JP2018207022A - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP2018207022A JP2018207022A JP2017113072A JP2017113072A JP2018207022A JP 2018207022 A JP2018207022 A JP 2018207022A JP 2017113072 A JP2017113072 A JP 2017113072A JP 2017113072 A JP2017113072 A JP 2017113072A JP 2018207022 A JP2018207022 A JP 2018207022A
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- 238000012545 processing Methods 0.000 title claims abstract description 81
- 235000012431 wafers Nutrition 0.000 claims abstract description 305
- 238000012546 transfer Methods 0.000 claims abstract description 36
- 238000003860 storage Methods 0.000 claims abstract description 29
- 230000004308 accommodation Effects 0.000 description 21
- 238000004140 cleaning Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 210000000078 claw Anatomy 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Manipulator (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
11 カセット載置ユニット
12 搬出ユニット
13 搬送ユニット
14 ウェーハ保持パッド収容ユニット
15 中心合わせユニット(加工処理ユニット)
16a 粗研削ユニット(加工処理ユニット)
16b 仕上げ研削ユニット(加工処理ユニット)
16c レーザー加工ユニット(加工処理ユニット)
17 洗浄ユニット(加工処理ユニット)
18 制御ユニット
20a 20b 20c 20d カセット載置テーブル
21a 21b 21c 21d カセット
22 ガイドレール
23 移動ロボット
23a 基台部
24 ロボットアーム
25 着脱部
25a 連結凹部
26 ガイドレール
27 移動手段
27a 基台部
28 ロボットアーム
29 着脱部
29a 連結凹部
30 筐体
31 収容室
32 搬出入開口
33 ウェーハユニット
34 環状フレーム
35 テープ
36 ウェーハ
38 ウェーハ
40 ウェーハ保持パッド
41 支持板
42 接続部
43 凹部
44 着脱ブラケット
44a 連結凸部
50 ウェーハ保持パッド
51 基台
52 吸着面
53 着脱ブラケット
53a 連結凸部
65 粗研削手段
67 仕上げ研削手段
70 レーザー光線照射手段
80 記憶部
Claims (2)
- 複数のウェーハを収容したカセットを載置するカセット載置ユニットと、該カセット載置ユニットに載置されたカセットからウェーハを搬出する搬出ユニットと、該搬出ユニットによって搬出されたウェーハを搬送する搬送ユニットと、該搬送ユニットに隣接して配設されウェーハにそれぞれ異なる加工又は処理を施す複数の加工処理ユニットと、該各ユニットを制御する制御ユニットと、を少なくとも備えた加工装置であって、
該搬送ユニットは、直線状に延在するガイドレールと、該ガイドレールに支持され移動する移動手段と、該移動手段の先端に着脱自在に連結されウェーハを保持する第1のウェーハ保持パッドとを備え、
該搬出ユニットは、ウェーハを保持する第2のウェーハ保持パッドと、該第2のウェーハ保持パッドを先端に着脱自在に装着し搬出又は搬入を行う移動ロボットとを備え、
ウェーハの種類毎に異なる複数種類の該第1のウェーハ保持パッド及び該第2のウェーハ保持パッドを複数収容するウェーハ保持パッド収容ユニットが配設され、
該カセットからウェーハを搬出する前に、該搬出ユニット及び該搬送ユニットは、当該ウェーハに対応する該第1のウェーハ保持パッド及び該第2のウェーハ保持パッドを装着すること、を特徴とする加工装置。 - 該制御ユニットは、ウェーハに対応して適した該第1のウェーハ保持パッド及び該第2のウェーハ保持パッド情報をウェーハID毎に予め記憶する記憶部を備え、
該カセットからウェーハを搬出する前に、該搬出ユニット及び該搬送ユニットに、該ウェーハ保持パッド情報に基づいた該第1のウェーハ保持パッド及び該第2のウェーハ保持パッドの装着を指示し、
該搬出ユニット及び該搬送ユニットは、指示された該第1のウェーハ保持パッド及び該第2のウェーハ保持パッドを装着すること、を特徴とする請求項1記載の加工装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017113072A JP2018207022A (ja) | 2017-06-08 | 2017-06-08 | 加工装置 |
US15/997,275 US20180358250A1 (en) | 2017-06-08 | 2018-06-04 | Processing apparatus |
CN201810562027.8A CN109037097A (zh) | 2017-06-08 | 2018-06-04 | 加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017113072A JP2018207022A (ja) | 2017-06-08 | 2017-06-08 | 加工装置 |
Publications (1)
Publication Number | Publication Date |
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JP2018207022A true JP2018207022A (ja) | 2018-12-27 |
