | 2021-08-25 | 株式会社ハーモテック | 旋回流形成体 |
US10553472B2 (en) * | 2018-06-22 | 2020-02-04 | Jabil Inc. | Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner |
JP7353711B2 (ja) * | 2019-08-14 | 2023-10-02 | 株式会社ディスコ | ウェーハ搬送装置 |
JP7488062B2 (ja) * | 2020-03-02 | 2024-05-21 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法および記憶媒体 |
-
2020
- 2020-05-13 JP JP2020084542A patent/JP7418924B2/ja active Active
-
2021
- 2021-04-15 KR KR1020210048869A patent/KR20210139144A/ko active Search and Examination
- 2021-04-26 US US17/240,290 patent/US11935778B2/en active Active
- 2021-04-26 SG SG10202104232RA patent/SG10202104232RA/en unknown
- 2021-05-10 CN CN202110503926.2A patent/CN113666089A/zh active Pending
- 2021-05-11 DE DE102021204748.3A patent/DE102021204748A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
US11935778B2 (en) | 2024-03-19 |
SG10202104232RA (en) | 2021-12-30 |
US20210358796A1 (en) | 2021-11-18 |
KR20210139144A (ko) | 2021-11-22 |
JP7418924B2 (ja) | 2024-01-22 |
CN113666089A (zh) | 2021-11-19 |
TW202143374A (zh) | 2021-11-16 |
DE102021204748A1 (de) | 2021-11-18 |
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