JP2019016787A - ダイシングテープ、ダイシングダイボンドフィルム、および半導体装置製造方法 - Google Patents
ダイシングテープ、ダイシングダイボンドフィルム、および半導体装置製造方法 Download PDFInfo
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- JP2019016787A JP2019016787A JP2018121885A JP2018121885A JP2019016787A JP 2019016787 A JP2019016787 A JP 2019016787A JP 2018121885 A JP2018121885 A JP 2018121885A JP 2018121885 A JP2018121885 A JP 2018121885A JP 2019016787 A JP2019016787 A JP 2019016787A
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- dicing tape
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- die bond
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- 150000005846 sugar alcohols Polymers 0.000 description 1
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
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Images
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
<レーザー光照射条件>
(A)レーザー光
レーザー光源 半導体レーザー励起Nd:YAGレーザー
波長 1064nm
レーザー光スポット断面積 3.14×10-8cm2
発振形態 Qスイッチパルス
繰り返し周波数 100kHz以下
パルス幅 1μs以下
出力 1mJ以下
レーザー光品質 TEM00
偏光特性 直線偏光
(B)集光用レンズ
倍率 100倍以下
NA 0.55
レーザー光波長に対する透過率 100%以下
(C)半導体基板が載置される載置台の移動速度 280mm/秒以下
〈ダイシングテープの作製〉
冷却管と、窒素導入管と、温度計と、撹拌装置とを備える反応容器内で、アクリル酸2-エチルヘキシル100質量部と、アクリル酸2-ヒドロキシエチル19質量部と、重合開始剤たる過酸化ベンゾイル0.4質量部と、重合溶媒たるトルエン80質量部とを含む混合物を、60℃で10時間、窒素雰囲気下で撹拌した(重合反応)。これにより、アクリル系ポリマーP1を含有するポリマー溶液を得た。次に、このポリマー溶液に1.2質量部の2-メタクリロイルオキシエチルイソシアネートを加えた後、50℃で60時間、当該溶液を空気雰囲気下で撹拌した(付加反応)。これにより、アクリル系ポリマーP2を含有するポリマー溶液を得た。次に、このポリマー溶液に、100質量部のアクリル系ポリマーP2に対して1.3質量部のポリイソシアネート化合物(商品名「コロネートL」,日本ポリウレタン株式会社製)と、3質量部の光重合開始剤(商品名「イルガキュア184」,BASF社製)とを加えて、粘着剤溶液(粘着剤溶液S1)を調製した。次に、シリコーン処理の施された面を有するPET剥離ライナーのシリコーン処理面上に粘着剤溶液S1を塗布して塗膜を形成し、この塗膜について120℃で2分間加熱して脱溶媒し、厚さ10μmの粘着剤層を形成した。次に、この粘着剤層の露出面に、ポリ塩化ビニル基材(商品名「V9K」,厚さ100μm,アキレス株式会社製)を貼り合わせ、その後に23℃で72時間の保存を行い、ダイシングテープを得た。以上のようにして、基材と粘着剤層とを含む積層構造を有する実施例1のダイシングテープを作製した。
