SG10202104232RA - Holding mechanism including bernoulli pad - Google Patents

Holding mechanism including bernoulli pad

Info

Publication number
SG10202104232RA
SG10202104232RA SG10202104232RA SG10202104232RA SG10202104232RA SG 10202104232R A SG10202104232R A SG 10202104232RA SG 10202104232R A SG10202104232R A SG 10202104232RA SG 10202104232R A SG10202104232R A SG 10202104232RA SG 10202104232R A SG10202104232R A SG 10202104232RA
Authority
SG
Singapore
Prior art keywords
holding mechanism
mechanism including
bernoulli pad
including bernoulli
pad
Prior art date
Application number
SG10202104232RA
Inventor
Kakinuma Yoshinori
Migiyama Yoshikuni
Saito Yoshinobu
RYU Jonghyun
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202104232RA publication Critical patent/SG10202104232RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0625—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum provided with a valve
    • B25J15/0641—Object-actuated valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
SG10202104232RA 2020-05-13 2021-04-26 Holding mechanism including bernoulli pad SG10202104232RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020084542A JP7418924B2 (en) 2020-05-13 2020-05-13 Retention mechanism

Publications (1)

Publication Number Publication Date
SG10202104232RA true SG10202104232RA (en) 2021-12-30

Family

ID=78280727

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202104232RA SG10202104232RA (en) 2020-05-13 2021-04-26 Holding mechanism including bernoulli pad

Country Status (6)

Country Link
US (1) US11935778B2 (en)
JP (1) JP7418924B2 (en)
KR (1) KR20210139144A (en)
CN (1) CN113666089A (en)
DE (1) DE102021204748A1 (en)
SG (1) SG10202104232RA (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7324667B2 (en) * 2019-09-20 2023-08-10 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
CN116417384A (en) * 2021-12-30 2023-07-11 盛美半导体设备(上海)股份有限公司 Wafer transfer method
CN114454203B (en) * 2022-02-17 2023-12-29 绍兴中芯集成电路制造股份有限公司 Manipulator and sucker
CN116553173A (en) * 2023-05-16 2023-08-08 华中科技大学 High-reliability non-contact chip pickup device and online control method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6322116B1 (en) * 1999-07-23 2001-11-27 Asm America, Inc. Non-contact end effector
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
JP4299104B2 (en) 2003-11-10 2009-07-22 株式会社ディスコ Wafer transfer mechanism
JP4243766B2 (en) * 2006-10-02 2009-03-25 Ｓｍｃ株式会社 Non-contact transfer device
US20080129064A1 (en) * 2006-12-01 2008-06-05 Asm America, Inc. Bernoulli wand
JP5040795B2 (en) 2008-04-30 2012-10-03 株式会社Ｉｈｉ Non-contact transfer device
MY181832A (en) * 2011-08-24 2021-01-08 Harmotec Co Ltd Non-contacting conveyance equipment
US8905680B2 (en) * 2011-10-31 2014-12-09 Masahiro Lee Ultrathin wafer transport systems
US9360772B2 (en) 2011-12-29 2016-06-07 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
JP2014165470A (en) 2013-02-28 2014-09-08 Nikon Corp Conveyance system and method, exposure apparatus and method, and device manufacturing method
WO2017179296A1 (en) 2016-04-14 2017-10-19 三菱電機株式会社 Substrate holding apparatus
JP6858041B2 (en) * 2017-03-16 2021-04-14 川崎重工業株式会社 Board transfer device
JP6818660B2 (en) * 2017-09-12 2021-01-20 株式会社東芝 Object holding device
JP7187147B2 (en) * 2017-12-12 2022-12-12 東京エレクトロン株式会社 Transfer device teaching method and substrate processing system
JP6924488B2 (en) * 2018-04-12 2021-08-25 株式会社ハーモテック Swirling flow forming body
US10553472B2 (en) * 2018-06-22 2020-02-04 Jabil Inc. Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner
JP7353711B2 (en) * 2019-08-14 2023-10-02 株式会社ディスコ Wafer transfer device
JP7488062B2 (en) * 2020-03-02 2024-05-21 東京エレクトロン株式会社 Bonding device, bonding system, bonding method, and storage medium

Also Published As

Publication number Publication date
JP2021180244A (en) 2021-11-18
US11935778B2 (en) 2024-03-19
US20210358796A1 (en) 2021-11-18
KR20210139144A (en) 2021-11-22
JP7418924B2 (en) 2024-01-22
CN113666089A (en) 2021-11-19
TW202143374A (en) 2021-11-16
DE102021204748A1 (en) 2021-11-18

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