JP2019193960A - 切削装置 - Google Patents
切削装置 Download PDFInfo
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- JP2019193960A JP2019193960A JP2018088270A JP2018088270A JP2019193960A JP 2019193960 A JP2019193960 A JP 2019193960A JP 2018088270 A JP2018088270 A JP 2018088270A JP 2018088270 A JP2018088270 A JP 2018088270A JP 2019193960 A JP2019193960 A JP 2019193960A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 56
- 238000007689 inspection Methods 0.000 claims abstract description 59
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 230000032258 transport Effects 0.000 claims description 71
- 238000003860 storage Methods 0.000 claims description 58
- 238000001514 detection method Methods 0.000 claims description 50
- 238000009530 blood pressure measurement Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract description 262
- 238000012545 processing Methods 0.000 abstract description 10
- 238000012546 transfer Methods 0.000 description 27
- 238000004140 cleaning Methods 0.000 description 20
- 238000010586 diagram Methods 0.000 description 18
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Abstract
Description
2 基板
2O 中心
7 フレーム(環状フレーム)
7a 開口
8 粘着テープ
9 フレームユニット
10 チャックテーブル
11A 保持面
13 仮置きレール(仮置き領域)
20 切削ユニット(加工ユニット)
30 カセット
30A ウエーハカセット
30B フレームカセット
40 カセット載置機構
41 検査用収容部(検査用ウエーハ収容部)
41A 第1開口
41B カセット載置台
41D 第2開口
60 カセット搬送部(搬送ユニット)
64 搬送アーム
64A 外側アーム(接触式搬送部)
64A1 バキュームパッド(吸着パッド)
64B 内側アーム(非接触式搬送部)
64B1 吸引パッド(非接触吸引保持器)
65 把持部
67 ウエーハ搬送アーム
68 駆動部
70 洗浄搬送部(搬送ユニット)
75 保持部
75A 吸引パッド(非接触吸引保持器)
75B バキュームパッド(吸着パッド)
80 検出ユニット
82 検出テーブル
82O 中心
83 センサフレーム
84 発光部(センサー部)
85 受光部(センサー部)
86 隙間
90 制御ユニット
91 回転制御部
92 算出部(算出ユニット)
93 判定部
100 切削装置
101 基台
101A 上面
110 収容箱本体
111 底板
113 支持トレー
114 ガイドレール
115 スライドレール(スライダ)
120 ウエーハ載置領域
121 外周領域
122 吸着孔(吸着領域)
123 ウエーハ吸着孔
124 連通路
130 吸引路
131 電磁弁
132 負圧源
133 圧力測定部
Claims (3)
- ウエーハ単体状態のウエーハ、又は環状フレームの開口にダイシングテープで保持されてフレームユニットを構成するウエーハを保持するチャックテーブルと、該チャックテーブルに保持されたウエーハを切削する切削ユニットと、単体状態のウエーハ又はフレームユニットを複数収容するカセットが載置されるカセット載置台を備えるカセット機構と、該カセットと該チャックテーブルとの間で該ウエーハ又は該フレームユニットを搬送する搬送ユニットと、を備える切削装置であって、
該カセット機構は、
該カセット載置台の下側で該カセット載置台と共に昇降し、検査対象の該ウエーハ又は該フレームユニットが該搬送ユニットによって収容される検査ウエーハ収容部を有し、
該検査ウエーハ収容部は、
収容される該フレームユニットを両脇で支持するガイドレールと、
該ガイドレールに支持され、該フレームユニットと同様の外径を有し、該搬送ユニットにより検査対象である単体状態の該ウエーハが載置される支持トレーと、を備える切削装置。 - 該搬送ユニットは、
単体状態の該ウエーハの上面を非接触吸引保持器で吸引保持する非接触式搬送部と、
該フレームユニットの該環状フレームを吸引保持する吸着パッドと、該吸着パッドに負圧を作用させる吸引路と、該吸引路内の圧力を測定する圧力測定部と、を備える接触式搬送部と、を有し、
該支持トレーは、
ウエーハを載置するウエーハ載置領域と、該搬送ユニットの該吸着パッドに対応する吸着領域とに連通する連通路と、を備え、
該支持トレーの該吸着領域に該吸着パッドから負圧を作用させ、該ウエーハ載置領域に載置した該ウエーハによって該吸引路の圧力が閾値以下の場合、該ウエーハが該支持トレーに載置されていると判定される請求項1に記載の切削装置。 - ウエーハ単体状態のウエーハの結晶方位を示す切り欠きの向きを検出する検出ユニットをさらに備え、
該検出ユニットは、ウエーハを保持すると共に該ウエーハより小径な検出テーブルと、該検出テーブルに保持されたウエーハの外周に設けられて該切り欠きを検出するセンサー部と、該検出テーブルを回転させて検出した該切り欠きを所定の方向に向ける回転制御部と、を備え、
該検出テーブルは、該搬送ユニットが該カセットから該ウエーハを搬出した搬送経路に設けられる請求項1または2に記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018088270A JP7083692B2 (ja) | 2018-05-01 | 2018-05-01 | 切削装置 |
CN201910342658.3A CN110429044B (zh) | 2018-05-01 | 2019-04-26 | 切削装置 |