ポリプロピレンフィルム/ポリエチレンフィルム/ポリプロピレンフィルムの3層構造を有するポリオレフィン系基材(商品名「DDZ」,厚さ90μm,グンゼ株式会社製)をポリ塩化ビニル基材(商品名「V9K」,アキレス株式会社製)の代わりに用いたこと以外は実施例1と同様にして、実施例2のダイシングテープを作製した。
ポリ塩化ビニル基材(商品名「V9K」,アキレス株式会社製)に代えてエチレン−酢酸ビニル共重合体基材(商品名「NED」,厚さ125μm,グンゼ株式会社製)用いたこと以外は実施例1と同様にして、比較例1のダイシングテープを作製した。
ポリ塩化ビニル基材(商品名「V9K」,アキレス株式会社製)に代えてエチレン−酢酸ビニル共重合体基材(商品名「RB0104」,厚さ130μm,倉敷紡績株式会社製)用いたこと以外は実施例1と同様にして、比較例2のダイシングテープを作製した。
<ダイボンドフィルムの作製>
アクリル樹脂(商品名「SG-708-6」,ガラス転移温度(Tg)4℃,ナガセケムテックス株式会社製)100質量部と、エポキシ樹脂(商品名「JER828」,23℃で液状,三菱化学株式会社製)11質量部と、フェノール樹脂(商品名「MEH-7851ss」,23℃で固形,明和化成株式会社製)5質量部と、球状シリカ(商品名「SO-25R」,株式会社アドマテックス製)110質量部とを、メチルエチルケトンに加えて混合し、固形分濃度20質量%の接着剤組成物溶液S2を得た。次に、シリコーン処理の施された面を有するPET剥離ライナーのシリコーン処理面上に接着剤組成物溶液S2を塗布して塗膜を形成し、この塗膜について130℃で2分間加熱して脱溶媒し、接着剤層たるダイボンドフィルム(厚さ10μm)を作製した。
実施例1のダイシングテープから、PET剥離ライナーを剥離した後、露出した粘着剤層に上述のダイボンドフィルムを貼り合わせた。貼り合わせにおいては、ダイシングテープの中心とダイボンドフィルムの中心とを位置合わせした。また、貼り合わせには、ハンドローラー使用した。次に、ダイシングテープにおける粘着剤層に対して基材の側から300mJ/cm2の紫外線を照射した。以上のようにして、ダイシングテープとダイボンドフィルムとを含む積層構造を有する実施例3のダイシングダイボンドフィルムを作製した。
実施例1のダイシングテープに代えて実施例2のダイシングテープを用いたこと以外は実施例3と同様にして、実施例4のダイシングダイボンドフィルムを作製した。
実施例1のダイシングテープに代えて比較例1または比較例2のダイシングテープを用いたこと以外は実施例3と同様にして、比較例3,4の各ダイシングダイボンドフィルムを作製した。
実施例1,2および比較例1,2の各ダイシングテープについて、以下のようにして引張応力を測定した。まず、ダイシングテープの粘着剤層に対して基材の側から300mJ/cm2の紫外線を照射して当該粘着剤層を硬化させた後、当該ダイシングテープからダイシングテープ試験片(幅20mm×長さ140mm)を切り出した。実施例1,2および比較例1,2のダイシングテープごとに、必要数のダイシングテープ試験片を用意した。そして、引張試験機(商品名「オートグラフAGS-50NX」,株式会社島津製作所製)を使用して、ダイシングテープ試験片について引張試験を行い、所定の引張速度で伸張されるダイシングテープ試験片に生ずる引張応力を測定した。本測定によって応力−歪み曲線を得た。引張試験において、初期チャック間距離は100mmであり、温度条件は−15℃であり、引張速度は10mm/分、100mm/分、または1000mm/分である。各ダイシングテープ試験片について得られた応力−歪み曲線を図12に表す。図12のグラフにおいて、横軸はダイシングテープ試験片の歪み(%)を表し、縦軸は当該ダイシングテープ試験片に生ずる引張応力(MPa)を表す。