JP2018503929A - メモリ・パッケージの下にコントローラを備えたメモリ・デバイス、ならびに関連するシステムおよび方法 - Google Patents
メモリ・パッケージの下にコントローラを備えたメモリ・デバイス、ならびに関連するシステムおよび方法 Download PDFInfo
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- JP2018503929A JP2018503929A JP2017526646A JP2017526646A JP2018503929A JP 2018503929 A JP2018503929 A JP 2018503929A JP 2017526646 A JP2017526646 A JP 2017526646A JP 2017526646 A JP2017526646 A JP 2017526646A JP 2018503929 A JP2018503929 A JP 2018503929A
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Classifications
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Abstract
Description
Claims (26)
- パッケージ基板と、
半導体ダイを有する、積み重ねられた複数のメモリ・パッケージと、
前記パッケージ基板に取り付けられ、前記積み重ねられた複数のメモリ・パッケージと前記パッケージ基板との間に配置されたコントローラであって、前記メモリ・パッケージの各々を管理するように構成されたコントローラと、
前記パッケージ基板により担持されており、前記メモリ・パッケージの積層を封止している、封止剤と
を含むメモリ・デバイス。 - 前記コントローラが、前記メモリ・パッケージの各々へのデータ転送および前記メモリ・パッケージの各々からのデータ転送を管理するように構成されていることを特徴とする、請求項1のメモリ・デバイス。
- 前記パッケージ基板が複数の第1ボンドパッドと複数の第2ボンドパッドとを含み、前記メモリ・デバイスが、
前記複数の第1ボンドパッドを前記メモリ・パッケージに結合する複数の第1ワイヤボンドと、
前記複数の第2ボンドパッドを前記コントローラに結合する複数の第2ワイヤボンドと
をさらに含むことを特徴とする、請求項1または2のいずれか1項のメモリ・デバイス。 - 前記メモリ・パッケージの各々が、基板と、複数のメモリ半導体ダイと、前記メモリ半導体ダイを少なくとも部分的に封止するパッケージ筐体とを含むことを特徴とする、請求項1から3のいずれか1項のメモリ・デバイス。
- 前記メモリ・パッケージの各々が、前記パッケージ基板に電気的に接続されたマルチチップ・パッケージであることを特徴とする、請求項1から4のいずれか1項のメモリ・デバイス。
- ダイ接着用接着剤によって、前記メモリ・パッケージの各々が、前記メモリ・パッケージのうちで隣接するものに取り付けられていることを特徴とする、請求項1から5のいずれか1項のメモリ・デバイス。
- 前記積み重ねられた複数のメモリ・パッケージが第1メモリ・パッケージと第2メモリ・パッケージとを含み、前記第1メモリ・パッケージが前記パッケージ基板に取り付けられており、前記第2メモリ・パッケージがダイ接着用接着剤によって前記第1メモリ・パッケージに取り付けられていることを特徴とする、請求項1から6のいずれか1項のメモリ・デバイス。
- 前記メモリ・パッケージが、フラッシュメモリを含み、かつ、NANDメモリおよび/またはNORメモリを含むことを特徴とする、請求項1から7のいずれか1項のメモリ・デバイス。
- 前記メモリ・パッケージの各々が、組み込みコントローラのないNANDパッケージであることを特徴とする、請求項1から8のいずれか1項のメモリ・デバイス。
- 前記コントローラが、前記積層において前記メモリ・パッケージのうちで一番下のものと、前記パッケージ基板との間に配置されていることを特徴とする、請求項1から9のいずれか1項のメモリ・デバイス。
- 前記メモリ・パッケージの積層と前記パッケージ基板との間にさらにスペーサを含み、前記スペーサが横方向において前記コントローラからは離れていることを特徴とする、請求項1から10のいずれか1項のメモリ・デバイス。
- データを読み出し、データを消去し、かつ/またはデータを書き込むよう、前記メモリ・パッケージに対して命令するように、前記コントローラが構成されていることを特徴とする、請求項1から11のいずれか1項のメモリ・デバイス。
- 前記メモリ・パッケージの各々の外側に前記コントローラが配置されていることを特徴とする、請求項1から12のいずれか1項のメモリ・デバイス。
- ホストに結合されるように構成されたマルチメディア・デバイスであって、
インタポーザと、
前記インタポーザに電気的に結合されたマルチチップ・メモリ・パッケージの積層と、
前記インタポーザに取り付けられており、前記マルチチップ・メモリ・パッケージの積層と前記インタポーザとの間に配置されたマルチメディア・コントローラ・ダイであって、前記ホストと前記マルチチップ・メモリ・パッケージの各々との間のデータ転送を管理するように構成されたマルチメディア・コントローラ・ダイと、
