JP2018525807A - マルチレイヤパッケージ - Google Patents
マルチレイヤパッケージ Download PDFInfo
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- JP2018525807A JP2018525807A JP2017553208A JP2017553208A JP2018525807A JP 2018525807 A JP2018525807 A JP 2018525807A JP 2017553208 A JP2017553208 A JP 2017553208A JP 2017553208 A JP2017553208 A JP 2017553208A JP 2018525807 A JP2018525807 A JP 2018525807A
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Ceramic Engineering (AREA)
- Geometry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
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Abstract
Description
第2活性レイヤ面及び第2活性レイヤ面と反対側の第2不活性レイヤ面を有するモールド内の1又は複数の第2コンポーネントの第2レイヤであり、1又は複数の第2コンポーネントは、第1方向及び第2方向に沿って互いに平行な第2活性コンポーネント面及び第2活性コンポーネント面と反対側の第2不活性コンポーネント面を有し、第2活性レイヤ面は、第1活性レイヤ面に向いて電気的に結合するとともに物理的に結合し、第2活性レイヤ面は、スルーモールドビア又はスルーシリコンビアを通じて第2不活性レイヤ面に電気的に結合される、第2レイヤと、を備えるパッケージである。
Claims (20)
- 第1活性レイヤ面と前記第1活性レイヤ面と反対側の第1不活性レイヤ面とを有するウェハにモールドされる1又は複数の第1コンポーネントの第1レイヤであり、前記1又は複数の第1コンポーネントのうちのそれぞれのコンポーネントは、第1方向及び前記第1方向に垂直な第2方向において互いに平行であるそれぞれの第1活性コンポーネント面及び前記第1活性コンポーネント面と反対側の第1不活性コンポーネント面を有し、前記1又は複数の第1コンポーネントのうちのそれぞれのコンポーネントは、前記第1方向及び前記第2方向に垂直な第3方向におけるそれぞれのz高さ測定値を有し、前記1又は複数の第1コンポーネントのうちの第1のコンポーネントのz高さは、前記1又は複数の第1コンポーネントのうちの第2コンポーネントのz高さと異なる、第1レイヤと、
第2活性レイヤ面及び前記第2活性レイヤ面と反対側の第2不活性レイヤ面を有するモールド内の1又は複数の第2コンポーネントの第2レイヤであり、前記1又は複数の第2コンポーネントは、前記第1方向及び前記第2方向に沿って互いに平行な第2活性コンポーネント面及び前記第2活性コンポーネント面と反対側の第2不活性コンポーネント面を有し、前記第2活性レイヤ面は、前記第1活性レイヤ面に向いて電気的に結合するとともに物理的に結合し、前記第2活性レイヤ面は、スルーモールドビア又はスルーシリコンビアを通じて前記第2不活性レイヤ面に電気的に結合される、第2レイヤと、
を備えるパッケージ。 - 前記第2不活性レイヤ面に取り付けられて前記第2活性レイヤ面に電気的に結合されるランドグリッドアレイ又はボールグリッドアレイをさらに備える、請求項1に記載のパッケージ。
- 前記第2活性レイヤ面は、はんだ又は接着剤を介して前記第1活性レイヤ面と物理的に結合される、請求項1に記載のパッケージ。
- 前記第1方向における前記1又は複数の第1コンポーネントのうちの1つの長さは、前記第1方向における前記1又は複数の第2コンポーネントのうちの1つの長さより長い、請求項1から3のいずれか一項に記載のパッケージ。
- それぞれ第1活性面及び前記第1活性面と反対側の第1不活性面を有する1又は複数の第1機能コンポーネントの第1レイヤと、
それぞれ第2活性面及び前記第2活性面と反対側の第2不活性面を有する1又は複数の第2機能コンポーネントの第2レイヤと、
を備え、
1又は複数の前記第1活性面は、スルーモールドビア又はシリコン貫通ビアを通じて1又は複数の前記第2活性面に向いて電気的に結合される、パッケージ。 - 前記1又は複数の第1機能コンポーネントの第1レイヤは、ウェハにモールドされる、請求項5に記載のパッケージ。
- 前記1又は複数の第2機能コンポーネントの第2レイヤは、モールド内にある、請求項6に記載のパッケージ。
- 前記モールドは、環状オレフィン系共重合体を含む、請求項7に記載のパッケージ。
- 前記1又は複数の第1機能コンポーネントのうちのそれぞれのコンポーネントの前記第1活性面及び前記1又は複数の第1機能コンポーネントのうちのそれぞれの前記コンポーネントの前記第1不活性面は、第1方向及び前記第1方向に垂直な第2方向において互いに平行であり、前記1又は複数の第1コンポーネントのうちのそれぞれのコンポーネントは、前記第1方向及び前記第2方向に垂直な第3方向におけるそれぞれのz高さ測定値を有し、前記1又は複数の第1コンポーネントのうちの第1のコンポーネントのz高さは、前記1又は複数の第1コンポーネントのうちの第2のコンポーネントのz高さと異なる、請求項5から8のうちのいずれか一項に記載のパッケージ。
- 機能コンポーネントは、受動コンポーネント又は活性コンポーネントである、請求項9に記載のパッケージ。
- 受動コンポーネントは、抵抗又はコンデンサである、請求項10に記載のパッケージ。
- 活性コンポーネントは、トランジスタ又は集積回路である、請求項10に記載のパッケージ。
- 前記パッケージは、システムインパッケージ(SiP)である、請求項9に記載のパッケージ。
- パッケージアセンブリを有するシステムであって、
回路基板と、
前記回路基板に結合されるパッケージアセンブリと、を備え、
前記パッケージアセンブリは、
それぞれ第1活性面及び前記第1活性面と反対側の第1不活性面を有する1又は複数の第1機能コンポーネントの第1レイヤと、
それぞれ第2活性面及び前記第2活性面と反対側の第2不活性面を有する1又は複数の第2機能コンポーネントの第2レイヤと、
を含み、
1又は複数の前記第1活性面は、スルーモールドビア又はシリコン貫通ビアを通じて1又は複数の前記第2活性面に向いて電気的に結合される、
システム。 - 前記第1活性面は、スルーモールドビア又はシリコン貫通ビアにより前記第2不活性面と電気的に結合される、請求項14に記載のシステム。
- 前記第2不活性面に取り付けられて前記第1活性面に電気的に結合されるランドグリッドアレイ又はボールグリッドアレイをさらに備える、請求項14に記載のシステム。
- 前記第1レイヤ及び第2レイヤは、モールドされる、請求項14に記載のシステム。
- 前記第1レイヤのモールド及び前記第2レイヤのモールドは、異なる化合物である、請求項17に記載のシステム。
- 前記1又は複数の第1機能コンポーネント又は前記1又は複数の第2機能コンポーネントは、ファンアウトコンポーネントである、請求項18に記載のシステム。
- 前記1又は複数の第1機能コンポーネントのうちのそれぞれのコンポーネントの前記第1活性面及び前記1又は複数の第1機能コンポーネントのうちのそれぞれの前記コンポーネントの前記第1不活性面は、第1方向及び前記第1方向に垂直な第2方向において互いに平行であり、前記1又は複数の第1コンポーネントのうちのそれぞれのコンポーネントは、前記第1方向及び前記第2方向に垂直な第3方向におけるそれぞれのz高さ測定値を有し、前記1又は複数の第1コンポーネントのうちの第1のコンポーネントのz高さは、前記1又は複数の第1コンポーネントのうちの第2のコンポーネントのz高さと異なる、請求項14から19のうちのいずれか一項に記載のシステム。
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