図12のグラフにおいて、実線E1は、実施例1のダイシングテープにおける引張速度10mm/分での応力−歪み曲線を表し、一点鎖線E1'は、実施例1のダイシングテープにおける引張速度100mm/分での応力−歪み曲線を表し、破線E1”は、実施例1のダイシングテープにおける引張速度1000mm/分での応力−歪み曲線を表し、実線E2は、実施例2のダイシングテープにおける引張速度10mm/分での応力−歪み曲線を表し、一点鎖線E2'は、実施例2のダイシングテープにおける引張速度100mm/分での応力−歪み曲線を表し、破線E2”は、実施例2のダイシングテープにおける引張速度1000mm/分での応力−歪み曲線を表し、実線C1は、比較例1のダイシングテープにおける引張速度10mm/分での応力−歪み曲線を表し、一点鎖線C1'は、比較例1のダイシングテープにおける引張速度100mm/分での応力−歪み曲線を表し、破線C1”は、比較例1のダイシングテープにおける引張速度1000mm/分での応力−歪み曲線を表し、実線C2は、比較例2のダイシングテープにおける引張速度10mm/分での応力−歪み曲線を表し、一点鎖線C2'は、比較例2のダイシングテープにおける引張速度100mm/分での応力−歪み曲線を表し、破線C2”は、比較例2のダイシングテープにおける引張速度1000mm/分での応力−歪み曲線を表す。
実施例1,2および比較例1,2の各ダイシングテープについて、以下のようにして引張弾性率を測定した。まず、ダイシングテープの粘着剤層に対して基材の側から300mJ/cm2の紫外線を照射して当該粘着剤層を硬化させた後、当該ダイシングテープからダイシングテープ試験片(幅20mm×長さ140mm)を切り出した。実施例1,2および比較例1,2のダイシングテープごとに、必要数のダイシングテープ試験片を用意した。そして、引張試験機(商品名「オートグラフAGS-50NX」,株式会社島津製作所製)を使用して、ダイシングテープ試験片について引張試験を行い、得られる応力−歪み曲線における初期の傾き(具体的には、引張試験開始後の歪み値1%までの測定データに基づき決定される傾き)から引張弾性率を算出した。引張試験において、初期チャック間距離は100mmであり、温度条件は−15℃であり、引張速度は10mm/分、100mm/分、または1000mm/分である。このような測定によって得られた引張弾性率を表1に掲げる。
実施例3,4および比較例3,4の各ダイシングダイボンドフィルムを使用して、以下のような貼り合わせ工程とその後のクールエキスパンド工程を行った。
10 ダイシングテープ
11 基材
12 粘着剤層
20,21 ダイボンドフィルム
W,30A,30C 半導体ウエハ
30B 半導体ウエハ分割体
30a 分割溝
30b 改質領域
31 半導体チップ
Claims (8)
- 基材と粘着剤層とを含む積層構造を有し、
幅20mmのダイシングテープ試験片について初期チャック間距離100mmで行われる引張試験において、5〜30%の範囲の少なくとも一部の歪み値で15〜32MPaの範囲内の引張応力を示し得る、ダイシングテープ。 - 前記引張試験において、歪み値5〜20%の範囲で15〜32MPaの範囲内の引張応力を示し得る、請求項1に記載のダイシングテープ。
- 前記引張応力は20〜32MPaである、請求項1または2に記載のダイシングテープ。
- 前記引張試験における温度条件は−15℃である、請求項1から3のいずれか一つに記載のダイシングテープ。
- 前記引張試験における引張速度条件は10〜1000mm/分の範囲内にある、請求項1から4のいずれか一つに記載のダイシングテープ。
- 請求項1から5のいずれか一つに記載のダイシングテープと、
前記ダイシングテープにおける前記粘着剤層上のダイボンドフィルムとを含む、ダイシングダイボンドフィルム。 - 基材と粘着剤層とを含む積層構造を有するダイシングテープ、および、当該ダイシングテープにおける前記粘着剤層上のダイボンドフィルム、を含むダイシングダイボンドフィルムにおける前記ダイボンドフィルムの側に、複数の半導体チップに個片化可能な半導体ウエハ、または、複数の半導体チップを含む半導体ウエハ分割体を、貼り合わせるための、第1工程と、
前記ダイシングテープにおいて15〜32MPaの範囲内の引張応力が生ずる条件で前記ダイシングテープをエキスパンドすることにより、前記ダイボンドフィルムを割断してダイボンドフィルム付き半導体チップを得るための、第2工程と、を含む半導体装置製造方法。 - 前記第2工程における温度条件は0℃以下である、請求項7に記載の半導体装置製造方法。
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