JP2020027902A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2020027902A JP2020027902A JP2018152885A JP2018152885A JP2020027902A JP 2020027902 A JP2020027902 A JP 2020027902A JP 2018152885 A JP2018152885 A JP 2018152885A JP 2018152885 A JP2018152885 A JP 2018152885A JP 2020027902 A JP2020027902 A JP 2020027902A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- chipping data
- chipping
- data
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 232
- 238000003384 imaging method Methods 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000003754 machining Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 56
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/06—Grooving involving removal of material from the surface of the work
- B26D3/065—On sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/141—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter for thin material, e.g. for sheets, strips or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/005—Computer numerical control means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
4:保持手段
6:切削手段
8:切削水供給手段
22:切削ブレード
28:撮像手段
38:表示手段
Claims (7)
- 被加工物を保持する保持面を有する保持手段と、該保持手段に保持された被加工物を切削する切削ブレードを回転可能に備えた切削手段と、該切削ブレードと被加工物とに切削水を供給する切削水供給手段と、該保持手段と該切削手段とを相対的に該保持面に平行なX軸方向に加工送りする加工送り手段と、該保持手段と該切削手段とを相対的に該保持面に平行でX軸方向に直交するY軸方向に割り出し送りする割り出し送り手段と、加工送り方向判定機構と、を備えた切削装置であって、
該加工送り方向判定機構は、切削溝を含む領域を撮像する撮像手段と、撮像された切削溝のチッピングデータを記録する記録手段と、を含み、
被加工物を第一の方向から切削した切削溝の第一のチッピングデータと、被加工物を該第一の方向と逆方向から切削した切削溝の第二のチッピングデータと、被加工物を該第一の方向に交差する第二の方向から切削した切削溝の第三のチッピングデータと、被加工物を該第二の方向と逆方向から切削した切削溝の第四のチッピングデータと、が該記録手段に記録される切削装置。 - 該撮像手段は、被加工物を透過する波長の光によって被加工物の裏面に形成された切削溝を撮像し、
被加工物を第一の方向から切削した切削溝の裏面側の第一の裏面チッピングデータと、被加工物を該第一の方向と逆方向から切削した切削溝の裏面側の第二の裏面チッピングデータと、被加工物を該第一の方向に交差する第二の方向から切削した切削溝の裏面側の第三の裏面チッピングデータと、被加工物を該第二の方向と逆方向から切削した切削溝の裏面側の第四の裏面チッピングデータと、が該記録手段に記録される請求項1記載の切削装置。 - 該加工送り判定機構は判断手段を備え、
該判断手段は、該記録手段に記録された該第一のチッピングデータと、該第二のチッピングデータと、該第三のチッピングデータと、該第四のチッピングデータと、を比較して切削溝を形成する方向を決定する請求項1記載の切削装置。 - 該加工送り判定機構は判断手段を備え、
該判断手段は、該記録手段に記録された該第一のチッピングデータと、該第二のチッピングデータと、該第三のチッピングデータと、該第四のチッピングデータと、に加え該第一の裏面チッピングデータと、該第二の裏面チッピングデータと、該第三の裏面チッピングデータと、該第四の裏面チッピングデータと、を比較して切削溝を形成する方向を決定する請求項2記載の切削装置。 - 該加工送り判定機構は、チッピングデータを表示する表示手段またはチッピングデータを出力する出力手段の少なくともいずれかを含む請求項1記載の切削装置。
- チッピングデータにはチッピングの大きさ、数量、が含まれる請求項1記載の切削装置。
- チッピングデータには画像が含まれる請求項6記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018152885A JP7313805B2 (ja) | 2018-08-15 | 2018-08-15 | 切削装置 |
CN201910675421.7A CN110834385B (zh) | 2018-08-15 | 2019-07-25 | 切削装置 |
US16/539,544 US11011393B2 (en) | 2018-08-15 | 2019-08-13 | Cutting apparatus |
TW108128862A TWI844556B (zh) | 2018-08-15 | 2019-08-14 | 切割裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018152885A JP7313805B2 (ja) | 2018-08-15 | 2018-08-15 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020027902A true JP2020027902A (ja) | 2020-02-20 |
JP7313805B2 JP7313805B2 (ja) | 2023-07-25 |
Family
ID=69523394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018152885A Active JP7313805B2 (ja) | 2018-08-15 | 2018-08-15 | 切削装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11011393B2 (ja) |
JP (1) | JP7313805B2 (ja) |
