JP2018181931A - 切削装置 - Google Patents

切削装置 Download PDF

Info

Publication number
JP2018181931A
JP2018181931A JP2017075149A JP2017075149A JP2018181931A JP 2018181931 A JP2018181931 A JP 2018181931A JP 2017075149 A JP2017075149 A JP 2017075149A JP 2017075149 A JP2017075149 A JP 2017075149A JP 2018181931 A JP2018181931 A JP 2018181931A
Authority
JP
Japan
Prior art keywords
cutting
camera
chuck table
axis
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017075149A
Other languages
English (en)
Japanese (ja)
Inventor
欣浩 楠
Yoshihiro Kusunoki
欣浩 楠
加藤　圭
Kei Kato
圭 加藤
宏 北村
Hiroshi Kitamura
宏 北村
高橋　聡
Satoshi Takahashi
聡 高橋
博光 植山
Hiromitsu Ueyama
博光 植山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2017075149A priority Critical patent/JP2018181931A/ja
Priority to TW107107807A priority patent/TW201839834A/zh
Priority to CN201810262192.1A priority patent/CN108687979A/zh
Priority to KR1020180035925A priority patent/KR20180113165A/ko
Publication of JP2018181931A publication Critical patent/JP2018181931A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2017075149A 2017-04-05 2017-04-05 切削装置 Pending JP2018181931A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017075149A JP2018181931A (ja) 2017-04-05 2017-04-05 切削装置
TW107107807A TW201839834A (zh) 2017-04-05 2018-03-08 切割裝置
CN201810262192.1A CN108687979A (zh) 2017-04-05 2018-03-28 切削装置
KR1020180035925A KR20180113165A (ko) 2017-04-05 2018-03-28 절삭 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017075149A JP2018181931A (ja) 2017-04-05 2017-04-05 切削装置

Publications (1)

Publication Number Publication Date
JP2018181931A true JP2018181931A (ja) 2018-11-15

Family

ID=63844645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017075149A Pending JP2018181931A (ja) 2017-04-05 2017-04-05 切削装置

Country Status (4)

Country Link
JP (1) JP2018181931A (ko)
KR (1) KR20180113165A (ko)
CN (1) CN108687979A (ko)
TW (1) TW201839834A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114683423A (zh) * 2022-06-01 2022-07-01 沈阳和研科技有限公司 一种划片机显微镜结构

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020121374A (ja) * 2019-01-30 2020-08-13 株式会社ディスコ 切削装置の原点位置登録方法
US11921054B2 (en) 2020-09-16 2024-03-05 Globalwafers Co., Ltd. Cleaved semiconductor wafer camera system
CN112223501A (zh) * 2020-10-13 2021-01-15 沈阳汉为科技有限公司 一种新型蜂窝陶瓷模具开槽装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10141932A (ja) * 1996-11-07 1998-05-29 Fujitsu Ltd パターン検査方法と装置
TWI264532B (en) * 2001-11-05 2006-10-21 Olympus Corp Substrate inspection device
JP4571851B2 (ja) * 2004-11-30 2010-10-27 株式会社ディスコ 切削装置
CN100355525C (zh) * 2005-04-20 2007-12-19 艾逖恩机电(深圳)有限公司 超声波焊线方法及其焊线装置
JP4813855B2 (ja) * 2005-09-12 2011-11-09 株式会社ディスコ 切削装置および加工方法
JP4837970B2 (ja) * 2005-10-06 2011-12-14 株式会社ディスコ 切削ブレードの交換装置
JP4939843B2 (ja) * 2006-06-07 2012-05-30 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114683423A (zh) * 2022-06-01 2022-07-01 沈阳和研科技有限公司 一种划片机显微镜结构

Also Published As

Publication number Publication date
CN108687979A (zh) 2018-10-23
TW201839834A (zh) 2018-11-01
KR20180113165A (ko) 2018-10-15

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