JP7460272B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP7460272B2 JP7460272B2 JP2020005339A JP2020005339A JP7460272B2 JP 7460272 B2 JP7460272 B2 JP 7460272B2 JP 2020005339 A JP2020005339 A JP 2020005339A JP 2020005339 A JP2020005339 A JP 2020005339A JP 7460272 B2 JP7460272 B2 JP 7460272B2
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- 238000012545 processing Methods 0.000 title claims description 115
- 235000012431 wafers Nutrition 0.000 claims description 97
- 238000005520 cutting process Methods 0.000 claims description 73
- 238000003384 imaging method Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 5
- 238000007689 inspection Methods 0.000 description 92
- 230000032258 transport Effects 0.000 description 15
- 238000003754 machining Methods 0.000 description 10
- 238000012937 correction Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000012790 confirmation Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Quality & Reliability (AREA)
- Geometry (AREA)
- Mining & Mineral Resources (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Laser Beam Processing (AREA)
Description
4 操作パネル
6 モニター(表示ユニット)
8 カセット
10 カセットテーブル
12 カセットエレベータ
14 プッシュプルアーム
16 位置決め部材
18 第1の搬送ユニット
20 チャックテーブル
20a 保持面
20b クランプユニット
22 加工送りユニット
24 撮像ユニット
26 切削ユニット(加工ユニット)
26a 切削ブレード
28 第2の搬送ユニット
30 スピンナ洗浄ユニット
32 制御ユニット
34 制御部
36 配置決定部
38 レポート作成部
40 レーザー加工装置(加工装置)
42 レーザービーム照射ユニット(加工ユニット)
42a ハウジング部
42b ヘッド部
11 ウェーハ
11a 表面
11b 裏面
13 分割予定ライン
13a,13a1,13a2 切削溝
13b 欠け
13c 検査領域
15 デバイス
17 ダイシングテープ
19 フレーム
21 フレームユニット
A,B,C,D,E,F,G 検査領域(エリア)
Claims (5)
- 表面側に設定された複数の分割予定ラインによって区画された複数の領域の各々にデバイスが形成されたウェーハを加工する加工装置であって、
複数のウェーハを収容したカセットが載置されるカセットテーブルと、該カセットテーブルに載置された該カセットから搬出されたウェーハを保持するチャックテーブルと、該チャックテーブルに保持されたウェーハの分割予定ラインに対応する領域に加工を施す加工ユニットと、該チャックテーブルと該加工ユニットとを相対的に加工送りする加工送りユニットと、該チャックテーブルに保持されたウェーハを撮像する撮像ユニットと、該加工ユニット、該加工送りユニット及び該撮像ユニットを制御する制御ユニットとを備え、
該制御ユニットは、
該チャックテーブルで保持されたウェーハの全ての分割予定ラインに対応する領域を該加工ユニットが加工した後、該加工送りユニットを作動させて該チャックテーブルを相対的に移動させることにより該撮像ユニットの直下に該チャックテーブルを位置付けて該撮像ユニットにウェーハを撮像させる制御部と、
加工が施された該全ての分割予定ラインに対応する領域のうち2以上の異なるエリアが個別に撮像された画像に基づいて各エリアでの加工状態に関する情報を導き出し、該情報及び該画像が記録されたレポートを作成するレポート作成部と、
該撮像ユニットで撮像される該2以上の異なるエリアの数が指定された場合に、該2以上の異なるエリアの配置を決定する配置決定部と、
を含み、
該配置決定部は、指定された該エリアの数に応じて、該表面において互いに直交する第1方向及び第2方向のそれぞれに該エリアを配置する際に、該第2方向における該エリアの間隔を等間隔とし、該第2方向の所定位置を通る該第1方向での該表面の幅内に複数の該エリアが等間隔で配置される様に該第1方向における該エリアの間隔を調整することを特徴とする加工装置。 - 該レポート作成部は、該カセットに収容された該複数のウェーハのうち最初に加工が施されたウェーハに対して該レポートを作成することを特徴とする請求項1に記載の加工装置。
- 該加工状態に関する該情報は、分割予定ラインに対応する領域に形成された溝の幅、該溝に形成された欠けの状態、及び、分割予定ラインの中央線からの該溝のずれ量を含むことを特徴とする請求項1又は2記載の加工装置。
- 該レポートの内容を表示する表示ユニットを更に備えることを特徴とする請求項1から3のいずれかに記載の加工装置。
- 該加工ユニットは、切削ブレードを回転可能に備えた切削ユニット、及び、レーザービームを集光する集光器を備えたレーザービーム照射ユニットのいずれかであることを特徴とする請求項1から4のいずれかに記載の加工装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020005339A JP7460272B2 (ja) | 2020-01-16 | 2020-01-16 | 加工装置 |