TW108114876A TWI840353B (zh) | 2018-05-01 | 2019-04-29 | 切割裝置 |
KR1020190049841A KR20190126249A (ko) | 2018-05-01 | 2019-04-29 | 절삭 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018088270A JP7083692B2 (ja) | 2018-05-01 | 2018-05-01 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019193960A true JP2019193960A (ja) | 2019-11-07 |
JP7083692B2 JP7083692B2 (ja) | 2022-06-13 |
Family
ID=68408412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018088270A Active JP7083692B2 (ja) | 2018-05-01 | 2018-05-01 | 切削装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7083692B2 (ja) |
KR (1) | KR20190126249A (ja) |
CN (1) | CN110429044B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112216649A (zh) * | 2020-10-14 | 2021-01-12 | 中国电子科技集团公司第二十四研究所 | 一种可固定任意异形晶圆的旋转清洗夹具 |
JP2021077763A (ja) * | 2019-11-08 | 2021-05-20 | 株式会社ディスコ | 加工装置及び板状ワークの搬入出方法 |
JP7504539B2 (ja) | 2020-05-22 | 2024-06-24 | 株式会社ディスコ | ドレッシング部材 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102628311B1 (ko) * | 2021-06-02 | 2024-01-24 | (주) 엔지온 | 인스펙션 유니트, 이를 구비하는 인스펙션 장치 및 이의 제어 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003163184A (ja) * | 2001-11-28 | 2003-06-06 | Disco Abrasive Syst Ltd | 切削装置 |
JP2007281051A (ja) * | 2006-04-04 | 2007-10-25 | Miraial Kk | 半導体ウエハのチップ加工方法 |
JP2009105109A (ja) * | 2007-10-22 | 2009-05-14 | Disco Abrasive Syst Ltd | ワーク収納搬送装置及び該ワーク収納搬送装置を備えた切削装置 |
JP2016201421A (ja) * | 2015-04-08 | 2016-12-01 | 株式会社ディスコ | 被加工物の搬送トレー |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4303041B2 (ja) | 2003-06-18 | 2009-07-29 | 株式会社ディスコ | 半導体ウエーハの加工装置 |
JP2005045134A (ja) * | 2003-07-25 | 2005-02-17 | Disco Abrasive Syst Ltd | 半導体ウエーハの加工装置 |
JP2006074004A (ja) * | 2004-08-02 | 2006-03-16 | Disco Abrasive Syst Ltd | ワーク搬送収納装置,およびそのワーク搬送収納装置を備えた切削装置 |
-
2018
- 2018-05-01 JP JP2018088270A patent/JP7083692B2/ja active Active
-
2019
- 2019-04-26 CN CN201910342658.3A patent/CN110429044B/zh active Active
- 2019-04-29 KR KR1020190049841A patent/KR20190126249A/ko not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003163184A (ja) * | 2001-11-28 | 2003-06-06 | Disco Abrasive Syst Ltd | 切削装置 |
JP2007281051A (ja) * | 2006-04-04 | 2007-10-25 | Miraial Kk | 半導体ウエハのチップ加工方法 |
JP2009105109A (ja) * | 2007-10-22 | 2009-05-14 | Disco Abrasive Syst Ltd | ワーク収納搬送装置及び該ワーク収納搬送装置を備えた切削装置 |
JP2016201421A (ja) * | 2015-04-08 | 2016-12-01 | 株式会社ディスコ | 被加工物の搬送トレー |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021077763A (ja) * | 2019-11-08 | 2021-05-20 | 株式会社ディスコ | 加工装置及び板状ワークの搬入出方法 |
JP7339858B2 (ja) | 2019-11-08 | 2023-09-06 | 株式会社ディスコ | 加工装置及び板状ワークの搬入出方法 |
JP7504539B2 (ja) | 2020-05-22 | 2024-06-24 | 株式会社ディスコ | ドレッシング部材 |
CN112216649A (zh) * | 2020-10-14 | 2021-01-12 | 中国电子科技集团公司第二十四研究所 | 一种可固定任意异形晶圆的旋转清洗夹具 |
Also Published As
Publication number | Publication date |
---|---|
CN110429044B (zh) | 2024-02-20 |
CN110429044A (zh) | 2019-11-08 |
KR20190126249A (ko) | 2019-11-11 |
JP7083692B2 (ja) | 2022-06-13 |
TW201946144A (zh) | 2019-12-01 |
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