JP2018181931A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2018181931A JP2018181931A JP2017075149A JP2017075149A JP2018181931A JP 2018181931 A JP2018181931 A JP 2018181931A JP 2017075149 A JP2017075149 A JP 2017075149A JP 2017075149 A JP2017075149 A JP 2017075149A JP 2018181931 A JP2018181931 A JP 2018181931A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- camera
- chuck table
- axis
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 172
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000007723 transport mechanism Effects 0.000 description 5
- 230000008602 contraction Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017075149A JP2018181931A (ja) | 2017-04-05 | 2017-04-05 | 切削装置 |
TW107107807A TW201839834A (zh) | 2017-04-05 | 2018-03-08 | 切割裝置 |
CN201810262192.1A CN108687979A (zh) | 2017-04-05 | 2018-03-28 | 切削装置 |
KR1020180035925A KR20180113165A (ko) | 2017-04-05 | 2018-03-28 | 절삭 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017075149A JP2018181931A (ja) | 2017-04-05 | 2017-04-05 | 切削装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2018181931A true JP2018181931A (ja) | 2018-11-15 |
Family
ID=63844645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017075149A Pending JP2018181931A (ja) | 2017-04-05 | 2017-04-05 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2018181931A (ko) |
KR (1) | KR20180113165A (ko) |
CN (1) | CN108687979A (ko) |
TW (1) | TW201839834A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114683423A (zh) * | 2022-06-01 | 2022-07-01 | 沈阳和研科技有限公司 | 一种划片机显微镜结构 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020121374A (ja) * | 2019-01-30 | 2020-08-13 | 株式会社ディスコ | 切削装置の原点位置登録方法 |
US11921054B2 (en) | 2020-09-16 | 2024-03-05 | Globalwafers Co., Ltd. | Cleaved semiconductor wafer camera system |
CN112223501A (zh) * | 2020-10-13 | 2021-01-15 | 沈阳汉为科技有限公司 | 一种新型蜂窝陶瓷模具开槽装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10141932A (ja) * | 1996-11-07 | 1998-05-29 | Fujitsu Ltd | パターン検査方法と装置 |
TWI264532B (en) * | 2001-11-05 | 2006-10-21 | Olympus Corp | Substrate inspection device |
JP4571851B2 (ja) * | 2004-11-30 | 2010-10-27 | 株式会社ディスコ | 切削装置 |
CN100355525C (zh) * | 2005-04-20 | 2007-12-19 | 艾逖恩机电(深圳)有限公司 | 超声波焊线方法及其焊线装置 |
JP4813855B2 (ja) * | 2005-09-12 | 2011-11-09 | 株式会社ディスコ | 切削装置および加工方法 |
JP4837970B2 (ja) * | 2005-10-06 | 2011-12-14 | 株式会社ディスコ | 切削ブレードの交換装置 |
JP4939843B2 (ja) * | 2006-06-07 | 2012-05-30 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
-
2017
- 2017-04-05 JP JP2017075149A patent/JP2018181931A/ja active Pending
-
2018
- 2018-03-08 TW TW107107807A patent/TW201839834A/zh unknown
- 2018-03-28 KR KR1020180035925A patent/KR20180113165A/ko not_active Application Discontinuation
- 2018-03-28 CN CN201810262192.1A patent/CN108687979A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114683423A (zh) * | 2022-06-01 | 2022-07-01 | 沈阳和研科技有限公司 | 一种划片机显微镜结构 |
Also Published As
Publication number | Publication date |
---|---|
CN108687979A (zh) | 2018-10-23 |
TW201839834A (zh) | 2018-11-01 |
KR20180113165A (ko) | 2018-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200219 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20201225 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210119 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20210713 |