JP2021077693A - 処理方法 - Google Patents
処理方法 Download PDFInfo
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- JP2021077693A JP2021077693A JP2019201376A JP2019201376A JP2021077693A JP 2021077693 A JP2021077693 A JP 2021077693A JP 2019201376 A JP2019201376 A JP 2019201376A JP 2019201376 A JP2019201376 A JP 2019201376A JP 2021077693 A JP2021077693 A JP 2021077693A
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- 238000003672 processing method Methods 0.000 title claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 163
- 238000010926 purge Methods 0.000 claims abstract description 63
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims description 52
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 abstract description 59
- 239000007789 gas Substances 0.000 description 144
- 238000002347 injection Methods 0.000 description 50
- 239000007924 injection Substances 0.000 description 50
- 239000012495 reaction gas Substances 0.000 description 34
- 239000002243 precursor Substances 0.000 description 15
- 101100476210 Caenorhabditis elegans rnt-1 gene Proteins 0.000 description 12
- 239000004020 conductor Substances 0.000 description 11
- 206010037544 Purging Diseases 0.000 description 8
- 238000001816 cooling Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
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- 230000008021 deposition Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002052 molecular layer Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- LXEXBJXDGVGRAR-UHFFFAOYSA-N trichloro(trichlorosilyl)silane Chemical compound Cl[Si](Cl)(Cl)[Si](Cl)(Cl)Cl LXEXBJXDGVGRAR-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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Abstract
Description
図1は、成膜装置10の一例を示す断面図である。図2は、上方から見た場合の成膜装置10の一例を示す模式図である。図2におけるA−A断面が図1である。図3および図4は、図1における軸線Xの左側の部分の一例を示す拡大断面図である。図5は、ユニットUの下面の一例を示す図である。図6は、図1における軸線Xの右側の部分の一例を示す拡大断面図である。図1〜図6に示す成膜装置10は、主に、処理容器12、載置台14、第1のガス供給部16、排気部18、第2のガス供給部20、およびプラズマ生成部22を備える。
アルゴン)等の不活性ガスである。パージガスが基板Wの表面に噴射されることにより、基板Wに過剰に吸着した前駆体ガスの原子または分子(残留ガス成分)が基板Wから除去される。これにより、基板Wの表面に、前駆体ガスの原子または分子が吸着した原子層または分子層が形成される。
一実施形態の成膜装置10により基板Wに所定の厚みの膜を形成する処理(以下「成膜処理」という。)によって、処理容器12内の各部、例えばアンテナ22aの天板40の下面や載置台14の上面に付着する堆積膜を除去する処理方法の一例について説明する。
