JP2019102489A - 回路基板及び回路基板の製造方法 - Google Patents
回路基板及び回路基板の製造方法 Download PDFInfo
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- JP2019102489A JP2019102489A JP2017228223A JP2017228223A JP2019102489A JP 2019102489 A JP2019102489 A JP 2019102489A JP 2017228223 A JP2017228223 A JP 2017228223A JP 2017228223 A JP2017228223 A JP 2017228223A JP 2019102489 A JP2019102489 A JP 2019102489A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
放熱板の構造が複雑となり、更に貫通孔内での熱伝導部材の進退を許容するために必要となる貫通孔の軸方向長さに対応した放熱板の板厚が必要となるという問題点がある。また、電気回路装置を配置するにあたって、当該貫通孔の軸方向を重力方向にすることができないという問題点がある。
最初に本開示の実施態様を列挙して説明する。また、以下に記載する実施形態の少なくとも一部を任意に組み合わせてもよい。
本開示の実施態様に係る回路基板及び回路基板の製造方法の具体例を以下に図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
図1は、実施の形態1に係る回路基板の斜視図である。回路基板1は、保持部材2と、保持部材2に保持された複数のバスバー3を備える。複数のバスバー3の一面上には、複数の回路部品4が載置されている。バスバー3の他面側には、放熱板5が一面を対向させて設けられている。回路基板1は、例えば電気接続箱(図示せず)の中に搭載され、車両用の給電装置として用いられる。
2 保持部材
21 外枠(凸部)
211 内面
22 柱部
221 側面
23 凹部
24 隔壁
241 外壁面
242 内壁面
3 バスバー(導電板)
31 入力バスバー(導電板)
311 載置部
312 立ち上り部
313 延設部
32 接続バスバー(導電板)
321 切り欠き部
33 出力バスバー(導電板)
331 載置部
332 立ち上り部
333 延設部
34 端子バスバー(導電板)
341 端子載置部
342 棒状部
4 回路部品
41 半導体スイッチ(回路部品)
411 端子
42 チップ部品(回路部品)
5 放熱板
61 第1熱伝導部材
62 第2熱伝導部材
7 導電体
Claims (8)
- 一面に回路部品を実装した回路基板であって、
他面には、前記回路部品に対応する位置に凹部が形成してあり、
該凹部の内部に設けられ、前記回路部品から発生した熱を伝導させる第1熱伝導部材
を備える回路基板。 - 前記回路部品と前記凹部とは、平面視にて少なくとも一部が重なっている
請求項1に記載の回路基板。
回路基板 - 前記他面に設けられた放熱板を備え、
前記第1熱伝導部材は、前記放熱板と前記凹部とによって封止してある
請求項1又は請求項2に記載の回路基板。 - 前記回路部品は複数の半導体スイッチを含み、
前記凹部の個数は、前記半導体スイッチの個数以上である
請求項1から請求項3のいずれか一つに記載の回路基板。 - 前記凹部は、前記他面に設けられた隔壁によって形成してある
請求項1から請求項4のいずれか一つに記載の回路基板。 - 前記回路部品の端子が載置される導電板を備え、
該導電板と前記放熱板との間隔が所定の絶縁距離となるように前記隔壁の高さが設定してある
請求項5に記載の回路基板。 - 前記他面の周縁部には、該周縁部に沿って凸部が形成されており、
該凸部の内面と、前記隔壁の外壁面との間には、第2熱伝導部材が設けられている
請求項5又は請求項6に記載の回路基板。 - 複数の導電板を金型の所定の位置に並べ、前記金型に樹脂を注入し、実装される回路部品の位置に対応した凹部を有する保持部材を形成すると共に、前記複数の導電板と前記保持部材とを一体化する工程と、
回路部品の端子が載置される前記導電板の領域に導電体を塗布する工程と、
前記導電体に位置合わせして、前記回路部品の端子を前記導電板上に載置する工程と、
前記回路部品が載置された状態で、一体化された前記複数の導電板と前記保持部材とをリフロー炉に投入して加熱し、前記導電体を溶融させて前記回路部品の端子と前記導電板とを接合する工程と、
熱伝導部材が一面に塗布された放熱板を、一体化された前記複数の導電板と前記保持部材の前記凹部が形成してある面に貼り付ける工程と
を備える回路基板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017228223A JP6950496B2 (ja) | 2017-11-28 | 2017-11-28 | 回路基板及び回路基板の製造方法 |
US16/767,951 US11924960B2 (en) | 2017-11-28 | 2018-11-08 | Circuit board and method for manufacturing circuit board |
DE112018006054.3T DE112018006054T5 (de) | 2017-11-28 | 2018-11-08 | Leiterplatte und Verfahren zum Herstellen einer Leiterplatte |
PCT/JP2018/041506 WO2019107106A1 (ja) | 2017-11-28 | 2018-11-08 | 回路基板及び回路基板の製造方法 |
CN201880072267.8A CN111345118B (zh) | 2017-11-28 | 2018-11-08 | 电路基板及电路基板的制造方法 |
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JP2017228223A JP6950496B2 (ja) | 2017-11-28 | 2017-11-28 | 回路基板及び回路基板の製造方法 |