CN (1) | CN110834385B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7370262B2 (ja) * | 2020-01-28 | 2023-10-27 | 株式会社ディスコ | 切削装置及び切削方法 |
JP7430451B2 (ja) * | 2020-04-02 | 2024-02-13 | 株式会社ディスコ | 切削装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0866848A (ja) * | 1994-08-30 | 1996-03-12 | Disco Abrasive Syst Ltd | 切削方向検出システム |
JPH10312979A (ja) * | 1997-05-12 | 1998-11-24 | Disco Abrasive Syst Ltd | ウェーハの切削状況の検出方法 |
JP2000252240A (ja) * | 1999-03-03 | 2000-09-14 | Disco Abrasive Syst Ltd | 切削装置 |
JP2000269164A (ja) * | 1999-03-18 | 2000-09-29 | Matsushita Electronics Industry Corp | 半導体ウェーハのダイシング方法及び装置 |
JP2016179505A (ja) * | 2015-03-23 | 2016-10-13 | 株式会社ディスコ | 切削ブレードの検査方法 |
JP2016181540A (ja) * | 2015-03-23 | 2016-10-13 | 株式会社ディスコ | 被加工物の切削方法 |
Family Cites Families (19)
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JP2592489B2 (ja) * | 1988-03-18 | 1997-03-19 | 富士通株式会社 | ウエハダイシング方法 |
EP0803336B1 (en) * | 1996-04-27 | 2003-07-02 | Nippei Toyama Corporation | Wire saw and work slicing method |
KR100460807B1 (ko) * | 2002-07-08 | 2004-12-09 | 삼성전자주식회사 | 반도체소자 제조설비의 웨이퍼 외관 검사장치와 이를이용하는 세정설비 및 그 검사방법 |
JP2005046979A (ja) | 2003-07-31 | 2005-02-24 | Disco Abrasive Syst Ltd | 切削装置 |
JP4532895B2 (ja) * | 2003-12-18 | 2010-08-25 | 株式会社ディスコ | 板状物の切削装置 |
JP4571851B2 (ja) * | 2004-11-30 | 2010-10-27 | 株式会社ディスコ | 切削装置 |
JP2007042855A (ja) * | 2005-08-03 | 2007-02-15 | Disco Abrasive Syst Ltd | ブレード検出手段を備えた切削装置 |
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JP5758111B2 (ja) * | 2010-12-02 | 2015-08-05 | 株式会社ディスコ | 切削装置 |
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JP2016100356A (ja) * | 2014-11-18 | 2016-05-30 | 株式会社ディスコ | 切削装置 |
JP2016120535A (ja) * | 2014-12-24 | 2016-07-07 | 株式会社ディスコ | 加工装置 |
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JP6498553B2 (ja) * | 2015-07-17 | 2019-04-10 | 株式会社ディスコ | レーザー加工装置 |
JP6600254B2 (ja) * | 2015-12-28 | 2019-10-30 | 株式会社ディスコ | ウェーハの加工方法 |
JP6716403B2 (ja) * | 2016-09-09 | 2020-07-01 | 株式会社ディスコ | 積層ウェーハの加工方法 |
-
2018
- 2018-08-15 JP JP2018152885A patent/JP7313805B2/ja active Active
-
2019
- 2019-07-25 CN CN201910675421.7A patent/CN110834385B/zh active Active
- 2019-08-13 US US16/539,544 patent/US11011393B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0866848A (ja) * | 1994-08-30 | 1996-03-12 | Disco Abrasive Syst Ltd | 切削方向検出システム |
JPH10312979A (ja) * | 1997-05-12 | 1998-11-24 | Disco Abrasive Syst Ltd | ウェーハの切削状況の検出方法 |
JP2000252240A (ja) * | 1999-03-03 | 2000-09-14 | Disco Abrasive Syst Ltd | 切削装置 |
JP2000269164A (ja) * | 1999-03-18 | 2000-09-29 | Matsushita Electronics Industry Corp | 半導体ウェーハのダイシング方法及び装置 |
JP2016179505A (ja) * | 2015-03-23 | 2016-10-13 | 株式会社ディスコ | 切削ブレードの検査方法 |
JP2016181540A (ja) * | 2015-03-23 | 2016-10-13 | 株式会社ディスコ | 被加工物の切削方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110834385A (zh) | 2020-02-25 |
US11011393B2 (en) | 2021-05-18 |
JP7313805B2 (ja) | 2023-07-25 |
US20200058524A1 (en) | 2020-02-20 |
TW202009099A (zh) | 2020-03-01 |
CN110834385B (zh) | 2023-08-18 |
TWI834706B (zh) | 2024-03-11 |
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