前記マルチチップ・メモリ・パッケージの積層を封止している封止剤と、
を含むマルチメディア・デバイス。 - 前記マルチメディア・コントローラ・ダイが前記メモリ・パッケージの各々に結合されていることを特徴とする、請求項14のマルチメディア・デバイス。
- 前記マルチメディア・コントローラ・ダイが、誤り訂正、ブロック管理、ウェア・レベリング、および/または物理から論理へのマッピングを提供するように構成されていることを特徴とする、請求項14または15のいずれか1項のマルチメディア・デバイス。
- 前記マルチメディア・コントローラ・ダイが、前記マルチチップ・メモリ・パッケージの各々と結合されたメモリ・インタフェイスを含むことを特徴とする、請求項14から16のいずれか1項のマルチメディア・デバイス。
- 各マルチチップ・メモリ・パッケージがNANDパッケージであることを特徴とする、請求項14から17のいずれか1項のマルチメディア・デバイス。
- メモリ・パッケージを製造する方法であって、
コントローラをパッケージ基板に取り付けることと、
第1メモリ・パッケージを、前記第1メモリ・パッケージと前記パッケージ基板との間に前記コントローラが配置されるように、前記パッケージ基板に取り付けることと、
第2メモリ・パッケージを前記第1メモリ・パッケージに取り付けることと、
前記第1および第2メモリ・パッケージを封止することと、
を含む方法。 - 前記コントローラを前記パッケージ基板にワイヤ・ボンディングすることと、
前記第1および第2メモリ・パッケージを前記パッケージ基板にワイヤ・ボンディングすることと、
をさらに含む、請求項19の方法。 - 封止剤が前記コントローラを少なくとも部分的には封止するように、前記パッケージ基板と前記第1メモリ・パッケージとの間の空洞に、前記封止剤を流し込むことをさらに含む、請求項19または20のいずれか1項の方法。
- 前記第1メモリ・パッケージを前記パッケージ基板に取り付けることが、前記第1メモリ・パッケージと前記パッケージ基板のちょうど間に前記コントローラの大部分が配置されるように前記第1メモリ・パッケージを前記パッケージ基板に取り付けることを含むことを特徴とする、請求項19から21のいずれか1項の方法。
- 前記第1メモリ・パッケージを前記パッケージ基板に取り付けることが、前記コントローラを前記パッケージ基板に結合するワイヤボンドが前記第1メモリ・パッケージと前記パッケージ基板とのちょうど間になるように、前記第1メモリ・パッケージを前記パッケージ基板の上に載せることを含むことを特徴とする、請求項19から21のいずれか1項の方法。
- 前記コントローラがマルチメディア・コントローラであり、前記第1および第2メモリ・パッケージがNANDパッケージおよび/またはNORパッケージであることを特徴とする、請求項19から23のいずれか1項の方法。
- 前記第1および第2メモリ・パッケージを前記パッケージ基板に取り付ける前に、前記第1および第2パッケージを検査して品質保証済み良品パッケージを突き止めることをさらに含む、請求項19から24のいずれか1項の方法。
- さらなるメモリ・パッケージを、前記第1および第2メモリ・パッケージならびに前記さらなるパッケージを封止する前に、前記第2メモリ・パッケージの上に積み重ねることをさらに含む、請求項19から25のいずれか1項の方法。
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US20180350776A1 (en) | 2018-12-06 |
US10128217B2 (en) | 2018-11-13 |
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JP2021073695A (ja) | 2021-05-13 |
US20170170149A1 (en) | 2017-06-15 |
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CN107004663A (zh) | 2017-08-01 |
TWI578467B (zh) | 2017-04-11 |
US11658154B2 (en) | 2023-05-23 |
US20200321318A1 (en) | 2020-10-08 |
TWI649846B (zh) | 2019-02-01 |
TWI664703B (zh) | 2019-07-01 |
JP6865498B2 (ja) | 2021-04-28 |
EP3221888A1 (en) | 2017-09-27 |
EP3221888B1 (en) | 2023-06-28 |
JP7408588B2 (ja) | 2024-01-05 |
US20160148918A1 (en) | 2016-05-26 |
TW201838116A (zh) | 2018-10-16 |
US9627367B2 (en) | 2017-04-18 |
US10727206B2 (en) | 2020-07-28 |
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