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JP2019102489A true JP2019102489A (ja) | 2019-06-24 |
JP6950496B2 JP6950496B2 (ja) | 2021-10-13 |
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US (1) | US11924960B2 (ja) |
JP (1) | JP6950496B2 (ja) |
CN (1) | CN111345118B (ja) |
DE (1) | DE112018006054T5 (ja) |
WO (1) | WO2019107106A1 (ja) |
Families Citing this family (1)
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US20230337353A1 (en) * | 2022-04-14 | 2023-10-19 | Hamilton Sundstrand Corporation | Devices and methods to improve thermal conduction from smt and chip on board components to chassis heat sinking |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63278261A (ja) * | 1986-09-24 | 1988-11-15 | Nec Corp | 電子部品冷却装置 |
JPH08172293A (ja) * | 1994-12-19 | 1996-07-02 | Fujitsu Ltd | 電子モジュール搭載回路基板ユニット |
JPH09321395A (ja) * | 1996-05-30 | 1997-12-12 | Matsushita Electric Ind Co Ltd | 電子部品搭載用放熱基板及びその製造方法 |
JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
Family Cites Families (6)
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JP3690729B2 (ja) | 2000-09-11 | 2005-08-31 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 電気回路装置及びコンピュータ |
US6818477B2 (en) * | 2001-11-26 | 2004-11-16 | Powerwave Technologies, Inc. | Method of mounting a component in an edge-plated hole formed in a printed circuit board |
TWI348748B (en) * | 2003-10-07 | 2011-09-11 | Rohm Co Ltd | Semiconductor device and method of fabricating the same |
JP5227716B2 (ja) * | 2008-09-28 | 2013-07-03 | 古河電気工業株式会社 | 発熱部品搭載回路基板 |
JP6435794B2 (ja) * | 2014-11-12 | 2018-12-12 | 富士電機株式会社 | 半導体装置 |
JP2017228223A (ja) | 2016-06-24 | 2017-12-28 | 三菱電機株式会社 | 信号処理装置 |
-
2017
- 2017-11-28 JP JP2017228223A patent/JP6950496B2/ja active Active
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2018
- 2018-11-08 US US16/767,951 patent/US11924960B2/en active Active
- 2018-11-08 DE DE112018006054.3T patent/DE112018006054T5/de active Pending
- 2018-11-08 WO PCT/JP2018/041506 patent/WO2019107106A1/ja active Application Filing
- 2018-11-08 CN CN201880072267.8A patent/CN111345118B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63278261A (ja) * | 1986-09-24 | 1988-11-15 | Nec Corp | 電子部品冷却装置 |
JPH08172293A (ja) * | 1994-12-19 | 1996-07-02 | Fujitsu Ltd | 電子モジュール搭載回路基板ユニット |
JPH09321395A (ja) * | 1996-05-30 | 1997-12-12 | Matsushita Electric Ind Co Ltd | 電子部品搭載用放熱基板及びその製造方法 |
JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
Also Published As
Publication number | Publication date |
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WO2019107106A1 (ja) | 2019-06-06 |
JP6950496B2 (ja) | 2021-10-13 |
CN111345118B (zh) | 2023-07-18 |
US11924960B2 (en) | 2024-03-05 |
DE112018006054T5 (de) | 2020-08-06 |
CN111345118A (zh) | 2020-06-26 |
US20230247754A1 (en) | 2023-08-03 |
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