一実施形態の処理方法におけるプラズマパージ処理のシーケンスの一例について説明する。図8は、プラズマパージ処理のシーケンスの一例を示す図である。
赤外線カメラを用いてマイクロ波により生成されるプラズマの発光強度分布を評価した結果について説明する。本評価では、ヒータ26の設定温度を80℃、チラー48の設定温度を60℃、パージガスとしてNH3ガスとH2ガスとArガスの混合ガス、マイクロ波の電力を2.5kWに固定し、処理容器12内の圧力を変化させたときのプラズマの発光強度分布を測定した。
まず、処理容器12内に堆積膜が付着した状態で、処理容器12内にウエハを収容し、以下に示される条件A〜Eにより処理容器12内に付着した堆積膜を除去する処理を行い、該処理の際にウエハに堆積したパーティクルの数を測定した。
チラー48の設定温度:80℃
処理容器12内の圧力:0.4Torr(53Pa)
マイクロ波の電力:3.0kW
パージガス:a−1/a−2/a−3=N2/N2/N2
パージ時間:60分
ヒータ26の設定温度:550℃
なお、a−1、a−2及びa−3は、第2の領域R2のうちのそれぞれアンテナ22a−1、22a−1及び22a−3が設けられた領域を示す。即ち、a−1/a−2/a−3=N2/N2/N2は、アンテナ22a−1が設けられた領域にN2ガスを供給し、アンテナ22a−2が設けられた領域にN2ガスを供給し、アンテナ22a−3が設けられた領域にN2ガスを供給することを意味する。
チラー48の設定温度:80℃
処理容器12内の圧力:2.0Torr(267Pa)
マイクロ波の電力:3.0kW
パージガス:a−1/a−2/a−3=H2/H2/H2+NH3
パージ時間:60分
ヒータ26の設定温度:550℃
チラー48の設定温度:80℃
処理容器12内の圧力:0.9Torr(120Pa)
マイクロ波の電力:3.0kW
パージガス:a−1/a−2/a−3=H2/H2/H2+NH3
パージ時間:60分
ヒータ26の設定温度:550℃
チラー48の設定温度:80℃
処理容器12内の圧力:0.8Torr(107Pa)から3.0Torr(400Pa)にステップ状に昇圧するステップと3.0Torr(400Pa)から0.8Torr(107Pa)にステップ状に降圧するステップとを含む複数のサイクル
マイクロ波の電力:3.0kW
パージガス:a−1/a−2/a−3=H2/H2/H2+NH3
パージ時間:60分
ヒータ26の設定温度:550℃
条件Aの後に条件Dを実施
12 処理容器
22 プラズマ生成部
22a アンテナ
40 天板
W 基板
Claims (15)
- 処理容器内でパージガスのプラズマを生成した状態で前記処理容器内の圧力を変化させる工程であって、生成した前記プラズマにより前記処理容器内に付着した膜を除去する工程を有する、
処理方法。 - 前記圧力を変化させる工程は、
前記処理容器内の圧力を上昇させるステップと、
前記処理容器内の圧力を下降させるステップと、
を含む、請求項1に記載の処理方法。 - 前記圧力を上昇させるステップと前記圧力を下降させるステップとは繰り返し行われる、
請求項2に記載の処理方法。 - 前記圧力を上昇させるステップは、前記圧力をステップ状に上昇させるステップであり、
前記圧力を下降させるステップでは、前記圧力をステップ状に下降させるステップである、
請求項2又は3に記載の処理方法。 - 前記圧力を変化させる工程は、前記処理容器内に基板を収容した状態で行われる、
請求項1乃至4のいずれか一項に記載の処理方法。 - 前記圧力を変化させる工程は、前記処理容器内に基板を収容しない状態で行われる、
請求項1乃至4のいずれか一項に記載の処理方法。 - 前記パージガスは、H2ガスを含む、
請求項1乃至6のいずれか一項に記載の処理方法。 - 前記パージガスは、NH3ガスを含む、
請求項1乃至7のいずれか一項に記載の処理方法。 - 前記プラズマは、アンテナからマイクロ波を供給することにより生成される、
請求項1乃至8のいずれか一項に記載の処理方法。 - 前記圧力を変化させる工程は、前記処理容器内に基板を収容した状態で前記基板に対して成膜処理を行う工程よりも前記アンテナの天板の温度を高くして行われる、
請求項9に記載の処理方法。 - 前記処理容器内で第2のパージガスのプラズマを生成する工程であって、生成した前記プラズマにより前記処理容器内に付着した膜を除去する工程を更に有する、
請求項1乃至10のいずれか一項に記載の処理方法。 - 前記第2のパージガスのプラズマを生成する工程は、前記処理容器内の圧力を一定に維持した状態で行われる、
請求項11に記載の処理方法。 - 前記第2のパージガスのプラズマを生成する工程は、前記圧力を変化させる工程の前に行われる、
請求項11又は12に記載の処理方法。 - 前記第2のパージガスのプラズマを生成する工程における前記処理容器内の圧力は、前記圧力を変化させる工程における前記処理容器内の圧力の最小値よりも低い、
請求項11乃至13のいずれか一項に記載の処理方法。 - 前記第2のパージガスは、N2ガスを含む、
請求項11乃至14のいずれか一項に記載の処理方法。
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