Family
ID=64564288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017113072A Pending JP2018207022A (ja) | 2017-06-08 | 2017-06-08 | 加工装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20180358250A1 (ja) |
JP (1) | JP2018207022A (ja) |
CN (1) | CN109037097A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020026645A1 (ja) * | 2018-08-01 | 2020-02-06 | 平田機工株式会社 | 搬送装置及び制御方法 |
US20210280439A1 (en) * | 2020-03-05 | 2021-09-09 | Hunan Sanan Semiconductor Co., Ltd. | Etching tool for demountably etching multiple pieces of silicon carbide |
WO2022070924A1 (ja) * | 2020-10-02 | 2022-04-07 | 日本電産サンキョー株式会社 | 産業用ロボットのハンド、産業用ロボット |
US12046486B2 (en) * | 2021-03-03 | 2024-07-23 | Hunan Sanan Semiconductor Co., Ltd. | Etching tool for demountably etching multiple pieces of silicon carbide |
Families Citing this family (6)
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JP7191472B2 (ja) * | 2019-01-25 | 2022-12-19 | 株式会社ディスコ | 加工装置の使用方法 |
EP3769906B1 (de) * | 2019-07-25 | 2022-02-02 | MAGNA STEYR Fahrzeugtechnik AG & Co KG | Verfahren und vorrichtung zur produktion von kraftfahrzeugen |
CN111252536B (zh) * | 2020-03-11 | 2022-02-22 | 上海御微半导体技术有限公司 | 一种物料传输装置 |
CN111618885B (zh) * | 2020-07-29 | 2020-10-16 | 山东元旭光电股份有限公司 | 一种晶圆自动上片装置 |
JP7517936B2 (ja) * | 2020-10-01 | 2024-07-17 | 株式会社ディスコ | 加工装置 |
CN113921455A (zh) * | 2021-09-29 | 2022-01-11 | 北京北方华创微电子装备有限公司 | 半导体工艺设备及其晶圆支撑结构 |
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2017
- 2017-06-08 JP JP2017113072A patent/JP2018207022A/ja active Pending
-
2018
- 2018-06-04 US US15/997,275 patent/US20180358250A1/en not_active Abandoned
- 2018-06-04 CN CN201810562027.8A patent/CN109037097A/zh active Pending
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JPH10151592A (ja) * | 1996-11-25 | 1998-06-09 | Mecs:Kk | 搬送ロボットのハンド自動交換システムと装置 |
JP2006222132A (ja) * | 2005-02-08 | 2006-08-24 | Disco Abrasive Syst Ltd | 研削装置,被加工物保持部のサイズ判別方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020026645A1 (ja) * | 2018-08-01 | 2020-02-06 | 平田機工株式会社 | 搬送装置及び制御方法 |
KR20200143485A (ko) * | 2018-08-01 | 2020-12-23 | 히라따기꼬오 가부시키가이샤 | 반송 장치 및 제어 방법 |
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US20210280439A1 (en) * | 2020-03-05 | 2021-09-09 | Hunan Sanan Semiconductor Co., Ltd. | Etching tool for demountably etching multiple pieces of silicon carbide |
WO2022070924A1 (ja) * | 2020-10-02 | 2022-04-07 | 日本電産サンキョー株式会社 | 産業用ロボットのハンド、産業用ロボット |
US12046486B2 (en) * | 2021-03-03 | 2024-07-23 | Hunan Sanan Semiconductor Co., Ltd. | Etching tool for demountably etching multiple pieces of silicon carbide |
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US20180358250A1 (en) | 2018-12-13 |
CN109037097A (zh) | 2018-12-18 |
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