SG10202012500RA SG10202012500RA (en) | 2020-01-16 | 2020-12-14 | Processing apparatus |
KR1020200174920A KR20210092670A (ko) | 2020-01-16 | 2020-12-15 | 가공 장치 |
CN202110037152.9A CN113199156A (zh) | 2020-01-16 | 2021-01-12 | 加工装置 |
TW110101215A TW202129805A (zh) | 2020-01-16 | 2021-01-13 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020005339A JP7460272B2 (ja) | 2020-01-16 | 2020-01-16 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021114502A JP2021114502A (ja) | 2021-08-05 |
JP7460272B2 true JP7460272B2 (ja) | 2024-04-02 |
Family
ID=77025208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020005339A Active JP7460272B2 (ja) | 2020-01-16 | 2020-01-16 | 加工装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7460272B2 (ja) |
KR (1) | KR20210092670A (ja) |
CN (1) | CN113199156A (ja) |
SG (1) | SG10202012500RA (ja) |
TW (1) | TW202129805A (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008004806A (ja) | 2006-06-23 | 2008-01-10 | Disco Abrasive Syst Ltd | ウエーハの加工結果管理方法 |
JP2011066233A (ja) | 2009-09-17 | 2011-03-31 | Disco Abrasive Syst Ltd | 切削装置 |
JP2013074198A (ja) | 2011-09-28 | 2013-04-22 | Disco Abrasive Syst Ltd | 加工装置 |
JP2017140682A (ja) | 2016-02-12 | 2017-08-17 | 株式会社ディスコ | 装置 |
JP2019040918A (ja) | 2017-08-22 | 2019-03-14 | ラピスセミコンダクタ株式会社 | 半導体製造装置及び半導体基板の研磨方法 |
JP2019046923A (ja) | 2017-08-31 | 2019-03-22 | 株式会社ディスコ | ウエーハの加工方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000108119A (ja) | 1998-10-08 | 2000-04-18 | Disco Abrasive Syst Ltd | 加工装置 |
JP4471632B2 (ja) | 2003-11-18 | 2010-06-02 | 株式会社ディスコ | ウエーハの加工方法 |
-
2020
- 2020-01-16 JP JP2020005339A patent/JP7460272B2/ja active Active
- 2020-12-14 SG SG10202012500RA patent/SG10202012500RA/en unknown
- 2020-12-15 KR KR1020200174920A patent/KR20210092670A/ko active Search and Examination
-
2021
- 2021-01-12 CN CN202110037152.9A patent/CN113199156A/zh active Pending
- 2021-01-13 TW TW110101215A patent/TW202129805A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008004806A (ja) | 2006-06-23 | 2008-01-10 | Disco Abrasive Syst Ltd | ウエーハの加工結果管理方法 |
JP2011066233A (ja) | 2009-09-17 | 2011-03-31 | Disco Abrasive Syst Ltd | 切削装置 |
JP2013074198A (ja) | 2011-09-28 | 2013-04-22 | Disco Abrasive Syst Ltd | 加工装置 |
JP2017140682A (ja) | 2016-02-12 | 2017-08-17 | 株式会社ディスコ | 装置 |
JP2019040918A (ja) | 2017-08-22 | 2019-03-14 | ラピスセミコンダクタ株式会社 | 半導体製造装置及び半導体基板の研磨方法 |
JP2019046923A (ja) | 2017-08-31 | 2019-03-22 | 株式会社ディスコ | ウエーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2021114502A (ja) | 2021-08-05 |
CN113199156A (zh) | 2021-08-03 |
TW202129805A (zh) | 2021-08-01 |
KR20210092670A (ko) | 2021-07-26 |
SG10202012500RA (en) | 2021-08-30 |
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